Method for manufacturing contactless chip-card and chip-card

FIELD: contactless chip-card and method for manufacturing contactless chip-cards.

SUBSTANCE: plastic substrate, which has notches, is prepared. Antenna coil is placed on the top side of plastic substrate. Construct, which has integrated chips, is placed on the back side of plastic substrate, opposite to top side. Electrical connection is created between coil and construct. Plastic substrate is placed into press mold for die casting. Card body is produced by die casting on the back side of plastic substrate.

EFFECT: manufacturing contactless chip-card, improvement of method for manufacturing chip-card, simplicity and efficiency of method, exclusion damage to built into chip-card antenna coil.

7 cl, 2 dwg

 

The present invention relates to a method for producing a contactless chip card and contactless smart card.

Manufacturer of contactless smart cards normalized format is, for example, a method of laminating at which the antenna coil and at least one semiconductor chip (semiconductor chip) is placed on the carrier film, which is embedded in the card case, made by laminating several films.

Another method involves placing a semiconductor chip and an antenna coil on a support layer, which is applied to the card by way of molding, so that the card case completely covers the semiconductor chip and the antenna coil.

In the document DE 197 32 353 A1 describes a method of manufacturing a contactless chip card, in which the molding pressure is made flat card case, provided with a recess, a conductive coil is placed on the surface of the recess, and the chip is installed in the recess and electrically conductive way connected with the coil leads. The recess is then filled with filling mass.

Described in the document DE 101 56 803 A1 a method of manufacturing a contactless data carrier provides for the use of media of workpiece (workpiece) as part of the mold for casting under pressure is the group of is placed on the coil, pour on both sides.

In document WO 97/23843 A1 for manufacturing contactless card coil is applied to the carrier film, the carrier film is placed in a form for injection molding. Integrated circuits, which must be in contact with the coil positioned on the carrier film and connected with the coil. The card case is then made by casting on the carrier film.

In the document DE 196 37 306 C1 describes a method of manufacturing a contactless chip card, wherein the carrier film that has a coil is covered with a covering layer, opposite the coil side of the carrier film is coated with a layer of the map, the resulting structure is placed in the mold for injection molding and poured resin.

The above methods have several disadvantages. Manufacture of chip cards by way of lamination is time consuming and expensive. Carried out in accordance with the prior art positioning of the coil on the host layer results in the way of molding to the fact that the coil is always completely filled. Due to the pressure due to the injection of the molding material in the form of a casting, has the opportunity to separate the turns of the antenna coil from the base layer.

The objective of the invention is to create a contactless chip card and gave the e to improve the method of manufacture of chip cards, to the smart card could be made simple and cost-effective manner and to prevent damage to the built-in custom chip card antenna coil.

This task is solved by a method according to paragraph 1 of the claims and the chip card according to paragraph 6 of the claims. Preferred variants of the method and forms of implementation of chip cards are presented in the dependent claims.

In accordance with this method for manufacturing a chip card provides for the preparation of a plastic substrate having grooves on the upper side of which is electrically conductive coil. Located on the back side of the plastic substrate structural element containing an integrated circuit, for example a semiconductor chip, is connected to the coil through the interlayer connections are placed in the grooves of the plastic substrate. For the enclosure card plastic substrate is placed in the mold for injection molding, and on the back side of the plastic substrate forming the card case is made.

Under the molding method in the sense of the invention and as is generally the case in the prior art is understood as a way of making the body of the card, which uses the shape of the body, the cavity of which is filled with polymer. The shape and size of the card is determined to perform is the group of the specified cavity. The method of molding, which is used for manufacturing corresponding to the invention, the chip card can be used the usual tools and equipment. Can be used with all commonly used in the methods of molding thermosetting plastics or thermoplastics.

Especially preferred is the fact that the upper side of the plastic substrate on the antenna coil forms one of the upper planes or outer side of the finished chip card, while the semiconductor chip is placed inside the smart card. Thus, the antenna coil in the injection molding material into the casting mold is not covered with the molding composition so that the turns of the antenna coil also will not delaminate from the substrate under the influence resulting in the injection pressure. When manufacturing the casing of the card can be used exclusively technological stages and tools that are typically used by manufacturers of modules and/or cards. In addition, there is no need for time-consuming and costly process steps that must be carried out in the laminating process. Due to the placement of the coil on the side of the plastic substrate opposite the placement of the chip on the substrate can easily accommodate several chips. The antenna on the surface of the card PEFC is the manufacture of chip cards can be coated using conventional printing method covering layer and lining.

In a preferred embodiment, the mentioned structural element is placed on a plastic substrate so that once the plastic substrate in the mold for molding structural element is located on the side opposite with the channel of the injection side of the mold. The advantage of this is that placed on the substrate structural element is not damaged under the influence of the pressure of the injection molding material.

Corresponding to the invention a contactless chip card, comprising a housing of a card placed in the card case plastic substrate, the coil is placed on a plastic substrate, and a structural element containing an integrated circuit, electrically connected with the coil, is designed so that the coil is placed on the upper side of the plastic substrate opposite the constructive element. The positioning of the coil on the upper side of the plastic substrate has the advantage that the chip card can be made economical method of injection molding.

Another form of the chip-card provides that faces the coil of the upper side of the plastic substrate for alignment and coatings coil provided with a covering layer.

The invention is explained below in more is detailed with reference to the drawings, which shows the following:

Figure 1 - schematic representation in section of a plastic substrate and a mold for injection molding, in which is put plastic substrate for the enclosure card.

Figure 2 is a schematic view corresponding to the invention of the smart card.

Figure 1 explains corresponding to the invention a method of manufacturing a chip card. As a starting material in accordance with the invention is a plastic substrate 1, on the reverse side 2 where the semiconductor chip 3 is not shown in the drawing pads. On the upper side 4 of the plastic substrate 1 opposite to the semiconductor chip 3, placed the antenna coil 5. The antenna coil 5 is electrically conductive way connected with the semiconductor chip 3 through the interlayer connection 7 in the grooves 6, made in the plastic substrate 1.

For the housings 8 plastic card substrate 1 is placed in the mold 9 for injection molding, the molding cavity which is made according to the form of the manufactured housing 8 cards. While the plastic substrate 1 in the mold 9 for injection molding are oriented so that the molding cavity of the mold 9 for molding surrounds only the back side 2 of the substrate 1. Mold 9 DL the molding contains side 10 channel 11 injection, through which the liquid polymeric material is injected into the molding cavity. Method of molding can be implemented by conventional known from the prior art way, and as materials for the housings 8 cards can be used as conventional thermoplastics and thermosets.

So under pressure that occurs when the injection was not injured placed on the plastic substrate 1 of the semiconductor chip, the latter is placed on the plastic substrate 1 on the side 12 of the mold 9 for casting under pressure, the opposite channel 11 injection. After pouring the plastic substrate 1 or the semiconductor chip 3 and the subsequent curing of the housing 8 cards made so the chip card 13 is removed from the mold 9 for casting under pressure. The upper side 4 of the substrate 1 forms the outer side of the chip card 13, which is visible to the coil 5. For leveling and covering the antenna coil 5 this outside for the next technological stage is covered with a not shown here covering layer. This covering layer can be applied in the usual way.

Figure 2 shows the corresponding invention, the chip card 13, which is made as described above. Placed on the plastic substrate 1 of the semiconductor chip 3 is now fully integrated in the housing 8 CT the s. Educated upper side 4 of the substrate outside the chip card 13 is provided covering layer 14, so that the antenna coil 5 is covered with this layer.

Corresponding to the invention method enables the manufacture of a contactless smart cards economical method of injection molding.

The reference list of items

1 plastic substrate,

2 the reverse side,

3 structural element,

4, the upper side,

5 antenna coil,

6 notch,

7 interlayer connection

8 enclosure card

9 mold for injection molding,

10 side,

11 channel injection,

12 side,

13 chip-card,

14 covering layer.

1. A method of manufacturing a contactless chip card (13), namely, that prepare a plastic substrate (1)having a recess (6), place the antenna coil (5) on the upper side (4) of the plastic substrate (1), place structural element (3)containing the integrated circuit, on the reverse side (2) of the plastic substrate (1), opposite the top side (4), make the electrical connection between the coil (5) and the structural element (3), put a plastic substrate (1) in press the form (9) for injection molding and are produced by injection molding the housing (8) of the card on the reverse side (2) of the plastic substrate (1).

2. The method according to claim 1, Otley is audica fact, that the coil (5) is electrically connected with the contact pins of structural element (3) by means of a metal interlayer connections (7), held in the notches (6).

3. The method according to claim 2, characterized in that the exercise floor and alignment coil (5), placed on the upper side (4) of the plastic substrate (1), by means of a covering layer (14) simultaneously with the print on this top side (4) and/or application of the covering layer.

4. The method according to claim 1, characterized in that the said structural element (3) is placed on a plastic substrate (1) so that when you place a plastic substrate (1) in the mold (9) for injection molding structural element (3) is located on the side (12), having opposite channel (11) injection side (10) of the mold (9) for injection molding.

5. The method according to claim 1, characterized in that the manufacture of chip cards (13) carry out continuous way.

6. The contactless chip card (13), comprising a housing (8) maps and accommodated in the housing (8) plastic card substrate (1), coil (5), placed on a plastic substrate (1), and located on the reverse side (2) of the plastic substrate (1) structural element (3)containing an integrated circuit, electrically connected to the coil (5), characterized in that the coil (5) is placed on the upper side (4) plastic p is Daiki (1), the opposite structural element (3).

7. The contactless chip card (13) according to claim 6, characterized in that the covering layer (14)covering the coil forms the outer side of the chip card (13).



 

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