Electronic module for non-contact identification

FIELD: technology for identification of individuals, stationary or moveable objects, products and analogical items, namely, portable electronic means like label or mark, making it possible to detect and recognize an object, to which such a mark is attached.

SUBSTANCE: electronic module contains bodiless integration circuit, inductance coil and capacitor, forming an antenna, and mounting board, made of polyimide ribbon with one-sided metallization, on which using thin-film photo-lithography methods flat coil is formed with mounting clamps and flexible leaf, connected to mounting clamp, bend of leaf is made with bending radius not less than thickness of commutation conductor.

EFFECT: planarization of module, decreased dimensions and decreased laboriousness of manufacture, expanded range of working temperatures and, therefore, expanded area of application of device, including radiation resistance.

2 dwg

 

The present invention relates to the field of identification, stationary or moving objects, products and similar items, and in particular to portable electronic type label or labels to detect and identify an object that is attached to this label. The module can be used for identification and authorization of people in certain areas, work stations or terminals of the communication and information systems, search and identification of animals, labeling of biological samples, chemicals and medical instruments, automated security systems, electronic payment systems and other systems.

A known design of an identification device containing unpackaged integrated circuit, the inductor and capacitor that form the antenna and circuit Board made of a polyimide tape with a one-sided metallization, which in the longitudinal direction by the methods of thin-film photolithography is formed of two switching electrically conductive tracks, and the tape is folded several times with a radius of bend not less than the thickness of the switching conductors and glued between the folded parallel areas of adhesive at a thickness of the adhesive joint is not less than the thickness of the conductors of the switching paths [1]. The disadvantage of the proposed technique is a mini solution is the inability to use the device in a planar structures, that does not microminiaturization.

A known design of a high-frequency identification device mounted on the flexible Board. Module, transmitting in response to the request polling signal with the identification information contains a flexible charge placed on it IP encoder for recording identification information, the antenna and the generator, the transmitting antenna modulated with the identification information of the RF signal. The device can be made by building on a flexible substrate, such as plastic, printed circuit conductors using conductive ink based on graphite or silver [2]. The device may be made in the form of a bracelet and serve to pass into the protected premises. The disadvantage of these devices are quite large dimensions and the need to use the internal power source for communication, because otherwise the range of the strong connection between the poll system and device are greatly reduced.

The closest in technical essence to the proposed module adopted for the prototype, is a contactless electronic module designed for installation in an identification card or label. The electronic module includes a substrate for mounting an electronic chip, which is made with the discerning business is using is connected to the antenna for providing contactless module, the antenna is fully located on the module and contains the coils are made in the plane of the substrate and the chip and the antenna are located on two opposite sides of the substrate of the module contact terminals of the antenna are connected to the pins by means of connecting wires drawn through the channels made in the basis [3]. The disadvantage of the proposed technical solution is the inability to use the module in planar structures, requires additional wires to ensure switching of the crystal IC with an antenna placed on opposite sides of the substrate, thereby complicating the design, increasing the complexity of manufacture and reducing the reliability of the module. In addition, the use of wires for switching chip with antenna eliminates the use of aluminum as the material of the inductor, thereby greatly reducing the radiation resistance of the module and, as a consequence, the scope of such devices.

The purpose of the invention is the creation of planar electronic module contactless identification, which results in the microminiaturization of the module is to minimize weight and size metrics and provides automation of the Assembly of the module and, as a consequence, improving the reliability and reducing the complexity.

The basis of invented the I put the task of creating a planar contactless identification module, devoid of these disadvantages and allows you to significantly expand the scope of such devices. The device must not contain an internal power source, to operate in a wide temperature range, have small dimensions and indicators reproducible with high accuracy settings, to possess low cost, due to the possibility of the production module based on automated equipment. The electronic module contains unpackaged integrated circuit, the inductor and capacitor that form the antenna and circuit Board made of polymer tape with one-sided metallization on which methods of thin-film photolithography is formed of a flat coil with mounting pins and flexible petal, coupled with mounting conclusion, bend the petal is performed with a bend radius not less than the thickness of the patch conductor.

Figure 1 shows the design of the electronic module contactless identification to the Assembly, where 1 is the mounting substrate; 2 - turns of the coil; 3 - internal output coil; 4, 5 - mounting pins; 6 - external output coil; 7 - flexible petal substrate.

Figure 2 shows an electronic module contactless identification, where 8 - die IC.

The solution of this problem is achieved by the fact that this module identificat the AI, containing unpackaged integrated circuit 8 for recording and issuing identification information, the inductor and capacitor that form the antenna for bidirectional contactless communication with the poll system, and the mounting substrate 1, made of a flexible polymer tape with one-sided metallization. The use of polyimide with thermostability range from liquid nitrogen temperatures to plus 350°as a flexible ribbon allows you to extend the operating temperature range of the module, and in combination with aluminum metallization provides radiation resistance of the module. From the layer of metallization methods of thin-film photolithography to form the coils of the coil 2. The internal output coil 3 is one of the mounting pins 4, the second mounting pin 5 is the continuation of the external output coil 6 which is placed on a flexible petal substrate 7 and is connected with a mounting conclusion through holes in the substrate. To avoid breakage and peeling of conductors radius of bend of the tape shall not be less than the thickness of the switching layer.

The construction and method of making the proposed module can be illustrated by the following examples.

Example 1. Electronic module contactless identification is collected on the flexible circuit substrate of polyimide film thickness of 12 μm, coated with the layer of aluminum with a thickness of 30 μm. Conductive switching conductors of coils coil and petal shaped with a resolution of thin-film photolithography. The length of the wires (the number of turns of the coil), and hence the size of the substrate, provide a resonant frequency of 13.56 MHz at a given capacity of the circuit. Planarization is achieved by mounting the chip on the substrate, on the opposite sides of which are convolutions of the coil. The connection of the contact terminals of the antenna with mounting pins running through the channels in the substrate is carried out by chemical etching of polyimide. Installation is widely used, automated and reliable in the electronics industry by ultrasonic welding. The internal output coil is one of the mounting pins, the second mounting pin is the continuation of the external output coil which is placed on a flexible petal substrate and connected to the mounting conclusion through holes in the substrate. This design allows the antenna circuit, and bend petals made with a bend radius of 50 μm and eliminates breakage and peeling of the conductor.

Example 2. Similar to that specified in example 1 by way of the assembled module on the flexible circuit substrate of Teflon thickness of 50 μm, coated with a layer of copper of a thickness of 50 μm. Installation carried the tsya group method of thermocompression with the use of ball pins, pre-formed on the chip. Bend the petal is made with a bend radius of 100 mm.

The use of the proposed design and the method of manufacturing the electronic module contactless identification in comparison with the prototype provides planarization module, increases radiation resistance, extends the operating temperature range allows use in its manufacture group automated methods of microelectronic technology, which consequently reduces the complexity. Due to this expands the scope of application of such electronic modules contactless identification.

Sources of information

1. Patent RU 2242798 C2, 7 G 06 To 19/077.

2. Patent WO 99/13441, MKI G 08 In 13/187.

3. Patent RU 2194306 C2, 7 G 06 To 19/077, G 09 F 3/00, prototype.

Electronic module contactless identification containing a substrate for mounting the chip, which is made with connection to the antenna, located entirely on the substrate and containing coils of a coil made in the plane of the substrate, the chip and antenna are located on opposite sides of the substrate, the contact terminals of the antenna connected to the pins through the channels made in the substrate, characterized in that the internal output coil is one of the mounting pins, the second mounting conclusion the two which is the continuation of the external output coil, available on flexible petal substrate and connected to the mounting conclusion through holes in the substrate, bend the petal is made with a bend radius not less than the thickness of the output.



 

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