Module for non-contact chip cards or identification systems

FIELD: engineering of modules for non-contact chip-cards or identification systems.

SUBSTANCE: module contains first and second antenna contact stripes, which respectively have first and second oppositely positioned surfaces, semiconductor circuit board with at least two contact means, while at least one contact means is in contact with first surface of antenna contact stripe, and at least one other contact means is in contact with first surface of second antenna contact stripe, one stripe of gluing film, which at least partially covers first surface of both first and second antenna contact stripes while at least one stripe of gluing film is applied outside the zone, covered by aforementioned semiconductor circuit board.

EFFECT: provision of durability and stability during manufacture.

6 cl, 3 dwg

 

The invention relates to a module for contactless chip cards or identification systems according to the generic concept of paragraph 1 of the claims.

Such modules for contactless chip cards or identification systems are known in themselves, for example, under the designation MS Infineon Technologies AG. A possible way of manufacturing such modules are also known from the document WO 96/05614.

As an essential in this known method of manufacturing should be considered that the chip (chip) with bar pins is fixed by the acrylic film located on the frame with the conclusions. Bar conclusions pressed through the film and in contact with the frame with the findings by means of diffusion soldering. Acrylic foil is located between the chip and conclusions.

The disadvantage module manufactured according to this method, it is necessary to consider what is required for fixing the acrylic film directly contributes to the overall thickness of the module. The thickness of the conventional module from about 330 to 400 μm causes significant costs when sealing the chip card, normalized according to ISO, to achieve good surface quality chip-card.

The implementation of a more subtle modules with a thickness of about 200 μm to overcome these disadvantages and to apply more thin chip cards still suffered n is luck because of the requirements of reliability and stability in the manufacture of cards and in the environment of use.

The present invention is the creation of a module for contactless chip cards or identification systems, which is thinner than the current modules, and yet has sufficient strength and stability in the manufacture of cards and in the environment of use.

In accordance with the invention this problem is solved by the module for contactless chip cards or identification systems containing

the first and the second antenna contact strip (1, 2), respectively, with first and second opposite surfaces,

semiconductor chip with at least two contact means, and at least one contact means is in contact with the first surface of the first antenna contact strip and at least one other contact means is in contact with the first surface of the second antenna contact strip

at least one strip of adhesive film, which at least partially covers the first surface of both the first and the second antenna contact strip

moreover, at least one strip of adhesive film deposited outside the zone covered by the semiconductor chip.

Due to the fact that the strip of adhesive film is no longer between the semiconductor chip and the antenna contact strips and applied only near the semiconductor is dikovoj chip on the antenna contact strip, the total thickness of the module can be reduced, because the strip of adhesive film is no longer contributes to the total thickness.

Special design antenna contact strips, which, for example, are part of the frame with the conclusions, with very long surface areas of the chip and the modified connection technology eliminates adhesive film in the area under the semiconductor chip. Passing through the adhesive film is replaced by at least one strip of adhesive film, which is made, for example, of glass fibre reinforced epoxy film. This strip of adhesive film causes, but without the through passage, the coupling module.

The thickness of the strips of adhesive film in the zone of the thickness of the semiconductor circuit can be selected in an arbitrary manner, without affecting the overall thickness of the module. When the appropriate combination of thickness of the adhesive film and the thickness of the semiconductor chip, a strip of adhesive film provides a protective function for the semiconductor chip.

Preferred embodiments of the invention are given in the dependent claims.

Preferred method of implementing the invention module provides that the first antenna contact strip and the second antenna contact strip have with therefore, its area connecting the antenna and the area of the chip, moreover, the area of the chip is narrower than the zone of connection of the antenna. Through this separation, antenna contact strips of the preferred design of the module is implemented due to the fact that provides space savings due to overlap and stable connection of the two antenna contact strips.

Especially preferred is, if the area of the chip to the first antenna contact strip is parallel to the area of the chip of the second antenna contact strip. Due to this configuration, the semiconductor chip may connect to antenna contact strips with a particularly significant space savings. If the area of the chip is very long, due to this, the area of the chip to the first antenna contact strip can easily contact area of the chip of the second antenna contact strip by means of strips of adhesive film adjacent to the semiconductor chip and the module acquires thereby a sufficient stability.

Therefore, in another preferred embodiment, also provides that the area of the chip is longer than the semiconductor chip.

Preferred method of implementing the invention module provides on the second surface of the first antenna contact strip and the second surface of the second antenna contact strip marked the second film, the second film covers the distance between the first antenna contact strip and the second antenna contact strip.

This second film, which in a typical case is removed acrylic film, but may also be made of other materials, for example paper, is mainly used in the manufacturing process of the module to be deposited on the first surface of the liquid adhesive could not leak through the gap between the first antenna contact strip and the second antenna contact strip. After completion of the manufacturing process, this second film can be removed and, thus, is not included in the total thickness of the module. By removing this second film can also implement the pre-separation of the interconnected modules. But you can also leave a second film on the second surface of the first and second antenna contact strips. In this case, it serves as an additional electrical isolation.

In another preferred embodiment corresponding to the invention of the module, the strip of adhesive film has a modulus of elasticity higher than the modulus of elasticity of the acrylic film. Due to this, higher values of the modulus of elasticity can be enhanced reliability and durability in comparison with the known modules.

Below the invention is explained in detail the example of execution with reference to the drawings 1A, 1b and 2, which shows the following:

Fig. 1A is a schematic top view of the front side of the module made according to the invention.

Fig. 1b is a schematic top view of the rear side of the module made according to the invention.

Fig. 2 is a schematic view in cross section of a module made according to the invention.

In Fig. 1A for a schematic top view of the front side of the module made according to the invention, shows the first antenna contact strip 1 and the second antenna contact strip 2. The first antenna contact strip 1 and the second antenna contact strip 2 is composed respectively of the first wide area connecting the antenna and narrow in the form of drainage area of the chip, and the area of the chip is longer than the area connecting the antenna.

The first antenna contact strip 1 and the second antenna contact strip 2 are arranged in such a way that the area of the chip to the first antenna contact strip 1 and the area of the chip of the second antenna contact strip 2 are located near and along its length parallel. Between the first antenna contact strip 1 and the second antenna contact strip 2 has a period of 8.

On the first surface of the first antenna contact strip 1 and the second antenna contact strip 2 is placed a semiconductor mikros the EMA 3, which continues from the area of the chip to the first antenna contact strip 1 to the area of the chip of the second antenna contact strip 2 through the available space between them 8.

The area of the chip is longer than the semiconductor chip 3. Due to this, there is a place for the two strips 4 and 5 adhesive film (shown shaded), which is placed on the right and left side of the semiconductor chip 3 on the first surface of the first 1 and second 2 antenna contact strips. The first strip 4 adhesive film covers this part of the area of the chip to the first antenna contact strip 1, which is adjacent to the zone connecting the antenna to the first antenna contact strip 1. In addition, the first strip 4 adhesive film covers part of these zones connecting the antenna and part of the area of the chip of the second antenna contact strip 2 which forms the end of the second antenna contact strip 2.

The second strip 5 adhesive film similarly covers part of the area of the chip of the second antenna contact strip 2, which is adjacent to the zone connecting the antenna of the second antenna contact strip and part of the said zone connecting the antenna and part of the area of the chip to the first antenna contact strip 1, the cat heaven forms the end of the first antenna contact strip 1.

Both strips 4, 5 adhesive film continues, thus, through the gap 8 between the first antenna contact strip 1 and the second antenna contact strip 2 and thereby connect the two antenna contact strip 1, 2. This leads to the necessary stability of the module.

Accordingly, the portion of the zone connecting the antenna to the first antenna contact strip 1 and the second antenna contact strip 2 remains uncovered strips 4 and 5 respectively adhesive film, to thereby provide then contact on these sites.

The first antenna contact strip 1 and the second antenna contact strip 2 are, for example, part of the frame with the conclusions. The adhesive film strips 4 and 5 in a typical case is a glass fibre reinforced epoxy film.

In Fig. 1b is a schematic top view of the rear side of the module made according to the invention, shows the first antenna contact strip 1 and the second antenna contact strip 2 with existing between them a gap 8. On the second surface of the first antenna contact strip 1 and the second antenna contact strip 2 is placed second film 6 (shown shaded), which connects the first antenna contact strip 1 with the second antenna contact strip 2 through the gap 8. The second film 6 extends through the entire premeiotic and prevents leakage through the gap 8 liquid glue, deposited on the first surface for fixing the semiconductor chip 3. As the material film 6 in a typical case, it is deleted acrylic film. But can be other materials, such as paper.

The second film 6 continues, in addition, on the second surface, at least over a part of the zones connecting the antenna.

The second film 6 can be designed in such a way that it serves as a carrier film for the installation process and after manufacturing module allows you to split the modules by removing the second film 6 without the use of cutting or punching. But the second film 6 can also serve as an additional insulating film on the reverse side of the finished module. In this case, the second film 6 is not removed.

In Fig. 2 is a schematic view in cross section along the line a-a' in Fig. 1A module made according to the invention, presents the design of a module from its component parts and their impact on the overall thickness of the module.

On the first surface of the first and second antenna contact strips 1, 2 are placed semiconductor circuit 3. Antenna contact strip thickness of about 60 μm, which is, for example, a part of the frame with the conclusions connected with a semiconductor circuit 3 of a thickness of about 120 μm through the contact means 7, in a typical case, representing with the Oh bar NiAu-conclusions thickness of 10 μm.

On the reverse side is schematically shown in Fig. 2 module placed second film 6, which in a typical case is a deleted acrylic film with a thickness of 30 μm. This second film 6 continues over the gap 8 between the first and second antenna contact strips 1, 2.

The result is thus the total module thickness of about 190 μm, if the acrylic film on the back side is removed, or approximately 220 μm, if the acrylic film is not removed.

Marked on the sides of the semiconductor chip 3 on the first surface of the strips 4 and 5 adhesive film does not affect the overall thickness of the module, if it does not exceed the thickness of the semiconductor chip 3 to the sum of thickness of the contact means 7. In this case possible would be the thickness of the strips of adhesive film of about 130 μm. However, in a typical case, the thickness of the strips of adhesive film is approximately 70 microns.

1. Module for contactless chip cards or identification systems containing the first and the second antenna contact strip (1, 2) respectively with first and second opposite surfaces, a semiconductor chip (3) with at least two contact means (7), and at least one contact means (7) is in contact with the first surface of the first antenna contact strip (1), and, at IU is e, one other contact means is in contact with the first surface of the second antenna contact strip (2)at least one strip (4, 5) adhesive film, which at least partially covers the first surface of both the first and the second antenna contact strip (2), characterized in that at least one bar (4, 5) adhesive film deposited outside the zone covered by the semiconductor chip (3).

2. The module according to claim 1, characterized in that the first antenna contact strip and the second antenna contact strip (2) are, respectively, the area connecting the antenna and the area of the chip, and the area of the chip is narrower than the zone of connection of the antenna.

3. The module according to claim 2, characterized in that the area of the chip to the first antenna contact strip (1) is placed parallel to the area of the chip of the second antenna contact strip (2).

4. The module according to claim 2, characterized in that the area of the chip is longer than the semiconductor chip (3).

5. The module according to claim 1, characterized in that the second surface of the first antenna contact strip (1) and on the second surface of the second antenna contact strip (2) are covered with the second film (6), the second film (6) closes the gap (8) between the first antenna contact strip (1) and the second antenna contact bands of the Oh (2).

6. The module according to claim 1, characterized in that the strip (4, 5) adhesive film has a modulus of elasticity higher than the modulus of elasticity of the acrylic film.



 

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