Device and the method of separation of materials

FIELD: mechanical engineering; devices and methods for separation of materials.

SUBSTANCE: the invention is pertaining to the device and the method for separation of materials, in particular, to monocrystals. The technical result of the invention is effective purification and removal of the stripped material during the cutting. For this purpose the device contains: a rotary cutter with a concentric hole, the edge of which forms the cutting edge, at that the rotary cutter is made with a capability of rotation around its central shaft for cutting of the material; a position device intended for positioning of the material subjected to cutting in respect to the rotary cutter in such a manner, that during the cutting process the cutting disk is moving across the material making rotation for cutting-off a separate plate; a device for feeding a lubricating-cooling liquid onto the rotary cutting disk and a device for feeding a gaseous medium onto the rotary cutting disk. At that the device for feeding the gaseous medium has a nozzle, which is mounted inside the concentric hole and is designed in such a manner, that the gaseous medium is fed onto the edge in the direction perpendicular to central shaft of the rotary cutting disk. The method provides for feeding of the lubricating-cooling liquid only onto the outlet side of the cutting disk if to look in the direction of its rotation behind the place of the rotary cutting disk pass through the material. At that the rotary cutting disk is subjected to cooling during operation of the cutting, and the plate is cooled only after operation of the cutting after the separate plate has been cut off during operation of the cutting. At that during the cooling operation the lubricant-cooling liquid is fed by the batching amounts, and during the stripping operation the lubricant-cooling liquid is fed in the bigger amount as compared with the indicated above amount.

EFFECT: the invention ensures the effective purification and removal of the stripped material during the cutting operation.

12 cl, 6 dwg

 

The invention relates to a device and method for separation of materials, in particular of single crystals.

The cutting of the inner cutting edge (inner hole cutting) is a known method of separation of single crystals, which is used in particular for the manufacture of semiconductor wafers. Figure 1 is a schematic depiction of a cut single crystal 1 internal cutting edge, and the single crystal 1 is visible on the form in plan in the direction of the Central longitudinal axis M. As can be seen in figure 1, the single crystal 1, which has an essentially cylindrical structure with a Central longitudinal axis M, is installed on crystallochemical, which is not shown and with which the single crystal can be shifted in the direction perpendicular to the Central longitudinal axis M, with the conveying device, which is not shown. To separate or cut semiconductor wafer, is provided a cutting disc 2, which consists of a Central metal sheet 2A, having concentric inner hole edge 3 which surrounds the inner hole, "busy" diamond particles and thereby form a cutting edge. The width of the Central metal sheet between its outer edge and its inner edge is greater than the diameter of the single crystal, and for this reason the figure schematically zobrazen only the inner edge. With a drive blade 2 can be brought into rotation around its Central axis R in the direction As shown in figure 1. Cutting disc and the single crystal are located relative to each other so that the axis R of rotation of the cutting disk and the Central longitudinal axis M of the single crystal 1 are parallel to each other at a certain distance from each other. In addition, by means of the conveying device, the single crystal 1 can be displaced perpendicular to its Central axis M in the direction of the blade 2 so that during the rotation of the cutting wheel cuts through the single crystal 1 is completely in the plane perpendicular to its Central longitudinal axis M, and can be moved away from the cutting blade 2 in the position in which the separated semiconductor wafer can be removed.

Inside relative to the edge 3 of the blade 2, surrounding the bore, before the position P1 in the direction of a rotation, in which the cutting disk is a single crystal 1 and below which is called the input side, is provided by the device 4 for supplying the cutting fluid designed for supplying coolant to the cutting edge. At position P2 in the direction of a rotation, in which the cutting disk out of the single crystal 1 and which is called below the output side, there is a second is a device for feeding coolant. In the process, before entering the cutting blade 2 in the single crystal 1 cutting fluid serves on the cutting edge or the cutting wheel 2 by means of the conveying device 4, whereupon due to the rotation of the blade 2 cutting fluid is moved into the gap formed by cutting. When the cutting disk 2 out of the single crystal 1, the lubricating fluid is fed again through the second conveying device 5, so that provided the treatment and disposal of removed material through educated at cutting gap. In the lubricant-coolant additive is added, which reduce surface tension and thereby contribute to improved wetting of the blade. The known device further comprises a device for washing the Central metal sheet and clamping system after a certain period of time.

There is a problem associated with the known device consists in the fact that effective treatment and disposal of removed material during cutting require such a large amount of coolant, which is formed by cutting the gap becomes filled with coolant fluid and the removed material. As a result, in the case of narrow gaps formed by cutting, it can happen, Thu will have contact between the Central sheet metal of the blade 2 and the area of the semiconductor wafer. Plot semiconductor wafer is attracted to the Central metal sheet by adhesion, which negatively affects the quality of the separated semiconductor wafer. In the case when the surface area of contact will be large, a situation may arise when a semiconductor wafer is broken. If, on the other hand, the amount of coolant is too low, its purifying and transporting steps will be sufficient. In addition, additives which reduce the surface tension, lead to a better wetting of the Central sheet metal, which promotes evaporation and drying formed by cutting the suspension on the Central metal sheet.

The objective of the invention is to develop a device and method for cutting a single crystal on a semiconductor wafer by cutting the inner cutting edge, which allows to eliminate the above described disadvantages.

The problem is solved by a device according to item 1 or 14 formulas of the invention and the method according to paragraph 8 or 16 claims.

Embodiments of the invention described in the additional claims.

The device according to the invention and the method according to the invention, in particular, have the advantage, conclude what the amount is, during the operation of cutting requires less coolant than in the known device. Due to it is high-quality cutting.

Additional features and used in practice, features of the invention are presented in the description of embodiments, given as illustrative examples with reference to the drawings.

The drawings show:

figure 1 is a schematic representation of the known device shown in plan in the direction of the longitudinal axis of the single crystal;

figure 2 is a schematic view of embodiment of the exercise device according to the invention, shown in plan in the direction of the Central longitudinal axis of the single crystal;

figure 3 is a schematic representation of the operation of the cooling method according to the invention;

figure 4 is a schematic representation of the operation distribution of coolant to the cutting tool before cutting;

figure 5 is a schematic representation of a cutting operation; and

6 is a schematic representation of operation of the cleaning method according to the invention.

As you can see in figure 2, the image device according to the invention in a known manner provided by cristalleria the eh and a feeding device for a single crystal 1 together with the blade 2 with the Central metal sheet 2A and covered with diamond particles flange 3 of the inner hole of the blade. In contrast to the known devices, the device according to the invention contains the first feed device 10, which is intended to supply coolant to the edge 3 of the inner hole and the cutting wheel 2 and which, when viewed in the direction of rotation of the blade 2, is provided on the output side in the position P2, after the place of passage of the disk through the single crystal 1. The first feed device 10 that is designed to supply the cutting fluid, constructed, for example, in the form of a nozzle. In addition, the second feed device 11 for purifying means provided on the output side in the area of the inner hole. In addition, the device 12 is designed to supply a gaseous medium, in particular compressed air, on the cutting wheel 2 and, in particular, on the edge 3, similarly provided on the output side.

Figure 3-6 shows an illustration of the functioning of the device according to the invention and the method according to the invention. Before the operation of the cutting or separation of the cutting wheel 2 and the single crystal 1 are separated from each other. Then, the single crystal 1 is shifted relative to the blade 2 and blade 2 during the rotation of cuts into the material of the single crystal 1 for cutting. As shown in figure 3, during the operation Department of the lubricating fluid when low the lines flow that is, when the low-speed v and low pressure p is supplied to the edge 3, which forms the cutting edge. The material used as the coolant, is a cutting fluid containing an additive, which provides increased surface tension δ coolant and, therefore, reducing the wetting of the Central metal sheet 2A. This results in poor wetting of the Central metal sheet 2A of the blade 2 and the formation of 20 drops of coolant on the surface of the Central metal sheet 2A. Also during the cutting operation, as shown in figure 4, the compressed air from the source 12 of the compressed air is released under pressure on the edge 3, resulting offset by poor wetting. Compressed air may also contribute to the formation of drops 20 and their distribution. As shown in figure 5, during the operation of the cutting blade 2 penetrates inside of the single crystal 1, the flange 3 and 20 drops of coolant formed on the surface of the Central metal sheet 2A, penetrate the interior of the single crystal 1 for cutting of section 1A of the semiconductor wafer. Air and lubricant-coolant is constantly being fed under low pressure p. At the time of cutting the AC is whether 20 coolant on the Central metal sheet 2A absorb filmed material and ensure the distribution of its Central metal sheet without drying or any contact with a semiconductor wafer.

After the operation of cutting the single crystal 1 and the separated semiconductor wafer shift away from the blade 2 through the supply device so that a cutting disc and single or separated semiconductor wafer are separated from each other, as shown in Fig.6. Clean and remove material that has accumulated on the Central metal sheet and the prisoner in the droplets 20 are performed now by compressed air under high pressure p by the conveying device 12 and by simultaneous feeding cleaning agent in sufficient volume and at a relatively high velocity v by means of the conveying device 11.

Thus, the method according to the invention is a two-stage method in which during the operation of cutting the cooling of the cutting tool, giving a whirl coolant, "encapsulation" of the captured material in a drop of coolant and the distribution and retention of drops of coolant containing filmed material, occur as a result of the centrifugal force. In the second stage, after moving the crystal in the direction from the cutting disk, perform the treatment and disposal of removed material by high pressure air and dispensing-ohla the giving of liquid in sufficient quantity. Cleanser used in the second stage may be identical to the coolant, but it can also represent another substance, such as water. Thus, the lubricant-coolant and cleanser can have different properties.

When using the method according to the invention for cooling and lubrication requires much less coolant than for the treatment and disposal of removed material. High-quality cutting can only be achieved with such a small amount of coolant. During real operations of cutting the amount of coolant set at the level of the minimum number required in order to ensure the cooling and lubrication. Formed by cutting the gap is clean, and avoid contact between the Central metal sheet and plot semiconductor wafer. However, during cleaning, the use of substantially higher volumetric flow rate is the ideal solution. These requirements contradict each other. Accordingly, cooling and cleanup is separated in time from each other, because both operations of different volumetric flow rates are optimal.

Instead of compressed air is also possible to apply another gas, for example nitrogen.

In the preferred embodiment, as shown in figure 2, includes a container 30 that is designed to supply coolant to the supply device 10, which delivers a small amount of coolant during the cutting operation, with the container in the operating position is located at a constant height above the feed device 10 and connected with the latter via a supply line 31. The container holds the lubricant-coolant, which is supplied to the feeding device 10 along supply lines only under the action of gravity or hydrostatic pressure. Air bubbles in the supply line moved up. Thus, it is guaranteed that, even in the case when the amount of coolant to be submitting are a small, guaranteed stable supply free from bubbles coolant.

The invention is suitable for cutting various materials such as optical glass, plastics and others.

1. Device for cutting materials, in particular of single crystals, on a separate plate containing a cutting disc (2) with a concentric hole, edge (3) which forms a cutting edge, with a cutting disc (2) is made to rotate around its the Central axis with the aim of cutting material (1), a positioning device for positioning material (1)to be cut relative to the cutting blade so that during the cutting blade is moved through the material, making a rotational movement, for cutting a separate plate (1A), the device (10) for supplying coolant to the cutting disc (2) and a device (12) for supplying a gaseous medium at a cutting disc, characterized in that the device (12) for supplying gaseous environment has a nozzle, which is installed inside a concentric hole and is designed in such a way that the gaseous medium is fed on the edge (3) in the direction perpendicular to the Central axis of the blade (2).

2. The device according to claim 1, characterized in that the device (10) for supplying coolant and a device (12) for supplying gaseous medium are arranged so that the cutting fluid and the gaseous environment serves on the output side for the place of passage of the blade (2) through material (1).

3. The device according to claim 1 or 2, characterized in that on the output side is provided by the device (11) for supplying cleaning agent, in particular coolant.

4. Device according to one of claims 1 to 3, characterized in that the device (10) for supplying coolant have the t nozzle, which is designed so that the lubricating fluid is fed to the edge (3).

5. Device according to one of claims 1 to 4, characterized by a control system that actuates a device (11) for supplying the cleaning means after the operation of cutting in such a way that served a greater amount of cleaning agent, in particular coolant, compared with the supply of coolant during the cutting operation.

6. Device according to one of claims 1 to 5, characterized in that in the working position above the device (10) for supplying the cutting fluid includes a container (30), designed to store the coolant, which is connected with a device for supplying coolant through a pipe (31), the filing is the result of the action of gravity.

7. The method of cutting material on a separate plate, in particular the cutting of single crystals of the inner cutting edge, in which the material (1) share with the blade (2), penetrating into the material due to the rotation during the cutting operation, the flow of coolant carried out only on the output side, when viewed in the direction of rotation, for the place of passage of the blade (2) through material (1), characterized those who, what a cutting disc (2) is cooled during the operation of cutting and clear only after the cutting operation, after the separate plate was cut during the cutting operation and during the cooling lubricant-coolant serves in a certain amount, and during the cleaning of lubricating-cooling fluid serves more as compared with certain specified amount.

8. The method according to claim 7, characterized in that the gaseous medium, in particular compressed air fed to the cutting disc (2).

9. The method according to claim 8, characterized in that, when viewed in the direction of rotation of the blade, the gaseous medium is served after the release of the blade from the material.

10. The method according to claim 8 or 9, characterized in that use cutting fluid containing an additive that increases the surface tension.

11. Device for cutting materials, in particular of single crystals, on a separate plate containing a cutting disc (2) with a concentric hole, edge (3) which forms a cutting edge, with a cutting disc (2) is made to rotate around its Central axis with the aim of cutting material (1), a positioning device for positioning material (1)to be cut relative to the cutting blade so that in time the I cutting blade is moved through the material, making a rotational movement, for cutting a separate plate (1A), the device (10) for supplying coolant to the cutting disc (2), the device (11) for supplying cleaning agent to the cutting disc (2), provided the control system that controls a device (10) for supplying coolant and a device (11) for supplying the cleaning means so that the cutting fluid is supplied during the operation of cutting and cleaning agent applied only after the cutting operation after the separate plate was cut off when the cutting operation, and the control system is designed so that the lubricant-coolant is supplied with a low volumetric flow rate and cleanser served with higher volumetric flow rate compared to the volumetric flow rate of coolant.

12. The method of separation of materials, in particular cutting single crystals, the inner cutting edge, in which the material (1) share with the blade (2), penetrating into the material due to the rotation, and the cutting fluid is served during the operation of cutting and cleanser served after the cutting operation after the separate plate was cut during the cutting operation, while SMAT is but the coolant serves low volumetric flow rate and cleanser serves a higher volumetric flow rate compared to the volumetric flow rate of coolant.



 

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