Integral micromechanical mirror

FIELD: electric engineering.

SUBSTANCE: integral micromechanical mirror has substrate to place four electrodes onto it. Four additional electrodes of capacitive movement converters are disposed onto the substrate in such a manner to form flat capacitor with mirror element. One additional fixing plate is disposed under mirror element directly onto substrate. There are torsion beams placed in such a way that they connect mirror element with fixing plate. Mirror element, torsion beams, electrodes of electrostatic drives and capacitive converters as well as fixing plate are made of semiconductor material. Area of substrate used for placing integral mirror is reduced. Position of mirror element is subject to control relatively the substrate.

EFFECT: improved reliability of operation.

2 dwg

 

The present invention relates to the field of integrated electronics and Microsystem technology, and more particularly to integral elements designed to change the direction of the optical signal.

Known integrated micromechanical mirror [G.-D.J.Su, H.Toshiyoshi, M.C.Wu, Surface-micromachined 2-D optical scanners with high-performance single-crystalline silicon micromirrors, IEEE photonics technology letters, vol.13, No. 6, june 2001, p.607, fig.1a]containing semiconductor substrate located here four electrodes made of semiconductor material, and the mirror element made in the form of wafers of semiconductor material located with a gap relative to the substrate and forming with four located on the substrate electrodes of the flat capacitors are used as electrostatic actuators associated with internal frame with a pair of torsion beams made of semiconductor material, of which one end is rigidly attached to the mirror element, and the other - to the elastic suspensions made of semiconductor material and connected to the inner frame, made of semiconductor material connected to the outer frame by means of a pair of torsion beams made of semiconductor material, of which one ends are rigidly attached to the inner frame and the other to pack whim the suspensions, made of semiconductor material and connected to an external frame made of semiconductor material and located directly on the semiconductor substrate.

This integrated micromechanical mirror allows you to reject the mirror element with respect to two mutually perpendicular axes X and Y, located in the substrate plane, i.e. at an arbitrary angle to the substrate plane.

The shortcoming of this integrated micromechanical mirror is the use of an additional area of a semiconductor substrate for placement of the fastening elements of the mirror element is a torsion beams, elastic suspensions, internal and external framework, and the absence of elements position control of the mirror element relative to the substrate.

Functional analogue of the claimed object is integrated micromechanical mirror [H.Toshiyoshi, W.Piyawattanametha, C.-T.Chan, M.C.Wu, Linearization of electrostatically actuated surface micromachined 2-D optical scanner, Journal of microelectromechanical systems, vol.10, No. 2, june 2001, p.205, fig.1]containing semiconductor substrate located here four electrodes made of semiconductor material, and the mirror element made in the form of wafers of semiconductor material located with a gap relative to the substrate and forming with four RA is laid on the substrate electrodes of the flat capacitors, used as electrostatic actuators associated with the inner frame by means of a pair of torsion beams made of semiconductor material, of which one end is rigidly attached to the mirror element, and the other to the inner frame, made of semiconductor material, forming with four located on the substrate electrodes of the flat capacitors are used as electrostatic actuators connected to the outer frame by means of a pair of torsion beams made of semiconductor material, of which one ends are rigidly attached to the inner frame and the other to the external frame made of semiconductor material and located directly on the semiconductor substrate.

This integrated micromechanical mirror allows you to reject the mirror element with respect to two mutually perpendicular axes X and Y, located in the substrate plane, i.e. at an arbitrary angle to the substrate plane.

The shortcoming of integrated micromechanical mirror is the use of an additional area of a semiconductor substrate for placement of the fastening elements of the mirror element is a torsion beams, internal and external framework, and lack of control provisions mirror ele is enta relative to the substrate.

Known the closest to the technical nature of the claimed object is integrated micromechanical mirror [J.-H.Kim, H.K.Lee, B.-I.Kim, J.-W.Jeon, J.-B.Yoon, E.Yoon, A high fill-factor micro-mirror stacked on a crossbars torsion spring for electrostatically-actuated two-axis operation in large-scale optical switch, IEEE 16thannual international conference on microelectromechanical system, 2003, p.259, fig.1], containing a substrate located here four electrodes made of metal, and the mirror element made in the form of a plate of metal that is located with a gap relative to the substrate and forming with four located on the substrate electrodes of the flat capacitors are used as electrostatic actuators associated with the substrate via elastic suspension, consisting of two supports made of metal, is rigidly connected to the mirror element and the torsion beam, made of metal, which is perpendicular rigid connection in the plane of the substrate with another torsion beam, made of metal, is rigidly connected with the other two pillars, made of metal and located directly on the substrate.

This integrated micromechanical mirror allows you to reject the mirror element with respect to two mutually perpendicular axes X and Y, located in the substrate plane, i.e. at an arbitrary angle to the plane under which Oki.

Advantage design of integrated micromechanical mirror is the placement of the fastening elements of the mirror element at last.

The shortcoming of integrated micromechanical mirror is the lack of controls provisions of the mirror element relative to the substrate, and also use as a structural material - metal, which reduces the degree of integration of these devices with elements of Microsystem technology and integrated electronics.

The task of the invention is to reduce the size of the substrate used for placing the integrated micromechanical mirrors and to provide the possibility of controlling the position of the mirror element relative to the substrate.

Technical result achieved in the implementation of the proposed invention is the reduction of the area of the substrate that is used for placing the integrated micromechanical mirrors and the possibility of controlling the position of the mirror element relative to the substrate, and the mirror element, the torsion beam, the electrodes of the electrostatic drive and capacitive transducers displacement and fastening plate made of a semiconductor material.

The technical result is achieved due to the introduction of four additional electrode is in capacitive transducers movements, located on the substrate in such a way that they form a mirror element of a flat capacitor due to their overlap, and one additional attachment plate located under the mirror element directly on the substrate, and the torsion beams are placed so that connect the mirror element with the fastening plate, and the mirror element, the torsion beam, the electrodes of the electrostatic drive and capacitive transducers displacement and fastening plate made of a semiconductor material.

To achieve the desired technical effect in the integrated micromechanical mirror containing substrate with the location of the four electrodes, the mirror element is made in the form of a plate and located with a gap relative to the substrate and forming with four located on the substrate electrodes of the flat capacitors are used as electrostatic actuators, and torsion beams, introduced four additional electrode capacitive transducers movements, located on the substrate in such a way that they form a mirror element of a flat capacitor due to their overlap, and one additional fastening plate located under the mirror element directly on the substrate, and a torsion BA is key posted thus, that connect the mirror element with the fastening plate, and the mirror element, the torsion beam, the electrodes of the electrostatic drive and capacitive transducers displacement and fastening plate made of a semiconductor material.

Figure 1 shows the topology of the proposed integrated micromechanical mirror and shows section. 2 shows the structure of the proposed integrated micromechanical mirrors.

Integrated micromechanical gyroscope (Figure 1) contains the semiconductor substrate 1 located here four electrodes of the electrostatic actuators 2, 3, 4, 5, made of a semiconductor material, four electrode capacitive transducers displacement 6, 7, 8, 9, made of a semiconductor material and located on a semiconductor substrate 1, the mirror element 10 made of semiconductor material, forming an electrostatic interaction with the electrodes of the electrostatic actuators 2, 3, 4, 5, which forms located on the semiconductor substrate 1 by the electrodes of the capacitive transducers displacement 6, 7, 8, 9 flat capacitors, and associated with a semiconductor substrate 1 through a torsion beams 11, 12, 13, 14 made of a semiconductor material, of which one ends are rigidly connected to serkal the first element 10, and the other with the fastening plate 15 made of a semiconductor material and located directly on the semiconductor substrate 1.

The device operates as follows.

The mirror element 10 integrated micromechanical mirrors grounded.

When applying to one of the electrodes of the electrostatic actuators 2, 3, 4, 5 voltage relative to the mirror element 10 (Figure 2), among them there is an electrostatic interaction, which leads to the deviation of the mirror element 10 in the direction of the electrode due to bending torsion beams 11, 12, 13, 14 connecting the mirror element 10 with the fastening plate 15. The difference of the voltages generated in pairs capacitive transducers movements formed by the overlap of the electrodes 6, 8 and 7, 9 with the mirror element 10, by changing the gap between the electrodes 6, 7, 8, 9 and mirror element 10, characterizes the magnitude of the deviation angle and direction of the deflection mirror element 10 with respect to two mutually perpendicular axes X and Y, located in the plane of the semiconductor substrate 1.

Thus, the proposed device is an integrated micromechanical mirror, allowing you to reduce the size of the substrate used for its placement, and to control the position of the mirror element relative is on the substrate.

The introduction of four additional electrodes capacitive transducers movements, one additional plate mounting and placement of the torsion beams in such a way that they connect the mirror element with the fastening plate, located under the mirror element directly on the substrate, and the mirror element, the torsion beam, the electrodes of the electrostatic drive and capacitive transducers displacement and fastening plate made of a semiconductor material, you can reduce the size of the substrate used for placing the integrated micromechanical mirrors, and to provide the possibility of controlling the position of the mirror element relative to the substrate, which allows you to use the invention as an integral component used for changing the direction of the optical signal.

Thus, the proposed integrated micromechanical mirror allows: compared with similar devices to increase the density matrix integrated micromechanical mirrors, by reducing the area of the substrate that is used for placing each of the integrated micromechanical mirrors, because the fastening elements are placed under the mirror element, and to provide the possibility of controlling the position of the mirror element relative to the nutrient substrate; compared with the prototype is to increase the degree of integration, since the integrated micromechanical mirror is made of a semiconductor material, and to provide the possibility of controlling the position of the mirror element relative to the substrate, by placing under the mirror element electrodes of the capacitive transducers movements.

Integrated micromechanical mirror containing substrate with the location of the four electrodes, the mirror element is made in the form of a plate and located with a gap relative to the substrate and forming with four located on the substrate electrodes of the flat capacitors are used as electrostatic actuators, and a torsion beam, characterized in that it introduced four additional electrode capacitive transducers movements, located on the substrate in such a way that they form a mirror element of a flat capacitor due to their overlap, and one additional fastening plate located under the mirror element directly on the substrate, and the torsion beams are placed so that connect the mirror element with the fastening plate, and the mirror element, the torsion beam, the electrodes of the electrostatic drive and capacitive transducers movements of the fastening plate made of a semiconductor material.



 

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