Narrow multicolor jet printing head

FIELD: jet printing.

SUBSTANCE: device 100 has three column matrices 61 of drop emitters, configured for multi-pass color printing with printing resolution, having a step of carrier axis points, which is less, than step of columnar nozzles of ink drop emitters. Jet printing head has resistors of high resistance heater and effective control circuits, which are configured to compensate alteration of parasite resistance, caused by power routes (86a, 86b, 86c, 86d).

EFFECT: compactness of jet printing head with large number of ink drop emitters.

20 cl, 11 dwg

 

The technical field

The present invention relates to ink jet printing and more particularly to narrow multicolor thin-film ink-jet printhead.

Prior art

The technique of inkjet printing is relatively well developed. Printers, computers, graphic plotters and Fax devices are implemented using inkjet technology to create media. The contributions of Hewlett-Packard company in inkjet technology is described, for example, in various articles in the Hewlett-Packard Journal, volume 36, No. 5 (may 1985); volume 39, No. 5 (October 1988); volume 43, No. 4 (August 1992); volume 43, No. 6 (December 1992); volume 45, No. 1 (February 1994).

Inkjet image is formed according to the exact placement on the print medium ink drops emitted from the device forming ink droplets, known as an inkjet printhead. Typically, an inkjet printhead is placed on a movable print carriage, which is moved over the surface of the printing medium and ejects drops of ink at appropriate times pursuant to command of a microcomputer or other controller, and synchronizing the application of ink drops is intended to correspond to the template pixel of the printed image.

Typical inkjet printhead Hewlett-Packard includes a matrix is recision formed nozzles to allow the plate which is attached to the barrier layer of ink, the latter, in turn, is attached to the thin film substructure, which includes resistors heater fire ink, and apparatus for enabling the resistors. The barrier layer ink limits the channels of the ink, comprising an ink chamber, located above the associated resistors shooting ink, and the nozzle to allow the plate are aligned with the associated ink chambers. The field shapers droplets of ink are formed by the ink chambers and parts of the thin film substructure and allow the plates, which are adjacent to the ink chambers.

Thin film substructure typically consists of a substrate, such as silicon, on which are formed various thin-film layers that constitute the thin-film resistors shooting ink, the device for inclusion resistors, and circuit connections for connecting pads, which are designed for external electrical connections of the printhead. The barrier layer of ink is typically a polymeric material, which is laminated in the form of a dry film in the thin film substructure and made so that it can be identified by the photo method and recover under the action of heat and/or ultraviolet radiation. In the inkjet printhead ink hearth is raised from one or more ink tanks in different ink chamber through one or more slits ink supply formed in the substrate.

Example physical location to allow the plates, ink barrier layer and the thin film substructure represented in Hewlett-Packard Journal, February 1994, p.44. Additional examples of the inkjet printhead shown in U.S. patent 4719477 and U.S. patent 5317346.

Regarding thin-film ink-jet print heads have increased the size of the substrate and/or the fragility of the substrate, when used more shapers drops of ink and/or ink supply slots.

Summary of the invention

The present invention is the task of creating an inkjet printhead, which is compact and has a large number of forming droplets of ink.

According to the present invention proposed a narrow jet printhead having three column matrix forming droplets of ink configured for multi-pass color printing with a resolution printing with the pitch axis of the carrier, which is less than the step column of nozzles forming droplets of ink. In accordance with a more specific aspect of the invention, the print head includes a heating resistors of high resistance and effective control scheme on FRI, which is configured to compensate for changes in parasite is about resistance, make tracks power.

Brief description of drawings

The invention is further explained in the description of the preferred variants of its embodiment with reference to the accompanying drawings, in which

figure 1 represents a view in plan of the shaper drops of ink and a choice of elementary actions inkjet printhead according to the invention;

figure 2 is a view in plan of the shaper drops of ink and tires land inkjet printhead according to the invention;

figure 3 - General view of the inkjet printhead (partial broken-out section) according to the invention;

4 is a view in plan of an inkjet printhead according to the invention;

5 is a sequence of layers of thin film printhead substructure according to the invention;

6 is a view in plan of a typical topology matrix driving scheme on FRI and tires land printhead according to the invention;

7 is an electrical wiring diagram of the heating resistor and the drive circuit on FRI printhead according to the invention;

Fig - view in plan of a typical slopes choice of elementary actions printhead according to the invention;

Fig.9 is a view in plan of a typical control scheme on FRI and tires land printhead according to the invention;

figure 10 is a view in section of the drive circuit on FRIDAY according to the invention;

11 is a General view of the principles of the EPA, used in which the printhead of the invention according to the invention.

A detailed description of the preferred embodiment variants of the invention

Inkjet printhead 100 (1-4) contains (a) a thin film substructure or crystal 11 containing substrate, such as silicon, and having various thin film layers formed on it, b) the barrier layer 12 of the ink located on the thin film substructure 11, and (C) channel or nozzle plate 13 attached by lamination to the top of the barrier 12 ink.

Thin film substructure 11 contains crystal integrated circuit, which is formed by a known method of forming integrated circuits, and typically includes a silicon substrate street 111A (figure 5), the shutter PT and the dielectric layer 111b, the resistor layer s and the first layer 111d metallization. Active devices, such as control circuits on FRI, formed in the upper part of the silicon substrate street 111A and the gate, and the dielectric layer 111b, which includes the oxide layer of the gate polysilicon gates and the dielectric layer adjacent resistor layer the resistors 56 of the heater is formed by a suitable formation of the pattern resistor layer s and the first layer 111d metallization. Thin film substructure further includes all the I composite layer a passivation, containing, for example, a layer of silicon nitride and a layer of silicon carbide and a layer 111f tantalum mechanical passivation, which at least covers the resistors 56 of the heater. Conductive layer 111g gold overlaps the layer 111f tantalum.

The barrier layer 12 of the ink formed from a dry film, which is laminated using heat and pressure to the thin-film structure 11, and is formed by photo method to form in her chamber 19 of the ink located above the resistor heater 56 and the channels 29 of the ink. Gold connecting pads 74 coming into contact for external electrical connections formed in the layer of gold on the longitudinally separated by gaps opposite ends of the thin film substructure 11 and not covered with a barrier layer 12 of the ink. As an example, the material of the barrier layer contains a photopolymer dry film acrylate-based, such as polymer dry film "Parad" (trademark), obtained from E.I. DuPont de Nemours and Company of Wilmington, Delaware. Dry film include other DuPont products, such as dry film "Riston" (trademark) and other dry film. Jet plate 13 contains, for example, a planar substrate consisting of a polymer material, in which the nozzle is formed with a laser. Jet plate also contains the galvanised is atall, such as Nickel.

Ink chamber 19 (Fig 3) in the barrier layer 12 of the ink are located above the respective resistors 56 heater shooting ink. Each ink chamber 18 is limited mutually connected edges or walls of the open chamber formed in the barrier layer 12. Ink channels 29 are limited to the additional Windows formed in the barrier layer 12, and combined with their cameras 19 shooting ink. Ink chambers 29 are open to the edge of the feeder adjacent slots 21 of the ink supply and take ink from the slot.

Jet plate 13 includes channels or nozzles 21 located above the ink chambers 19 in such a way that each resistor 56 heater shooting ink and associated ink chamber 19 are aligned and form shaper 40 drops of ink. Each of the resistors of the heater has a nominal resistance of at least 100 Ohms, for example about 120 or 130 Ohms, and may contain segmented resistor (Fig.9), in which the resistor 56 heater contains two areas 56a, 56b resistor connected region 59 of the metallization. This structure of the resistor provides a resistance that is greater than the resistance of one resistor.

Although these printheads are described as having a barrier layer and separate the second nozzle plate, it should be understood that the print heads can be implemented with a single barrier/allow a structure that can be manufactured, for example, using a single photopolymer layer that is exposed by using multiple exposure, and then manifested.

Shapers 40 drops of ink are arranged in a column matrix or groups 61, which pass along the reference axis L and are separated by intervals from each other transversely relative to the reference axis L. the Resistors 56 of the heater of each group forming droplets of ink are usually aligned with the reference axis L and have a predetermined distance between the centers or the step P of the nozzles along the reference axis L. Step R nozzles can be 1/600 inch or more, for example 1/300 inch. Each column of the matrix 61 forming droplets of ink includes, for example, 100 or more shapers of droplets of ink, i.e. at least 100 of forming droplets of ink.

As an illustrative example of the thin film substructure 11 may be rectangular, in which the opposite edges 51, 52 are longitudinal edges of LS, separated from each other by spaces, while the opposite edge 53, 54 have a width or lateral dimension of WS, which is less than the length LS of the thin film substructure 11. The extent (length) of temperaturestructure 11 is defined along the sides 51, 52, which may be parallel to the reference axis L. the Reference axis L may coincide with the axis, which is commonly referred to as the axis of advancement of the media. For convenience, horizontally split ends of the thin film substructure will also be mentioned under reference numbers 53, 54, used to refer to the edges of these ends.

Despite the fact that the formers 40 drops of ink of each column of the matrix 61 forming droplets of ink are shown as collinear, it should be understood that some of the formers 40 drops of ink matrix forming droplets of ink can be slightly shifted from the center line of the column in order to compensate for the delay shooting.

So far each of the formers 40 drops of ink includes a resistor 56 of the heater, these resistors heaters are columnar groups or matrices that correspond to the column matrix forming droplets of ink. For convenience, a matrix or group of resistors of the heater will be referred to under number 61.

Thin film substructure 11 printhead 100 (1-4) contains three notches 71 of the ink supply, which are located along the same line as the reference axis L, and are separated from each other by intervals transversely relative to the reference axis L. in the slot 71 of the ink supply serves ink in three gr is PPI 61 forming droplets of ink, and they are located on the same side groups forming droplets of ink, which serves ink. Thus, through each of the slits 71 are served ink of any color, which is different from the color of ink supplied through the other openings of the ink supply, such as blue, yellow and red.

The gap or step between CF column matrices forming droplets of ink is less than or equal to 1060 microns (μm), i.e., not more than 1060 mm. Nozzle all the columns can be located in the same locations along the reference axis L and transverse nozzle columns are essentially collinear.

Step P of the nozzles, the location and volume of ink droplets forming ink drops provide a multi-pass printing, which provides step of printing dots is smaller than the step of nozzles, which is in the range of 1/300 1/600 inch to inch. The volume of the droplets is in the range from 3 to 7 picolitres for ink dye-based, preferably about 5 picolitres. A printing step of points along the axis of the carrier, which is parallel to the reference axis L, is in the range from 1/1200 inch to 1/2400 inches, which corresponds to a range resolution of 1200 dpi to 2400 dpi. Regarding the step of nozzles such a pitch range of printing dots corresponds to from 1 / 4th to 1 / 8th step nozzles 1/300 inch or step points, which is equal to about the 1/2-th to 1/4-th step of nozzles 1/600 inch. The step of printing pixels along the scan axis, which is orthogonal to the reference axis L may be in the range of 1/600 inches to 1/1200 inches, which corresponds to a range resolution from 600 dpi to 1200 dpi along the scanning axis.

For printhead having three column matrix 61, and each has at least 96 forming droplets of ink having a step P of the nozzles 1/300 of an inch, the length LS of the thin film substructure 11 is about 11500 microns, and the width of the thin film structures of about 4200 μm. In another example, the width WS of a thin film substructure is about 3400 microns. Typically, the coefficient of relative extension (i.e. LS/WS) thin film substructure more than 2.7.

Respectively adjacent and associated with the column matrix 61 shapers 40 drops of ink are columnar matrix 81 of the control circuits on FRI, formed in the thin film substructure 11 printheads 100A, 100B (6) for the column matrix 61 forming droplets of ink. Each matrix 81 of the control circuits on FRI contains many control circuit 85 on FRIDAY, having drain electrodes connected respectively with their resistors 56 heater with conductors 57a resistors of the heater. With each matrix 81 of the control circuits on FRI and matrix forming droplets of ink associated columnar what I bus 181 of the earth, which is electrically connected to the electrodes of the origins of all control circuits 85 on FRI bonded matrix 81 of the control circuits on FRI. Each column of the matrix control circuit 81 on FRIDAY, the associated bus 181 earth pass horizontally along the associated column of the matrix 61 forming droplets of ink and are at least horizontally together with the associated column matrix 61. Each bus 181 land electrically connected with at least one connecting contact pad 74 at one end of the structure of the printhead and at least one connecting contact pad 74 at the other end of the structure of the printhead (figure 1 and figure 2).

Bus 181 and earth conductors 57a of heater resistors formed in the layer s metallization (figure 5) thin film substructure 11, as conductors 57b of the heater resistors and the electrodes of sinks and sources control circuit 85 on PT (described below).

Scheme 85 on FRI each column of the matrix control circuits on FRI managed by the linked column of the matrix 31 logic circuits 35 decoder, which decodes the address information related address bus 33, which is connected with the corresponding connecting pads 74 (6). The address information identifies the shapers of droplets of ink, which must be filed with the CN is rgii shooting, and used logic circuits 35 decoder to enable the drive circuits on FRI addressed or selected shaper drops of ink.

One conclusion of each resistor 56 (7) of the heater is connected through a line selection basic steps of connecting the contact pad 74, which receives the signal PS of choice elementary action shooting ink. Thus, as another output of each resistor 56 of the heater is connected to the output of the flow related control circuit 85 on FRI, energy PS shooting ink is supplied to the resistor 56 of the heater, if the associated control logic on FRI included as managed by the linked logic decoder 35.

For a representative column of the matrix 61 (Fig) forming droplets of ink forming droplets of the ink column matrix 61 forming droplets of ink can be arranged in four groups 61A, 61b, 61C, 61d elementary operations adjacent adjacent forming droplets of ink. Resistors 56 heater a specific group of elementary actions electrically connected to the same four tracks 86a, 86b, C, 86d choice of elementary actions in such a way that the forming droplets of ink of a particular group of elementary actions connected with the ability to switch in parallel to the same signal PS is selecting elementary action shooting ink. For example, the number N of forming droplets of ink in a column matrix is an integer multiple of 4, each group of elementary steps includes N/4 shapers of droplets of ink. Group 61A, 61b, 61C, 61d elementary operations are located sequentially from the horizontal edge 53 to the horizontal edge 54.

On Fig more specifically presents a view in plan of tracks 86a, 86b, C, 86d choice of elementary actions for the associated column of the matrix 61 shapers drops and the associated column of the matrix control circuit 81 85 (6) on FRI implemented, for example, using trails in the metallization layer 111g gold (figure 5), which is above and dielektricheskii separated from the associated matrix 81 of the control circuit on FRI and bus 181 of the earth. Route 86a, 86b, C, 86d choice of elementary actions electrically connected to the four groups 61A, 61b, 61C, 61d elementary operations through resistor conductor 57b (Fig)formed in the layer s metallization, and mutually United interlayer holes 58 (Fig.9), which pass between the slopes of the choice of elementary actions and resistor conductors 57b.

The first track 86a choice of elementary steps runs horizontally along the first group of 61 elementary steps and overlaps a portion of the conductor 57b resistor heater (Fig.9), which are connected with resistors 56 of the heater per the Oh group 61A choice of elementary steps and are connected via an interlayer holes 58 (Fig.9) with conductors 57b resistors of the heater. The second track 86b choice of elementary steps includes a section, which runs along the second group 61b elementary steps and overlaps a portion of the conductor 57b resistor heater (Fig.9), which are connected with resistors 56 of the heater of the second group 61b elementary steps and are connected via an interlayer holes 58 with conductors 57b resistors of the heater. The second track 86b includes an additional section, which runs along the first route 86a choice of elementary steps on the side of the first track 86a choice of elementary steps, which is the opposite of the resistors 56 of the heater of the first group 61A elementary steps. The second track 86b choice of elementary steps usually has the shape of a letter L, in which the second section is narrower than the first section to bypass the first track 86a choice of elementary steps, which is narrower than the wider section of the second track 86b choice of elementary steps.

The first and second tracks 86a, 86b choice of elementary actions is usually at least pass horizontally together with the first and second groups 61A, 61b of elementary actions and is connected with its connection pads 74, located on the horizontal edge 53, which is nearest to the first and second tracks 86a, 86b of the choice of basic operations.

Fourth Proc. of the SSA 86d choice of elementary actions runs horizontally along the fourth group 61d choice of elementary actions and overlaps a portion of the conductor 57b resistor heater (Fig.9), which are connected with resistors 56 of the heater of the fourth group of the choice of the elementary actions, and are connected via an interlayer holes 58 with these conductors 57b resistors of the heater. The third track s choice of elementary steps includes the section that runs along the third group 61C elementary actions, and overlaps a portion of the conductor 57b resistor heater (Fig.9), which are connected with resistors 56 of the heater of the third group 61C elementary actions, and are connected via an interlayer holes 58 with conductors 57b resistors of the heater. The third track s choice of elementary steps includes an additional section, which runs along the fourth route 86d choice of elementary steps. The third track s choice of elementary steps usually has the shape of a letter L, in which the second section is narrower than the first section to circumvent the fourth track 86d choice of elementary steps, which is narrower than the wider section of the third track s choice of elementary steps.

The third and fourth tracks s, 86d choice of elementary actions are usually held horizontally with the third and fourth groups 61C, 61d of elementary actions and is connected with its connection pads 74, located on the horizontal edge 54, which is nearest to the third and fourth what ertai tracks s, 86d choice of basic operations.

Route 86a, 86b, C, 86d choice of basic operations for the column matrix 61 forming droplets of ink overlap control circuit on FRIDAY and the bus lands associated with the column matrix forming droplets of ink, and are in the area, which runs horizontally together with the associated column matrix 61. Thus, four route choice elementary operations for the four basic operations column of the matrix 61 forming droplets of ink are along the matrix to the ends of the substrate of the printhead. The first pair of tracks choice of basic operations for the first couple of groups 61A, 61b of elementary actions located on one half of the length of the printhead substrate, is in the area, which runs along the first pair of groups of elementary actions, while the second pair of tracks choice of basic operations for the second pair of groups 61C, 61d of elementary actions located on the other half of the length of the substrate of the printhead is in the area, which runs along the second pair of groups of elementary actions.

Route 86 choice of elementary actions and associated rail land, which electrically connect the resistors 56 of the heater and associated drive circuits 85 bundles with connection pads 74, referred to as tracks the s supply. Also tracks 86 choice of elementary actions can be referred to as vysokotochnye or ungrounded track power.

Usually parasitic resistance (or resistance to inclusion) of each of the control circuits 85 on FRI configured to compensate the change of the parasitic resistance, made in the various control circuits 85 on FRI parasitic route, educated routes power to reduce the change of energy supplied to the heater resistors. In particular, the routes of power form a parasitic route, which makes the parasitic resistance in the circuit on FRIDAY that varies with location in the route. Parasitic resistance of each of the control circuits 85 on FRI chosen so that the Union of the parasitic resistance of each drive circuit 85 on FRIDAY and parasitic resistance tracks power as applied to the control circuit on FRI changed only slightly from one shaper drops of ink to another. Since the resistors 56 heater have the same resistance, the parasitic resistance of each drive circuit 85 on FRI configured to compensate the change of the parasitic resistance associated tracks power as applied in various control schemes 85 on FRIDAY. Thus, essentially the same energy serves the camping in the connection pads, United slopes in power, and essentially the same energy can be supplied in different resistors 56 of the heater.

Each of the control circuits 85 (figure 9 and figure 10) on FRI contains a number of electrically connected pins 87 drain electrodes located above the pins 89 area drain formed in a silicon substrate street 111A (figure 5). Many of electrically connected pins 97 source electrodes alternate with the electrodes 87 runoff and positioned above the pins 99 region of origin, formed in the silicon substrate street 111A. Polysilicon pins 91 of the shutter, which are connected at their respective ends, are located in the thin oxide layer 93 of the gate, formed on a silicon substrate street 111A. Layer 95 phosphorothioates glass separates the electrodes 87 drain electrodes 97 source from a silicon substrate street 111A. The set of conductive contacts 88 drain electrically connect the electrodes 87 drain regions 89 runoff, while the set of conductive contacts 98 source electrically connect the electrodes 97 source area 99 of the source.

The area occupied by each control scheme on FRI, is small, and the resistance of the inclusion of each of the control circuits on the PT is low, for example less than or equal to 14 or 16 Ohms, i.e. no more than 14 or 16 Ohms, which requires effective management schemes on FRI. For example, the resistance of on the Ron can be associated with the region And the drive circuit on FRI as follows:

Ron <(250,000 Ohms·micron2)/A

where a region And is represented in microns2(μm2). This can be accomplished, for example, by using the oxide layer 93 shutter, having a thickness which is less than or equal to 800 angstroms (i.e., not more than 800 angstroms), or the length of the shutter, which is less than 4 μm. The presence of the resistor heater at least 100 Ω allows to produce circuits on FRI smaller than if the heater resistors have a lower resistance as with a larger value resistor heater greater resistance to the inclusion of PT can be prevented from taking into account the energy distribution between parasite resistance and the resistors of the heater.

As a concrete example, the electrodes 87 of the drain region 89 of the drain electrodes 97 source region 99 polysilicon source and the pins 91 of the shutter can be held perpendicular or transverse to the reference axis L and in the longitudinal direction of the tire 181 of the earth. For each scheme 85 on FRI length fields 89 drain regions 99 source across the reference axis L is the same as the length of the pins of the shutter across the reference axis L (6), which limits the length of the active regions across the reference axis L. the length of the pins 87 electrodes of the drain pins 89 region of the drain pins 97 source electrodes, pins 99 field source and polysilicon pins 91 of the shutter can abominates the horizontal length of these elements, because these elements are long and narrow.

Resistance to enable each of the circuits 85 on FRI separately configured using control horizontal length constantly contactaremos segment pins area runoff, which constantly contactitems segment is devoid of electrical contacts 88. For example, constantly contactarme segments of the pin area of the flow may begin at the ends of fields 89 runoff, which are the most remote from resistor 56 of the heater. Resistance include a specific schema 85 on FRI increases with increasing the length of constantly contactaremos segment pin area runoff, and this length is chosen to limit the resistance to the inclusion of specific schemes on FRI.

As another example, the resistance of the inclusion of each scheme 85 on PT can be configured by selecting the size of the scheme on FRI. For example, the length of the scheme on FRI across the reference axis L may be chosen to limit the resistance of inclusion.

In an embodiment, in which the route-specific power circuit 85 on FRI traced with reasonable aimed routes in the connection pads 74 on the next split the ends of the structure of the printhead, the parasitic resistance increases with increasing distance from blijaishih the end of the printhead, and the resistance of the enable control circuit 85 on FRI decreases (making the scheme more efficient FRI) with increasing distance from this nearest end to compensate for the increase of the parasitic resistance of the track power. As for constantly contactitem segments of pin flow control circuit 85 on FRI, starting at the ends of the pins of field runoff and are the most distant from the resistors 56 of the heater, the length of such segments decreases with increasing distance from the nearest pin horizontally split ends structure of the printhead.

Each bus 181 earth formed from the same thin-film metallization layer as the electrodes 87 drain electrodes 97 source circuits 85 on FRI, active areas of each of the schemes on FRI consist of regions 89, 99 source and drain, and polysilicon gates 91 are predominantly bottom-bound bus 181 of the earth. This allows the bus lands and matrix schemes on FRIDAY to take a more narrow area, which in turn allows you to get thinner and therefore less expensive the thin film substructure.

In a variant, when ever contactarme segments pins area runoff begin at the ends of the pins area runoff, which are the most remote from resistor 56 of the heater, the length of each bus 181 land across or horizontally relative to the nutrient reference axis L and to the associated resistors 56 of the heater can be increased, when the length of constantly contactitem sections of pins runoff increases, because there is no need to extend the drain electrodes through these constantly contactarme section pins runoff. In other words, the width W of the tire 181 land can be increased by increasing the length to which the tire land overlaps the active area of the control circuit 85 on FRI, depending on the length of constantly contactitem segments of the field runoff. This is achieved without increasing the width of the area occupied by the bus 181 land and associated matrix control circuit 81 on FRIDAY, as the increase is achieved by increasing the overlap length between the bus of the earth and the active regions of the control circuit 85 on FRIDAY. Really in any particular scheme 85 DC bus of the earth may overlap the active area across a support axis L, in essence, by changing the length contactitem segments regions of the flow.

In an embodiment, in which constantly contactarme segments of the field of flow begin at the ends of the pins area runoff, which are the most remote from resistor 56 of the heater and in which the lengths of these constantly contactitem segments area of the flow decreases with increasing distance from the nearest end of the structure of the printhead, modulation or changing the width W of the tire 181 of the earth by changing the length constantly some of tactilely segments of the field drain is provided for bus earth, having a width W181, which increases when approaching the nearest end of the structure printhead (Fig). Because the value of joint currents increases when approaching the connecting contact pads 74, this form provides a reduced resistance tires earth when approaching the connecting contact pads 74.

The resistance of the tires of the earth can also be reduced by using horizontally appropriate parts bus 181 land horizontally divided between logic decoder 35. For example, such parts can be held horizontally outside the active areas on the width of the area in which the generated logic circuit 35 of the decoder.

The following diagram parts associated with the column matrix forming droplets of ink may be located in areas having a width which is indicated at 6 and Fig pointers that follow widths.

Areas that contain:Width
Conductors, resistors 57About 95 microns (μm) or less (W57)
Scheme 81 on FRINot more than 350 μm, or not more than 220 μm, for example (W81)
Logic decoder 31About 34 μm or less (W31)
Route 86 choice is a basic action About 290 microns or less (W86)

This width is measured across the horizontal extent of the substrate of the printhead, which is located along the same line as the reference axis L.

Figure 11 presents a General view of the inkjet printing device 20, which can be used above the heads. Inkjet printer 20 includes a chassis 122 located in the housing or casing 124 of a molded plastic material. Chassis 122 is formed, for example, from sheet metal and includes a vertical panel a. Sheets of print media loaded separately through the print zone 125 using adaptive system 126 for the loading and unloading of printed media, which includes the boot tray 128 for storing print media before printing. Print media may be any type, such as paper, card stock, transparencies, Mylar (plastic) and the like, but for convenience is represented on paper as a printing medium. The series is driven by electromotor of rollers, including roller 129 of the actuator driven by the stepper motor, can be used to move the print media from the input tray 128 in the print zone 125. After printing roller 129 of the actuator delivers the printed sheet into a pair of retractable in the original wing elements 130 drying, which depicted stretched out to receive the printed sheet. Elements 130 support the newly printed sheet in a short time over any previously printed sheets still drying in an output tray 132 before cleaning rotary manner to the sides, as shown curved arrows 133 to drop the newly printed sheet into the output tray 132. The system of loading and unloading of printed media may include a number of regulatory mechanisms for adapting the different sizes of print media, including the format of "letter"format "standard", format a-4, envelopes, etc. such as sliding bracket 134 adjust the length and the slit 135 loading envelope.

The printer (11) further comprises a controller 136 of the printer in the form of a microprocessor located on a circuit Board 139 supported on the rear side of the vertical panel a chassis. The controller 136 of the printer accepts commands from the host device, such as a personal computer (not shown), and controls the operation of the printer, including the promotion of print media through the print zone 125, move the print carriage 140 and the flow of signals in the formers 40 drops of ink.

The rod 138 of the slide the print carriage having a longitudinal axis parallel to the axis of the scanning carriage supported by the chassis 122 to smenaema size to support the print carriage 140 for reciprocating motion or scanning along the scanning direction of the carriage. The print carriage 140 supports the first and second replaceable cartridge 150, 152 printhead (each of which is sometimes referred to as "pen", "print cartridge" or "cartridge"). Print cartridges 150, 152 contain their print heads 154, 156, which are usually turned down nozzle to eject the ink down on the part of the printed media, which is in the area 125 print. Print cartridges 150, 152 are clamped in the print carriage by using a latch mechanism which includes a locking lever, the latch elements or terminators.

Print media is moved through the zone 125 print along the axis of the carrier parallel to a tangent of a printed media, which is at the bottom and crossed the cartridge nozzles 150, 152. If the axis of the carrier and the axis of the carriage were located in the same plane (11), they would be perpendicular to each other.

Protivovrashchatelnogo mechanism on the reverse side of the print carriage is engaged with gorizonalno located protivoavarijnoj beam 185, which is formed as a single unit with a vertical panel a chassis 122 in order to prevent the forward rotation of the print carriage 140 around the rod 138 of the slider.

The print cartridge Assembly 150 is monochrome print cartridge, while the print cartridge 152 is one who by the tri-color print cartridge.

The print cartridge Assembly 140 is driven along the rod 138 of the slide using an endless belt 158, which may be operated in the traditional way, and strip 159 barcode encoder is used to detect the position pechatayutsya carriage 140 along the scanning direction of the carriage.

1. Inkjet printhead containing

the substrate (11) printhead, comprising many thin-film layers

three nearby column of the matrix (61) shapers (40) drops formed in the printhead substrate and extending along the longitudinal axis,

each column of the matrix formers drops provides ink droplets of different colors and has at least 96 shapers drops, split step R shaper drops,

mentioned columnar matrix formers drops are separated from each other by a distance not more than 1060 µm,

shapers drops are designed to create droplets of ink having a volume of an ink droplet, which provides multi-pass printing resolution, equal to not less than 1/(2P) dots per inch along the axis of the print parallel to the horizontal direction,

three column matrix (81) control circuit (85) on FRI, formed in the substrate of the printhead that are Smin the mi column matrix formers drops for power supply in the column matrix formers drops.

2. Printhead according to claim 1, characterized in that R is in the range of 1/300 to 1/600 of an inch.

3. Printhead according to claim 1, characterized in that the formers drops is configured to form droplets with a volume of 3 to 7 picolitres.

4. Printhead according to claim 1, characterized in that each of the shapers drops contains a resistor (56) a heater having a resistance that is at least 100 Ohms.

5. Printhead according to claim 1, characterized in that it further comprises bus lands that overlap the active region of the control circuits on FRI.

6. Printhead according to claim 1, characterized in that each of the control circuits on FRI has a resistance of inclusion that is less than 250,000 Ohms·μm2)/A, where a is the area of this control scheme on FRI in μm2.

7. Printhead according to claim 6, characterized in that each of the control circuits on FRI has a thickness of oxide (93) shutter, which is equal to not more than 800 Å.

8. Printhead according to claim 6, characterized in that each of the control circuits on FRI is the length of the shutter, which is less than 4 microns.

9. Printhead according to claim 1, characterized in that each of the control circuits on FRI has a resistance switching is not more than 14 Ohms.

10. Printhead according to claim 1, characterized in that each of these schemes on FRI has resistance, good discharge performance is e include no more than 16 Ohms.

11. Printhead according to claim 1, characterized in that it further comprises the track power (86a, 86b, C, 86d, 181), and the control scheme on FRI configured to compensate for parasitic resistance made tracks power.

12. Printhead according to claim 11, characterized in that the respective resistance of the inclusion of the mentioned schemes on FRI chosen so as to compensate the change of the parasitic resistance made tracks power.

13. Printhead according to clause 12, wherein the size of each of the schemes on FRI chosen so as to set the resistance enabled.

14. Printhead according to clause 12, wherein each of the circuits on FRI contains electrodes (87) flow area (89) drain contacts (88) drain electrically connecting the said electrodes runoff from the mentioned areas of the drain electrodes (97) of the source region (99) source, contacts (98) source, electrically connecting the electrodes of the source area source, and area drain configured to set the resistance of the inclusion of each of the schemes on FRI in order to compensate for the change in the parasitic resistance made tracks power.

15. Printhead according to 14, characterized in that region of the flow contain elongated area of flow, and each contains constantly contactitems segment, the ima is the overall length, sufficient to set the resistance enabled.

16. Printhead according to claim 1, characterized in that each column of the matrix control circuits on PT is in the region having a width that is equal to not more than 220 microns.

17. Printhead according to claim 1, characterized in that each column of the matrix control circuits on PT is in the region having a width that is equal to not more than 350 μm.

18. Printhead according to claim 1, characterized in that the substrate of the printhead has a length LS and width WS and LS/WS more than 2,7.

19. Printhead according to clause 16, wherein WS is equal to about 4200 ám.

20. Printhead according to clause 16, wherein WS is equal to about 3400 microns.



 

Same patents:

The invention relates to the technique of inkjet printing and can be used in inkjet printers and other printing devices

Microinjector // 2146621

FIELD: jet printing.

SUBSTANCE: device 100 has three column matrices 61 of drop emitters, configured for multi-pass color printing with printing resolution, having a step of carrier axis points, which is less, than step of columnar nozzles of ink drop emitters. Jet printing head has resistors of high resistance heater and effective control circuits, which are configured to compensate alteration of parasite resistance, caused by power routes (86a, 86b, 86c, 86d).

EFFECT: compactness of jet printing head with large number of ink drop emitters.

20 cl, 11 dwg

FIELD: printing devices.

SUBSTANCE: cartridge comprises compact structure of electrical connections, which includes a number pairs of matrix-columns of electrical contact areas arranged over the back side of the cartridge and connected with the droplet generators.

EFFECT: enhanced reliability.

13 cl, 18 dwg

FIELD: typewriters, printing devices; drop precipitation components, drop precipitation plates with nozzles.

SUBSTANCE: the method for forming a component of plate contains operations: forming of the body using first material, where aforementioned body has periphery, forming of the cover using second material, around the aforementioned body, in such a way that the cover extends at least across a part of the periphery of aforementioned body, and forming of the nozzle, which passes through aforementioned body. The method for forming a plate, when the plate with nozzles is limited to the plane of plate with nozzles and contains a plate, which has at least one layer of plate with nozzles and a set of nozzles, where each nozzles passes through plastic placed within an aperture in the plate with nozzles, contains operations for forming a set of individual bodies of polymeric material, distributed across the plane of plate with nozzles, and forming of at least one metallic layer of plate with nozzles by galvanoplastic application around aforementioned bodies of polymeric material. The method for forming a component of the plate contains following operations: creation of a layer of first photo-resistive material on a substrate, selective development and removal of photo-resistive material on the substrate to form a mesh of separate bodies of first material on the substrate, creation of first metallic cover around aforementioned bodies to form metallic plate with nozzles, having apertures, each one of which contains a body of aforementioned first material, and creation of a nozzle, which passes through each body.

EFFECT: an improved method is suggested for manufacturing the component meant for usage in a device for drop precipitation.

3 cl, 12 dwg

FIELD: power engineering.

SUBSTANCE: device comprises housing structure that defines the central plane, a number of passages for discharging droplets that pass through the housing structure parallel to the central plane, nozzle for discharging droplets, means for generating sound wave within the passage, and collector that is extended throughout the housing structure parallel to the central plane and perpendicular to the passages. The passages passing through the central plane are shifted perpendicular to the central plane with respect to the adjacent passages. Each nozzle is in communication with the appropriate passage. The collector crosses the passage so that the reflection coefficient of the sound wave of the boundary between each passage and collector is the same for all passages. According to the second version, the device has first group of passages shifted with respect to the central plane in the first direction perpendicular to the central plane, second group of passages shifted with respect to the central plane in the second direction perpendicular to the central plane, and drives. According to the third version, the device has additional means for generation of sound wave and discharging droplet through the nozzle. The collector intersects each passage of the first group whose reflection coefficient differs from that of the second group of passages, first circuit for generating first exciting signal that excite the passages of the first group, and second exciting circuit for generating the second exciting signal that excites the passages of the second group. The first and second group of passages are excited alternatively.

EFFECT: improved design.

21 cl, 21 dwg

FIELD: production methods; jet printing.

SUBSTANCE: method of high speed creating of multicolor printings during steam processing is foreseen: providing as minimum two steam printings heads, working on high operational frequency, and the printing heads, working on high operational frequency, allow to process the ink with phase changing; providing as minimum two kinds of oil going trough them, and the passing of the base under the printing heads with the speed of 1000 foots per minute; where on the base is formed as minimum one illustration during the process of steam processing. The method of providing high speed, resistant to coloring and other surfaces under the touching of print during the process of material steam processing with using of inks with phase changing is overseen: the providing as minimum one set of printing heads, allowing to use ink with phase changing, with frequency 20kHz, the material providing; the providing of the system for transporting of the material, which allows to transportate the material under the printing heads; providing of great amount of inks with phase changing; transportation of material over the printing head sets with the speed 1000 foots/minute, ejection of ink as minimum from two printing heads to the material, for illustration forming. The method of providing high speed, resistant to coloring and other surfaces under the touching of print during the process of material steam processing with using of inks with phase changing is overseen: the providing as minimum one set of printing heads, allowing to use ink with phase changing, with frequency 20kHz, providing of porous material; providing of transportational system of material, which allows to transportate the material under the printing heads; providing of great amount of inks with phase changing; transportation of material over the printing head sets with the speed 1000 foots/minute, ejection of ink as minimum from two printing heads to the material, for illustration forming; on the stage of ejecting of inks its formed the illustration, which has up to 200 points/printing head/ liner inch.

EFFECT: under the decreasing of the costs it is decreasing the amount of trash and increased the efficiency.

33 cl, 1 dwg

FIELD: technological processes, typography.

SUBSTANCE: method for making components for jet printing head consists of the following stages: making case, with upper surface, making several apertures in the indicated upper surface, passing into the case, and an actuating structure inside each of the apertures. Each actuating structure remains fixed to the body frame during operation. The actuating component for the jet printer with formation of drops under request, has a case with an upper surface, an aperture in the upper surface, passing into the case along the axis of the aperture, a convex actuating structure inside the aperture, and electrodes, which are positioned such that, they can apply a field to the actuating structure in such a way that, the actuating structure is deformed. Electrical voltages applied to the walls do not give rise to deviation of the walls and emission of drops through the nozzle.

EFFECT: fast propulsion, without loss of accuracy and piezoelectric material settles uniformly, actuating mechanisms have same channel separation along matrix.

36 cl, 69 dwg

FIELD: machine-building.

SUBSTANCE: invention related to flowing media ejection device and to the device control electrical chain. Half-conductor system contains an undercoat, which has first surface, first insulation material, located on at least the first surface segment, and first insulation material contains many holes, which forms a route to the first surface, a first conducting material, located on the first insulation material, in a way that many holes basically are free of the first conduction material, a second insulation material, located on the first conduction material and partly on the first insulation material, in a way that many holes basically are free of the second insulation material, and second conduction material, located on the second insulation material and inside of the many holes, in a way that some part of the second conduction material, located on the second insulation material, has electrical contact with the undercoat.

EFFECT: invention has higher technical requirements at manufacturing cost decrease.

60 cl, 9 dwg

FIELD: printing industry.

SUBSTANCE: head for jet printing device comprises base, having inlet channel for ink, ejection outlet hole to eject ink supplied through inlet channel, flow area, which provides for fluid medium communication between inlet channel and ejection outlet hole. Additionally flow area includes the first flow formed near base and the second flow formed along the first flow at side opposite to base relative to the first flow. Width of the first flow differs from width of the second flow in plane of section perpendicular to direction of ink flow. Besides, between the first flow and the second flow there is a stepped section.

EFFECT: invention provides for structural design of head, in which channels are suitable in resistance to flow of ink, have satisfactory thickness of side walls, making it possible for neighbouring channels to eject various amounts of ink.

7 cl, 19 dwg

FIELD: printing.

SUBSTANCE: reference element is formed of a material which contains a mixture of first resin and second resin, which structural formula is different from the first resin, and is moulded between the feeding element and the substrate of the ejecting element, so that is an integral part of the feeding element.

EFFECT: head for ejecting fluid and method of its manufacture provide the ability to compound the reference element and an element for supplying ink with high impermeability and low probability of delamination, ie with high affinity to each other.

19 cl, 17 dwg, 2 tbl

FIELD: process engineering.

SUBSTANCE: ink-jet printer ink ejection head has power supply conductor, hear conductor and excitation circuit conductor arranged to the left of ink feed port. Said conductors may be arranged using a portion of jumper located to separate feed ports. Besides, multiple feed ports are configured to feed ink and pressure chambers and separated by means of jumpers. Thus, ejection opening may be located on both sides of said feed ports. Conductor connected heater with poser supply conductor or excitation circuit is also located in jumper portion making a separation baffle for feed ports.

EFFECT: dense configuration of pressure chambers and ejection openings, optimum sizes of heaters.

12 cl, 49 dwg

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