Microcooling device

FIELD: cooling equipment, particularly heat exchange apparatuses.

SUBSTANCE: device to remove heat from heat-generation component includes coolant stored in liquid coolant storage part, heat absorbing part including at least one the first microchannel and installed near heat-generation component. Heat absorbing part communicates with storage part. Liquid coolant partly fills microchannel due to surface tension force and evaporates into above microchannel with gaseous coolant generation during absorbing heat from heat generation component. Device has coolant condensing part including at least one the second microchannel connected to above coolant storage part separately from the first microchannel, gaseous coolant movement part located near heat-absorbing part and condensing part and used for gaseous coolant movement from the first microchannel to the second one. Device has case in which at least heat-absorbing part is placed and heat-insulation part adjoining heat absorbing part to prevent heat absorbed by above part from migration to another device parts.

EFFECT: reduced size, increased refrigeration capacity, prevention of gravity and equipment position influence on device operation.

22 cl, 4 dwg

 

The SCOPE of the INVENTION

The present invention relates to microgastrinae device for removal of excessive heat, and more particularly to microgastrinae device for electronics products, which produces excess heat, despite the small size of the product, for example, the integrated circuit device.

A BRIEF description of the prior art

Due to the significant amount of heat produced by the device of the integrated circuit, such as the recently developed Central processing unit (CPU), the device itself and installation, containing, tend to degrade the reliability of the product. In particular, in the semiconductor device on a number of parameters affects the working temperature, so that their values change, thereby providing the device with the problem of violation of the characteristics of the integrated circuit.

One of the typical ways of solving the aforementioned problems is the use of a fan for forced cooling of the device. However, the above method has its own problems, such as low cooling capacity, the introduction of an additional source that generates heat, such as electric power source for the fan, and the additional heat generated by the fan.

In another way, having the m higher cooling capacity, is the removal of heat by the phase change of liquid material (“refrigerant”). In other words, the liquid material used as the refrigerant passes the source, produce heat, and turns into gas for heat dissipation due to the energy of evaporation, which is very widely used in refrigerators and air conditioners. The problem with this method is that different equipment must be installed for condensing vaporized (or gaseous) refrigerant, so that the weight of the entire installation and energy consumption increase.

Known cooling device of very small size, the so-called “heat pipe”, which uses the phase changes of liquid material and the phenomenon of natural convection. Even if there are different types of heat pipes, heat pipe of the double pipe having an inner and outer tubes, is an efficient cooling device. In the double pipe type refrigerant fills the outer tube and the inner wall of the pipe has many small holes in order to form the passage in the outer tube from the inner part of the inner pipe. When heat from a heat source is transferred to the outer tube, the refrigerant in the outer pipe turns into a gas by absorbing heat, and evaporated hedge the t enters the inner pipe through the holes in the inner tube. The gas in the inner tube then moves to the opposite end of the inner tube under the action of the difference between the lifting force and air pressure. At the opposite end of the inner pipe, the refrigerant condenses to a liquid. The fluid flows through the holes in the inner pipe into the outer pipe and in the end returns to its original place for the refrigerant (see Reference exchangers, transl. edited Aguardiente, volume 2, Moscow, ENERGOATOMIZDAT, 1987).

Heat pipe manufactured by the aforementioned method, is small and has a high cooling capacity. However, since the movement of the gaseous refrigerant in the pipe depends on the difference between the lifting force and the air pressure and the movement of the liquid refrigerant depends on gravity, there is a limitation in the installation location or the location of the heat pipe. In addition, since the heat pipe shall be so designed, in which the refrigerant is condensed at the opposite end from the source that generates heat, as the size of the heat pipe becomes smaller, its cooling capacity is reduced and its efficiency deteriorates.

SUMMARY of the INVENTION

In this regard, the present invention is solving the above-mentioned problems of the conventional refrigeration devices, and create microgastrinae device, which can be made very small, but very high performance cooling.

In addition, another objective of the present invention is to provide a refrigeration device, high performance, no restrictions on the location of the machine or its location, which is not subject to gravity.

In order to solve the above-mentioned objectives of the present invention created a refrigerating device which removes heat generated by the source, produce heat, and the specified refrigeration unit contains refrigerant in the specified refrigeration device; a part for storing the refrigerant, which stores the specified liquid refrigerant; a portion for absorbing heat, containing at least one microchannel, and located near the source, produce heat, and connected with a part that stores the refrigerant and the liquid refrigerant partially fills the microchannel due to surface tension and evaporates, passing into the gaseous refrigerant in the specified microchannel absorption heat source that generates heat; part for condensing the gaseous refrigerant in which the condensation is carried out, and this part for condensing the refrigerant comprises at least one microchannel connected with shown is a part for storing refrigerant separately from the specified microchannel portion to absorb heat; part, which moves gas located near the part to absorb heat, and the parts in which the condensation, and which is the passage through which the refrigerant gas moves from the microchannel parts for heat absorption in the microchannel part for condensing the refrigerant; a housing that contains at least the portion to absorb heat, and the device according to the invention includes a part for thermal insulation adjacent to the part to absorb heat, to prevent transfer of heat absorbed by the heat absorption in the other zones. The housing can be made of a semiconductor material, layered material, metal, metal alloy, ceramic material or a crystalline material. Preferably, the microchannel is made in the range of approximately 10-9m to about 10-3m in width and in the range from about 0.5 cm to about 5 cm in length. The microchannel has at least one protuberance on its inner surface, making the cross-sectional area of the microchannel becomes smaller toward the part, which moves on the gas. Specified, the bump can be formed on the inner surface of the microchannel portion to absorb heat. Preferably specified microca the al part for condensing the refrigerant has at least one protuberance on its inner surface, making the cross-sectional area of the microchannel portion for condensation of the refrigerant is reduced in the direction from the portion which moves the gas to the specified part for storing the refrigerant. Specified, the bump can be formed on the inner surface of the microchannel portion for condensing refrigerant.

Specified microchannel portion for condensing refrigerant has at least one flattened taper portion on its inner surface, making the cross-sectional area of the microchannel portion for condensation of the refrigerant is reduced in the direction from the portion which moves the gas to the specified part for storing refrigerant.

The volume of parts for condensation is greater than the volume of the part to absorb the heat.

Preferably on the outer surface of the housing adjacent to the part for condensing refrigerant formed ribs. Moreover, the ribs can be made of thermoelectric element, and microtriode made with microfibre. Also on the inner surface portion for condensation according to the invention can be performed set of edges, and on the inner surface of the part to absorb the heat made many microcannular.

In the refrigeration device according to the invention before the provided microwave generator for supplying microwave energy to the refrigeration device.

It is expedient to provide on the inner surface of the microchannel specified parts for condensing refrigerant've done many microcannular. Also preferably, a specified part for absorbing heat and a specified part for condensing refrigerant formed on the same plane XY, and also insulated from one another.

Preferably the part for heat absorption and condensation of the refrigerant insulated from one another by parts for heat insulation. While the microchannels for heat absorption is formed in the form of curves.

The refrigeration device according to the invention provides high performance regardless of the place of installation and its location.

BRIEF DESCRIPTION of DRAWINGS

Tasks and aspects of the invention will be apparent from the following description of embodiment with reference to the accompanying drawings, on which:

figure 1 depicts a schematic view in section to illustrate the cross-section plane XZ of the refrigeration device in accordance with the design of the present invention;

figure 2 depicts a view in section for illustration of the refrigeration device shown in figure 1, as it can be seen from the line a-a';

figure 3 is an enlarged schematic view to illustrate one of microca the Alov in part, in which absorbed the heat of the refrigeration device shown in figure 1; and

4 is a view in section to illustrate the cross-section plane XZ of the refrigeration device 100' according to another design of the present invention.

DETAILED description of the INVENTION

Now will be described the embodiment of the present invention with reference to the accompanying drawings. Figure 1 depicts a schematic view in section to illustrate the cross-section plane XZ of the refrigeration device in accordance with the design of the present invention. Refrigerating device 100 according to the present invention includes a portion 102 for storing liquid refrigerant, which stores the refrigerant (indicated by the wavy patterns on the drawing), and the portion 106 to absorb heat, which is located near the part 102, which stores the refrigerant, and near the source that produce heat (not shown). Part 106, in which heat is absorbed, includes many of the microchannels 114 (shown with oblique lines in the drawing). The refrigerant stored in the part 102 for storing refrigerant, partially fills the microchannels 114 under the action of surface tension of each of the microchannel in accordance with the phenomenon of capillarity.

Refrigerating device 100 according to the present invention additionally VK is uchet part 104, which moves the gas located across part 102, which stores the refrigerant, and is separated from that part 106, in which heat is absorbed. Refrigerating device 100 also includes a portion 108, which is used for insulation, located adjacent to the part 106, in which heat is absorbed, in order to prevent heat transfer to other parts. The refrigeration unit also includes a portion 110, in which the condensation located across parts 106, in which heat is absorbed and separated in the direction of the Z axis part 108, which is used for insulation.

Preferably, the part 102, which stores the refrigerant portion 106, in which heat is absorbed, part 104, which moves gas, part 108, which is used for insulation, and part 110, in which the condensation formed in the housing 112, which forms an embodiment of the refrigeration device 100 according to the present invention.

In order to more accurately describe the geometric structure of the structural design of the present invention, figure 2 shows a view in section of the refrigeration device 100 of figure 1, as it can be seen from the line a-a'. Refrigerating device 100 includes a portion 102, which stores the refrigerant, which is separated in the direction of the axis X from part 104, which moves on the gas, and the portion 106, which is opasaetsya heat inserted between them. As mentioned, many of the microchannels 114 formed in part 106, in which heat is absorbed.

Next, the process operation of the refrigeration device 100 will be described with reference to figures 1-3. As shown in figure 1, the direction of heat transfer is shown with large arrows 120 and 122. The heat produced by an external source, generating heat (not shown), is transmitted to the part 106, which absorbed the heat of the refrigeration device 100. Preferably, to maintain thermal contact between the external source, produce heat, and the outer wall of the housing 112 of the refrigeration device 100, which is located next to the part 106, in which heat is absorbed.

The housing 112 may be made from a variety of materials, including semiconductor materials such as silicon Si or gallium Ga, layered materials, such as single-layer metal Assembly type copper si or aluminum Al, or any alloys, ceramics or crystalline materials such as diamond. In particular, if the external source that generates heat, is a semiconductor device, the cooling device 100 according to the present invention can be made of the same semiconductor material that has been used for semiconductor devices. Refrigerating device 100 according to the present invention, ka is described below, can be made in one piece in one of the following manufacturing processes. Therefore, the cooling device 100 can be made of the same size (for example, several or tens of square centimeters square in the XY-plane), and the external source that generates heat so that thermal resistance of the cooling device 100 of the present invention could be minimized.

As shown in figure 2, heat transferred from an external source, generating heat, is absorbed in part 106, in which heat is absorbed. As shown in figure 2, part 106, in which heat is absorbed, has a multitude of microchannels 114, and the refrigerant stored in the part 102, which stores the refrigerant fills to a predetermined part of the channels 114 due to the phenomenon of capillarity. This is shown in detail in figure 3. As shown in figure 3, which is an enlarged view of a schematic illustration of one of the microchannels 114 part 106, which is absorbed by the heat, the refrigerant fills the space part 102, which stores the refrigerant to the position in the microchannel, designated as “A”.

Position “A”, which is filled with the refrigerant depends on the type of refrigerant and the size of the microchannels 114. In particular, the type of refrigerant may be different depending on the material of the body 112, for which the refrigerant can enter into a chemical reaction with the surface of the microchannels 114 or housing 112. From the point of view of environmental pollution, the preferred may be the new refrigerant, the type is not relevant to the CFC. As the refrigerant that is compatible with the material of the body 112, for example, in the electronics type integrated circuit, can be preferably selected water is H2O or an alcohol, such as methanol or ethanol. High heat capacity of the above-mentioned refrigerant and a small corner of its surface tension with a semiconductor device result in a large flow of refrigerant to transfer a large amount of heat. In addition, there are no problems associated with environmental pollution. Even if there is a defect in the body 112 (e.g., a thin crack on the surface of the hull is very small, the probability that the refrigerant will flow from the housing 112.

In General, although in the latter there is the surface tension, it surpasses the influence of gravity. Therefore, it is difficult to get significant advantage from the surface tension of a macroscopic system. For that it was possible to neglect the influence of gravity, the size of the system decreases. Thus it is preferable that the width of each microchannel 114 corresponding to the cooling device 100 of the present invention, was approximately in the range from 1 nm to 1000 microns, and the length of the channel 114 were p is blithedale in the range from 0.5 to 5, see In addition, the cross-sectional area of each of the microchannel 114 may be formed in the shape of a circle, oval, rectangle, square, polygon, etc. As described below, the cross-sectional area can be increased or decreased in a predetermined direction in order to control the magnitude of the surface tension between the inner wall of the channels 114 and refrigerant.

As described above, if heat is transferred from an external source, generating heat to the microchannels 114 part 106, in which heat is absorbed, filled with refrigerant, small bubbles are produced by evaporation of part of the refrigerant filling the microchannels 114, so that there arises the turbulence of the refrigerant. Such small bubbles and turbulence of the refrigerant produce more small bubbles (not shown) in the microchannels 114. These small bubbles move to part 104, which moves gas that does not contain any refrigerant. As the bubbles move only a distance of a few millimeters, the influence of gravity can be neglected. Therefore, even if part 102, which stores the refrigerant, and part 104, which moves gas, respectively located on upper and lower levels, the bubbles can move to part 104, which moves gas from part 102, which stores ledgent, under the action of pressure drop in parts 106, in which heat is absorbed. The movement of the bubbles will be described in detail below.

The aforementioned movement of the bubbles having a predetermined direction, can be created by the bumps 116 formed on the inner surface of the microchannels 114 in part 106, in which heat is absorbed. In other words, as shown in figure 3, many bumps 116 are on the inner surface of the microchannels 114 in the area near the part 102, which stores the refrigerant. Since the cross-section of the microchannel 114 becomes smaller in the direction to part 104, which moves gas (i.e. in the direction of the axis X), the surface tension becomes larger in this direction. The aforementioned increase in surface tension allows the refrigerant to have that kind of potential energy, which causes the refrigerant to move in the direction from portion 102, which stores the refrigerant to part 104, which moves on the gas. As a result, in accordance with the direction of the potential energy of the refrigerant, a large part of the bubbles formed in the refrigerant tends to move in the direction of the x axis.

As shown in figure 1, part 104, which moves on the gas, initially formed as an empty space. Bubbles are moving from part 106, in which heat is absorbed, part 104, paramoreu moving gas, permeate gases (gaseous refrigerant). As the gaseous refrigerant exits the part 106, which is absorbed by the heat, the refrigerant gas moves to part 110, in which the condensation, due to the pressure drop in the zone adjacent to the part 106, in which heat is absorbed, and part 110, in which the condensation.

When the number of bubbles per unit volume increases the cooling capacity of the refrigeration device according to the present invention. Therefore, it is preferable to increase the possibility of formation of such bubbles. For example, many microcannular (not shown) can be performed on the inner surface of the channels 114 in part 106, in which heat is absorbed. Alternatively, a microwave generator (not shown) may be used to supply microwave energy to the refrigeration device 100 to create small oscillations of the refrigeration device, to thereby increase the formation of bubbles.

Then, the gaseous refrigerant loses its energy evaporation in part 110, in which the condensation is carried out in order to move in the liquid refrigerant. In order to more effectively perform the condensation of the refrigerant, the set of edges (not shown) can be mounted on the outer surface of the body 112 near part 110, in which Khujand is realized condensation. The aforementioned ribs can be made of microscopic size. In addition, for example, if microtriode made with microfibre, the heat taken away from the part 110, in which the condensation, can be recycled to create a circulation of ambient air. Or, if the edge is made of thermoelectric element, the heat taken away from the part 110, in which the condensation can be transformed into electrical energy, which can be used for other electronic devices. In addition, according to another design of the present invention, part 110, in which the condensation can be made larger than that of the part 106, in which heat is absorbed (for example, approximately 10 times) for convection in the atmosphere could also be used for condensing gaseous refrigerant. In addition, microrubra can be formed on the inner surface of the part 110, in which the condensation is carried out, thereby increasing the efficiency of condensation of the refrigerant.

In part 110, in which the condensation of the gaseous refrigerant is condensed and collected as a liquid refrigerant. When going a sufficient amount of liquid refrigerant, the liquid refrigerant moving part 102, in which toroi stored refrigerant, through the microchannels formed in part 110, in which the condensation. The condensed refrigerant moving part 102, which stores the refrigerant, under the action of the same principle which was described above. Like the design part 106, in which heat is absorbed, the channel part 110, in which the condensation can include many bumps 118 on the inner surface in the area adjacent to the part 104, which moves on the gas. At the same time, the bumps 118 are formed on the opposite side from the bumps 116 are formed in part 106, in which heat is absorbed. The refrigerant condensed in the liquid returns to the part 102, which stores the refrigerant, thereby completing the circulation of the refrigerant in the refrigeration device 100.

As described above, the circulation of refrigerant in the refrigeration device 100 according to the present invention, is executed independently, without any external driving force, mainly due to the phenomenon of capillarity, by the surface tension of the liquid refrigerant, without the influence of gravity. Because many of the microchannels 114 included in part 106, in which heat is absorbed, the surface tension is greater than the force of gravity in these cases.

Because the present invention applies the phenomenon of microdynamics, there are a number of ways of making Kholodilin the th device 100 according to the present invention. For example, can be used ways MEMS (microelectromechanical system) or MLA (single-layer metal Assembly), or a method of making ultra-precise designs using laser or plasma.

Now will be described another embodiment of the present invention with reference to figure 4, which is a view in transverse section to illustrate the XZ plane of the refrigeration device 100' according to another design of the present invention. As shown in the drawing, the refrigeration device 100' may be implemented as a multilayer structure, as an extension of the single-layer design of the refrigeration device 100.

The circulation of the refrigerant in the refrigeration device 100' is described below. The refrigerant becomes a gas by absorbing heat in the part 100' to absorb heat, and gaseous refrigerant begins to move under the action of the same mechanism, which is described in a single-layer structure of the cooling device 100. Then the same amount of refrigerant, which came out of the part 102', which stores the refrigerant is returned from the portion 110'in which the condensation is carried out, in part 102', which stores the refrigerant, in accordance with the principle of continuity. Gaseous refrigerant is returned to the liquid refrigerant in the portion 110'in which the OS is done condensation, through part 104', which moves gas to compensate for the amount of refrigerant which has entered the part 102', which stores the refrigerant from part 110', which is condensation. Thus, there is a circulation of refrigerant in the refrigeration device 100'.

As shown in the drawing, the refrigeration device 100' differs from the refrigeration device 100 a multilayer structure part 110', which is condensation, but all the basic principles, such as the circulation of the refrigerant, phase transition or heat generation are the same in both refrigeration devices 100 and 100'. Multilayer structure portion 110', in which the condensation, includes many of the microchannels (areas shaded oblique lines) and separated part 108', which is used for insulation. Many bumps 118' formed in order to create characteristics of the movement direction of the refrigerant in the microchannels. Of course, these bumps can be formed on the inner surface of the microchannels in part 110'in which the condensation is carried out, in order to securely hold the predefined characteristics of direction. Just as in single-layer design of the refrigeration device 100, the bumps 116' may also be formed in part 106', which is absorbed by those who lo to characterize the movement direction of the refrigerant.

As described above, multiple layers, in part 110', in which the condensation is formed in order to increase the efficiency of condensation of the refrigerant, thereby increasing the cooling capacity of the refrigeration device 100'.

In accordance with the present invention, provided microgastrinae device having the characteristic of high efficient heat dissipation, which also increases the parameters and reliability of the products with refrigeration device according to the present invention.

When describing specific preferred designs of the invention should be understood that the invention is not limited to those described design, and various changes and modifications can be made therein specialist in this field of technology without going beyond the scope or concept of the invention as defined in the attached claims.

For example, an object of the present invention may be embodied in a cooling device, which includes a separate housing part, which stores the refrigerant, or for the part, in which the condensation, mutually connected with a part in which heat is absorbed through the pipe as with the part in which the moving gas. In this particular design, the size of individual housing may be larger than the part in which heat is absorbed, so that the cooling capacity can be increased.

Alternatively, the above-described part of the refrigeration device according to the present invention, can be formed on a plane, so that the thickness of the cooling device can be reduced. In this particular design, the part in which heat is absorbed, and part, in which the condensation is formed, for example, on the XY plane, and they are insulated from one another by an insulating part, which is also formed on the same XY plane, and are connected to one another by a part that stores the refrigerant, and a part which moves the gas is also formed on the same plane XY.

In addition, the microchannels in the part in which heat is absorbed, can be formed in the form of curved lines rather than straight lines.

1. A refrigerating device which removes heat generated by the source, produce heat, and the specified device contains:

the refrigerant in the specified refrigeration device;

a part for storing the refrigerant, which stores the specified liquid refrigerant;

part for heat absorption, containing at least one microchannel and located near the source, produce heat, and connected with a part, in which x is anicca refrigerant, moreover, the liquid refrigerant partially fills the microchannel due to surface tension and evaporates, passing into the gaseous refrigerant in the specified microchannel, while absorbing heat from a source that generates heat;

part for condensing the gaseous refrigerant in which the condensation is carried out, and this part for condensing the refrigerant contains at least one second microchannel connected to a specified part for storing refrigerant separately from the specified microchannel parts for heat absorption;

part, which moves gas located near the part to absorb heat, and the parts in which the condensation, and which is the passage through which the refrigerant gas moves from the microchannel parts for heat absorption in the microchannel part for condensing the refrigerant;

the building, which contains at least the portion to absorb heat,

moreover, the device includes a portion for insulation adjacent to the part to absorb heat, to prevent transfer of heat absorbed by the heat absorption in the other zones.

2. Refrigerating device according to claim 1, in which the casing is made of a semiconductor material, layered material, metal, metal alloy, ceramic material or cristalli the definition of the material.

3. Refrigerating device according to p. 1, wherein said microchannel is made in the range of approximately 10-9m to about 10-3m in width.

4. Refrigerating device according to p. 3, wherein said microchannel is made in the range from about 0.5 cm to about 5 cm in length.

5. Refrigerating device according to claim 1, wherein said microchannel has at least one protuberance on its inner surface, making the cross-sectional area of the microchannel becomes smaller toward the part, which moves on the gas.

6. The refrigeration device according to claim 5, wherein said protuberance is formed on the inner surface of the microchannel portion to absorb heat.

7. Refrigerating device according to p. 1, wherein said microchannel portion for condensing refrigerant has at least one protuberance on its inner surface, making the cross-sectional area of the microchannel portion for condensation of the refrigerant is reduced in the direction from the portion which moves the gas to the specified part for storing refrigerant.

8. The refrigeration device according to claim 7, wherein said protuberance is formed on the inner surface of the microchannel portion for condensing refrigerant.

9. Refrigerating device according to p. 1, wherein said microchannel parts for air conditioning is ncacii refrigerant has at least one pivoted on a cone portion on its inner surface, making the cross-sectional area of the microchannel portion for condensation of the refrigerant is reduced in the direction from the portion which moves the gas to the specified part for storing refrigerant.

10. Refrigerating device under item 1, in which the volume of parts for condensation is greater than the volume of the part to absorb the heat.

11. Refrigerating device under item 1, in which the outer surface of the housing adjacent to the part for condensing refrigerant formed ribs.

12. Refrigerating device according to p. 11, in which the said ribs are made of thermoelectric element.

13. Refrigerating device according to p. 11, in which microtriode made with microfibre.

14. Refrigerating device under item 1, in which the inner surface portion for condensing performed a set of edges.

15. Refrigerating device under item 1, in which the inner surface of the part to absorb the heat made many microcannular.

16. Refrigerating device under item 1, which provides a microwave generator for supplying microwave energy to the refrigeration device.

17. Refrigerating device under item 1, in which a specified part for absorbing heat and a specified part for condensing refrigerant formed on one and the same Oh the XY plane.

18. Refrigerating device under item 1, in which a specified part for absorbing heat and a specified part for condensing refrigerant formed on the same plane XZ and insulated from one another.

19. Refrigerating device according to p. 18, in which the part for heat absorption and condensation of the refrigerant insulated from one another by parts for heat insulation.

20. Refrigerating device under item 1, in which the microchannels for heat absorption is formed in the form of curves.

21. Refrigerating device under item 1, which provides a high performance regardless of the place of installation and its location.

22. Refrigerating device under item 1, in which the inner surface of the microchannel specified parts for condensing refrigerant done many microcannular.



 

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3 cl, 2 dwg

FIELD: heat transfer equipment, particularly to carry heat for long distances, for instance refrigerators.

SUBSTANCE: heat-exchanging system comprises closed loop including main heat-exchanging channel, heat carrier agent pumping device, additional heat-exchanging channel and heat-carrier supply channel connecting the main and additional heat-exchanging channels. Heat carrier agent pumping device may withdraw heat carrier agent in vapor or vapor-and-liquid state from one heat-exchanging channel and supply above vapor or vapor-and-liquid heat carrier agent under elevated pressure into another heat-exchanging channel. Heat carrier agent supply channel is formed as channel with capillary partition closing the channel. During heat-exchanging system operation the capillary partition obstructs vapor penetration or vapor-and-liquid flow. The vapor penetration obstruction is defined by cooperation between meniscuses and inner surfaces of capillary channels formed in the partition. The vapor-and-liquid flow obstruction is defined by bubble meniscuses cooperation with inner surfaces of capillary channels of the partition. The heat carrier agent pumping device may withdraw vapor or vapor-and-liquid heat carrier agent from any heat-exchanging channel and pump above heat carrier agent under elevated pressure in another heat-exchanging channel.

EFFECT: increased efficiency of heat-exchanging system.

14 dwg, 18 cl

FIELD: applicable for heat abstraction in various media.

SUBSTANCE: the heat transferring device has a sealed pipe with condensation and evaporation zones filled up with a heat-transfer agent with pockets provided on the inner surface, the pockets used for inhibition of draining condensate are located in the evaporation zone and made annular or formed by the sections of the helical surface adjoining the pipe inner wall with its lower edge at an acute angle, which are separated from one another by radial partitions, the annular pocket is formed by the side surface of the truncated cone, adjoining the inner wall of the mentioned pipe with the larger base. Besides, at least some of the pockets located one above other are positioned at such a distance that a capillary effect occurs between the surfaces facing one the other.

EFFECT: enhanced efficiency of heat transfer due to the increase of the pipe surface wettable by the heat-transfer agent, as well as simplified structure an facilitated actuation of the device.

3 cl, 7 dwg

FIELD: chemical and oil industry.

SUBSTANCE: reactor comprises housing, means for supplying initial components and discharging finished product, unit for heating and cooling made of a number of heat pipes, additional catalyzer applied on the heat pipes and/or housing and made of a coating. The heat pipes are staggered in the space of the housing. The total area of the surface of the heat pipes in the catalytic zone should provide heating and cooling the catalytic zone.

EFFECT: enhanced efficiency.

5 cl, 1 dwg

FIELD: electric mechanical engineering, possible use for cooling electric generators and electric engines.

SUBSTANCE: in proposed system for cooling electric machines, containing compressed air source with force pipeline, splitting vortex pipe, having as a result of energy division to hollows - hot one and cold one, thermal pipe made inside the hollow shaft of electric machine, as a special feature, along axis of hollow shaft a tubular channel is made for passage of cold flow from splitting vortex pipe, and space, formed by external surface of tubular channel and internal surface of hollow shaft is thermal pipe, condensation area of which - external surface of tubular channel, and evaporation area - internal surface of hollow shaft.

EFFECT: efficient and even cooling of electric machine, simplified construction, increased manufacturability.

2 dwg

FIELD: control of temperature of spacecraft and their components.

SUBSTANCE: proposed method includes measurement of temperatures in spacecraft temperature control zones, comparison of these temperatures with high and low permissible magnitudes and delivery of heat to said zones at low limits. Heat is delivered by conversion of electrical energy into thermal energy. Power requirements are measured at different standard time intervals of spacecraft flight forecasting orientation of its solar batteries to Sun. Magnitude of electric power generated by solar batteries is determined by forecast results. Measured magnitudes of consumed electric power are compared with forecast data. According to results obtained in comparison, flight time is divided into sections at excess of energy generated by solar batteries over consumed power, equality of these magnitudes and shortage of generated energy. High magnitudes of temperature are maintained at excess energy sections by conversion of difference of generated energy and consumed energy into heat. In case of reduction of generated energy in the course of changing the orientation of solar batteries on Sun, temperature in these zones is reduced to low limits at simultaneous equality of energies. In case of further increase of generated energy, temperature in said zones is increased to high limits at equality of energies. Then, in the course of change of generated energy, temperature correction cycles in temperature control zones are repeated.

EFFECT: avoidance of excess of consumed energy above generated energy of solar batteries.

7 dwg

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