Silicone composition for the manufacture of electrical products

 

The invention relates to the field of electrical insulating equipment, in particular the silicone composition used in the electrical industry for the production of insulating materials and for impregnation of windings of electrical machines and devices. Silicone composition for the manufacture of electrical devices operating at temperatures up to 180C, is a solution in an organic solvent or mixture of solvents polyorganosiloxane, polyester 315, tetramethoxysilane, epoxy resin, rezol tributyltinchloride resin and N-disubstituted polyaminopropyl, in the following ratio, wt.h.: polyorganosiloxane 70,0-80,0; polyester 315 of 12.5-14.5; tetrabutoxide 0.5 to 1.5; epoxy resin 2,5-7,5; rezol tributyltinchloride resin 2,5-7,5; N-disubstituted polyaminopropyl 0,1-0,4; an organic solvent 50,0-68,0. The technical result from the proposed use of the composition is a decrease in the temperature of curing of the composition, increased electric strength, cementing capacity with long-term stability during storage. 1 C.p. f-crystals, 2 tab.

Nastojashem, used in the electrical industry for the production of insulating materials and for impregnation of windings of electrical machines and devices. Scope dictates specific requirements for the source and utverzhdenii compositions, including, for permissible continuous operating temperature, the required duration and minimum temperature drying and curing, stability in storage, as well as the level of the electric characteristics. [K. N. Brembo, L. M. Bernstein. Drying, impregnation and compounding windings of electrical machines. M: Energy, 1967, S. 22-23, 26, 45, 61, 86-89].

It is widely known use of silicone compositions, varnishes, resins, binders in the manufacture of electrical insulating materials and electrical products with operating temperature up to 180[Handbook of electrical materials /Ed. by Y. C. Koritski and others, 3rd ed., so 1. M.: Energoatomizdat, 1986, S. 141-143, 153-155, 158-161, 163, 165, 167-169, 171, 173, 181, 183, 195, 272, 278-294, 301, 321].

Known silicone composition for preparing electrical products containing polyorganosiloxane, oligoether based on terephthalic, isophthalic acids or their dimethyl esters, and polyhydric alcohol is Nata in number, respectively, of 0.16 to 0.70 and 0.64 to 0.70 wt.% per oligoether in the form of a solution in an organic solvent [EN 2071613 C1, 10.01.1997]. The main disadvantage of these compositions is the need to use high temperatures (up to 200-220)With large and duration of the curing process to achieve the desired electrical and mechanical characteristics.

To improve the mechanical characteristics and a reduced duration and lower temperature curing compositions developed domestic impregnating silicone compositions TO-915 [GOST 16508-86] and CO-K [THE 6-02-1-012-89] on the basis of polyorganosiloxane and polyester-based diethylene glycol, maleic anhydride and castor oil (polyester 315).

However, these compositions require high temperature curing (190-200)With and relatively long duration of the process. Closest to the proposed technical substance is a composition used for the manufacture of insulating silicone enamel low temperature drying brand CO-976 [Technological regulations "Fabrication of silicon insulating enamel brand CO-976" 01.I.011210.00004 (1983)].

This silicone composition for the manufacture of electrical products working on the solvent mixture of polyorganosiloxane, polyester 315 and tetraethoxysilane when the ratio of non-volatile components, equal to 84:14:2 wt.h. respectively. As the organic solvent composition contains aromatic hydrocarbons (xylene, toluene), or a mixture thereof, or ethyl cellosolve, or solvent. This composition possesses in dry condition high heat resistance (class H), good moisture resistance and water resistance, excellent electrical properties (dielectric strength, specific volume resistance) as in the initial state and when exposed to high temperatures and moisture. However, the disadvantages of the known compositions should include large energy required for complete curing.

The present invention is to develop a silicone composition having all the advantages known, but require a lower temperature curing at least the duration of the process.

To solve the problem proposed by the present silicone composition for the manufacture of electrical products for operating temperatures up to 180S, representing a solution in an organic solvent or mixture of solvents polili resin and N-disubstituted polyaminopropyl, in the following ratio, wt.h.:

Polyorganosiloxane 70,0-80,0

Polyester 315 of 12.5-14.5

Tetrabutoxide of 0.5-1.5

Epoxy resin 2,5-7,5

Rezol tributyltinchloride

resin 2,5-7,5

- N-Disubstituted polyaminopropyl of 0.1-0.4

Organic solvent or

solvent mixture of 50.0-68,0

Additional content in the proposed composition of epoxy resin, rezol tributyltinchloride resin and N-disubstituted polyaminopropyl when the above ratio of components helped to reduce the curing temperature of the composition to 130-150To reduce the duration of the curing process and to obtain a composition for the manufacture of electrical products without compromising the heat and consumer properties of the composition in comparison with the known lacquer KO-K, CO-915, as well as CO-926 (in the case of manufacturing of glass textolites).

This proposal is illustrated by the following examples.

Example 1 (the prototype). Composition based on silicone lacquer KO-K, tetramethoxysilane and xylene represents a 64% solution in xylene oligomeric bases containing, by weight.h.:

Polyorganosiloxane 75,4

Polk, containing the above amount of polyorganosiloxane and polyester 315 with a solution of 2 wt.h. tetraethoxysilane 6.2 wt.h. xylene.

Characteristics of the composition are given in table.2.

Examples 2-7. The proposed composition is prepared by mixing the components in the amounts indicated in the table.1. Their relative performance is shown in table.2.

Examples 8-11 (control). The control composition is prepared by mixing the components in the amounts indicated in the table.1. Their relative performance is shown in table.2.

Claims

1. Silicone composition for the manufacture of electrical devices operating at temperatures up to 180S, representing a solution in an organic solvent polyorganosiloxane, polyester 315 and tetraethoxysilane, characterized in that it further contains an epoxy resin, rezol tributyltinchloride resin and N-disubstituted polyaminopropyl in the following ratio, wt.h.:

Polyorganosiloxane 70,0-80,0

Polyester 315 of 12.5-14.5

Tetrabutoxide of 0.5-1.5

Epoxy resin 2,5-7,5

Rezol tributyltinchloride resin 2,5-7,5

N-disubstituted floor is the, as the organic solvent contains a mixture of organic solvents.

 

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FIELD: electrical engineering; insulating materials for wires or commutators of electrical machines.

SUBSTANCE: proposed mica base insulating material has mica paper layer, backing of inorganic fiber (glass or basalt), and binders, such as betulinic and adipic acids having molecular mass of 10 000 to 15 000. Such binders of desired molecular mass can be easily produced.

EFFECT: enhanced mechanical strength, heat resistance, and flexibility; facilitated manufacture.

1 cl, 2 tbl, 11 ex

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