Portable data carrier
The invention relates to a compact disc. Its application allows to obtain a technical result in the form of maintaining the operability and reliability of the data carrier. This result was achieved by a portable data carrier contains cantabrana body having a recess for accommodating the chip module, the chip module includes at least one semiconductor chip on the first main side of the carrier chip, connected to cartoonanime body, and contains the contact pin metallization on the second main side of the chip holder, and the holder of the chip is given curve lying within the lateral edges of the recesses, and metallization ends in the confines of a given curve. 6 C.p. f-crystals, 5 Il.The invention relates to a portable data carrier containing cantabrana body having a recess for accommodating the chip module, the chip module includes at least one semiconductor chip on the first main side of the carrier chip, connected to cartoonanime body, and contains the contact pin metallization on the second main side of the chip holder.Such wearable novtel is based card) with an embedded integrated circuit module. These data carriers then called chip cards. Data carriers named species affected when using different loads. Because of the structural characteristics of the body of the card and the chip module on the device can act high bending loads, which depending on the design implementation can lead to failure caused, for example, breakage of the chip or break electrical connections. The susceptibility to failure of such devices depends on the size of the chip, the length of the connection of a flexible metallic conductors between the contact pads of the semiconductor chip and applied materials.Known from the prior art chip-module usually has a holder consisting of epoxy resin. On the first main side of the holder is placed a semiconductor chip, which is connected to the holder, for example by gluing or laminating. On the second main side of the holder opposite the first main side, deposited metallization. Metallization has a contact pin and forms available later outside contacts of the chip module. Typically, the metallization has six or eight electrically separated from each of the contact pins, which connect the ski guides skipped through the holder opening. For mechanical protection of semiconductor chip and a flexible metallic conductors on the first major side posted casting mass which covers the semiconductor chip and the flexible metal conductors. If the media data is subjected to bending loads that occur, for example, in installations for sorting letters when sending mail, it may be damaged. Due to the design, there is a data carrier in the mail envelope affects high kinetic energy, which, on the one hand, due to the high speed, and, on the other hand, frequent changes of direction through the movable roller unit for sorting letters.In order to reduce operating on a data carrier efforts were attempted, namely, to or by increasing the resistance to bending of the module in the semiconductor chip and the area of flexible metal conductors through the use of especially durable coatings, either through the use of stiffening elements, such as frames on the first main side of the carrier chip, direct tensile and compressive efforts on the adhesive connection between the chip module and cartoonanime body of the data carrier. N is to connect the chip module and cartoonizing body, because it is thanks to its elastic properties proved to be particularly preferred.However, when high bending loads can cause damage to the semiconductor chip or wire connections to the chip module.The present invention is to create a portable data carrier, which even under high bending loads would have high reliability.This problem is solved by the characteristics of p. 1 formula.The invention derives from the fact that the bending of the semiconductor chip or the entire chip module the less, the smaller the size of the chip module. As described above, the chip modules or portable data carriers must meet specified standards (ISO), an arbitrary reduction of the chip module, however, is impossible. The invention therefore provides that the holder of the chip is given curve. Since the occurrence of bending loads weakest point, in principle, is possible using a convenient location places the specified curve in the holder semiconductor chip and the electrical connections (flexible metallic conductors) to be placed on a rigid surface. In other words, the invention provides, sledovatel vodnikova chip, but flexible metal conductors.The preferred implementation is given in the dependent claims.In one preferred implementation places the specified bending are located in the area outside the semiconductor chip. More preferably, if a given curve are out covering the semiconductor chip coverage. If a given curve are simultaneously within the lateral edges of the recess, acting on portable media efforts can best be allocated from the semiconductor chip and the electrical connections.In one implementation of the invention places the specified bend formed at least one slot in each contact output metallization, and the slot divides the corresponding terminals in the first and second zones. At least one slot in each contact output weakens the metallization in the area, having a maximum resistance to bending of the entire chip module. The holder of the chip, which, however, is much thicker metallization, has significantly less resistance to bending. Due to this, in the zone of the slots occurs the place of the specified curve.The preferred first and second zones coedine “Electro-Plating” without modifying existing equipment or operations, which is proven and cost effective way. If completely separated from each other by the slits of the first and second zones, the improvement of pins would occur by way of “Electroless Plating”.The preferred way of slots are in the same direction in the respective contact pins, in which the contact pin lie next to each other. The slots adjacent the contact pins are thus on the same axis. This axis is mainly parallel to the side edges of the semiconductor chip. It in any case does not pass through the semiconductor chip. In this case, it would contribute to the destruction of the semiconductor chip.The appropriate jumpers are significantly narrower than at least one slot. Width remaining in the contact output jumpers mainly determines the bending space of the specified curve. The minimum possible width jumpers depends on the requirements of method “Electro-Plating”.Alternatively, the metallization may end up in the confines of a given curve. This means nothing else than that formed by the slot of the first zone contact output disappears.The invention is explained in more detail with the aid lower the moat implementation;- Fig.2: a top view of the metallization of the chip module of Fig.1;- Fig.3: cross section of a second example of the portable data carrier according to the invention; and- Fig.4: a top view of an alternative form of execution of the metallization of the chip module;- Fig.5: portable data carrier, which shows the location of the places specified bending relatively cartoonizing body.In Fig.1 depicts a fragment of the portable data carrier according to the invention. In the recess 2 cartoonizing body 1 in a known manner placed the chip module 3. The chip module 3 consists of a holder 18 of the chip on the first main side 5 which is placed a semiconductor chip 4. On the second main side 6 of the holder 18 of the chip caused the metallization 7. Metallization has a number of pins (not shown), each of which is connected a flexible metallic conductors 11 with the contact pad of the semiconductor chip 4. Flexible metal conductors 11 skipped through holes 19 in the holder 18 of the chip, in order to get into the holes 19 on the contact area. The semiconductor chip 4 and the flexible metal conductors 11 is surrounded by a further coating 10, for example, plastic molding mass. The chip module 3 is connected to the side edges derate, consisting, for example, epoxide, very flexible due to its materials.On the contrary, the metallization 7 consisting, for example, copper has a high resistance to bending. In places metallization, where it is cut, there are, therefore, designated a specified curve. Place 9 of the specified bend formed, therefore, the holder of the chip and special performing metallization, are ideally outside the area where the semiconductor chip 4 and the flexible metal wires 11. The maximum action places the specified bending is achieved when they lie within the lateral edges 12 of the recess 2 and the outside of the cover 10. Places the specified bending can in this case serve as “cardan support”. Upon the occurrence of a bending load holder chip is bent in places of a given curve, and the semiconductor chip and the flexible metal conductors are passed only a small effort, because they lie in the rigid area of the chip module.In Fig.2 depicts a top view of the metallization 7, due to the form in which the holder of the chip can be formed in place of the specified curve. Metallization has eight contact pins 8. They are electrically separated from each other by slits 22. In the hard zone designation is. the n is not their edges marked for POS. 21 the area. POS. 19 shows areas where the holder of the chip (not shown), has openings, through which are passed a flexible metallic conductors, electrically connected with the contact pins. Rectangular zone C1...C8 are defined by the ISO 7816 places where the contact pin in contact with the external zapisyvaus-reader. The position and size of the pads on the contact output and their location in relation to each other precisely established by the ISO.To occur when bending loads efforts were as small as possible, the metallization can be reduced to the established ISO pads. Since, however, the portable data carrier according to the invention are produced in huge quantities, technological processes and equipment associated with extremely high costs. The invention provides for performing the metallization of the slots 13, which share the contact pin 8 respectively on the first 14 and second 15 zone. In this example, the first 14 and second 15 zones are connected by narrow bridges 16. The less Uyeshiba. Width X jumper is ideally 0-0,2 mm. This implementation preferably when the contact pads or contact the conclusions should be treated the way “Electro-Plating”. The necessary electrodes are placed outside shown in Fig.7 metallized zone. Way “Electro-Plating” is realized when the metallization with many other metallizatsii for modules lies on an infinite tape. In Fig.2, shows another designated 24 division, which metallization connected to the carrier tape (not shown).In Fig.3 shows a second example of the portable data carrier according to the invention which differs from that shown in Fig.1 only in that the metallization 7, starting from the set ISO pads C1...C8, is completely absent. Due to this, between cartoonanime body 1 and the metallization 7 chip-module 3 occurs an uneven surface. This, however, from a technical point of view is not a disadvantage, however, for aesthetic reasons it is undesirable.In Fig.4 shows a top view of an alternative made metallization 7, and located in the upper part of the contact pin 8 have two slots 13, so that approximately in the middle of each contactng what about the one axis. This axis is approximately parallel to the position of a semiconductor chip (not shown) on the opposite main side of the chip holder. In the depicted example, run jumper 16 is made substantially narrower relative to the width of the contact pins. However, this is not required, the bridge 16 may be wider, and the slots respectively already. Due to the width of the bridges 16 occurs need the power of places specified bend to bend.In the lower part of Fig.4 shows another variant in the chip holder can be obtained the place of the specified curve. In this option, contact terminals 8 are each only from the second zone 15. Formed by the slits 13 of the first zone 14, is shown in the upper part near the bottom of the contact pins is completely absent. Due to this process is already described a depression in the surface of the portable data carrier. This option is suitable, however, only when the elevation of the pads is by electroplating. Ennobling way “Electro-Platig” existing equipment then it is impossible.In Fig.5 when viewed from above, shows cantabrana body 1 of the portable data carrier. The data carrier contains established in the but next to each other contact pin 8 form the axis, parallel short side edges 17A, 17b cartoonizing body. Made in the pins 8 of the slot 13 are also on the same axis, parallel short side edges 17A, 17b cartoonizing body. This is because the critical bending load is held parallel to the long side edges 17c, 17d cartoonizing body 1.The bending load on the semiconductor chip and the wire connections can be reduced due to the formation of places specified bend in the holder of the chip module. Places the specified bending form due to the special topology applied to the holder of the chip metallization compliance with standard ISO 7816. This makes it possible to dispense with the traditional elements of rigidity than can be cut costs.
Claims1. Portable data carrier containing cantabrana body (1) having a recess (2) for accommodating the chip module (3), and chip-module (3) comprises at least one semiconductor chip (4) on the first main side (5) of the holder (18) chip connected to cartoonanime body (1), and containing the contact pin (8) metallization (7) on the second main side (6) of the holder (18) of the chip and the holder (18) chip has tion (7) ends within places (9) given below.2. Media under item 1, characterized in that the seat (9) of the specified curve lie outside the semiconductor chip (4).3. Media under item 1 or 2, characterized in that the seat (9) of the specified curve lie outside covering the semiconductor chip (4) cover (10).4. Media under item 1, characterized in that the seat (9) of a given curve is formed by at least one slot (13) in each contact output (8), which divides the corresponding contact pin (8) on the first (14) and second (15) zone.5. Media under item 4, characterized in that the first (14) and second (15) zones are interconnected, at least one jumper.6. Media under item 4 or 5, characterized in that the slots (13) are held in the direction in which the contact pin (8) lie adjacent to each other.7. Media under item 4, characterized in that the bridge (16) have a substantially smaller width than at least one slot (13).
FIELD: access tickets and cards.
SUBSTANCE: paper body of ticket has through socket, wherein electronic module is placed, containing integral chip and antenna. Antenna is formed by at least one coil, made by printing by paint with silver dust, polymerized to hardening by thermal processing.
EFFECT: lower costs.
3 cl, 6 dwg
FIELD: chip-cards engineering.
SUBSTANCE: antenna on substrate has at least one coil of electric-conductive paint, applied to antenna by template method, two card bodies on each side of substrate, each of which has at least one plastic layer, a micro-chip or module, connected to antenna. Substrate is made of paper and has slits in each corner, on level of which by soldering two card bodies are connected, which allows card to divide in layers in place of greatest bending load.
EFFECT: higher efficiency.
11 cl, 6 dwg
FIELD: chip-cards engineering.
SUBSTANCE: antenna is made by template method on substrate, and bodies of cards are made during lamination of substrate. Milling of hollow is performed on card body, opposite to side of substrate with template print of antenna with possible mounting of module, containing micro-chip and two-side circuit. Slits made at corners of antenna substrate prior to lamination stage provide for engagement of card bodies with each other.
EFFECT: higher efficiency.
11 cl, 6 dwg
SUBSTANCE: method includes manufacturing antenna by template method at substrate, gluing contacts of microchip to antenna substrate by electric-conductive glue, laminating card on each side by hot pressing on antenna substrate, hence manufacturing two bodies of card. In corners of antenna substrate slits are made, which provide for soldering together of card bodies during lamination.
EFFECT: higher efficiency.
8 cl, 6 dwg
FIELD: electric engineering.
SUBSTANCE: carrying film has at least one current-conducting track with connecting portions, containing multiple interconnected surfaces 7 and empty hollows 8.
EFFECT: higher efficiency, higher reliability.
3 cl, 3 dwg
FIELD: data medium engineering.
SUBSTANCE: proposed data medium has at least two antennas, corresponding to different transmission ranges. In this case the data medium may be fabricated such a way that it is ensured possibility of operation with devices for record/read, functioning in accordance with different standards. At least two from the antennas produce a single unit. Owing to this union the developed data medium may be fabricated with high efficiency.
EFFECT: technical result of the invention is increased economic efficiency of data medium fabrication.
3 cl, 4 dwg
FIELD: chip cards with body, semiconductor circuit and substrate, while substrate on both sides is provided with flat contacts and conductors of contact openings, which connect upper and lower flat contacts electrically to each other.
SUBSTANCE: because conductors of contact openings are hollow inside, air moisture can penetrate chip card through hollow gaps and damage semiconductor micro-circuit, of conductors of contact openings are not closed. Method includes positioning conductors of contact openings so close to edge of substrate, that their lower ends project into base of external hollow and close together there.
EFFECT: prevented penetration of moisture into inner hollow, wherein micro-circuit is positioned, without need for special protection of contact opening conductors.
10 cl, 2 dwg
FIELD: apparatuses for blanking plastic, mainly blanking inserts integrated to chip-cards.
SUBSTANCE: apparatus includes operating in pair blanking punch with blanking surface and counter-support between which plastics to be punched is placed. Blanking surface of blanking punch has acute-angled cutting edges with apex angle less than 90°. Counter-support is in the form of die. It allows to blank notches practically along the whole perimeter of insert.
EFFECT: reduced probability of cracking in paint layer along edge of blanked portion and burr occurring.
5 cl, 6 dwg
FIELD: engineering and production of electronic labels, in particular, ones meant for attachment to metallic objects.
SUBSTANCE: one of characteristics of electronic labels is that reading and recording during their utilization can be performed without mechanical contact with communication frame (antenna). In this case reading head is set at some distance from label and interacts with is by means of magnetic waves. When such labels are positioned on metallic objects, reading becomes obstructed or even impossible due to dispersion of waves in the object. Invention makes it possible to prevent such a drawback because antenna is equipped with electromagnetic component meant for isolation of antenna and thus for improving receipt quality.
EFFECT: improved quality of receipt.
2 cl, 2 dwg
FIELD: technology for manufacturing modules.
SUBSTANCE: in accordance to method for manufacturing a module to be built into body of card, on one of the sides of base 4,5,6 of this module current-conductive structure 7 is provided. During manufacture of module base at least its first layer 1, positioned on the lower side 9 directed from current-conductive structure 7, is made of material, properties of which, during mounting of module in the body of card in accordance to certain technology, have important value for aforementioned mounting, and are synchronized with properties of material of this layer of card body.
EFFECT: simplification and decreased costs of manufacturing technology.
3 cl, 3 dwg