A method of manufacturing a laminated chip cards

 

The invention relates to a method of manufacturing a laminated chip-cards of paper or film. The technical result is to create a manufacturing method with which it is possible to manufacture smart cards in bulk. The smart card is made of at least two layers of paper or film as a supporting material, and one layer is placed a semiconductor crystal, and the second layer has connecting contacts and the printed conductor or external contact pads. Contacts of a semiconductor crystal of electrically conductive way connected with the connecting contacts of the second layer. It does not require the module chips for the manufacture of smart cards. Bearing material, provided with integrated circuits and contacts, can be laminated using the format endless roll, as in the manufacture of paper. 3 C.p. f-crystals, 2 Il.

The invention relates to a particularly economical method of manufacturing a laminated chip-cards of paper or film.

Chip-cards (with chip) find, among other things, the use of applications that are limited to a certain time, or such, in which the chip card can be used only the NENO certain number of calculation units to pay for telephone calls. Since the chip card when such use does not bring any self-benefit, but has only saved the contents of a small value, for economic reasons, the chip card itself must have cost, defined as a small part of the purchase price of the acquisition, which must be held low. Therefore we strive to create a material, cards, card design and manufacturing methods, with which the chip card can be produced most cost-effective way.

In international publication WO 95/21423 described chip-card, made of paper, in which the module smart card laminated in layers of paper. Module smart card contains at least one semiconductor chip with the integrated circuit, and with its conclusions according to the standards for smart cards. In the case of working and contactless chip card module chip-cards are printed wires acting as antennas, which are connected electrically conductive way with a semiconductor crystal. In the manufacture of laminate using conventional methods for the manufacture of paper. The different layers are glued together and compressed; the notches in the paper is performed by stamping or milling, h is provodnikov crystal, is made regardless of a laminate of a layer of paper.

In the publication WO 97/18531 describes a chip card in which a layer of plastic with laminated it crystal integrated circuit (IC) is associated with an insulating layer as a substrate, provided with bilateral printed circuit Board, so that the conclusions of the crystal IP conductive way associated with speaking to him conductors on the insulating layer.

In document EP 0706152 A2 describes a chip card and method of its manufacture, in which the crystal without making module method inverted crystal is mounted on the conductors, which are printed on the film, and back rolled into the Central film and foreign film. In the film there are cross-cutting contacts for connection with external contacts.

In the publication WO 97/27564 described the smart card is covered with a foil crystal module, which is manufactured through a pair of heated laminating rolls.

The present invention is to create a method of manufacture, by which it is possible economical manufacture of smart cards in large quantities.

This problem is solved by a method characterized by signs of paragraph 1 of the claims. Possible VA the AI with the invention of the smart card is manufactured by laminating at least two layers of a thin substrate material, for example, paper or film, and on the same layer is semiconductor crystal is provided for the chip card, and the second layer has connecting contacts and the printed conductors or external contact pads, which are provided for signal transmission and energy. Semiconductor crystals on one layer are placed so that their contacts facing to the second layer. Layers are linked in such a way that the contacts of the semiconductor crystal electrically conductive way connected with the connecting contacts of another layer. In the case of chip cards, is equipped with an external contact pads provided for establishing contact of a semiconductor crystal of the connecting contacts and the external contact pads are placed on two opposite sides of one layer. Electrically conductive connection between them is carried out through grooves or through holes in the bearing material of this layer. The chip card can thus be manufactured without inserting module, smart card, and carrying materials, in particular in the form of strips or tapes, retracted from the bobbins and can be made in the device, in principle known from the manufacturing technique managetwitter the invention, with reference to Fig.1 and 2.

In Fig.1 is a schematic representation of a device for manufacturing a chip card with an external connector pads.

In Fig.2 is a schematic representation of a device for producing a contactless chip card.

In Fig.1 is shown provided at least two layers of supporting materials 1 and 2 in side view a device for the manufacture of smart cards. In the first carrier material 1, which is provided for the first layer chip card inserted semiconductor crystal 6. In the preferred method of manufacture from a single strip of bearing material is made of a large number of smart cards, which are separated only after the connection of the carrier materials 1, 2. For simplicity in Fig.1 in cross section shows a device with only one semiconductor crystal 6 in the first raw material 1. On this semiconductor chip 6 to the left and to the right, and, if necessary, in the direction to the plane of the drawing, you can imagine located near other semiconductor crystals, which are provided respectively for other smart cards. Each semiconductor crystal 6 is placed in the first raw material 1, preferably in the recess. This recess may Ave is maintained, the integrity of the upper rear side 11 of the first carrier material. This rear upper side 11 can be also applied to other segments to cover the semiconductor element from the rear, or such layers can be applied at the final stage of manufacture.

The connecting pins 3, which contacts the semiconductor crystal 6 in the manufacture of the laminate are connected by electrically conductive connections 7 (for example, the so-called bar of the conclusions of the semiconductor crystal of the soft solder, for example from NiAu), printed on facing the semiconductor crystal 6 side of the second carrier material 2. In the example implementation shown in Fig.1, the pads 4, which is provided for setting an external contact chip cards, for example, with connection terminal contacts are turned from a semiconductor crystal 6 external upper side 11 of the second carrier material 2. To ensure conductive connection 5 of electrically conductive material is located in the through holes, which are performed in the second host material 2 before applying the electrically conductive material provided for connecting the contacts and the pads 4. After separation of the chip card first nessier layer 2 provided for the electrical leads connecting the contacts 3, provided in the through holes electrically conductive connections 5 and the external contact pads 4.

The carrier material 1, 2 shown in Fig.1 embodiment, leaves the coils (rolls) 12, as is the case in the manufacture of paper and paperboard using a so-called endless roll formats. Serial conveyor to move the interconnected load-bearing materials in Fig.1 shows only the rollers 13, which further transportation pressed consisting of layers of laminate and preferred way are placed at various locations along the path of the feed carrier material in the device. These rolls can be equipped with heating devices that heat carrier material in such a way that placed between layers of a carrier material of the bonding layer, for example a layer of glue, provides better grip. In addition, for the manufacture of electrically conductive connections 7 between the contacts of semiconductor element 6 and the connecting pins 3 can be heat pressed through the outside of the heating element, and in this case, preferably through jointly driven roller is, and in any case, deviations from this option by using a larger number of layers included in the scope of this invention. Thus it is essential that the semiconductor crystal directly in the form of a crystal IP is embedded in one layer. Electrical conductors for connecting placed on another layer or on it. As a supporting material can be used in particular paper or film in the format of an endless roll. Provided on the second layer of connective contacts and/or contact pads can be the preferred way to made by way of the endless screen printing, in which, for example, the conductive phase is applied in a thin layer and is structured. The connecting pins of the IC to the connecting contacts of the second layer is made in a similar manner as in the method of installation method of the inverted crystal, known in the art of semiconductor IP.

To improve conductive connections 7, made with pads or bar pins, between the semiconductor crystal 6 and educated second bearing material 7 the second layer may have a fill weight of 8, which is preferably formed of m which takes place in the direction of the provided conductive compounds 7, while the conductivity in the transverse direction, i.e. in the plane of connection of the carrier materials 1 and 2, the minimum in order to avoid short circuits between the various contacts. Can also be used isotropic conductive or insulating filling mass, preferably, if the filling mass after application and after connection of the carrier materials 1, 2 undergo some shrinkage, so that the conductive connections 7 are pressed against the contacts of semiconductor element 6 and the connecting contacts of the second layer 2, and in this way creates a durable electrically conductive connection 7 with the power circuit.

Similarly, this version of the implementation in accordance with the invention can be made and a contactless chip card. In this case, instead deposited on the second carrier material 2 pads 4 on the inner upper side, provided with connecting contacts 3, is applied and structured printed conductor 10 (see Fig.2). This printed conductor 10 can be made in a spiral form in the form of a coil which is provided for use as a coil for signal transmission and power transmission. Other components and sposob.1. The second carrier material 2, the preferred way is equipped with electrically conductive structure only on the side facing the semiconductor crystal 6. The laminate may consist of, as the above-described embodiment, more than two layers. In principle, the possible combinations of solutions shown in Fig.1 and 2, if, for example, the required chip card, which must be suitable for external electrical connections, and for contactless applications.

Claims

1. A method of manufacturing a chip card, in which the first stage is provided by the first carrier material (1) at least one specified for the corresponding smart card semiconductor chip (6), which contains an integrated circuit and has at least one contact, and the second carrier material (2) at least one specified for the corresponding chip card connector contact (3), at the same time as the carrier materials used strip of paper or film intended for a variety of smart cards, and in the second stage bearing materials (1, 2) are connected to each other by compression and/or bonding, and a semiconductor contact creeley by cutting or punching.

2. The method according to p. 1, characterized in that the bearing materials are and are transported through the bobbins (12) or rolls (13).

3. The method according to p. 1 or 2, characterized in that before the first stage in the second host material (2) perform the through-hole and on the first stage to the second carrier material (2) to form at least one prescribed for the appropriate smart card of the connecting pin (3) and at least one placed on the opposite side of the second carrier material contact pads (4) on both sides of electrically conductive material is applied in a prescribed configuration, and in the through holes to form conductive connection (5) between the respective connecting contact (3) and the corresponding contact pad (4).

4. The method according to any of paragraphs.1-3, characterized in that in the first stage to the second carrier material (2) to form at least one prescribed for the appropriate smart card of the connecting pin (3) and at least one connected to a printed conductor (10) is applied conductive material in the specified configuration.

 

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