Epoxy composition

 

The invention relates to the production of polymeric materials based on epoxy resins used as binders for laminates, protective coatings, sealants. The composition includes epoxygenase resin, structurai modifier and amine hardener. As serosoderjaschei modifier contains Thiokol brand UXO-2 with an average molecular weight of 800 and active content of SH-groups of 3-4%, and as the amine hardener - silicon diamine of the formula

with molecular weight of 566 and content of active amino groups of 5.7%. A specific ratio of components allows to obtain polymeric materials with improved chemical resistance, water resistance and water-repellent properties while maintaining heat resistance and hardness. table 2.

The invention relates to the production of polymeric materials based on epoxy resins used as binders for laminates, protective coatings, sealants.

Known epoxy composition comprising epoxygenase oligomer and polymer of aromatic amine curing agent, which as a polymer Entov, wt.h.:

Epoxygenase oligomer 100

Polyoxymethylene 32,5-39,5

see patent RU No. 2055082, IPC C 08 G 59/52, C 08 L 63/02//C 08 L 63/02, C 08 L 81/04, 1996.

The cured material has a relatively high heat resistance, but has a low water repellency, chemical resistance and water resistance.

An object of the invention is the creation of the epoxy composition to produce polymeric materials with improved chemical resistance, water resistance and water-repellent properties while maintaining heat resistance and hardness.

The technical problem is solved in that the epoxy composition comprising epoxygenase resin and amine curing agent, as the amine hardener contains silicon diamine of the formula

with molecular weight of 566 and content of active amino groups of 5.7%, in addition structurai modifier Thiokol brand UXO-2 with an average molecular weight of 800 and active content of SH-groups of 3-4%, in the following ratio, wt.%:

Epoxygenase resin grades ED-20, ED, ED-22 47,6-53,5

The specified Thiokol 9,4-20,4

The specified silicone diamine 32,0-37,1

The solution of the technical problem ottalkivajyshij properties while maintaining heat resistance and hardness.

In the inventive composition is used epoxygenase resin grades ED-20 ED-16, ED-22 (GOST 10587-84).

As serosoderjaschei modifier use Thiokol brand UXO-2.

As the amine hardener use the product interaction-aminopropyltriethoxysilane and diphenylsilanediol. The hardener is produced by interaction-aminopropyltriethoxysilane and diphenylsilanediol at a molar ratio of 2:1, respectively. In a reaction flask is charged with 44,28-aminopropyltriethoxysilane, 21,6 g diphenylsilanediol and heated with stirring in a stream of nitrogen to 140C. the Reaction mixture was kept until complete removal of the formed ethanol. The product yield 56,05 g (the 98.9 wt.%).

The composition is obtained by mixing epoxygenase resin and serosoderjaschei modifier. Immediately before use in the composition is injected hardener and poured into a mold. The curing time at room temperature 24 hours

This invention is illustrated by the following examples of specific performance.

Example 1. 20,4 g serosoderjaschei modifier thoroughly mix from 47.6 g of epoxygenase resin injected 32,0 g otvetit Solomou %.

Formulations of compositions according to the examples of embodiment represented in table 1.

Properties of hardened epoxy compositions are presented in table 2.

Thus, as can be seen from the examples of embodiment, this invention allows to obtain products having a high water-repellent properties, chemical resistance, water resistance and heat resistance, which allows to use it as a filling composition in the manufacture of protective coatings, filled plastics, sealants.

Claims

Epoxy composition comprising epoxygenase resin and amine curing agent, characterized in that it as an amine curing agent contains a silicon diamine of the formula

with molecular weight of 566 and content of active amino groups of 5.7% and an additional sulfur-containing modifier - Thiokol brand UXO-2 with an average molecular weight of 800 and active content of SH-groups of 3-4% in the following ratio, wt.%:

Epoxygenase resin grades ED-20,

ED-16, ED-22 47,6 - 53,5

The specified Thiokol 9,4 - 20,4

The specified silicone diamine 32,0 - 37,1

 

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