Method and device for cutting the cutting tool of the layered material made of fragile material and plastic

 

Heat the plastic, at least in the field of a predetermined line of cut, thus lowering its viscosity. Place a single cutting tool on the plastic side of the laminate to the possibility of regulatory efforts of the pressing. By providing relative movement between the cutting tool and sheet material at a predetermined cut line cut the plastic and at the same time Scrabble brittle material, thus causing stress. If necessary to further increase the mechanical stress on the section line for the tensile strength scratched fragile material. The preferred field of application is the cutting of thin layered materials of glass or ceramics and plastics. The technical result of the invention is the provision of cutting the layered material in a single operation with high precision, fast cutting. 2 C. and 33 C.p. f-crystals, 1 Il.

The invention concerns a method and device for cutting a layered material made of fragile material and plastic. The preferred case of application is the cutting of thin layered materials from stellulata composites component parts of which are materials that are distinguished by their mechanical and thermal properties.

Plastics commonly used for the manufacture of such laminated materials are relatively flexible or plastic and have a high coefficient of thermal expansion equal to 20-80 ppm/K, and a low softening temperature, usually equal 120-260C.

In contrast, brittle materials, such as glass, glass ceramics or ceramics used for the manufacture of laminated materials, are mechanically fragile and usually have a low coefficient of thermal expansion and a high softening temperature. The coefficient of thermal expansion of glass is typically around 3.5-11 ppm/K, and the softening temperature TGis usually 500-750C.

Due to the different physical properties of the two materials, essentially, up to the present time there are no methods or devices for cutting a single cutting tool of the layered material in a single operation, containing fragile and plastic. Previously known methods and devices are only for cutting respectively neoo material, as, for example, glass, perform a scratch on the glass surface, for example, by using a diamond cutter or a small blade or a cutting edge made of solid metal. Damage to the surface, is designed in such a way, represents the next line of fracture of the glass, along which a controlled way a crack develops under the action of tensile forces. During the execution of scratches on the glass normal force exerted on the cutting tool must not exceed a certain value depending on the thickness of the glass. Otherwise, it usually leads to uncontrolled fracture of glass (N.Jebsen-Marwedel and(publishers) Glastechnische Fabrikationsfehler [defects in the processing of glass], Springer-Verlag, Berlin, Heidelberg, New York, 1980, page 577 et seq., Chapter 12.7, F. Kerkhof andDas "Schneiden" des Glases ["cutting" glass]).

In addition to conventional mechanical cutting for some time known methods, when using heat tools cause the voltage on the section line. For example, in DE 19715537 A1 describes a method and apparatus for cutting a flat workpiece made of brittle material with a laser beam, used to create thermomechanical napara using stencil (JP 06008145 A) or water-jet method with the use of abrasive substances (DE 3533340 Al).

In contrast, untreated plastic films are typically cut or cutting with the gradual deepening of the blade into the material using the cutting force of the two blades with sharp edges, made of solid metal and moving to each other, or by cutting with a very sharp knife or blade.

However, all the above mentioned methods are not suitable for cutting laminate mentioned type, for example, laminates of glass and plastic. It is obvious that cutting with the gradual deepening of the blade layered material is possible only with the use of thin glass. However, cutting with the gradual deepening of the blade material, achieved through cutting efforts in a thin glass sheet, causing uncontrolled cracking of brittle fracture across the direction of cutting. Although acute skalpirovany knife and can cut plastic film, he is not able to cut or scratch glass. Moreover, he very quickly Satupaitea on the glass surface.

When cutting with a diamond cutter or a small cutting disk of the hard metal it is necessary to maintain the contact force is below a certain limit in which trument, limited thus, it is not enough for reliable cutting the film in a layered composite material. Because of its flexibility requires a relatively large effort pressure (or normal force) for cutting plastic film, which again would lead to uncontrolled fracture of the glass.

Due to these facts it is impossible for one operation to cut layered materials using conventional methods of mechanical cutting. Alternative methods of cutting such composite materials have drawbacks.

In known laser cutting equipment costs are much higher due to the use of laser and optical peripheral devices, resulting in significantly higher costs. On the layered material or optical devices can be deposited evaporating or even thermally decomposing substances.

Waterjet cutting leads to pollution of the surface and to the formation of surface defects under the action of water and mixed it with abrasive substances. Similarly sandblasting cutting cause pollution of the surface and the formation of defects on the surface of the layered material. These methods cause additional costs for cleaning the existing industry, for example, the industry displays as a substitute thin glass substrates, much easier if there was a way of cutting that would be possible, compatible with conventional methods of cutting, would cause only a small additional cost and if it would be appropriate, could be used in existing equipment for cutting glass.

The present invention is a method and device for cutting a single cutting tool layered material made of fragile material such as glass, glass ceramics or ceramics and plastics, providing the cutting of laminated material as possible in a single operation while ensuring high precision cutting and matching circuit, and fast cutting.

In addition, the object of the invention is a method and device that can be combined with existing methods of cutting, to cause a small additional costs and, if appropriate, be used with existing cutting equipment.

According to the invention the task in respect of the way of cutting the layered material made of fragile material and plastic, for about the offer, plastic, at least in the field of a predetermined line of cut, providing reduction of the viscosity of the plastic,

- place the cutting tool on the plastic side of the laminate with adjustable force pressing the cutting tool to the surface of the layered material,

- create relative movement between the cutting tool and sheet material along the line of the incision, cutting the plastic and at the same time scratching fragile material, thus causing mechanical stress, and, if necessary,

- additionally increases the stress on the section line for the tensile strength scratched fragile material.

According to the invention the task in relation to the device is achieved by creating a device that has:

means for heating the plastic, at least in the field of a predetermined line of cut, providing reduction of the viscosity of the plastic,

- a single cutting tool made with the possibility of placing it on the plastic side of the laminate and regulation of his efforts being pressed to the surface of the layered material,

means for providing relative motion between the cutting tool and the layered om causing mechanical stress, and, if necessary,

- a means to further increase mechanical stress on the section line for the tensile strength scratched fragile material.

Through the present invention provides efficient cutting of a single cutting tool in a single operation layered material made of fragile material and plastic, in particular a layered material made of fragile material with a layer of plastic applied with one hand.

This is a big advantage because the use of two cutting tools aimed at each other or installed one after the other, always causes the need for complex and dependent on the adjustment process, which is not required in the case of this technical solution.

The cutting tool must be placed on the plastic side of the laminate, in order to reliably cut the plastic and at the same time scratching fragile material to brittle fracture at the site of incision.

To solve significant problems associated with mechanical cutting laminated materials, it is necessary to reduce a large contact force of the cutting tool when cutting plastics is tsya its viscosity, therefore, for cutting plastic is already quite small effort of pressing the cutting tool.

Possible need additional increase mechanical stress on the section line to the tensile strength scratched fragile material can be carried out, for example, by bending in the area of scratches, and the distribution of cracks caused by stress, occurs along the line of the incision.

For the implementation of cutting the layered material made of fragile material with layers of plastic, marked on both sides, cut the plastic on each side of the layered material and Scrabble brittle material either from one side or from two sides.

In this case, the cutting of plastic and scratching fragile material can be performed in two oppositely mounted cutting tools in a single operation or at least one cutting tool in two consecutive operations. With this purpose, heat the plastic, at least in the field of a predetermined line of cut, reducing the viscosity of the plastic, the heating is carried out, at least on the plastic side of the laminate, at which place the cutting tool.synchronize the contact force of the cutting tool to the surface of the layered material. Then provide relative movement between the cutting tool and sheet material along the line of the incision, cutting the plastic on this side.

On the opposite plastic side of the laminate placed this cutting tool or another cutting tool with adjustable force pressing the cutting tool to the surface of the layered material. Provide relative movement between the secondary cutting tool and sheet material along the line of the incision, cutting the plastic and at the same time scratching fragile material, causing mechanical stress. If necessary, you also increase the stress on the section line for the tensile strength scratched fragile material.

Cutting the layered material made of fragile material with layers of plastic, marked on both sides, in which the cutting of the plastic and the scratching of brittle material is performed by two oppositely mounted cutting tools, preferably has the following stages:

- use additional cutting tools for the layer of plastic material applied on the second side of the brittle material,

correspondingly place the cutting tool on each plastic side of the laminate with adjustable force pressing the appropriate cutting tool to the surface of the layered material,

- provide relative movement between the cutting tools and sheet material along the line of the incision, cutting the plastic and at the same time scratching fragile material, causing mechanical stress, while brittle material scratch on one side or on two sides, and, if necessary,

- additionally increases the stress on the section line for the tensile strength scratched fragile material.

In this case, two of the cutting tool is preferably installed directly opposite each other and carry out their synchronous movement relative to the laminate along the line of the incision.

If two of the cutting tool have ahead of one relative to another, the cutting tool that cuts the only plastic on one side of the layered material, preferably set ahead of the opposite cutting tool that cuts the plastic and at the same time scratch fragile material/or jet of hot gas. In this case, you can heat the whole of the layered material.

However, heating of the plastic material can also be heated cutting tool, in particular its heated lower end. In this case, the heating of the plastic, at least in the region of the section line through heat transfer from the heated cutting tool can perform both separately and in addition to other methods of heating.

Heating plastics can be above its softening temperature and below its softening temperature, preferably slightly below its softening temperature.

Heated plastic is cut, providing relative movement between the cutting tool and a layered material, while moving the cutting tool and/or layered material moving along a predetermined line of cut.

In addition, when the same operation can cutting tool to cause a scratch on the surface of the brittle material and to form the cutting line. As was already cut the plastic side of the composite material, it maintains the separation of the layered material in the propagation of cracks formed by tensile stress, the pany fragile material, comparable speeds during normal cutting glass.

In addition, the molten plastic film at the cutting point eliminates the need for wet film, for example, water, glycol or propanol, frequently used in the conventional cutting glass for improved cut quality and increase the life span of the cutting tool.

Thin incision required when cutting the plastic and at the same time when applying scratches on fragile material, preferably takes place when cutting laminate cutting tool having mounted diamond tip blade or cutting blade.

Diamond is the hardest known mineral, due to this property ideal for cutting laminate when it is installed on the cutting tool regardless of whether the cutting edges of natural or synthetic diamond.

Preferably use blades and/or cutting blades, which are made of particularly hard and durable alloy, or ceramics, for example from a sintered alloy containing tungsten carbide and/or diamond. The cutting discs are preferably beveled wedge-shaped manner and on the outer edge with a well-polished is the combat and, you may also transverse oscillations with a small amplitude and variable frequency. The result is improved cutting. Improvement cutting is not dependent on frequency. However, it was found that at higher frequencies the best effect is achieved in the larger number of oscillations per unit of time. It is preferable to use ultrasound, high frequency which can be generated using relatively inexpensive tools. Frequencies in the range above 100 kHz can be generated with the required amplitudes only at relatively high costs. To create ultrasound is preferable to use a modulator, such as a crystal oscillator or magnetostrictive modulator, for example a Nickel rod, put in a strong magnetic alternating field. The ultrasound generated by the ultrasound exposure, means the sound waves with frequencies higher than 16 kHz. According to the invention, it is preferable to use sound waves with a frequency of 20 to 100 kHz and an amplitude of from 5 to 40 μm. In this case, vibrations of the cutting tool passing transversely, longitudinally and/or transversely relative to the direction of cutting, provide the best offset plastic from the cut line. Thus the s vibrations of the cutting tool is reduced axial and supporting forces, required for cutting plastic and simultaneously for the formation of scratches on a fragile material.

According to the present invention improves the quality of the cut and reduces the risk of uncontrolled fracture of brittle material. As a result of this improved method and improved performance when cutting or allows such operation.

The method and apparatus preferably used for cutting laminated materials, in particular of thin layered materials made of fragile material such as glass, glass-ceramic or ceramic sheet, and plastic, in particular of a plastic film, the plastic film can be used to protect from scratching the film, preferably polyethylene, or a film of deposited polymer.

Furthermore, the method and device are used for cutting laminated materials made of fragile material and plastic material, the viscosity of which can be reduced by heating the cutting tool. Suitable plastics are, for example, thermoplastics, and from them especially suitable are, for example, polyamides, polycarbonates, polyethersulfone is In this case of layered materials preferably have a thickness of plastics from 1 to 300 μm and fragile material 10 to 300 μm.

Brittle material and plastic preferably connected by a layer of adhesive of a thickness of preferably from 2 to 50 microns.

On the other hand, the plastic may be applied to the brittle material by extrusion, by way of casting, spraying or coating with a roller or with layers of plastic film.

However, the method and apparatus is also suitable for cutting laminated materials made of relatively thick brittle material, for example glass, in particular of sheet glass, glass ceramics or ceramics, and plastics, the thickness of the brittle material is preferably up to 30 mm

In addition, you can also cut these layered materials in which the brittle material comprises silicon, germanium or carbon.

Education required line of cut and, in particular, the necessary line scratching requires careful placement of the cutting tool. The angle between the longitudinal axis of the cutting tool and the cutting plane in the cutting direction preferably is adjustable from 55 to 75. Especially preferably the angle is equal to 65.

The following example is intended to further illustrate the ISM tool 5 in one operation layered material 1, made of fragile material 2 and plastics 4. Layered material 1 is, for example, thin glass-plastic laminated material of the glass sheet 2 thickness preferably 10-300 μm, and the plastic film 4 of a thickness of 1-300 μm, preferably connected with each other by a layer of adhesive 3 of a thickness of 2-50 μm.

Heated single cutting tool 5 can be placed on the plastic side 4 glass-plastic laminated material 1, and the contact force of the cutting tool 5 to the surface of a glass-plastic laminate 1 can be adjusted by a suitable means, for example, spring elements 13. The corresponding contact force can be easily determined empirically, and it usually corresponds to the contact force, which is necessary for scratching raw fragile material of appropriate thickness. The lower end 6 of the heated cutting tool 5 includes mounted wedge-shaped diamond for the formation of particularly thin cut lines. Using the electric heating element 7 cutting tool 5, and particularly preferably its lower end 6 can be heated to the temperature required for cutting according to the regulation of the heating voltage, in a particularly preferred variant of the invention, the automatic control and regulation of the temperature is carried out by means of thermocouples 9, which is as close as possible attached to the lower end 6 of the cutting tool 5 and is connected with a device 8 for regulating the heating voltage. Thus, it is possible to set and regulate the temperature of the cutting tool 5, necessary for cutting certain plastics 4.

While cutting you should maintain a constant temperature of the cutting tool 5, or at least, the temperature of its lower end 6, is required for cutting the corresponding plastic 4.

The appropriate temperature of the cutting tool 5 and, in particular, its lower end 6 can also easily determined empirically. As a starting point you can use the softening temperature of the plastic material 4, respectively, to be cut, or the temperature, which is slightly above the softening temperature. In this case, to provide the necessary heat transfer to the plastic 4, respectively, to be cut, the temperature of the cutting tool 5 and, in particular, the temperature of its lower end 6 may be the you is to negatice to such an extent, in order not increased or almost no increase in the contact force required for simultaneous scratching glass 2.

With the help of the device (not shown), which preferably may be a radiation source, for example a heat source, an infrared and/or laser heater, or the source of the jet of hot gas, the plastic may be additionally heated, at least in the field of a predetermined line of cut.

With further improvement of the invention a device for heating is placed so that local heating of the plastic was, at least along the section line. This is a device for heating is preferably placed together with the cutting tool and ahead of the latter. In this case, the specified device can be used to heat the plastic alone, after which do not require heating of the cutting tool, and in addition to the heating of the heated cutting tool.

The cutting tool 5 through the suspension 14 is connected with the guide elements 15, which provide the movement of the cutting tool 5 in any desired, predetermined cut line along the glass-plastic laminate 1, and this up to a predetermined cut line cut plastic 4 with the layer of adhesive 3 and at the same time scratch is formed on the lower glass 2, which is connected with plastic 4, causing mechanical stress on the section line. This occurs when cutting thin layered materials.

If necessary, use additional devices (not shown) can be increased mechanical stress on the section line for the tensile strength of the glass 2. This is achieved by propagation of a crack along the line of the cut, i.e. the so-called break glass. In this case the fault occurs, essentially, under the action of tensile forces at the bend line scratching chain downstream emerging small cracks.

As an example, at least the lower end of the cutting tool is heated to approximately 200For cutting flat glass-plastic laminates containing glass sheet with a thickness of 50-400 μm, which is connected with the plastic film 4 of a thickness of 50 μm made of polyethylene terephthalate. In this case, the contact force set approximately 1 H for speeds of approximately 10 m/min.

The invention is not limited to the implementation of direct cuts; of course, it can also be made curved sections.

In the preferred varieze or magnetostrictive modulator 10 and the coupling element 12 to be subjected to ultrasonic vibrations, which are the longitudinal and/or transverse relative to the cutting tool 5 (lengthwise and/or crosswise to the direction of cutting) and have a low amplitude, preferably from 5 to 40 μm, and adjustable frequency. The frequency of ultrasonic vibrations may be set by a function generator 11, with the necessary incisions are achieved at frequencies in the range from 20 to 100 kHz.

The cutting tool may preferably be configured to rotate at least one axial element 16 perpendicular and parallel to the plane of the cutting in the cutting direction, and the angle between the longitudinal axis of the cutting tool 5 and the plane of the cutting in the cutting direction can be adjusted from 55 to 75, preferably 65.

In addition, the invention is not limited to sharp flat layered materials can also be cut layered materials having a non-planar shape such as a convex composite parts, such as automotive windshields mirrors or plastic-coated and composite products made from hollow glass with plastic coating.

The method according to the invention and the device is C large costs included in the existing methods and devices. Method and device for the first time give the ability to cut a single cutting tool with great speed and in a single operation laminates made of fragile material and plastic. Precision cutting and following the contours correspond to well-known methods of cutting brittle materials or unprocessed plastics.

The preferred application is the cutting of thin layered materials of glass or ceramics and plastics when the thickness of the glass or glass-ceramic preferably 10-300 μm, and the thickness of the plastic 1-300 microns.

List of items:

1. Laminate

2. Brittle material

3. The layer of adhesive

4. Plastic

5. Cutting tool

6. The lower end of the cutting tool

7. The heating element

8. A device for controlling the heating voltage

9. Thermocouple

10. The piezo or magnetostrictive modulator

11. Functional generator

12. The connecting element

13. The spring elements

14. Suspension

15. Guide

16. The axial element

Claims

1. The way of cutting the layered material made of fragile material and plastic in a single operation by Dinosauria a certain line of cut, providing lower the viscosity of the plastic, place the cutting tool on the plastic side of the laminate with adjustable force pressing the cutting tool to the surface of the layered material, creating a relative movement between the cutting tool and sheet material along the line of the incision, cutting the plastic and at the same time scratching fragile material, thus causing mechanical stress, and, if necessary, further increase mechanical stress on the section line for the tensile strength scratched fragile material.

2. The method according to p. 1, in which the use of additional cutting tools for the layer of plastic material applied on the second side of the brittle material, heat the plastic, at least in the field of a predetermined line of cut, providing reduction of the viscosity of the plastic, respectively, placed the cutting tool on each plastic side of the laminate with adjustable force pressing the appropriate cutting tool to the surface of the layered material, provide relative movement between the cutting tools and sheet material along the line of the incision, cutting the material scratch on one side or on two sides, and, if necessary, further increase mechanical stress on the section line for the tensile strength scratched fragile material.

3. The method according to p. 1 or 2, in which the heating is carried out by radiation, e.g. infrared and/or laser radiation, or by a stream of hot gas.

4. The method according to one of paragraphs.1-3, in which the heating is carried out heated cutting tool, preferably heated lower end.

5. The method according to one of paragraphs.1-4, in which heated the entire layered material.

6. The method according to one of paragraphs.1-5, in which the laminated material is cut set with a diamond tipped cutting tool.

7. The method according to one of paragraphs.1-6, in which a laminate cutting blade and/or the cutting blade of the cutting tool.

8. The method according to p. 7, in which the use of a blade or the saw blade is made of hard metal or ceramic, in particular from a sintered alloy containing tungsten carbide and/or diamond.

9. The method according to one of paragraphs.1-8, in which the cutting tool, preferably its lower end, is made with the possibility of axial ultrasonic vibrations.

10. The method according to one of paragraphs.1-9, in which the cutting ih fluctuations along and/or transversely relative to the direction of cutting.

11. The method according to p. 9 or 10, in which ultrasonic vibrations are of low amplitude, for example from 5 to 40 microns.

12. The method according to one of paragraphs.9-11, in which the use frequency of ultrasonic vibrations in the range from 20 to 100 kHz.

13. The method according to one of paragraphs.1-12, in which the plastic using a plastic film or a film of deposited polymer.

14. The method according to p. 13, in which the use of a plastic film of polyethylene or polycarbonate.

15. The method according to one of paragraphs.1-14, in which the plastic has a thickness of from 1 to 300 μm.

16. The method according to one of paragraphs.1-15, in which the brittle material using glass, such as flat glass, glass ceramics or ceramics.

17. The method according to p. 16, in which the brittle material has a thickness of 30 mm

18. The method according to one of paragraphs.1-17, in which the brittle material using glass, glass-ceramic or ceramic sheet.

19. The method according to p. 18, in which the brittle material has a thickness of from 10 to 300 μm.

20. The method according to one of paragraphs.1-19, in which the brittle material and plastic are connected to each other by a layer of adhesive.

21. The method according to p. 20, in which the layer of adhesive has a thickness of from 2 to 50 microns.

22. The method according to one of paragraphs.1-21, kitty roller or several layers of plastic film.

23. Device for cutting laminate, made of fragile material and plastic, which contains means for heating the plastic, at least in the field of a predetermined line of cut to ensure a decrease of the viscosity of the plastic, a single cutting tool made with the possibility of placing it on the plastic side of the laminate and regulation efforts being pressed to the surface of the layered material, means for providing relative motion between the cutting tool and sheet material along the line of cut for cutting plastic and simultaneous scratching fragile material, thus causing mechanical stress, and, if necessary, means for further increasing the mechanical stress on the section line for the tensile strength scratched fragile material.

24. The device according to p. 23, which includes an additional cutting tool made with the possibility of placing the layer of plastic is applied on the second side of the brittle material, and regulation efforts being pressed to the surface of the layered material, means for heating the plastic, at least in the field of a predetermined line of cut is relevant instruments and sheet material along the line of cut for cutting plastic and simultaneous scratching fragile material, thus causing mechanical stress, scratching fragile material on one side or on both sides, and, if necessary, a means to further increase mechanical stress on the section line for the tensile strength scratched fragile material.

25. The device according to p. 23 or 24 in which the means for heating the plastic contains a radiation source, for example a heat source in the form of infrared and/or laser heater, and/or source streams of hot gas.

26. Device according to one of paragraphs.23-25, in which the cutting tool, preferably its lower end, is made with the possibility of its heat.

27. Device according to one of paragraphs.23-26, in which the lower end of the cutting tool set contains a diamond.

28. Device according to one of paragraphs.23-27, in which the lower end of the cutting tool is made in the form of the blade and/or the cutting blade is made of hard metal or ceramic, for example from a sintered alloy containing tungsten carbide and/or diamond.

29. Device according to one of paragraphs.23-28, in which the cutting tool, preferably its lower end which has a capability of performing ultrasonic vibrations in Nanoha element.

30. Device according to one of paragraphs.23-29, in which the cutting tool, preferably its lower end which has a capability of performing ultrasonic vibrations across the direction of cut in the direction transverse to the cutting tool, by means of piezoelectric or magnetostrictive modulator and the coupling element.

31. Device according to one of paragraphs.23-30, in which the cutting tool, preferably its lower end which has a capability of performing ultrasonic oscillations of the longitudinal direction of the cutting in a direction transverse to the cutting tool, by means of piezoelectric or magnetostrictive modulator and the coupling element.

32. Device according to one of paragraphs.29-31, in which the amplitude and frequency of ultrasonic oscillations are regulated with feedback and without it.

33. The device according to p. 32, in which the amplitude of ultrasonic oscillations are in the range from 5 to 40 μm, and the frequency of ultrasonic vibrations in the range of 20 to 100 kHz.

34. Device according to one of paragraphs.23-33, in which the means for heating the plastic material contains at least one heating element, one thermocouple and one device for regulating the heating voltage.

35. Device according to one of perpendicular and parallel to the plane of the cutting at least in the cutting direction.

 

Same patents:
The invention relates to the cutting of laminated glass and can be used on glass factories that manufacture laminated glass

FIELD: process engineering.

SUBSTANCE: invention relates to separation of semiconductor chip surface layer. In compliance with first version, focused laser beam is directed onto chip so that its focus is located at layer separation plane perpendicular to beam axis and displaced to scan layer separation plane in direction of chip exposed side surface and deep down to make continuous cutout. In compliance with second version, focused laser beam is directed onto chip so that focus is located in layer separation plane perpendicular to beam axis and displaced in said plane to produce non-overlapping local regions with disturbed chip structure topology and weakened atomic bonds. Said local regions are distributed over entire said plane. External effects are applied to layer being separated to destruct said weakened atomic bonds.

EFFECT: separation of lateral surface layers from semiconductor crystals.

9 cl, 14 dwg, 12 ex

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