Polymer composition

 

Describes a polymer composition comprising titankeramik oligomer product TMFT and compound KP-B, based oligoadenylate and unsaturated epoxy-ether resins in the following ratio, wt.h. : product TMPT 10-20, compound KP-303 B 90-110. The technical result is to increase vitality, reduce the curing time, the absence of solvent and reducing the loss of microwave energy after sealing and impact of 98% humidity at +40oWith over 12 days. table 2.

The invention relates to the field of polymeric compositions that are intended for sealing electrical products, including ferrite components microwave devices, radio electronic elements.

Known compound [AU 535330] , including epoxy Dianova resin, titankeramik oligomer (product TMPT), methyltetrahydrophthalic anhydride and a filler. Preparation and curing of the compound is carried out at elevated temperature (100 and 160oRespectively), the cure time is long (more than 8 hours). This compound does not provide the stability loss of microwave energy ferrite components microwave devices. After Hermetica/img> (if requirements not more than 1q). The closest in technical essence and the achieved result is the compound [RU 2194067 C1], including epoxy Dianova resin ED-20 or ED-16 titankeramik oligomer (product TMPT), curing agent for epoxy resins AF-2, an organic solvent or mixture of solvents.

This compound has limited viability (no more than 1 hour), which presents difficulties in its use in conditions of mass production. The cure time is long (4 hours). The composition includes a solvent, which affects the porosity and, consequently, the moisture resistance. Need for waterproofing details to apply multi-layer coating. The compound does not provide the stability loss of microwave energy after sealing and moisture.

The technical result of the invention is to increase vitality, reduce the curing time, the absence of solvent and reducing the loss of microwave energy after sealing and impact of 98% humidity at +40oWith over 12 days.

The technical result is achieved due to the fact that the polymer composition, comprising titankeramik the 45042-2002) in the following ratio of components, wt.h.: Product TMPT - 10-20 Compound KP-B - 90-110 Product TMFT is hydroxycobalamin titankeramik oligomers cruciform structurei{[OSi(CH3)(C6H5)]2-5HE}4.

Compound KP-B consists of oligoadenylate brand TGM-3 (Triethylenetetramine) unsaturated epoxy-ether resins, peroxide of Dicumyl and accelerator (drying agent).

A polymeric composition was prepared by mixing the components at a temperature of 2510oWith, then utverjdayut at 150-160oC for 1 hour.

Table 1 shows the compositions of the polymer compositions of the invention in table 2 properties.

The compositions of the polymer compositions according to the invention.

The specified range of ratios of components selected due to the fact that the excessive amount of product TMPT reduces mechanical and waterproof properties of polymer compositions, and in smaller quantities - not attained the required properties.

As can be seen from the data presented in table 2, the proposed polymer composition has a number of advantages: - greater vitality (>30 days versus 1 hour); - short curing time (1 hour to 4 hours); - lack of process is 0,8); - improved waterproof properties (loss of microwave energy after exposure to high humidity is not more than 0,8 qagainst >1,0 q).


Claims

Polymer composition comprising titankeramik oligomer product TMPT, characterized in that the compound KP - B based oligoadenylate and unsaturated epoxy-ether resins in the following ratio, wt.h.:

Product CMFT 10 - 20

Compound KP-B 90 - 110

 

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2 tbl, 6 ex

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