A supporting member for a semiconductor crystal, designed for installation in a card with integrated circuits
The invention relates to a bearing element for a semiconductor crystal and can be used for installation in a card with integrated circuits. The technical result is to increase the protection from destruction. The device contains a lot of covering, surrounding and protecting the semiconductor chip, and at least two outputs of conductive material having drawn together the ends of reduced thickness. 11 C.p. f-crystals, 8 ill. The invention relates to a bearing element for a semiconductor crystal at least two terminals, in particular for installation in a card with integrated circuits (IC), and the element includes a sealing and protecting the coating weight, the conclusions made from conductive material and at the ends, facing each other, have a reduced thickness, and in cross-section with only one side has rung. The semiconductor crystal is placed on the conclusions in the area of this section of reduced thickness and mechanically connected with them.Such bearing element is known from Japan patent JP 08-116016 as presented in abstracts of Japanese patents. This known bearing element, however, will not exceed available in the required manner.Known for a variety of load-bearing elements for semiconductor crystals, designed for installation in a card with IP. Thus, in U.S. patent 5134773 described supporting member with the contact pads of conductive material in the form of a frame, in which the semiconductor crystal is glued onto situated in the centre of the island crystal and electrically connected by means of pripevami the wire leads to contact pads located on the periphery. The semiconductor crystal is surrounded by a sealing mass that protects the crystal and wire and, in addition, holds the pads in their position. So as to contact pads on the side facing the IC needs to be provided with free access of air mass has only one side. So, in spite of this, to ensure a good mechanical fastening pads on the side facing the IP in the field of electrically insulating them from each other slotted holes have a back cut-outs filled with a sealing mass and implement the connection type of the riveted connection.Bearing element is described in U.S. patent 5134773, intended for use in the composition of the so-called contact is for the reader, however, it is also known that only provides two outputs, which can electrically be connected with the coil located on the card or on the device input card.In addition, it is possible to make conclusions on the number and shape of the run so that they are suitable for connection with the coil or antenna, and with the reader.In the manufacture of contactless cards with IP-based technology lamination, when the carrier foil coil is located on the host element and sealed with at least two covering films, often takes place that layup bearing element you must do is possible with small geometric dimensions to provide optimum wrap covering film, razmyagchayuschiesya under the influence of temperature and pressure around the bearing member and thereby to obtain a high quality card with no failures and defects of prints, i.e., the flat outer surface to which is applied the pressure.Standard design card with the IC for contactless application provides for the following: carrier foil coil has a thickness of about 200 μm, two foil gel core is from scratch have a thickness of about 50 μm. All of this gives a thickness of about 800 μm in accordance with ISO 7816. Hence the required height of the support member less than 400 μm and the minimum possible length in the plane of the card.If the implementation is known from the patent U.S. carrier element is derived height exceeding 400 microns, due to the mounting of the crystal on the island for crystal and height of the loop pripevami wire leads.The objective of the invention is the creation of a bearing element, which has a small height and superior characteristic tensile fracture and thus simple to manufacture.This task is solved by a bearing element according to paragraph 1 of the claims. Preferred options for implementation are listed in the dependent claims.The findings that during mounting of the semiconductor chip and covering the chip and the bond wires are part of the support frame, the so-called framework conclusions, have a section of reduced thickness, so that in cross-section with only one hand had rung. The section with reduced thickness in accordance with the invention is manufactured by stamping. When this thickness reduction of 50% nominalwage is flat, while the opposite plane has rung. The semiconductor crystal is placed in the area of this site. It can be located on the side of the stairs, and on the opposite side. Preferably the crystal to its active side is oriented in the direction from the findings, if it is placed on the side of conclusions with a step. If it is placed on the opposite side, in the preferred embodiment, it is mounted oriented with its active side to the conclusions, as pripevami wire findings in the area of the site smaller thickness can connect with conclusions and thereby the height of the loop pripevami wire conductors is not of great importance. In both cases there is the desirable saving in height.The maximum possible savings height is achieved through the use of so-called mounting method of the inverted crystal, in which a semiconductor crystal directly with their pads, which are preferably provided with projections, so-called bar pins, soldered or glued to the conclusions. This makes it possible to abandon pripevami wire leads.Disclaimer Ostrovno and in the best fixation of the mass of the coating on the findings, since the mass of the coating may surround the crystal on both sides and forms a good connection to the crystal electrodes. By excluding Islands to host crystal are also excluded forces caused by stress concentration, resulting in improved properties of strength, destruction.A consequence of the less desirable height of the load bearing element is the fact that one of the surfaces of the findings remains free and can be used for making contacts. In the best constructions card with IP, in particular laminated card with IP, it is preferable for this embodiment, when the coating weight between the findings is in line with the surface of the conclusions.Conclusions can be relative to the weight of the coating and to form in these places contact lugs for connecting terminals on the antenna. It is preferred for the method of installation in which the antenna coil is printed on the carrier foil. The carrier foil preferably has a notch or recess, in which there should be a lot of coverage, while the findings or, respectively, in this case, contact the petals have on the carrier foil to adhere to the conclusions katokato, consisting in that the bearing element can be introduced later, in the laminated card, which, however, has the notch. Preferred, the ends of the antenna coil is placed in a recess, to provide a simple way to communicate with the conclusions of the bearing member, for example, by gluing, prepaymania or by using a spring connecting elements.Bearing element, which has only such pads instead of acting on the contact edges of the petals can also directly be applied to the carrier foil coil. In this case, the respective core foil laminate the cards should have the notch.Contact petals can preferred way to have extended ends to better connect with the conclusions of the wound coil.Particularly good fixing of the weight of the coating with the conclusions provided in the case, if the conclusions bent at a right angle to the crystal and therefore unbent plots lie in the weight of the coating. If contact lugs bent at right angles preferably in the other direction, it is even more effective pinning. In addition, in this way are formed drugies in the following examples, with reference to the drawings, which shows the following: Fig. 1-6 - views in cross section of various forms of execution of the bearing member corresponding to the invention, Fig. 7 - bearing element with contact petals for mounting on the carrier foil coil and Fig. 8 - bearing element with pads for mounting on the carrier foil coil or directly on the card with the IP.In Fig.1 shows the invention bearing element in the cross section shown in Fig. 7. Two conclusions 1 is placed along the oppositely located edges of the support member. They serve, on the one hand, as a plane of support for a semiconductor crystal 2 and, on the other hand, to communicate with them outside of the bearing member. To this end, they are connected with a semiconductor crystal 2 with pripevami wire leads 4. Semiconductor crystal 2 is mechanically connected to pins 1 through the adhesive means 3. Semiconductor crystal 2 and pripevami wire 4 is filled or covered with a coating weight of 5. The weight of the cover 5 preferably has a light color, in contrast to conventional commercially available black mass of the coating, seen through the layers of the card with the IP.As can be seen from Fig.7 conclusions 1 predpochtitelney substrate for semiconductor crystal during installation. Conclusions 1 for mounting is connected with the supporting frame, so-called conclusions, and after mounting the crystal and casting or coating are cut from it. In the shown examples, there are only two output 1, as these bearing elements are primarily suitable for contactless cards with IP. You can, however, provide some conclusions as to contact pads in accordance with ISO 7816, to obtain thereby supporting member for contact cards with IP. The essential thing is that does not provide any Islands for crystal. Thereby the exception of any effort caused by stress concentration, and, on the other hand, the weight of the coating 5 may be applied to the entire crystal 2 and thereby to contribute to a better consolidation of findings 1 on the host item, as they are mostly fixed by adhesive bonding 3, not only due to the forces of adhesion between the coating weight of 5 and conclusions 1.Even more effective pinning conclusions 1 is provided in the case, if they are bent at an angle, as shown in Fig.2. The first section 1C output 1 is bent approximately at a right angle to the crystal 2. In another embodiment, the wasp is hiccups another externally accessible pad, so this bearing element is suitable for use in so-called "combicheck", as it on the one hand can connect to the coil, and on the other hand may come in contact with the reader. In this case you need more than two conclusions. However, in the General case, it is sufficient to use only two curved output.Along with the exception of the island to host crystal is one of the main aspects of the support member corresponding to the invention, illustrated by segment 1A output 1, which, in contrast to the nominal thickness, has a reduced thickness, and a step there is only one side of the pin 1, as shown in section in the drawing. Thus the total height of the bearing member is reduced by about half the thickness of the conclusion, if the semiconductor crystal 2 is placed in the area of this plot 1a with reduced thickness. As these areas 1A can be performed at small sizes on the mechanical properties of output 1 is not a negative influence.In Fig.1 and 2 show a semiconductor crystal 2 is placed on the side with the step in the output section 1, and the active side of the semiconductor crystal 2, i.e. the side on cot semiconductor crystal 2 is placed on the side of findings 1, the opposite side with a step in the cross-section, and the active side is oriented toward conclusions 1. Pripevami wire 4, according to the invention, connected to the 1A section with reduced thickness, so that the loop height of the wire should not lead to additional increase the height of the bearing member. Additional savings height can be achieved due to the fact that the reverse side of the crystal is not supplied with a coating weight of 5, as follows from Fig.4. This is possible because the active side of the semiconductor crystal 2 is oriented in the direction of conclusions 1.In Fig. 5 and 6 show other possible mounting options, in which the semiconductor crystal 2 is connected to pins 2 by applying a mounting method of the inverted crystal. Pads crystal 2 is directly connected with areas conclusions with less thickness. Before this, they can be supplied with conductive protrusions 6, the so-called bar pins or lugs for soldering. The lowest elevation is the element corresponding to Fig.6, in the case of semiconductor element 2 mounted according to the method of the inverted crystal region of the plot aasan option of embedding corresponding to the invention the bearing member in the carrier foil 7 to the antenna coil 8. The bearing element has conclusions 1 contact with petals, that is 1, which protrude over the edge of the mass of the coating 5. Contact petals have extended ends 1b, to allow better contact with the conclusions of the coil 10. When mounting the weight of the cover 5 is inserted into the recess 9 in the carrier foil, and the contact lugs 1 are in contact with the conclusions of the coil 10. These mounting options provide a particularly flat design of the bearing member in a laminated card.In Fig.8 shows a variant in which conclusions 1 made in the form of pads, which in the drawing are not visible because they are located on the bottom side of the bearing member. It is shown that the protruding above the edge of the mass of the coating 5, the patches are removed, that is, for example, when cutting from the scope of the conclusions. Bearing element is placed on the carrier foil 7 of the coil and in contact with the conclusions of the coil 10. In order to obtain a flat surface of the card, the upper core foil laminate card with IP must have the notch.Bearing element made in accordance with such variations may be introduced in the already laminated or covered card 11, which for this purpose has the recess 12. In the recess 12, you can see the conclusions 10 coil, kyodai 1 bearing element.Such subsequent embedding of the bearing member in a card with IP 11 provides a simple method of manufacturing a so-called combinatory, which on the one hand has contact pads for contacting with the card reader located on one surface of the card with the IC 11, and on the other hand it has the coil 8. For implementation of this option is especially suitable bearing element is performed, as shown in Fig.2.
Claims1. Bearing element for a semiconductor chip (2) with at least two conclusions (1) primarily for installation in a card integrated circuit (11), and referred item contains a lot of cover (5), surrounding and protecting the semiconductor chip (2) referred to the conclusions (1) made of conductive material and are drawn to each other the ends (1A) of a reduced thickness compared to the nominal thickness of the conclusions (1), and in cross section on one side only form a step, the semiconductor chip (2) is placed on the conclusions (1) in the area of the specified section (1A) of reduced thickness and mechanically connected with the conclusions of (1), characterized in that the conclusions (1) is placed on one surface of m is by stamping.2. Bearing element under item 1, characterized in that the loose surface of the conclusions (1) is located in line with the surface of the mass of the coating (5).3. Bearing element under item 1 or 2, characterized in that the pins (1) are only in the field of mass of the coating (5) and there form a contact pad.4. Bearing element under item 1 or 2, characterized in that the conclusions (1) protrude above the edge of the mass of the coating (5) and form a contact petals.5. Bearing element under item 4, characterized in that the contact lugs (1) have an extended end (1b).6. Bearing element according to any one of paragraphs. 1-5, characterized in that the semiconductor chip (2) is placed on the conclusions (1), and the active side of the semiconductor chip (2) is addressed to the conclusions (1).7. Bearing element under item 6, characterized in that the semiconductor chip (2) is placed on the side of conclusions (1) having in cross section a step.8. Bearing element under item 7, characterized in that the mechanical connection also act as electrical connections (6).9. Bearing element under item 7, characterized in that electrical connections are made through pripevami wire leads (4).10. Bearing element according to any one of paragraphs. 1-5, characterized in that th is and the semiconductor chip (2) is turned in the direction of the conclusions (1), moreover, electrical connections are made through pripevami wire leads (4).11. Bearing element according to any one of paragraphs. 1-10, characterized in that the first section (1C) conclusions (1) is bent approximately at a right angle relative to the semiconductor chip (2).12. Supporting member 11, characterized in that the segment (Id) conclusions (1) is bent approximately at a right angle in the direction from the semiconductor chip (2).
FIELD: access tickets and cards.
SUBSTANCE: paper body of ticket has through socket, wherein electronic module is placed, containing integral chip and antenna. Antenna is formed by at least one coil, made by printing by paint with silver dust, polymerized to hardening by thermal processing.
EFFECT: lower costs.
3 cl, 6 dwg
FIELD: chip-cards engineering.
SUBSTANCE: antenna on substrate has at least one coil of electric-conductive paint, applied to antenna by template method, two card bodies on each side of substrate, each of which has at least one plastic layer, a micro-chip or module, connected to antenna. Substrate is made of paper and has slits in each corner, on level of which by soldering two card bodies are connected, which allows card to divide in layers in place of greatest bending load.
EFFECT: higher efficiency.
11 cl, 6 dwg
FIELD: chip-cards engineering.
SUBSTANCE: antenna is made by template method on substrate, and bodies of cards are made during lamination of substrate. Milling of hollow is performed on card body, opposite to side of substrate with template print of antenna with possible mounting of module, containing micro-chip and two-side circuit. Slits made at corners of antenna substrate prior to lamination stage provide for engagement of card bodies with each other.
EFFECT: higher efficiency.
11 cl, 6 dwg
SUBSTANCE: method includes manufacturing antenna by template method at substrate, gluing contacts of microchip to antenna substrate by electric-conductive glue, laminating card on each side by hot pressing on antenna substrate, hence manufacturing two bodies of card. In corners of antenna substrate slits are made, which provide for soldering together of card bodies during lamination.
EFFECT: higher efficiency.
8 cl, 6 dwg
FIELD: electric engineering.
SUBSTANCE: carrying film has at least one current-conducting track with connecting portions, containing multiple interconnected surfaces 7 and empty hollows 8.
EFFECT: higher efficiency, higher reliability.
3 cl, 3 dwg
FIELD: data medium engineering.
SUBSTANCE: proposed data medium has at least two antennas, corresponding to different transmission ranges. In this case the data medium may be fabricated such a way that it is ensured possibility of operation with devices for record/read, functioning in accordance with different standards. At least two from the antennas produce a single unit. Owing to this union the developed data medium may be fabricated with high efficiency.
EFFECT: technical result of the invention is increased economic efficiency of data medium fabrication.
3 cl, 4 dwg
FIELD: chip cards with body, semiconductor circuit and substrate, while substrate on both sides is provided with flat contacts and conductors of contact openings, which connect upper and lower flat contacts electrically to each other.
SUBSTANCE: because conductors of contact openings are hollow inside, air moisture can penetrate chip card through hollow gaps and damage semiconductor micro-circuit, of conductors of contact openings are not closed. Method includes positioning conductors of contact openings so close to edge of substrate, that their lower ends project into base of external hollow and close together there.
EFFECT: prevented penetration of moisture into inner hollow, wherein micro-circuit is positioned, without need for special protection of contact opening conductors.
10 cl, 2 dwg
FIELD: apparatuses for blanking plastic, mainly blanking inserts integrated to chip-cards.
SUBSTANCE: apparatus includes operating in pair blanking punch with blanking surface and counter-support between which plastics to be punched is placed. Blanking surface of blanking punch has acute-angled cutting edges with apex angle less than 90°. Counter-support is in the form of die. It allows to blank notches practically along the whole perimeter of insert.
EFFECT: reduced probability of cracking in paint layer along edge of blanked portion and burr occurring.
5 cl, 6 dwg
FIELD: engineering and production of electronic labels, in particular, ones meant for attachment to metallic objects.
SUBSTANCE: one of characteristics of electronic labels is that reading and recording during their utilization can be performed without mechanical contact with communication frame (antenna). In this case reading head is set at some distance from label and interacts with is by means of magnetic waves. When such labels are positioned on metallic objects, reading becomes obstructed or even impossible due to dispersion of waves in the object. Invention makes it possible to prevent such a drawback because antenna is equipped with electromagnetic component meant for isolation of antenna and thus for improving receipt quality.
EFFECT: improved quality of receipt.
2 cl, 2 dwg
FIELD: technology for manufacturing modules.
SUBSTANCE: in accordance to method for manufacturing a module to be built into body of card, on one of the sides of base 4,5,6 of this module current-conductive structure 7 is provided. During manufacture of module base at least its first layer 1, positioned on the lower side 9 directed from current-conductive structure 7, is made of material, properties of which, during mounting of module in the body of card in accordance to certain technology, have important value for aforementioned mounting, and are synchronized with properties of material of this layer of card body.
EFFECT: simplification and decreased costs of manufacturing technology.
3 cl, 3 dwg