Dielectric composition for high contrast coating on steklomontage under fusible glass
(57) Abstract:The invention relates to the field of electronic technology and can be used in the manufacture of gas discharge display panels AC and DC. The technical result - getting accent cover black on steklomontage with mechanochemical stability to low-melting glass (LPS) when exposed to high temperatures T>TPLThe FSC. The formation of the contrasting cover black on steklomontage under fusible glass (FSC), which has a mechanical resistance to LPS when exposed to temperatures above the melting point of the FSC, is provided through the use of a dielectric composition comprising the glass strain temperature t10.9 , TDef.Art.below.t11.08 TDef.FSCin the amount of 35-45% and refractory black color component in the amount of 55-65%, where TDef.FSC- temperature deformation LPS, TDef.Art.below.- temperature deformation Steklovolokno. table 1. The invention relates to the field of electronic technology and can be used in the production of indicators - discharge indicatorname black matrix on the screen of a color picture tube based colloidal graphite drug [ABT. St. USSR 1365982, CL H 01 J 9/22, publ. 20.12.99,].The disadvantage of this composition is the use as a component of black colloidal graphite drug which is unstable under thermal treatments in air, because at temperatures above 300oWith the oxidation and total burnout graphite.Known dielectric composition black oxide WG-MP (praseodymium-manganese) used in electro-luminescent indicators for the formation of dielectric layers by spraying in the environment of the AG or AG+O2(Black Pr-Mn oxide dielectric material for AC thin-film destrolumimes cent display, Matsuoka Tomiza, Kuwata Sum, Fujuta Yosuke, Ab Atsushi - S Electrochem, Soc, 1988, 135, No. 7, R. 1836-1839).The disadvantage of this dielectric composition is that for formation of a dielectric layer requires sophisticated, expensive equipment for spraying. The coating process is time-consuming, inefficient, and environmentally harmful.In addition, the drawbacks include the necessity to use in the deposition process of the expensive inert environment, as well as the use of rare earth materials.Known dielectric composition based syncoperation glass and powder tubl. 23.07.80 year).The disadvantage of this dielectric composition is formed using the coating cannot be used under low-melting glass (LPS), as the heat distortion temperature of fusible glass and syncoperation glass close. Under high temperatures, namely, at temperatures greater than the melting temperature of LPS (T>Tplasma LPS) there is a softening syncoperation glass and its mixing with low-melting glass, with refractory material black color diffuses into the low-melting glass, which is unacceptable in the manufacture of the ISU AC.Closest to the present invention is a dielectric composition containing glass and refractory component black [application France 2169911, H 01 J 17/00, 19.10.73, - prototype].Despite the fact that this dielectric composition allows to obtain a contrasting dark color in a thin enough layer, it cannot be used in the production of the ISU due to the fact that the composition of low-melting glass, which is in thermal treatments carried out after viginia contrast coating, leads to its deformation and casticin is sufficient to obtain contrasting floor black on steklomontage, with mechanical and chemical resistance to low-melting glass at high temperatures T>Tplasma LPS.This technical result is achieved by the fact that the known dielectric composition for high contrast coating on steklomontage under low-melting glass containing glass and refractory component is black, contains glass strain temperature t1not more than 0.9 temperature deformation Steklovolokno (TDef.Art.underand not less 1,08 temperature deformation of low-melting glass (TDef.FSC)
(0.9 TDef.Art.below.t11.08 TDef.FSC) in the following ratio, wt.%:
Glass - 35-45
Refractory component black - 55-65
Use in the composition of the dielectric composition of the glass strain temperature in the proposed limits of ratios with temperature deformation Steklovolokno and fusible glass provides good adhesion of the black refractory material to steklomontage, maintains the shape of the contrasting element during high-temperature annealing, and also prevents diffusion of the black component in the fusible glass.
the Cam information and identification of sources containing information about the equivalents of the claimed invention, allows to establish that the applicant is not detected similar, characterized by symptoms that are identical to the characteristics of the claimed invention, and the definition from the list of identified unique prototype, as the most similar set of features analogue, has identified a set of essential towards perceived by the applicant to the technical result of the distinctive features in the claimed object set forth in the claims.Therefore, the claimed invention meets the requirement of "novelty."To verify compliance of the claimed invention to the requirement of inventive step was conducted an additional search of the known solutions, in order to identify characteristics that match the distinctive features of the prototype of the characteristics of the claimed invention, the results of which show that the claimed invention is not necessary for the expert in the obvious way from the prior art, so as not detected dielectric composition for forming a contrast coating on steklomontage under fusible glass, allowing you to get good contrast (black) layer with high the sustainable structure of coating, excluding mechano-chemical effect between these layers during annealing at temperatures, large temperature melting fusible glass.Thus, the claimed dielectric composition meets the requirement of "Inventive step".Dielectric composition for forming a contrast coating on steklomontage prepared as follows. Powder glass strain temperature t10.9 , TDef.Art.below.t11.08 TDef.FSCin the amount of 35-45 weight. % black powder refractory component in the amount of 55-65 wt.% mix in a ceramic drum with glass balls for 2 hours the mixture is Then freed from the balls and cook contrasting dielectric paste. By the method of screen printing on steklomontage (TDef.Art.below.= 600o(C) form the elements of a contrast coating. Steklovolokno with contrast coating is subjected to heat treatment at T=58010oC.During the next operation at the hard coating layer is formed of a dielectric-based low-melting glass with TDef.FSC=42510oC. Stekloplastika with contrast cover the spas coating on the plate display form between the electrodes. When applying contrast coatings on the basis of the dielectric composition the proposed composition of the resistance of the interelectrode insulation on the plates is more than 10109Ohms, indicating the absence of interaction of the dielectric composition with electrodes on steklomontage. When further forming a dielectric coating on the basis of the low-melting glass in contrast elements according to the technological cycle of production of steklomontage with the electrodes of the ISU AC and annealing at temperatures T>Tplasma LPSalso not happening mechano-chemical interaction between the covers, with the electrophysical properties of contrast coating does not change.It is known that in the manufacture of the ISU AC select temperature mode viginia electrodes, barriers, dielectric largely depends on the temperature of deformation Steklovolokno. In addition, the choice of glass for the dielectric coating also depends on the temperature of deformation Steklovolokno. So when the heat distortion temperature of the selected glass is equal to t10.9 TDef.Art.below.when the burn-in at T>Tplasma LPSSteklovolokno with contrasting floor CTE is a low-melting glass with temperature ratio with glass in the composition of contrasting composition t11.08 TDef.FSCdue to the different viscosity of the glass at the temperature of annealing is not their interpenetration and refractory black component is not diffused into the low-melting glass.When the burn-in of Stekloplastik, the annealing temperature must be below the temperature of deformation Steklovolokno. However, if you use glass in the composition of the dielectric composition with10.9 TDef.Art.below.then the annealing temperature T>Tplasma LPSwill be insufficient to slight melting of the glass and the formation of a strong form with refractory component. In addition, the adhesion of the dielectric contrast of the coating to steklomontage will be insufficient, and when the burn-layer LPS will invalidate the integrity of contrasting coating that will cause it to move in the layer of low-melting glass and the change of electrical characteristics of the device.If the glass in the composition of the dielectric contrast of the composition has a t1<1,0 8TDef.FSCin the process of thermal treatment due to the comparable values of the viscosities of the glasses will be the interpenetration of glasses, consequently, refractory black component will diffuse into the low-melting glass, which is unacceptable in technology is oppozitsii selected so to ensure good adhesion of contrast coating to steklomontage, preserved the integrity of the contrast coating by melting a low-melting glass, and created high contrast on the plate indicating the ISU AC.If the amount of glass in the dielectric composition to take more than 45%, the content of refractory black component will be less than 55%, which will not allow to receive a contrast coating is sufficiently dense, non-porous and punctures, which contrast the ISU AC will be the bad.When the content of the glass in the dielectric contrast of the composition to less than 35% of the content of the refractory component will be more than 65%, which will result in a violation of the strength of the contrast element when the burn-in, because the number of steklovata is insufficient to ensure good adhesion of the particles of the refractory filler in contrasting finish. As a result, after melting a low-melting glass particles of the refractory filler will diffuse into the low-melting glass, will invalidate the integrity of the coating will change electrical characteristics of the device.The study of the properties of the proposed dielectric contrast of the composition is a heat distortion temperature of 600oWith the ISU AC as described above was prepared several formulations of dielectric pastes. When applying a contrast coating method, screen printing was used the same stencil. The floor was vigilos at T=58010oWith a delay of 2.5 hours. Then formed a layer LPS - S-3, which was Vigala in the same temperature regime.Options dielectric composition used in the preparation of pastes:
Example 1.Glass S-3 - 45%
Refractory component black VK-74 - 55%
The strain temperature of the glass S-3 - 480oWITH
The strain temperature of the glass FSC S-3 - 425oWITH
The strain temperature of the glass S-3 corresponds to the ratio of 0.9 TDef.Art.below.t11.08 TDef.FSCnamely 600>480>425oC.Contrast coating formed on the basis of this dielectric composition has a black, dense, without posichek and piercing, inert, stable under low-melting glass has a good adhesion on steklomontage.Example 2.Glass S-3 - 35%
Refractory component black VK-74 - 65%
The coating quality matches the quality of the coating, opican is - 70%
Contrasting the coating obtained on the basis of specified dielectric composition may not have sufficient mechanical and chemical stability, collapses under the influence of a low-melting glass, the color contrast is bad, broken electrical characteristics of the device.Thus, the proposed dielectric composition allows you to form a contrast coating, black, high dielectric properties, with mechanical and chemical stability to the structural elements of the ISU alternating current when exposed to a low-melting glass during heat treatments (see table). Dielectric composition for high contrast coating on steklomontage under low-melting glass containing glass and refractory black color component, wherein the dielectric composition contains glass strain temperature t1not more than 0.9 temperature deformation Steklovolokno and at least 1,08 temperature deformation fusible glass in the following ratio, wt. %:
Glass - 35 - 45
Refractory component black - 55 - 65
FIELD: electronic engineering; gas panel manufacture.
SUBSTANCE: proposed dielectric composition incorporates low-melting glass and high-melting filler powders wherein particles of low-melting glass and high-melting filler powders have at least one of following shapes: spherical, cylindrical, or planar; amounts of low-melting glass and high-melting filler are chosen from equation , where k1 = ρ1/ρ2 is factor characterizing physical of low-melting glass and high-melting filler; k2 = V1/V2 is factor characterizing packing density of particles of low-melting glass and high-melting filler powders; m1 and m2 is amount of low-melting glass and high-melting filler, respectively, g; ρ1 and ρ2 is density of low-melting glass and high-melting filler, respectively. V1 and V2 is volume occupied by low-melting glass and high-melting filler, respectively, cm3.
EFFECT: enhanced structure density of structural components.
1 cl, 1 tbl
FIELD: electronic engineering; anti-flash coatings for gas panels.
SUBSTANCE: proposed composition production process does not include high-temperature treatment and environmentally harmful operations. Anti-flash coating is produced from dielectric composition incorporating 2 - 5 mass percent of silicon oxide and 95 - 98 mass percent of photo-exposable material based on epoxy and acrylic resins; composition is applied in layer of 2 - 5 μm in thickness and exposed.
EFFECT: enhanced mechanical strength and lighting characteristics of coating and environmental friendliness of its production process; reduced labor consumption and cost.
2 cl, 5 ex
FIELD: electronic engineering, applicable in production of gas-discharge indicating panels.
SUBSTANCE: use is made of pastes, in the production of process of which the filler powder is mixed and ground in and organic solvent taken in amounts respectively 1.5 to 245 percent by mass and 75 to 98.5 percent by mass. To improve the paste quality, the filler powder and organic solvent mix is agitated with addition of balls, 2 to 5 mm in diameter, taken in amounts of 60 to 100 percent of the mix mass,, for preparation of the paste use is also made of am organic binder heated to 45-65 C.
EFFECT: provided forming of components of the gas-discharge panel with a high degree of resolution.
3 cl, 3 ex
SUBSTANCE: invention discloses a device based on SSB technology for cleaning, separating, modifying and/or immobilising chemical objects or biological objects in fluid medium. The disclosed device has one or more supports made from microwire tied by their ends and having a multilayer structure consisting of a centre rod and at least one coating layer suitable for binding chemical or biological objects with a functional coating or ligands lying on the surface of the support made from microwire in the absence of the effect of a magnetic field created between the supports made from microwire and particles in the fluid medium. Described also is a method of cleaning, separating, modifying and/or immobilising chemical or biological objects in a fluid medium using said device.
EFFECT: invention enables to clean, separate, modify or immobilise objects in a fluid medium with high flow rate.
24 cl, 2 tbl, 14 ex
FIELD: electronic engineering; gas panel manufacture.
SUBSTANCE: proposed method includes formation of contact members for strip conductors in insulator holes at distance of 1.5 to 3 mm from its edge.
EFFECT: facilitated procedure.