The solution for bezelektrodnogo copper plating, the method bezelektrodnogo copper plating

 

(57) Abstract:

The invention relates to plating products. Proposed solution bezelektrodnogo copper plating containing a copper ion, a complexing reagent, the connection phosphonoacetic acid as a reducing agent and a metal catalyst to initiate a redox reaction, and lithium ion and surfactant polyoxyethylene type. In addition, the method bezelektrodnogo copper plating, which use this solution, as well as metallic product obtained by this method. The solution bezelektrodnogo copper plating according to the present invention provides a deposition on the surface of the object metallization homogeneous and needle copper film and can therefore be used to increase the strength of adhesion between different metals and resins, including adhesion of the copper foil with resin, which is applied in such conductor circuits, multilayer printed circuit boards or copper coated laminate. 3 S. and 6 C.p. f-crystals, 4 Il., table 1.

The technical field

The present invention relates to a solution for bezelektrodnogo copper plating and method bezelektrodnogo medeelektrolitniy copper plating, which together can have a homogeneous and needle copper film deposited on the surface of the object metallization, and therefore can be used to increase the strength of adhesion between different metals and resins, including adhesion of the copper foil with resin that is used in wiring diagrams, such as multilayer printed circuit boards, or coated with copper and laminates; and metallic products, which can be received by the specified method.

Art

Multilayer PCB traditionally made by the initial preparation of the copper-plated laminate for the inner layer by processing the copper foil on the copper-plated laminate to form a circuit; further processing the above-mentioned copper foil by roughing the surface (in the General case, which includes degreasing followed by the process of the soft etching, exemplified by treatment with ammonium persulfate, sodium persulfate, copper chloride, hydrogen peroxide - sulfuric acid, etc.,); subsequent build-up needle films of copper oxide or cuprous oxide on the upper surface of the foil with the help of this process, as the blackening is provided with the material, impregnated thermoreactive resin (i.e., pre-preg), with the aim of producing a multilayer laminated circuit Board having a high adhesive strength.

Since the electrical connection must be established with each layer of the multilayer laminated circuit Board manufactured through the above process, in holes drilled through the Board, it is necessary to make plated through holes. However, the conventional method has the disadvantage that the penetration of the acid solution used in the process of catalytic processing for plating through holes, or the penetration of gas metallizing solution in the process bezelektrodnogo copper plating has a tendency to dissolve the film formed by the oxide of copper or copper oxide, thereby causing a phenomenon known as "pink ring" (i.e. "halo").

On the other hand, there is an alternative method of manufacturing a multilayer printed circuit Board, whereby the circuit Board is formed on the copper-plated laminate using the copper foil, which is pre-processed by roughing the surface in order to eliminate the need for processes of roughing the surface, as well as fo the AMI, as low clear pattern for resist printing etching or resist etching to ultraviolet irradiation, which is associated with the roughness of the surface on a copper foil.

In recent years we have developed ways to repair the above-mentioned disadvantages of the coated copper laminates and increase the adhesive strength by using some special types of processing betalactaminam applying chrome coating (Japanese patent application laid 15980/1986, 15981/1986 and 41775/1986).

In practice, however, the above-mentioned process bezelektrodnogo copper plating requires the use of formalin as a necessary reducing agent and thus there are problems such as (a) abnormal deposition of copper on the resin substrate, (b) the instability of the gas metallizing solution or (b) an unpleasant odor, and possible Carcinogenicity.

The authors of the present invention has recently developed a method of splicing needle and the copper film with excellent adhesive strength using betalactamase copper plating (Japanese patent application laid 116176/1992). Although this technology allows the fabrication of coated copper laminate having a high adhesive strength in the absence of Vishay limited and advantage of the invention is not always possible to use.

Accordingly, it was necessary to improve the above-mentioned technology to provide the technology, which would provide a better adhesive strength and would be more versatile.

The invention

In the course of performing serious amount of research on the improvement of the above technologies, based on the Japanese patent application laid 116176/1992, the authors of the present invention have discovered an unusual fact that lithium ion is extremely effective in creating a uniform copper film and the needle structure. The basis of the following invention formed this and other discoveries, in particular, homogeneous and needle copper film with excellent adhesive strength can be obtained if the solution for bezelektrodnogo copper plating of lithium ions that prescribed in the technology, either alone or in conjunction with surface-active substance polyoxyethylene type other than surfactants polyoxyethylene type containing acetylene moiety used in this technology.

Accordingly, the subject of this Yo for bezelektrodnogo copper plating, containing a copper ion, a complexing reagent, the connection phosphonoacetic acid as a reducing agent and a metal catalyst to initiate a redox reaction, characterized in that it further contains a lithium ion.

Another object of the present invention is to create a solution for bezelektrodnogo copper plating, which is based on the solution for bezelektrodnogo copper plating containing a copper ion, a complexing reagent, the connection phosphonoacetic acid as a reducing agent and a metal catalyst to initiate a redox reaction, characterized in that it further contains a surfactant polyoxyethylene type and lithium ion.

Another object of the present invention is to provide a method bezelektrodnogo copper plating, whereby a uniform and needle copper film precipitated on the surface of the object metallization by using the above solution for bezelektrodnogo copper plating, as well as in obtaining metallic products using this method.

Brief description of drawings

Fig. 1 is an image, Polo using the solution for bezelektrodnogo copper plating, according to Example 1.

Fig. 2 is an image obtained using an electron microscope, showing a crystalline structure of the copper film obtained by using the solution for bezelektrodnogo copper plating according to Example 2.

Fig. 3 is an image obtained using an electron microscope, showing a crystalline structure of the copper film obtained by using the solution for bezelektrodnogo copper plating according to Example 3.

Fig. 4 is an image obtained using an electron microscope, showing a crystalline structure of the copper film obtained by using the solution for bezelektrodnogo copper plating according to Example 10.

The best example of carrying out the invention

Although as lithium source for supplying lithium ions solution for bezelektrodnogo copper plating corresponding to the present invention, it is possible to use various lithium salts such as lithium hydroxide, lithium carbonate, lithium sulfate, lithium chloride, lithium bromide, lithium fluoride or lithium hydride, from a management perspective, preference is given to lithium hydroxide and lithium carbonate, which will be explained later, a t the least concentration of lithium ions in the solution to bezelektrodnogo copper plating was in equivalents of lithium hydroxide from 0.1 to 200 kg/m3preferably from 1 to 100 kg/m3.

The above-mentioned lithium ion may be introduced in the form of lithium hydroxide or lithium carbonate, to also serve as a pH regulator solution for bezelektrodnogo copper plating, in this case, together with it is possible to use sodium hydroxide or potassium hydroxide.

Meanwhile, as surfactants polyoxyethylene type, be inserted into the solution for bezelektrodnogo copper plating corresponding to the present invention, may be mentioned compounds, which include surfactant polyoxyethylene type containing acetylene radical, polyoxyethylene adduct of an alkyl phenol, polyoxyethylene adduct of amide of fatty acid, the block polymer of polyoxyethylene-polyoxypropylene, polyoxyethylene-polyoxypropylene adduct of ethylene diamine and ethoxylates of secondary alcohols. Among them, the predominant are those surfactants polyoxyethylene type that contain acetylene, polyoxyethylene adduct of an alkyl phenol and polyoxyethylene adduct of amide fatty acids.

Examples of the composition of the surfactants polyoxyethylene type of content the content type, can serve those obtained by the addition of oxide alkylene, such as ethylene oxide to alcindoro, for example, 2,4,7,9-tetramethyl-5-Decin-4,7-diol and 3,6-dimethyl-4-octyn-3,6-diol, where the predominant examples can be expressed by the following formula (I):

< / BR>
in which R1and R2denote alkyl groups, R3and R4represent a hydrogen atom or a lower alkyl group, a m1 and n1 - number, making a total of from 3.5 to 30.

Surfactant polyoxyethylene type containing acetylene moiety, expressed by the above formula (I), the surface-active substance polyoxyethylene type containing acetylene radical, which are disclosed in Japanese patent application laid 116179/1992, including, for example, surfactants sold under such factory brands as Surfinol 440, Surfinol Surfinol 465 or 485 (all manufactured Nisshin chemical industries Co., Ltd.), suitable for practical applications with satisfactory results.

Examples of the composition polyoxyethylene adduct of phenol alkyl include those obtained by joining the above-mentioned oxide alkylene to alkyl phenol, such as phenol of Manila or phenol Oct denotes alkyl group, and n2 is an integer from 2 to 110.

Polyoxyethylene adduct of an alkyl phenol expressed in the above formula (II) includes, for example, surfactants sold under such factory brands as mulgen 985 (manufactured by Kao Corporation), Nonion NS-270 (manufactured by Nippon oil and fat Co., Ltd.), Newcol B-10 (manufactured by Nihon Surfactant Co., Ltd.), suitable for practical application.

Examples of the composition polyoxyethylene adduct of amide fatty acids include those obtained by the addition of oxide alkylene, such as the above, fatty acid amide, for example the amide stearyl or amide of oleyl where most of the variants can be expressed by the following formula (III):

,

where R6denotes alkyl group, and m3, and n3 are integers, in the amount of giving from 1 to 60.

Polyoxyethylene adduct of amide of fatty acid, expressed by the above formula (III) includes, for example, surfactants sold under such factory brands as Esomide HT-60 or Esomide 0-15 (both manufactured Lyon Corporation), suitable for practical application.

In addition, surfactants polyoxyethylene type other than under such factory marks, as Pluronic P-85 or Pluronic L-44 (both manufactured by ASAHI DENKA KOGYO K. K.); polyoxyethylene-polyoxypropylene adducts of ethylene diamine sold under such factory brands as Tetronic TR-704 (manufactured by ASAHI DENKA KOGYO K. K.); ethoxylates, secondary alcohol, sold under such factory brands as Adekatol 80-145 (manufactured by ASAHI DENKA KOGYO K. K.); alkyl-ethylenoxide the adducts of carboxylic acids, sold under such factory brands as RO MB-2621S (manufactured by Nikko chemicals Co., Ltd.), suitable for practical use.

Mainly, you should mix the above surfactant polyoxyethylene type in the solution for bezelektrodnogo copper plating in the ratio of about 0.001 to 20 kg/m3, preferably from 0.01 to 10 kg/m3.

Additionally, you can use other surfactants other than the above-mentioned type, for example the condensation product of naphthalene sulfonate - formalin sold under this brand name, as Demor N (manufactured by Kao Corporation), or a sulfonate alkyl naphthalene sodium, sold under such factory brands as Perex NB-L (manufactured by Kao Corporation).

Although according to the present sobradinho copper plating by using only a lithium ion battery without the aid of non-ionic surfactant, primarily use a non-ionic surfactant, in particular surfactant polyoxyethylene type containing acetylene, for reasons of stability and service life of gas metallizing solution.

In addition to the lithium ion and surfactant polyoxyethylene type described above, the solution for bezelektrodnogo copper plating corresponding to the present invention can be prepared using known substances for a solution bezelektrodnogo copper plating, which uses the connection phosphonoacetic acid as reductant. For example, copper ion for bezelektrodnogo copper plating can be obtained from conventional copper salts such as copper sulfate, copper chloride or copper nitrate. As complexing reagent can be used any compound which can form complexes with these ions of copper, for example citric acid, tartaric acid, malic acid, EDTA (possibly tartrate the Ethylenediamine), Quadra or glycine (aminouksusnoy acid).

As connection phosphonoacetic acid as the reducing agent can be mentioned such compounds as phosphonoacetate acid and hypophosphite sodium. As metal catalli palladium in the form of inorganic salts.

Referring to each ingredient solution for bezelektrodnogo copper plating corresponding to the present invention, if the metal catalyst to initiate a redox reaction Nickel is used, it is preferable that the concentration of copper ions ranged from 7 to 160 mol/m3and the concentration of Nickel ions ranged from 1 to 23 mol/m3moreover , it is desirable to have a molar ratio between ions of copper and Nickel to about 13:1.

It is preferable to use the number of copper ions in a molar ratio to the complexing reagent in size from 1 to 10. Also preferably create a concentration phosphonoacetic acid as reductant from 100 to 1000 mol/m3.

In the case when the metal catalyst to initiate a redox reaction using another metal, it is possible to apply the above amounts and ratios, although the most suitable number can be defined later by experiment.

Corresponding to the present invention the solution for bezelektrodnogo copper plating in addition to the above ingredients may be created using various other fields of the desired pH of the solution.

Note that the variant of implementation, where appropriate present invention the solution for bezelektrodnogo copper plating is prepared in the form of a concentrated composition that at the time of application it can be diluted several times in such a diluent, such as water.

According to the present invention betalactamase copper plating can be performed using the appropriate present invention and prepared as described above, the solution for bezelektrodnogo copper plating in accordance with conventional metallization techniques. When implementing the methods also preferably well in advance to remove from the solution for bezelektrodnogo copper plating dissolved oxygen, and with this purpose mainly purging the solution with an inert gas such as nitrogen or argon, prior to the metallization process.

Additionally, mainly, to the temperature of the solution bezelektrodnogo copper plating for the relevant invention bezelektrodnogo copper plating was from 40 to 100oWith, and the processing time was 5 min or more. In addition, for bezelektrodnogo copper plating corresponding to the present invention, it is preferable to use oscillatory taiwania and deoxidation you can also use an inert gas.

In addition, although the pH used in the conventional betalactamases madnani is from 11 to 14, for bezelektrodnogo copper plating corresponding to the present invention, it is preferable to control the pH value in the range from 8 to 10. The corresponding present invention betalactamase copper plating, if it is done when the pH value is smaller than the conventional range, not going to happen no needle deposition or the desired adhesive strength.

The authors of the present invention previously found that betalactamases madnani for receiving the needle deposition is a General trend, namely that in the metallization solution when reusing solution accumulates phosphorous acid as a side product of the reaction and that needle crystal structure of the deposited film relatively quickly disappears.

Compared to that using meets the present invention solution for bezelektrodnogo copper plating due to the action of lithium ion created acicular crystal structure itself is more durable and adapted to almost four times longer, isotable more detailed explanation of this invention on the basis of numerous examples. However, the present invention is in no way limited to those described in the examples.

Example 1.

Preparation of the solution (1) for bezelektrodnogo copper plating:

The solution for bezelektrodnogo copper plating is prepared based on the composition given below, and in accordance with generally accepted way:

(Composition)

Copper sulfate (pentahydrate) - 8,0 kg/m3< / BR>
Citric acid (monohydrate) - 11,0 kg/m3< / BR>
50% aq. rest. phosphonoacetic acid - 31,010-3< / BR>
Boric acid - 31,0 kg/m3< / BR>
The Nickel sulfate (uranyl) - 0.6 kg/m3< / BR>
Surfinol 465 - 0.1 kg/m3< / BR>
The lithium hydroxide (monohydrate) - 28,8 kg/m3< / BR>
(pH) - 9,0

Using the above solution for bezelektrodnogo copper plating on the copper-plated laminate (base copper foil thickness of 35 μm), mounted on the upper surface of the substrate of epoxy resin, was taken betalactamase copper plating at 70oWith oscillatory mixing is carried out at a speed of 0.013 m/S. the Result was verified using an electron microscope to confirm the formation of a homogeneous and needle-shaped crystals, as shown in Fig.1.

Example 2.

Made the ACLs Example 1 solution for bezelektrodnogo copper plating was prepared in exactly the same way, except that Surfinol 465 was replaced by Emulgen 985.

Using the above solution for bezelektrodnogo copper plating on the copper-plated laminate, mounted on the upper surface of the substrate of epoxy resin, was taken betalactamase copper plating under the same conditions as in Example 1. The result was verified using an electron microscope to confirm homogeneous and needle deposition, as shown in Fig.2.

Example 3.

Preparation of the solution (3) for bezelektrodnogo copper plating:

On the basis of the solution for bezelektrodnogo copper plating according to Example 1, the solution for bezelektrodnogo copper plating was prepared in exactly the same way, except that Surfinol 465 was replaced by Esomide HT-60.

Using the above solution for bezelektrodnogo copper plating on the copper-plated laminate, mounted on the upper surface of the substrate of epoxy resin, was taken betalactamase copper plating under the same conditions as in Example 1. The result was verified using an electron microscope to confirm homogeneous and needle deposition, as shown in Fig.3.

Example 4.

Example 5.

Preparation of the solution (5) for bezelektrodnogo copper plating:

On the basis of the solution for bezelektrodnogo copper plating according to Example 1, the solution for bezelektrodnogo copper plating was prepared in exactly the same way, except that Surfinol 465 was replaced by Tetronic TR-704.

Example 6.

Preparation of the solution (6) for bezelektrodnogo copper plating:

On the basis of the solution for bezelektrodnogo copper plating according to Example 1, the solution for bezelektrodnogo copper plating was prepared in exactly the same way, except that Surfinol 465 was replaced by Adekatol 80-145.

Example 7.

Preparation of the solution (7) for bezelektrodnogo copper plating:

On the basis of the solution for bezelektrodnogo copper plating according to Example 1, the solution for bezelektrodnogo copper plating was prepared in exactly the same way, except that Surfinol 465 was replaced by AKYPO MB-2621S.

Example 8.

Preparation of the solution (8) for bezelektrodnogo copper plating:

On the basis of a solution to basilectal what atom, except that Surfinol 465 was replaced by Demor n

Example 9.

Preparation of the solution (9) for bezelektrodnogo copper plating:

On the basis of the solution for bezelektrodnogo copper plating according to Example 1, the solution for bezelektrodnogo copper plating was prepared in exactly the same way, except that Surfinol 465 was replaced by Perex NB-L.

Example 10.

Preparation of the solution (10) for bezelektrodnogo copper plating:

The solution for bezelektrodnogo copper plating is prepared based on the composition given below, and in accordance with generally accepted way:

(Composition)

Copper sulfate (pentahydrate) - 8,0 kg/m3< / BR>
Citric acid (monohydrate) - 11,0 kg/m3< / BR>
50% aq. rest. phosphonoacetic acid - 31,010-3< / BR>
Boric acid - 31,0 kg/m3< / BR>
The Nickel sulfate (uranyl) - 0.6 kg/m3< / BR>
The lithium hydroxide (monohydrate) - 28,8 kg/m3< / BR>
(pH) - 9,0

Using the above solution for bezelektrodnogo copper plating on the copper-plated laminate (base copper foil thickness of 35 μm), mounted on the upper surface of the substrate of epoxy resin, was taken betalactamase copper plating for 10 min at 70oWith celebate the mcm. Subsequent examination of the copper film using an electron microscope confirmed the formation of a homogeneous and needle-shaped crystals, as shown in Fig.4.

Comparative example 1.

Preparation of the comparative solution (1) for bezelektrodnogo copper plating:

On the basis of the solution for bezelektrodnogo copper plating according to Example 1, the solution for bezelektrodnogo copper plating was prepared in exactly the same way, except that lithium hydroxide was substituted for sodium hydroxide. The amount of sodium hydroxide necessary to set the value of pH of 9.0, was to 26.9 kg/m3(670 mol/m3).

Comparative example 2.

Preparation of the comparative solution (2) for bezelektrodnogo copper plating:

The solution for bezelektrodnogo copper plating is prepared based on the composition given below, and in accordance with generally accepted way:

(Composition)

Copper sulfate (pentahydrate) - 8,0 kg/m3< / BR>
Citric acid (dihydrate) to 15.6 kg/m3< / BR>
Phosphonoacetate acid (monohydrate) - 29.0 kg/m3< / BR>
Boric acid - 31,0 kg/m3< / BR>
The Nickel sulfate (uranyl) - 0.6 kg/m3< / BR>
Sodium hydroxide - 19,0 kg/m3< / BR>
(pH) - 9,0

the x Examples 1 to 10, and comparative solutions for bezelektrodnogo copper plating obtained in Comparative examples 1 and 2 were prepared test samples using a copper-plated laminate (base copper foil 35 μm), mounted on the substrate of epoxy resin in accordance with the following conditions and were assessed in relation to the thickness of the deposited film, the appearance of the deposition, the strength of the surface layer of the multilayer laminated circuit boards obtained after bezelektrodnogo copper plating by fastening the pressing of each test sample using the prepreg.

Note that the above betalactamase copper plating was carried out by immersion in a solution with a pH of 9.0 for 10 min at 70oWith oscillatory movement performed at a speed of 0.013 m/s the results of the tests are summarized in Table.

[Conditions of preparation of test specimens]

Sample 1

Betalactamase copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Example 1.

Sample 2

On the basis of the solution for bezelektrodnogo copper plating according to Example 1 copper plating was carried out using metallisierung used parts of copper sulfate, phosphonoacetic acid, Nickel sulphate and pH (i.e., lithium hydroxide). A number of compounds of phosphorous acid (i.e., the side reaction product), accumulated in the solution for bezelektrodnogo copper plating, according to a study conducted at this stage amounted to 120 mol/m3.

Sample 3

On the basis of the solution for bezelektrodnogo copper plating according to Example 1 copper plating was carried out using gas metallizing solution, which was used for approximately four shifts (*) with simultaneous research and replenishment of used parts of copper sulfate, phosphonoacetic acid, Nickel sulphate and pH (i.e., lithium hydroxide). A number of compounds of phosphorous acid (i.e., the side reaction product), accumulated in the solution for bezelektrodnogo copper plating, according to a study conducted at this stage amounted to 460 mol/m3.

4 sample

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Example 2.

Sample 5

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Example 3.

Sample 6

Sample 7

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Example 5.

Sample 8

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Example 6.

Sample 9

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Example 7.

Sample 10

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Example 8.

Sample 11

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Example 9.

Sample 12

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Example 10.

Sample 13

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Comparative example 1.

Sample 14

On the basis of the solution for bezelektrodnogo copper plating according to Comparative example 1, the copper plating was carried out using the Finance and replenishment of used parts of copper sulfate, phosphonoacetic acid, Nickel sulphate and pH (i.e., lithium hydroxide). A number of compounds of phosphorous acid (i.e., the side reaction product), accumulated in the solution for bezelektrodnogo copper plating, according to a study conducted at this stage amounted to 110 mol/m3.

A sample of 15

On the basis of the solution for bezelektrodnogo copper plating according to Comparative example 1, the copper plating was carried out using gas metallizing solution, which was used for approximately four shifts (*) with simultaneous research and replenishment of used parts of copper sulfate, phosphonoacetic acid, Nickel sulphate and pH (i.e., lithium hydroxide). A number of compounds of phosphorous acid (i.e., the side reaction product), accumulated in the solution for bezelektrodnogo copper plating, according to the analysis at this stage amounted to 490 mol/m3.

Sample 16

Copper plating was carried out immediately after preparation of the fresh solution for bezelektrodnogo copper plating according to Comparative example 2.

(*) The word "change" refers to the condition when the ingredients are freshly prepared solution for bezelektrodnogo copper plating were polno solution in the replenishment, equivalent to the amount that was used in the original solution, and "four changes," by analogy means that the total recharge in four times the amount that was used in the original solution.

The results given in the table clearly show that the samples using the solution for bezelektrodnogo copper plating according to the present invention (i.e., Samples 1, 4 and 12) demonstrate sufficient metal deposition, having a needle-like appearance and excellent durability of the surface layer. It is also obvious that the above process is maintained after repeated use (Samples 2 and 3), suggesting the usefulness in industrial applications. On the other hand, in the comparative solution for bezelektrodnogo copper plating, although in the beginning (Sample 13) there is a certain degree of execution, the execution tends to decrease with repeated use (Samples 14 and 15), which indicates unacceptable for practical industrial applications.

Industrial applicability

Copper foil obtained in betalactamases madnani according to the present invention has a homogeneous and needle structure that provides the E. of the copper oxide or cuprous oxide, which are the products of the conventional way, in the process of metallization of through holes, the appearance of "pink ring" (or "halo") is hardly possible.

Accordingly, the solution for bezelektrodnogo copper plating and method bezelektrodnogo copper plating conforming to the present invention can be used in the manufacture of a variety of electronic parts such as multilayer printed circuit boards, multilayer substrates for mounting systems flexible substrates, packages with internal connection or terminal devices I / o; and for such purposes as increasing the adhesion of metal with resin for the manufacture of other industrial products, such as electromagnetic screens or forms.

1. The solution bezelektrodnogo copper plating to obtain a homogeneous and needle copper film containing copper ion, a complexing reagent, the connection phosphonoacetic acid as a reducing agent, a metal catalyst to initiate a redox reaction and surfactant polyoxyethylene type, characterized in that it additionally contains a lithium ion.

2. The solution on p. 1, characterized in that the surfactant in the PA, containing acetylene radical, polyoxyethylene adduct of an alkyl phenol or polyoxyethylene adduct of amide fatty acids.

3. The solution on p. 1, characterized in that the surfactant polyoxyethylene type is a surface-active substance polyoxyethylene type containing acetylene radical, which may be represented by the following formula I

< / BR>
in which R1and R2denote alkyl groups, R3and R4represent a hydrogen atom or a lower alkyl group, and m1and n1number, making a total of from 3.5 to 30.

4. The solution on p. 1, characterized in that the surfactant polyoxyethylene type represents polyoxyethylene adduct of phenol alkyl, which may be represented by the following formula II

< / BR>
where R5denotes alkyl group, and n2is an integer from 2 to 110.

5. The solution on p. 1, characterized in that the surfactant polyoxyethylene type represents polyoxyethylene adduct of amide fatty acids, which may be represented by the following formula III

< / BR>
where R6means alkyl, wherein the source of lithium ion is either lithium hydroxide or lithium carbonate.

7. The solution according to any one of paragraphs. 1-6, in which the hydrogen ion exponent (pH) of the solution takes values from 8 to 10.

8. The way bezelektrodnogo copper plating, including immersion of the object metallization solution for bezelektrodnogo copper plating containing a copper ion, a complexing reagent, the connection phosphonoacetic acid, a metal catalyst to initiate a redox reaction and surfactant polyoxyethylene type with getting on the object is homogeneous and needle-shaped copper foil, characterized in that the solution further injected lithium ion.

9. Metallic product, the surface of which is covered homogeneous and needle copper film that reached by immersing the jewelry in the solution for bezelektrodnogo copper plating containing a copper ion, a complexing reagent, the connection phosphonoacetic acid, a metal catalyst to initiate a redox reaction and surfactant polyoxyethylene type, characterized in that the solution further contains a lithium ion.

 

Same patents:
The invention relates to methods of applying metallic coatings to the surface of articles made of iron or its alloys, by decomposition of the suspension of the covering substance

The invention relates to a chemical magnesiu dielectrics and can be used in automotive, engineering and instrument-making industry and in the production of household appliances

FIELD: technological processes.

SUBSTANCE: invention is related to technology for production of metalised woven and nonwoven materials, and may be used for production of catalysts, and also for production of decorative and finishing materials. Method includes previous chemical activation of coated material surface, using as activator glyoxal acid and/or oxalic acid. Then chemical metallisation is carried out, which is realised from solution containing bluestone. Stabiliser used is tetraethylene glycol, and reducer - glyoxal. Sodium hydroxide is used in solution to maintain required acidity.

EFFECT: invention provides for production of metalised dispersed woven and nonwoven materials using simplified technology, with simultaneous cheapening and provision of production safety due to use of proposed ingredients and their certain ratio.

2 ex

Up!