The methods for the production of cardboard packaging

 

(57) Abstract:

In the manufacture of packaging Board and packaging, not permeable to liquids and gases, as well as products obtained by the above method, the polymerizing reaction mixture is applied evenly on the paper or cardboard base of thin or thick cardboard. The mixture contains at least one silicon compound forming the inorganic polymer frame, chain-type or crosslinking containing alternate silicon atoms and oxygen, and at least one reactive organic compound forming the organic side chain and/or cross-linkage with respect to the polymer skeleton. The reaction mixture can form a colloidal solution, in which simultaneously with the polymerization takes place gelation, after which the gel is dried, compacted and utverjdayut with the formation of the coating layer that is not permeable to liquids and gases. In addition to oxygen and silicon specified polymer frame, chain-type or crosslinking may contain metal atoms, which are bonded to silicon, and organic compound as the reactive groups may contain apocrine polymer coating can be applied in a uniform layer on the previously obtained impermeable glassy coating layer, to close manufactured packaging. Products, which can be attributed paper or cardboard, coated according to this method, are containers for milk and juices or similar packaging liquid food products, food packaging type bags, sealed thermal method, removable tires containers and boxes, as well as substrates for microwave and conventional ovens. This packing material provides packaging impermeability to liquids and gases, sufficient strength when removing containers from thin or thick cardboard. 5 C. and 12 C.p. f-crystals, 6 ill., table 4.

The invention relates to a method of manufacturing a packaging Board, in which a cardboard base of thin or thick cardboard provided with at least one non-permeable for liquids and gases the coating layer is silicon-based. The invention relates also to a method based on coating paper or cardboard base for the manufacture of packaging, not permeable to liquids and gases, and to the products, including food packaging and the substrate formed with the use of these methods.

For a useful practical application in the packaging of liquid and other ultam, not permeable to liquids and gases. Floor not allow oxygen to penetrate into the packaging and spoil the product, and protects the package from moisture and smell of the product coming out of the package. Corresponding impermeability to gases may be required for medical and packaging of medical and cosmetic products and detergents.

An effective method of manufacture is not permeable to liquids and gases packaging liquid products, such as containers for juice, is to provide a cardboard container with a thin aluminium foil. By itself, the aluminum is also used for removable tires cups for yogurt and prostokvasha and boxes for butter and margarine. However, the aluminum foil has drawbacks: it has a high cost of manufacture, it doesn't decompose biologically, there are difficulties in the regeneration of the packaging material, the packaging may not be heated in microwave ovens. Another problem for detachable aluminum layers is the fact that they are easy to tear and burn.

An alternative solution to ensure the impermeability of cardboard or paper used for packaging, is to supply one or ¾ Packed product. The best coating on its impermeability very close approach to the aluminum foil and as substitute materials are devoid of the foregoing disadvantages inherent in the aluminum. However, it is necessary to combine different polymeric materials in these solutions-substitutes so that they included, for example, the barrier layer that is not permeable to oxygen, water vapor and odors, layers, providing sealing, i.e., thermal printing method, on both sides of the paper or cardboard and one or more layers of binding material to bind the polymers with paper or cardboard, as well as with each other. Consequently, the structure of a packing paper or cardboard becomes complicated, and the consumption of the polymer increases.

Examples of packages obtained by the described method are containers designed for use as a packaging of milk, cream, sour milk, juice or other liquid food products and is completely made of cardboard with layers of polymer coating. In these cardboard containers usually provide four or even five layers of polymer coating so that, for example, cardboard from which the material and the top sealing layer, for example, polyethylene, and the opposite side of the cardboard supply other sealing layer of polyethylene. Other typical applications as packaging is packaging for freezing, for example, milk, sour milk, yogurt, water, juice, desserts and ice cream, in which the packaging has the form of a small Cup or container, usually made of plastic or thin cardboard with a coating and features a removable lid, sealed thermal method. The material of the tires is a paper covered not permeable to oxygen and odor barrier, consisting, for example, polyamide, copolymer of ethylene-vinyl alcohol (EV-HE) or polyethylenterephthalat (PET), with a layer of binding material and sealed with a thermal method layer, which covers the open part of the container or glass and, for example, consists of a modified styrene copolymer of ethylene and methacrylic acid, which helps to seal the layer thermal method and is easy to remove. Similarly Packed cosmetic products and pharmaceutical tablets using plastic or glass containers fitted with a removable paper cover, sealed polymeric coating.

In the patent which serves as a barrier, not permeable to oxygen. According to this publication, the coating is created by polymerization of organosilane that affect UV radiation. As a result, in addition to the inorganic polymer skeleton, the coating formed of the organic connection due to the reaction of the organic groups of the silane with each other. However, in coating the proportion prevalent inorganic polymer frame, and because of this, the coating may become too fragile to withstand, for example, the operation of folding, which is the stage of the manufacture of containers made of thin or thick cardboard; also, do not discuss the proof of the coating to water vapor. It is obvious that such coverage may not be provided with a thin or thick cardboard, suitable for packaging liquids. In addition, organosilane are to expensive raw materials for coatings.

Coating the silicon-based also described, for example, in the published application DE 4020316 and DE 4025215 which refer to the paper as one of the possible substrates of coverage, but describe in detail only the coating of plastic or metal; according to the publications task coverage is ensuring resistance to wear so that linkopomoy substrate tsya the present invention.

Another use of impermeable packaging Board are underlying layers for food and open containers for microwave or conventional ovens, which can be component of consumer packaged foods, such as cooked foods that require heating, or sold as separate products. Such layers and containers must be permeable to water and fat and, in addition, from products intended for furnaces must have a sufficient thermal stability. In open containers for furnaces used thin cardboard, coated polyesters; however, its disadvantages are the large thickness of the desired polymer layer and the fact that the polymer coating with great difficulty can withstand temperatures above 200oC, typical ovens. For substrates that are designed for microwave ovens, as the polymer coating was applied to the polypropylene.

The challenge aimed invention is to provide a carton of the fundamentals of thin or thick cardboard intended for use as a packaging material, a polymeric coating layer, which provides the packaging nieponice is rtone while saving opaque material, but at the same time, the manufacturer of the coating is sufficiently strong and durable so it can withstand, without fracture, folding required for containers of thin or thick cardboard. The invention is characterized by the steps of creating a polymerizable reaction mixture containing at least one silicon compound for forming an inorganic polymer frame, chain type, or crosslinking, containing alternate silicon atoms or oxygen, and at least one reactive organic compound for forming an organic side chain and/or cross-links with respect to the polymer skeleton, applying this mixture in an even layer on a cardboard base and curing the above-mentioned mixture for forming the coating layer.

The method according to the invention can be implemented on the basis of silicon compounds such as silane reacting with it organic compounds, water, and possibly the catalyst, whereby the hydrolyzed silicon group connection is first partially condensed, forming in a solution of colloidal particles. When ripe, sols and/or the addition of the catalyst the reaction proceeds with the growth and combination of carton. When this gel is finally dried and utverjdayut by heating or irradiation using UV, IR, laser or microwave radiation to form on the cardboard thin impervious coating. Depending on conditions, the curing time may vary from fractions of seconds to several hours. Thus obtained coating has both features are usually characteristic for both inorganic and organic substances, and the properties of the coating can be adjusted, in particular, by appropriate choice of the organic component, which forms the cross-linkage or side chains.

Applied organic compound is a pure organic compound based on carbon capable of forming an organic side chain or the cross-linkage on the basis of carbon through the reaction sites of the polymer frame, formed of a silicon compound. These organic compounds thus differ from kremniyorganicheskih compounds, such as organosilane polymerized by hydrolysis and condensation of alkoxygroup in substantially inorganic chain or mesh structure.

A significant part of the polymer layer is substantially cheaper organosilanes. Moreover, organic compound, which is preferably added to the reaction mixture at a relatively late stage, improves the completion of polymerization. Polymer frame that is created using only organosilanes may provide steric hindrance to joint reactions reactive substituents of the silane, while the presence of free organic compound supposedly able to continue the reaction even after that, forming a larger number of side chains and/or cross-links between inorganic chains of silicon-oxygen. By adjusting the amount of applied organic compounds the degree of organicity created thus coverage and dependent properties can also be adjusted at the stage of polymerization.

According to the invention creates a strong, permeable to oxygen and water vapor, the coating layer, which does not break when bending, can withstand folding and can be made very thin without the creation of small, visually indistinguishable, pin holes in the coating during the forming stage or then, during heating, or joints, that is the problem for existing materials coatings and due to acaemy the coating layer can be applied on smooth cardboard base with such a small flow of the coating material as 1 g/m2but in practice, the preferred amount of the coating lies in the range from 2 to 6 g/m2. Another advantage is that the polymer of the sealing layer can be evenly applied directly over the coating layer on the silicon base without the use of bonding agent between the layers. In known combinations of organic coatings share only gas-tight barrier, which may be made of polyamide, PET or EV HE, in a typical case, is at least 20 g/m2and these materials require a separate layer of connecting material between the barrier layer and sealed by thermal method. Therefore, the invention can be applied to achieve significant savings in material and reduce the weight of the cardboard in comparison with the above known technology. Another advantage of the invention is the fact that a uniform coating of opaque mixture easy to implement, using methods commonly used in paper production, as well as thin or thick cardboard, for example, application layer and removing the excess by using a plate or knife, or spray. Thus, a uniform coating can be effectively asisgalvin cardboard, using the same applied technology, which is used for conventional uniformly applied coatings. The coating can also be performed on the molded blanks containers or in the molding process. If necessary, the mixture may be increased in size with the filling material, the most preferred materials include scales or lanzadonii materials-fillers such as talc, mica or glass flakes. When the coating is formed, these substances are arranged in the direction of the surface and contribute to its properties of impermeability. The adhesion of the coating with respect to the agents-excellent fillers. You can also paint the floor adding to the mixture of pigments or organic agents-dyes or adulteration in the mineral composition of the organic and/or inorganic fibers or particles, attaching which the coating can be improved binding agents. Further, it is possible to incorporate organic polimerizuet agent, which forms a polymeric structure, self in relation to inorganic chain structure or inorganic structure with crosslinking according to the invention and mixed with it. In addition to the SD card the e-treated cardboard, which is not necessary to pre-dry. In this case, the cardboard can be pre-coated with any kind of coating, commonly used in the paper and cardboard industry.

The polymer coating obtained according to the invention, chain skeleton or frame with crosslinking may consist of atoms of silicon or metal and alternative towards them of oxygen atoms. Preferably, the structure consisted mainly of silicon and oxygen, and a fairly small number of metal atoms can be combined with the same structure as Vice-silicon. Metals can preferably be, for example, Ti, Zr and Al. Organic groups, mating with the polymer structure can be mainly substituted or unsubstituted alkyl and aryl groups.

Polimerizuet reaction that creates inorganic polymer frame coating according to the invention can be described as an example by the following formula:

< / BR>
in which Me is an atom of tetravalent metal,

R is an alkyl group or hydrogen,

X - for example, alkyl or aryl fragment or chain,

Y - reaction Deputy, which can Bita,

u, v and w are integers,

n and m are integers in the range from 1 to 3.

In organic curing covering composition, which preferably is carried out at the stage of drying and the final formation of the coating, the organic compound using the reactions of addition can be combined with the reaction Deputy Y of organosilane for forming an organic side chain. Depending on the reactivity groups reaction can also be condensing. The reactive group at the end of the chain may further react with the Deputy Y of organosilane in the polymerization process, whereby between the silicon circuits creates organic cross-stitching. There is also a variant in which the substituents Y of organosilane react directly with each other, forming transverse stitching between the silicon circuits. The number and length of cross-links, i.e., the degree of organic coatings can be controlled by the nature and proportion of organic compounds included in the reaction mixture. Particularly suitable organic compounds in the role of cross-links are epoxides containing two epoxypropyl in alkyl or aryl fragment or chain, and diols (diatomic camping, for example, water, alcohol and/or liquid silane. Hydrolysis occurring in the above example, reaction, binds water (if it is present), while at the same time with this process in the reaction is liberated alcohol, converteres in the liquid phase.

As the source materials of the method according to the invention suitable organosilane, including gidrolizuacy and condensing group, or their hydrolysates.

Respectively, can be applied to compounds containing these Central atoms as Zr, Ti, Al, B, etc., compounds of these metals and silicon, or a mixture of such compounds. For example, can be applied silanes of the following type:

(YX)a(HX')bSi(OR)4-a-b, (1)

where Y is a reactive organic group such as epoxy group, vinyl group or any other polymerizable organic group,

X and X' is a hydrocarbon group containing from 1 to 10 carbon atoms,

R is a hydrocarbon group containing from 1 to 7 carbon atoms, alkoxyalkyl group or acyl group containing from 1 to 6 carbon atoms,

a is a number from 1 to 3,

b is a number from 0 to 2 satisfying the condition a +b 3.

Organic polymerization can be described with the help of the above reaction equation) and their polymerization to form cross-linkage cover.

As an example, presents a transverse cross-linking of the polyethylene oxide formed by epoxysilane:

< / BR>
b) attached organic reaction pre-polymerized compound reacts with the reactive group of organosilane

< / BR>
C) attached polymerized organic substance reacts when molecules discussed substances are polymerized with each other

< / BR>
g) all alternatives a, b and C can act together.

The number and length of cross-links, i.e., the degree of organic coatings can be controlled by the nature and proportion of organic compounds included in the reaction mixture. The organic compound may be a monomer, which can be pre-polymerizate in varying degrees and/or combine with the silane during uniform application of the mixture. Adding to the reaction mixture, the organic compound can also be in the form of a pre-polymerized substances. The amount of organic compounds in the calculation of monomer can be from 5 to 80, preferably from 10 to 70 and most preferably from 10 to 50 molar percent of the total amount of polymerizable and is the system of groups, may include, for example: glycidoxypropyltrimethoxysilane, glycidoxypropyltrimethoxysilane - glycidoxypropyltrimethoxysilane - glycidoxypropyltrimethoxysilane - glycidoxypropyltrimethoxysilane - glycidoxypropyltrimethoxysilane, - glycidoxypropyl(methoxyethoxy)silane, - glycidoxypropyltrimethoxysilane - glycidoxypropyltrimethoxysilane - glycidoxypropyltrimethoxysilane, goldacker(methyl)dimethoxysilane, glycidoxypropyltrimethoxysilane, goldacker(ethyl)dimethoxysilane, goldacker(phenyl)dimethoxysilane, goldacker(vinyl)dimethoxysilane - getidentity(methyl)dimethoxysilane - getidentity(ethyl)dimethoxysilane - glycidoxypropyl(methyl)dimethoxysilane - glycidoxypropyl(ethyl)dimethoxysilane - glycidoxypropyl(ethyl)dimethoxysilane, - glycidoxypropyl(methyl)dimethoxysilane.

Silanes containing two glycidoxypropyl may include, for example: bis(goldacker)dimethoxysilane, bis-(goldacker)detoxifies, bis-(getidentity)dimethoxysilane, bis-(getidentity)detoxifies, bis-(glycidoxypropyl)dimethoxysilane and bis(glycidoxypropyl)detoxified.

Examples of compounds according to formula (1) containing other reactive groups include: wine is an, - aminopropyltriethoxysilane, N--(aminoethyl)-- aminopropyltrimethoxysilane, N-bis( -hydroxyethyl) - aminopropyltriethoxysilane, N-(-amino-ethyl) - aminopropyl(methyl)dimethoxysilane - chloropropionitrile - mercaptopropionylglycine and 3,3,3-cryptosporidiosis.

Examples of the silicon compounds described by the General formula (2)

(HX)nSi(OR)4-n, (2)

are dimethyldiethoxysilane, methyltrimethoxysilane, tetraethoxysilane, phenyltrimethoxysilane and FemaleCircumcision.

These compounds can be used as separate components or as a mixture of two or more compounds.

Other possible compounds are, for example, colloidal silicon dioxide (i.e., a colloidal solution containing a certain fraction of very fine powder of oxide, silicon dioxide), which disperses, for example, in water or alcohol and in which the particle diameter is preferably from 1 to 100 nm.

As organic compounds, which act as cross-links, can be applied pre-polymerized substances, and the reaction of the group organosilane preferably react with pre-polimerizovannuju, that combined with inorganic kisloroddonornymi chains. For example, for the reaction with silanes containing epoxy groups, can be applied epoxy resin or aromatic diols (diatomic alcohols).

As diols can be used aromatic alcohols such as Bisphenol A, Bisphenol S and 1.5-dihydroxynaphthalene. For the reaction with silanes containing acrylic groups or aryloxy group, can be applied acrylates. Pre-polymerized substance having a reactive double bond, used with vinyl silanes or with other silanes containing capable of polymerization of the double bond, as well as with silanes containing sulfhydryl groups. Polyols (polyhydric alcohols) are used with silanes containing isocyanate groups. The isocyanates used with silanes containing hydroxy groups, and epoxy resin is used with aminosilane.

As the filling material can be applied mineral fillers, such as talc and mica. In addition, to the mixture can be added binders, hardeners and other additives used for the preparation of compositions and coatings.

Hydrolysates joint is of Italy, such as a mixture of water and alcohol in the presence of acid; this method is well known. When silicon compounds according to General formulas (1) and (2) is used in the form of hydrolysates, the best result is obtained usually by mixing the silane and hydrolysis mixture.

Curing catalyst induces curing the coating at a relatively low temperature and has a positive effect on its properties.

As curing catalysts silanes containing epoxy groups, can be applied, for example, the following substances: acid Bronsted, such as hydrochloric acid, nitric acid, phosphoric acid, sulfuric acid, acid and so on; a Lewis acid such as ZnCl3, FeCl3, AlCl3, TiCl3and a metal salt of the corresponding organogenic acids such as sodium acetate and oxalat zinc; organic esters of boric acid such as bromatology ether and breathily ether: alkali such as sodium hydroxide and potassium hydroxide; titanates, such as tetramethoxysilane and tetraisopropoxide; acetylacetonates of metals, such as titanium acetylacetonate; amines, such as n-butylamine, di-n-butylamine, guanidine and imidazole.

May is the train salt such as ammonium perchlorate, ammonium chloride, ammonium sulfate, ammonium nitrate, sodium acetate and aliphatic persulphate.

The choice of a suitable curing catalyst depends on the desired properties and purpose of the coating composition.

In addition, the coating may contain solvents, such as alcohols, ketones, esters, ethers, cellosolves, carboxylates or mixtures thereof. Especially recommended lower alcohols from methanol to butanol. Usually used as methyl-, ethyl - and butylcellosolve, lower carboxylic acids, and aromatic compounds such as toluene and xylene, and also esters, such as ethyl acetate and butyl acetate. However, the use of solvents, it is preferable to minimize, for example, using this as silanes, because the evaporation of solvent vapours in connection with the coating on thin cardboard requires a very complex devices.

To obtain a smooth coating optionally may be added a small amount of an agent that regulates the flow (such as a block copolymer dioxide diatomic radical and dimethylsiloxane).

The coating can also be added antioxidants and substances that serve as protection against UV radiation. is config hardener.

The coating layer based on silicon obtained in the described manner, has a vitreous outer surface, as well as the density and the ability to bend, does not crack and does not form a hole, it is thermally stable and chemically resistant. The coating is impermeable to oxygen, grease, odor and water vapor, and insensitive to moisture. If recyclization material produced by the method of cooking, present a small amount of covering material does not harm the thus obtained recyclebank pulp.

Curing opaque layer, and removing the remaining liquid phase is preferably carried out by heating the coating in a temperature range from about 100 to 200oC. Heating eliminates the porosity of the coating, giving it the desired impermeability to liquids and gases.

As mentioned above, the polymer coating, sealing joints between faces, may be applied over the coating layer according to the invention, without adhesion between the layers. For example, when the packaging container of the type made of thin or thick cardboard, polymer, sealed thermal method, plays the role of an adhesive agent, which seals the junction of componentmonitor, sealed thermal method.

Because a thin glassy coating that meets the requirements of the invention, transparent, images and text printed on the cardboard before the coating process, are clearly distinguishable. For food substrates, in which the vitreous surface is the outer surface of the product, which is an advantage.

Packing cardboard with a coating made according to the invention can be applied not permeable to oxygen and odor material containers or small cups, designed for packaging liquid food products. The coating layer can withstand without destruction folding coated with a thin cardboard to create the edges of the container with the shape of a rectangular prism or tetrahedron.

Another special application packaging Board, coated according to the invention, is not permeable to grease, heat-resistant material basis for food products, such as flat open containers for heating food in microwave and conventional ovens. In this case, thin cardboard is also subject to folding and bending and coating must withstand such treatment without destruction. In addition, one of the special is irrigating thermal stability of the coating. Thin cardboard can be formed in a flat container by pressing at high temperature, and such containers can easily withstand normal temperature ranges and microwave ovens, and even temperature exceeding 300oC, in which a thin cardboard begin to char. At the same time, the layers of coating to protect the cardboard from the softening influence of steam coming from the heated food product, so that the container retains its shape. Being cooked, the food does not stick to the coating according to the invention. A container that meets the conditions of the invention may be a component of the consumer packaging of the finished food product, for example, when a food product is intended to be reheated in the substrate after printing packaging or containers for heating food can be sold to consumers themselves.

Further, the invention includes a method of manufacturing a packaging that is not permeable to liquids and gases, characterized in that the polymerizable reaction mixture is applied evenly on the paper or cardboard base of thin or thick cardboard, with the mixture includes at least one compound of silicon, forming neorg Rennie or oxygen, and at least one reactive organic compound forming the organic side chain and/or cross-linkage with respect to the polymer skeleton, the reaction mixture solidifies with the formation of the coating layer, and the packaging is partially or completely formed from the thus obtained paper or cardboard with a polymer coating.

In this context it should be mentioned that the cardboard base in the present invention refers to the type of fairly rigid packaging material fiber-based, with sufficient rigidity so that it was suitable for container-like packages or substrates of food products completely manufactured from this material. The weight of such a Board is at least approximately 170 g/m2and for the most part, about 225 g/m2or higher. The cardboard in the weight range 170-250 g/m2usually refers to thin, and with a weight of 250 g/m2or higher - to Tolstoy. The term "paper" in the context of the invention refers to a more thin and light material, fiber-based, suitable as a packaging material, for example, sealed thermal method removable tires portions of the packages or boxes.

Products according to the invention, manufactured according to the above methods include, in particular, sealed packages of thin and thick cardboard for liquid food products, such as containers for milk, cream, sour milk or juice, and small cups, sealed paper packaging for food products, such as bags for powdered soup mixes, packaging, coffee and spices, food open flat containers made of thin cardboard for microwave or conventional ovens, as a component of packages ready food packaging made of thin or thick cardboard for detergents and heat sealed by the method of paper tires glass, plastic packaging or packaging made of thin cardboard intended for food, medical and cosmetic products, in particular, cover the cups for yogurt, milk, juices, water, ice cream or desserts, tire collapsed containers for milk and boxes for oils, margari the ryh:

Fig. 1 shows a small yogurt Cup according to the invention, equipped with a sealed thermal method of coating paper;

Fig. 2 - section of the inlet portion of the Cup and the top edge of the paper in the form of enlarged fragment of Fig. 1;

Fig. 3 - open flat container for furnaces manufactured according to the invention of thin cardboard;

Fig. 4 is a cross - section of the edge of the container in the form of a magnified portion of Fig. 3;

Fig. 5 is made of thin cardboard milk container according to the invention, and

Fig. 6 is a cross - section of the container wall in the form of a magnified portion of Fig. 5.

Consumer packaging of yogurt according to the invention, shown in Fig. 1 and 2, preferably consists of a small plastic Cup with 1 not permeable to oxygen and odors covering paper 3, the sealing heat input method part 2. Covering paper 3 includes a paper layer 4, is not permeable to oxygen and odors polymer layer 5 on the silicon base, made with the method of the Sol-gel of the present invention, and, for example, heat sealed by the method of layer 6 of a modified styrene copolymer of ethylene and methacrylic acid. Sealed heat is simultaneous with this sealed thermal method layer 6 allows you to remove the top paper at the opening of the Cup. The weight of the paper layer 4 covering the paper may be, for example, from 40 to 80 g/m2specific weight is not permeable to oxygen and smells of the coating layer 5 is preferably from about 2 to 5 g/m2and the weight is heat sealed by the method of layer 6 may be, for example, approximately 20 g/m2.

Designed for outdoor furnaces flat container 7 according to Fig. 3 and 4, which can be applied, for example, in the packaging of prepared foods, includes a layer of thin cardboard 8 and glassy polymer layers 9 on the silicon base, formed by way of a Sol-gel according to the invention on the inner and outer surfaces of the substrate. The weight of layers of thin cardboard is at least about 225 g/m2and the weight of both glassy polymer layer 9 is preferably approximately from 2 to 5 g/m2. Polymer layers 9 provide the substrate is not permeability for water and fat and withstand the normal operating temperatures cookers from 200 to 250oC without failure. The polymeric layer of the inner surface of the container specially protects the food product from sticking, and the polymer layer of the outer surface of the container glavnih examples of the polymer layer of the outer surface can be excluded. Illustrated outdoor container 7 by itself can also be used in microwave ovens.

Milk container 10 illustrated in Fig. 5 and 6 and having the form, which is based on a rectangular prism, made entirely covered, not permeable to liquids and gases packing cardboard. Packing cardboard includes a polymer layer 11 on the outer surface of the container 10, a sealed thermal method, a layer of thin cardboard 12, not permeable to oxygen and odors polymer layer 13 on the silicon base, made using the process of the Sol-gel and placed within a layer of thin cardboard and sealed thermal method layer 14 constituting the inner surface of the container. Sealed thermal method, the layers 11, 14, for example, of polyethylene on the joints of the container 10 tightly fasten the overlapping layers of thin cardboard between them. The proportion of thin cardboard container 12 is at least about 225 g/m2specific weight is not permeable to oxygen and odors polymer layer 13 is preferably approximately from 2 to 5 g/m2while the percentage of both layers 11, 14, sealed thermal method is, for example, which may be provided with an additional polymer layer (not shown) between the layer of thin cardboard 12 and layer 13 Sol-gel, which may also contain pigments and fillers. Examples of preferred polymers are polyolefins and styrene acrylates. The specified polymer layer can be applied to reduce the thickness of the material layer 13 Sol-gel, because in comparison with a layer of thin cardboard polymer surface smoother and more impenetrable.

The invention as applied to him polymeric materials coatings are described using the following application examples.

Example 1. Barrier coating

182 g of 2,2-bis(4-hydroxyphenyl)propane dissolved by stirring 473 g of gamma-glycidylmethacrylate at room temperature. 24 g of 0.1 N hydrochloric acid is gradually added to the mixture, stirring all the time. Stirring is continued for about two hours, adding approximately 20 g of colloidal silicon dioxide. If necessary, add 1 g of an agent that regulates the flow. Thus prepared solution is suitable for at least one month. About one hour before applying the solution was added, stirring, 16 g methylimidazole (Lewis acid). This solution is suitable for approximately 24 hours.

P
1. Thin SBS paperboard with a coating of pigment, basic weight 235 g/m2the thickness 314 microns.

2. Thin cardboard with a spray coating of stravation.

3. Cardboard with a smooth surface, basis weight of 230 g/m2the thickness of ~300 ám.

The floor was overiden by heating in an oven at 160oC for 2 minutes.

Test results

Covering solution according to Example 1 was used in the tests carried out on thin cardboard of various grades 1, 2 and 3. The results show that coverts the solution to this viscosity best suited for smooth and less porous varieties of thin cardboard (samples 1 and 2).

Visual assessment showed that the floor is clean, clear and has a good planatarium ability. Based on the results of studies using the electron microscope shows that the coating samples 1 and 2 intact and continuous. The floor in the sample 3 is partially absorbed by the pores, which causes the formation of holes.

The physical properties of the coating are given in table. 1.

Example 2

The solution is pre-hydrolyzing the same way as in Example 1.

Instead of the colloidal silicon dioxide is added under continuous peer less than 10 microns (Finntalc C10).

After adding methylimidazole in the mixture was reduced viscosity suitable for coating, by adding thereto approximately 7 g of colloidal silicon dioxide.

Coverts the solution used for coating thin cardboard grades 1 and 3 of Example 1. Floor utverdili and dried in the same conditions as in Example 1.

Test results

Visual assessment showed that the coating slightly matte and has a good planatarium ability.

The physical properties of the coating are shown in table. 2.

Example 3

of 35.6 g of phenyltrimethoxysilane, 276,6 g glycidylmethacrylate and 19.8 g of aminopropyltriethoxysilane mixed in a vessel in an ice bath. To this mixture gradually dropwise added 6 g of water and continued stirring in an ice bath for 15 minutes, after which small quantities are added 12 g of water and continued stirring the mixture in an ice bath for 15 minutes. Then added dropwise at a faster pace 97,2 g of water and continued the stirring for two hours at room temperature. Next to this hydrolysate was added by 43.6 g of epoxy resin (Dow Corning D. E. R. 330). The coating was applied to a thin cardboard 1-3 of Example 1 with udlenniteley test sample 3 are shown in table. 3.

Example 4

The solution is pre-hydrolyzed as in Example 3. The hydrolysate was added 147 g of mica (Kemira Mica 40). Coverts the solution used for coating thin cardboard grades 1, 2 and 3 of Example 1. Floor utverdili and dried as in Example 3.

Test results

Visual inspection showed that the coating slightly matte and has a good planatarium ability. The physical properties of the coating are shown in table. 4.

Specialists in this field it is obvious that different embodiments of the invention are not limited to the above examples, but may vary in accordance with the attached claims.

1. A method of manufacturing a packaging Board, which includes the receipt and uniform application of the polymerizable reaction mixture on a cardboard base (8, 12) and curing the above-mentioned mixture with the formation of the coating on a silicon substrate (9, 13), characterized in that the cardboard base of thin or thick cardboard has a specific gravity of at least 170 g/m2and the coating is formed of at least one non-permeable to liquids and gases by layer, polymerizing the reaction mixture contains at least one krovkami, containing alternate silicon atoms and oxygen, and at least one reactive organic compound for forming an organic side chain and/or cross-links with respect to the polymer skeleton.

2. The method according to p. 1, characterized in that the organic compound contains at least one reactive epoxy, amino, hydroxyl, carboxyl, carbonyl, vinyl, or methacrylate group.

3. The method according to p. 1 or 2, characterized in that the reaction mixture includes at least one organosilane forming polymer frame and containing epoxy, amino, hydroxyl, carboxyl, carbonyl, vinyl, or methacrylate group, which reacts with the specified organic compound and/or forms cross links.

4. The method according to any of the preceding paragraphs, characterized in that the reaction mixture includes a metal compound that combines with the polymer frame so that part of the silicon atoms other than oxygen atoms, substituted by metal atoms.

5. The method according to any of the preceding paragraphs, characterized in that the organic compound is calculated on the monomer 5 - 80 mPW> 6. The method according to any of the preceding paragraphs, characterized in that the polymerizable reaction mixture containing a liquid phase consisting of silane, solvent, such as alcohol, water, and organic compounds and/or pre-polymerized substances, evenly applied onto a cardboard base and allow the mixture to enter the gel, after which the mixture solidifies with the formation of the impermeable coating layer.

7. The method according to p. 6, characterized in that the mixture, which is evenly applied on the cardboard, is a colloidal mixture comprising a liquid phase containing a monomer and a pre-polymerized substances and colloidal reactive particles.

8. The method according to p. 6 or 7, characterized in that the curing is carried out with heating at a given temperature from about 100 to 200oC.

9. The method according to p. 6 or 7, characterized in that the curing is carried out with radiation.

10. The method according to any of the preceding paragraphs, characterized in that the weight of the formed coating layer (9, 13) is at least 1 g/m2preferably about 2 to 6 g/m2.

11. The method according to any of the preceding paragraphs, characterized in that the Yat on a cardboard base for the formation of the layer of the coating.

12. The method according to any of the preceding paragraphs, characterized in that on a cardboard base type information and then printed on the surface of the shape transparent not permeable to liquids and gases, the coating layer is silicon-based.

13. The method according to any of the preceding paragraphs, wherein forming the junction polymer coating (6, 14) is applied evenly over the pre-formed not permeable to liquids and gases of the coating layer (5, 13) on a silicon basis, with the polymer coating used to cover packing (1, 10).

14. A method of manufacturing packaging (1, 10), is not permeable to liquids and gases, characterized in that the polymerizable reaction mixture is applied evenly on the paper (4) or a cardboard base of thin or thick cardboard (12), the mixture includes at least one silicon compound forming the inorganic polymer frame, chain-type or crosslinking containing alternate silicon atoms and oxygen, and at least one reactive organic compound, forming an organic side chain and/or cross-linkage with respect to the polymer ka is mirouet of the thus obtained paper or cardboard with a polymer coating.

15. Packaging a food product, characterized in that it is an articulated container (10) of thin or thick cardboard, not permeable to oxygen and odors, a small Cup made of thin cardboard or paper bag, made by the method according to p. 14.

16. Packaging (1) food, medical or cosmetic product, characterized in that it is formed by p. 14 closing its input side solenaya not permeable to oxygen coating paper (3).

17. The substrate for the food product, such as an open container for microwave or conventional ovens (7), characterized in that it is made of is not permeable to water and grease high temperature packaging Board made according to any one of paragraphs.1 - 13.

 

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