Thermoelectric semiconductor heat exchanger

 

(57) Abstract:

The invention is intended for application in the field of heat transfer, namely the intensification of heat transfer in refrigeration, air conditioning systems and other similar devices. Thermoelectric semiconductor heat exchanger contains two made of vysokoteploprovodnyh material and coaxially mounted tubes: external, is provided with radial holes in the form of longitudinal slots, and the inner, made in the form of a polyhedron. The device also contains collected from thermocouples thermoelectric modules (TEM), electrically interconnected by sections consistently. TEM installed their first junctions on the inner faces of the pipe along its entire length, and the second junction TEM located in a radial hole of the outer tube at the level of its surface, with longitudinal ribs attached at its base to the surface of the outer tube. Through the ends of the sealed annulus derived power supply terminals TEM and pipe for pumping air. The use of the heat exchanger will allow you to abandon environmentally harmful cooling fluid is sabreena relates to the field of heat transfer and can be used for intensification of heat transfer in refrigeration, the air conditioning systems and other similar devices.

In all cases heat transfer heat transfer through the boundary (wall) separating media with different temperatures. The effectiveness of heat transfer depends on the properties of the medium separation boundaries (for example, the coefficient of thermal conductivity of the wall material), and the magnitude of the difference in temperature between the two environments - the greater the temperature gradient, the more efficient the heat transfer. Of course, the intensification of heat transfer is possible only by changing these parameters.

The most promising technical solutions, in which the intensification of heat transfer due to the change in temperature difference between the environments is achieved by using thermoelectric modules (TEM).

Known heat exchanger according to ed. mon. (USSR) N 439252 (H 01 L 35/02, 1973 ), in which the intensification of heat transfer between the flows of media in two coaxially arranged pipes is achieved by TEM, located on the outer surface of the inner tube and protected from the flow of the case.

The disadvantages of this device include a lack of efficiency and operational reliability the definition of the solution is a device on the bus. St. (USSR) N 1763841 (F 28 D 7/10, F 28 F 13/00, 1992) also contains a coaxially arranged pipes with different environments, and provided with internal longitudinal ribs, each of which has insulated the area located inside the outer tube, and the area located outside of the outer tube. The outer tube is made with radial holes (in the form of longitudinal slits) in the ribs of the inner pipe with the outer flange. Temps are between flanging and fins in thermal contact with them.

A disadvantage of the known devices is the need to ensure a continuous flow of two media in coaxial pipes.

The proposed thermoelectric semiconductor heat exchanger contains two made of vysokoteploprovodnyh material and coaxially mounted tubes: external, is provided with radial holes in the form of longitudinal slots, and the inner, made in the form of a polyhedron. The device also contains collected from thermocouples thermoelectric modules are electrically interconnected by sections consistently. TEM installed their first junctions on the inner faces of the pipe along its entire length, and the second junction TEM, whic is United at the base to the surface of the outer tube.

Through the ends of the sealed annulus derived power supply terminals TEM and pipe for pumping air.

The proposed thermoelectric semiconductor heat exchanger shown in the accompanying drawings.

In Fig. 1 is a front view in section, Fig. 2 is a side view, Fig. 3 shows a diagram for each section-serial-TEM.

Thermoelectric intensifier consists of a hexagonal copper pipe 1, the sides of which the entire length of pipe installed 36 uniform semiconductor modules 2 (each module consists of 16 elements) electrically interconnected by sections consistently. The cold junctions of the modules installed on each of the faces, soldered copper foil 3. After installation of this design in a pipe with holes 4 foil 3 is deflected and soldered to the outer surface of the pipe 1, and the remaining part of the foil is bent at an angle of 90 degrees to the pipe surface. For sealing and subsequent vacuum annulus in the ends of battery inserted rubber gaskets 5, top, epoxy 6, through which removed the power supply terminals 7 and 8 and the pipe for pumping air 9.

electrical network via the power supply terminals 7 and 8 thermoelectromotive 2 provides the heat transfer through thermoelectric elements. By adjusting the value of the power supply, you can control the rate of temperature change of the working environment (air, water, oil and others) at the exit of the pipe 1. Depending on the polarity of the applied voltage can be achieved of a thermoelectric heat exchanger in either heating or cooling.

Specifications

The fluid flow, l/min 2...3

Consumed power, W 200

Time output mode, min 1,2...1,5

The maximum temperature difference,oC to 42

Ambient temperature,oC -20...+50

Overall dimensions, mm: diameter 55

length 350

Weight kg 0,4

The use of the heat exchanger will allow you to abandon environmentally harmful coolants type "freon", to simplify the manufacturing techniques to improve reliability.

1. Thermoelectric semiconductor heat exchanger containing made of vysokoteploprovodnyh material and coaxially mounted tubes: external, performed with radial holes, and internal, in thermal contact, which established the first junctions of thermopile, wherein the inner pipe is made of multi-faceted, and thermopile installed swne surface of the outer tube in its radial holes, with longitudinal ribs that are attached at their bases to the surface of the outer tube, and the edges sealed annulus derived power supply terminals of thermopile and the pipe for pumping air.

2. Thermoelectric semiconductor exchanger according to p. 1, wherein thermopile consists of thermoelectric modules are electrically coupled each section sequentially.

 

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