Integrated circuit

 

(57) Abstract:

Usage: in the computer and electronic equipment. The inventive design of semiconductor crystal standard integrated circuits introduced switching ring located around the perimeter of the crystal, the number of which is equal to the number of terminals of the crystal. In addition to the existing pads, called in this case the inner edge of the semiconductor crystal are external contact pads. All pads to allow connection to any leads of the package IC with any internal contact area of the crystal are elongated - this is accomplished by providing electrical connections necessary internal pads with the outside by means of the switching rings. The technical result of the invention is to improve reliability and increase Tehnologichesky printed circuit Board containing integrated circuit as a component. 3 Il.

The invention relates to semiconductor integrated circuits (IC), in particular to circuits with dielectric isolation components and substrate policella, which made traditional technologies: semiconductor or hybrid.

As the first analogue of [2] is considered, from the point of view of its design, standard integrated chip, comprising a housing in which is placed crystallochemical made with pads on two of its opposite sides, is electrically connected by a metallic conductors, which is fixed to the semiconductor chip with contact pads that are connected to pads of Kristallografiya wire jumpers, and conclusions are pressed into the housing, electrically connected to pads of the semiconductor chip.

As a second analogue of [3] is selected chip that includes a polycrystalline substrate, active and passive elements, placed in isolated dielectric parts of monocrystalline semiconductor, a system of metallic compounds with intersections, which are made in the form located directly in the substrate alloy sections with the grain size of the polycrystal, not exceeding 3 microns.

As a prototype reviewed by poluprovodni 2, spaced double row along the perimeter or matrix, depending on their number (from 14 to 64) and the type of housing of the semiconductor crystal 3 with active, passive elements and the metal interconnects, wires 4, one end of which is welded to the contact pads of the crystal 5, located generally along the perimeter, and the other to the findings of the case or contact pads of Kristallografiya 6 connected to the terminals of the buildings IC.

The shortcoming of total as for the prototype, and for both analogues, from the point of view of the authors of this work is "hard" pin assignment IC in the Assembly process, not subsequently changed, which leads to the following consequences: when designing printed circuit boards for electronic equipment and computer engineering this IC is placed on the card in the specified range of conditions the place and it is connection to other components of the card (trace). During this process you may experience the following situation: tracks supplied to the IC from above (from below), must be connected with the bottom (top) pins of the IC, such tracks almost inevitably cross the other route is suitable to lateral conclusions IC (Fig.Alonei side they cross the road, suitable for vertical conclusions IC (Fig. 2B). As a result, virtually impossible to do without vias or jumpers, which reduces the quality of the Board, its reliability and manufacturability.

The invention is directed to improving the reliability and increasing the manufacturability of the PCB that contains an integrated circuit as a component.

This is achieved by the fact that the perimeter of a semiconductor crystal at the expense of some increase in its area are concentric switching ring, as if separating pad crystal 5 prototype (Fig. 1) into two parts: internal and external pads. Pads crystal prototype performs two functions: remove information from the functional part of the crystal IC and transfer it to the pads of Kristallografiya 6 and, therefore, conclusions 2 IC. In contrast to the prototype in the IC of the proposed design these functions are: internal pads remove information from the crystal, and the external - transfer it to the pads of Kristallografiya. The connections of the inner pads with the outside is performed by switching the number of the I pad is electrically connected with one of the switching rings in the manufacturing process of the IC, and each inner pad has the possibility of switching to any of the switching rings before installing the chip on the circuit Board.

The invention is illustrated in Fig.3, which presents a view of the proposed integrated circuit from the top, from which it is evident that the design standard IC with case 1, the pins 2, the semiconductor crystal 3, the connecting conductors 4, the contact area of the crystal 5, hereinafter referred to as internal and run directly on the substrate in the form of high-alloy sections with the grain size of the polycrystal, not exceeding 2 μm, and the contact pads of Kristallografiya 6, inputs: switching ring 7, the number of which is equal to the number of pads of the crystal is performed on the surface of film technology, and the external contact pads 8, next commutation rings along the edge of the crystal and connected hinged conductors 4 with pads 6 of Kristallografiya.

Internal and external contact pads are extra long - length domestic limited to the level of the last (external) switching ring, and each external contact area of the ptx2">

To implement embedded in the device capabilities of the pins when installing the IC on the circuit Board, you must perform the electrical connection through burning of the insulation layer between the particular internal contact pad and a switching ring which is connected with the necessary output IC.

It should be noted that the die size of this IC in comparison with the prototype slightly increases due to the width of the switching rings (2 μm) and the same insulating distance between them. For example, if the pin number of the IC - 24 the size of the side of the semiconductor crystal will increase by approximately 0.2 mm,

The use of the proposed integrated circuits will minimize the number of conflicts between the roads, and consequently, the number of interlayer connections (transitions)

In the static state, the IC of the proposed design assumes the presence of a chip with pins 2 (Fig. 3), isolated switching ring 7 from its functional parts, i.e. from the inner pads 5.

The way the proposed use of the IC in the composition of the circuit Board or other device after the appointment of conclusions the proposed method is not the best chip designs, microprocessors and microassemblies. - M.; Chapman and hall, 1989, S. 400.

2. USSR author's certificate N 1583995, H 01 L 23/28, 1987.

3. USSR author's certificate N 470237, H 01 L 27/00, 24.08.77.

Integrated chip that includes a polycrystalline substrate, active and passive elements, metal interconnects, wherein it around the perimeter of the surface of the semiconductor crystal entered the switching ring width of 2 μm and the same insulating distance between them, the number of which is equal to the number of terminals of the crystal IC, and in addition to the internal pads introduced external contact pads located on the edge of the crystal and connected to pads of Kristallografiya, pads are made extra long, directly in the substrate in the form of high-alloy sections with the grain size of the polycrystal not more than 2 μm, each external contact pad is in electrical connection with one of the switching rings, which determines its length, and the length of each of the inner pads to allow its commutation with any switching ring before installing the IC on the circuit Board is limited to external comm

 

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