Composition for compound


(57) Abstract:

Use: for sealing elektroradiotekhnika products. The inventive composition of the compound comprises, by weight.h.: epoxy Dianova resin 90-110, olovoorganichyeskikh oligomer f-ly Sn{ [OSi(CH3)(C6H5)]3OH}440-60. table 2.

The invention relates to the field of compositions for compounds used for sealing electrical products and high-voltage coils of transformers, chokes, operated at high temperatures.

Known compounds EPA-4 and ECR-6 epoxy Dianova resins, hardeners, plasticizers [1]

However, these compounds have in normal conditions at a frequency of 103Hz insufficient dielectric properties: dielectric constant of 4.5 and 3.5, respectively, the tangent of dielectric loss angle of 0.08 and 0.007, respectively, dielectric strength 20 kV/mm and 27.5 kV/mm, respectively, and the maximum operating temperature 125oC [2]

The closest in technical essence and the achieved result is a composition for compound including epoxy Dianova resin, titankeramik oligomer /TMPT/, methyltetrahydro C for 30 min, the mixture of resin ED-16 and oligomer TMPT when mixing the injected filler, the mixture is cooled to 90oC and enter methyltetrahydrophthalic anhydride, heated to 90oC, the compound utverjdayut at 160oC 8 hours with step temperature rise and cooling. The compound has a high operating temperature, but at a frequency of 103Hz dielectric characteristics low:

the dielectric constant 4,15

the tangent of dielectric loss angle 0,012,

dielectric strength 23 kV/mm

The present invention is the creation of such a compound, which would have reduced the value of the dielectric constant and tangent of dielectric loss and high electrical strength.

The task to solve due to the fact that the compound contains:

epoxy Dianova resin 90-110 wt.h.

metal-containing organosilicon oligomer-tetrakis/methylphenylsiloxanes/stanan formula Sn{ [OSi(CH3)(C6H5)]3OH}440-60 wt.h.

The compound is produced by mixing heated at 6010oC epoxy Dianova resin and olovoorganichyeskikh oligomer, the above formulas, the resulting mixture is vacuum at 60o10oC and a pressure of 0.6 to 1.3 kPa within 15-30 minuteviagracom oligomer receive the following method, described in the article by M. A. Simagina and other "study of the cruciform structure of Organoelement oligomers method of vibrational spectroscopy", General chemistry, I. 63, vol. 7, 1993, S. 1591-1595.

The mixture of epoxy Dianova resin and the above olovoorganichyeskikh oligomer at room temperature can be stored for a long time. Application of the above oligomer as a hardener, and at the same time modifier makes it possible to reduce the number of components of the compound and thereby to facilitate the process at the same time, the operating characteristics are stored at this level.

Table 1 shows the composition of the compounds according to the invention, in table 2 of their properties.

1. Composition for compound including epoxy Dianova resin and metal-containing organosilicon oligomer, characterized in that the metal-containing organosilicon oligomer it contains olovoorganichyeskikh oligomer of the formula


in the following ratio, wt.h.

Epoxy Dianova resin 90 110

Olovoorganichyeskikh oligomer 40 60

2. The way the receipt is of Homer, followed by curing compound when heated, characterized in that the metal-containing organosilicon oligomer use olovoorganichyeskikh oligomer of the formula Sn{[OSi(CH3)(C6H5)]3OH}4heating is carried out at (60 10)oAfter mixing the resulting mixture viewmirror at (60 10)oC and a pressure of 0.6 to 1.3 kPa for 15 to 30 minutes, and the curing is carried out at 100o2 h, then at 150oWith 3 h and at 200oWith 3 hours


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