The binder composition for a laminated insulating material

 

(57) Abstract:

The invention relates to the production of a composition of epoxy resin to obtain a flame-retardant laminates, foil mainly used in electronics, electrical engineering, electronic engineering and other industries that require non-combustible insulating materials. An object of the invention is to increase the fire resistance of the material, reducing the cost and simplifying the technology of preparation of the binder composition while maintaining the strength and dielectric properties of layered materials. The technical result is achieved in that the binder composition, comprising an epoxy Dianova resin, tetrabromodiphenylether, the hardener is a mixture of aromatic diamines and organic solvent further comprises 3,3 dichloro 4,4 - diaminodiphenylmethane, curing catalyst and glycolate arsenic (III) in the form of its 50 90% solution in ethylene glycol or ethyl cellosolve in the following ratio, wt. including epoxy Dianova resin 100,0; tetrabromdifenilolpropan 6,0 15,0; a mixture of 4,4

diaminodiphenylmethane and 3,3 dichloro 4,4 - diaminodiphenylmethane 8,2 - 15,5; glycolate, arsenic (III) in the form of 50 Italy 135,0 205,0. table 2.

The invention relates to the production of epoxy resins for non-combustible (flame retardant) insulating laminates, mostly foiled glass-reinforced plastics used in electronics, electrical engineering, electronic engineering and other technical fields that require non-combustible materials.

Known composition of epoxy resin to obtain a reinforced materials, mainly copper clad dielectrics, comprising, by weight.h. epoxy Dianova resin (EM-20, EM-8, EM-22) 76-89; organic hardener polyamine diaminodiphenylsulfone of 2.5 to 12.0; 4,4'-diamino-3,3'-deoxycytidylate 5-24; organic solvents (toluene, acetone, amide solvents) 120-150 (1).

Known composition enables the production of a material with good electrical and mechanical properties: strength adhesive foil with base dielectric 135aboutC and 15 h 400-420 kg/cm2specific volume resistivity 2,31015Omsm, surface resistivity 2,21016Ohms, but this material is not a fire-resistant materials.

Closest to the technical essence and the achieved result to the stated izobreteny is the one epoxy resin ED-20, ED-8 and others ). 100 wt.h. the hardener is a mixture of aromatic diamines mixture of 4,4'-diaminodiphenylmethane and 4,4'-diaminodiphenylsulfone in the ratio from 1: 2 to 1:3 20,09-21,45 wt.h. fire retardant (flame retardant additive) tetrabromodiphenylether (TRIP) to 54.4 wt.h. organic solvents, the amount of which is determined by the technological parameters for the desired degree of impregnation of glass (manufacturing process of glass-reinforced plastics, THE 6-14-415-60) (2).

Major drawbacks of this arrangement are:

the resistance of the dielectric on the basis of this song is not below 16, and the modern requirements of IEC EBITDA should not exceed 10;

tensile peeling the foil from the Foundation for the dielectric does not exceed 4.0 N;

fire retardant TRIP is scarce product.

The aim of the invention is to increase the fire resistance, cost reduction and simplification of the preparation of compositions of the binder while maintaining the strength and electrical properties of copper clad laminates.

This technical problem is achieved by the fact that in the binder composition for a laminated insulating material including epoxy Dianov, sman, and an organic solvent, a curing system further comprises 3,3'-dichloro-4,4'-diaminodiphenylmethane with a ratio of 4,4'-diaminodiphenylmethane and 3,3'-dichloro-4,4'-diaminodiphenylmethane from 1: 1 to 1:2 and the curing catalyst complex compounds of boron TRIFLUORIDE with amines and as a flame retardant advanced glycolate, arsenic (III) as 50-90% solution in ethylene glycol or acetone, toluene, ethyl cellosolve, dioxane in the following ratio, wt.h.

Epoxy Dianova resin 100,0

Tetrabromodiphenyl - propane 6,0-15,0

A mixture of 4,4'-diminutive-

nylmethane and 3,3'-dichloro-

4,4'-diaminodiphenylmethane at a ratio of from 1:1 to 1:2 8,2-15,5 curing Catalyst of 0.2-0.4

The glycolate of arsenic (III) in

as 50-90% solution

ethylene glycol or ACE-

tone, toluene, etincelle - solve, dioxane 5,8-50,2

Organic dissolve ritel 135,0-205,0

As the epoxy resin composition using various epoxy Dianova resin commonly used in similar impregnating compositions for glass-reinforced plastics,such as, for example, ED-20, ED-8, ED-16, ED-19, ED-14, e-23, e-44 (GOST 10587-76).

Used as a flame retardant glycolate, arsenic (III) in the form of the solution is spent interaction arsenous anhydride with a glycol (ethylene glycol) in a ratio of 1:1 or 1:2, followed by dissolving the obtained glycolate, arsenic (III) in one of the specified organic solvent to obtain 50-90% solution.

Thus, to obtain glycolate, arsenic (III) use as a pure technical arsenous anhydride, and arsenous anhydride in the form of various different waste steel production, containing significant amounts of arsenic in the form of oxide, for example, arsenic dust generated during the cleaning process gases metallurgical plants, the electrostatic dust (TU 48-0222-12-78, ARSENICAL dust). The latter contains > 50% As and < 2% Sn, and a small amount of Fe, Cu, S, Mn, Ti, Ni in the form of oxides.

Used glycolate, arsenic is a transparent liquid from light brown to dark brown without peculiar smell.

As the organic solvent in the composition using various organic solvents, such as, for example, acetone, toluene, ethyl alcohol and other alone, and mixtures thereof.

Curing system for the claimed composition of the binder is a mixture of aromatic diamines: 4,4'-diaminodiphenylmethane (DADPM) THE 6-14-415-70 and 3,3'-dichloro 4,4'-diaminodiphenylmethane (Diameter X) THE 6-14-980-73 and acid curing catalyst series pack-605 TRIFLUORIDE complex compounds CSOs boron with benzylamine, UE-605/5-TU-6-09-6100-69, a complex of boron TRIFLUORIDE with p-toluidin - rated

P R I m e R 1. 100 wt.h. epoxy Dianova resin ED-20 is dissolved in the organic solvent is acetone. In the resulting solution was injected 6 wt.h. tetrabromdifenilolpropan, 8.2 wt.h. hardener: a mixture of 4,4'-diaminodiphenylmethane and Diamete X in the ratio of 1:1 and 0.2 wt.h. catalyst pack-605/1.

Later in the solution is injected to 5.8 wt.h. flame retardant 50%-aqueous solution glycolate, arsenic (III) in ethylene glycol.

The obtained composition of epoxy resin impregnated fiberglass brand e-1-1-100-18 or paper. Fiberglass or paper dried at 100-110aboutC for 5-15 minutes Impregnated fiberglass or paper (prepreg) is cut into sheets will be collected in a package, faced on one or both sides of the copper galvanostatic foil and pressed.

Mode pressing: exposure at specific pressure of 4 MPa and 160aboutWith 2.5 hours for the fiberglass, and paper for steklolyuks at specific pressure of 6 MPa and a temperature of 160aboutWith too 2,5 hours

P R I m e R s 2-9 summarized in table.1 and illustrate the invention with different ratios of components.

Thus, the use as flame retardant glycolate, arsenic (III) is of Tillerson, dioxane (50-90% solution) allow not only to increase the resistance, but also improves (simplifies) the technology of preparation of the binder, substantially contributes to its cheaper.

In table. 2 presents data on the properties of foiled dielectrics made using a binder according to the claimed invention (examples 3, 4 properties of glass textolites, 5, 6 steklolyuks, 7, 8 glinkov).

The composition itself has the vitality 10-20 min at 170aboutC and at room temperature for up to 17 days.

Comparative analysis of the claimed invention and the prior art leads to the conclusion that the claimed invention meets the requirements of "novelty", "inventive step technique" and is industrially applicable.

The BINDER COMPOSITION FOR a LAMINATED INSULATING MATERIAL including epoxy Dianova resin, tetrabromdifenilolpropan as flame retardant curing system containing 4,4-diaminodiphenylmethane, and an organic solvent, characterized in that the curing system further comprises 3,3-dichloro - 4,4-diaminodiphenylmethane with a ratio of 4,4-diaminodiphenylmethane and 3,3-dichloro - 4,4-diaminodiphenylmethane the glycolate of arsenic (III) in the form of 50-90% solution in ethylene glycol or acetone, toluene, ethyl cellosolve, dioxane in the following ratio, wt.h.

Epoxy Dianova resin 100

Tetrabromdifenilolpropan 6 15

A mixture of 4,4-diaminodiphenylmethane and 3,3-dichloro-4,4-diaminodiphenylmethane at a ratio of 1:1 15,5 8,2

The curing catalyst of 0.2-0.4

The glycolate of arsenic (III) in the form of 50-90% solution in ethylene glycol or acetone, toluene, ethyl cellosolve, dioxane 5,8-50,2

Organic solvent 135-205

 

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