(57) Abstract:Usage: the invention relates to electrical engineering and can find application in the production of radio engineering and electrical engineering, to meet the requirements of stability when exposed to high voltage test a high frequency, high temperature and non. The purpose of the invention is the provision of non-filled composition of products while maintaining insulating properties. The inventive composition containing epoxy Dianova resin, isomethyltetrahydrophthalic anhydride, filler, contains advanced accelerator and di-- chlorotalonil ether WineFestival acid of General formula as epoxy Dianova resin resin that is modified by poliefirakrilaty in a ratio of 20 to 100, with the following content, wt. including epoxy Dianova resin 100; isomethyltetrahydrophthalic anhydride 55 60; filling 100 160; chlorotalonil ether WineFestival acid 30 32; accelerator 1-2. table 2. The invention relates to electrical engineering and can find application in the production of radio engineering and electrical engineering, to meet the requirements of the abutment is the temperature of the working environment (120aboutC) and non (- extinguishing in case of fire).Known insulating compounds based on epoxy Dianova resins, containing in its composition, the curing agent and the filler [1, 2]
The disadvantage of these compositions is that they lack the properties of non.Closest to the technical nature of the claimed invention is selected as a prototype composition containing epoxy resin, isomethyltetrahydrophthalic anhydride, silicon or silicon carbide, modified diallylmalonate 
The composition has the same characteristic disadvantage inherent in all compositions based on epoxy resins, no properties of non.The purpose of the invention is the provision of non - (self-extinguishing when the fires covered with composition products while maintaining high electrical strength of insulation and resistance to high temperature working environment.The aim is achieved in that the composition containing epoxy Dianova resin, isomethyltetrahydrophthalic anhydride and a filler further comprises a di- --chlorotalonil ether vinylphosphonic acid of General formula the GF-9 in a ratio of 20 wt.h. IFG-9 per 100 wt. including resin in the following components: Epoxy Dianova resin 100
Isomethyltetrahydrophthalic anhydride 55-60 Filler 100-160
vinylphosphonic acid 30-32 Accelerator 1-2
Taken as source material resin ED-20 is a homogeneous liquid from light to dark brown, with a mass fraction of epoxy groups within 15-19% dynamic viscosity of 5.5 to 6.8 Pas.Compositions on the basis of this resin are widely used for impregnating, encapsulating, sealing elektroradiotekhnika products, as an adhesive in many industries.In order to make the filling and adhesive compositions ductility and resistance to cracking during heat treatment and exploitation filled products resin modified by the addition of the plasticizer of preferability brand IFG-9, in the amount of 20 wt.h. on 100 wt.h. the resin. The plasticizer IFG-9 is a transparent liquid from yellow to dark brown color with a viscosity of 0.1-0.25 Pas at room temperature with mass fractions of the basic substance of 37.5% at least.Resin ED-20 manufactured and supplied by the industry as modified in vitalinformation (PEPA) or isomethyltetrahydrophthalic anhydride (out-MTHFA). The polyethylenepolyamine brand of probe liquid from light yellow to dark brown in colour, with a mass fraction of total nitrogen 28-30%, with the hardening capacity of 1.5 hours max.The curing of the resin occurs with the introduction of the curing agent at room temperature, and during hot drying (60-80aboutC). The viability of the prepared composition with the curing agent of the probe at room temperature for no more than 1.5-2 hoursAs a hardener to the proposed composition selected isomeinterface anhydride from MTHFA having the empirical formula C9H8ABOUT3representing an oily liquid with a density of 1.17-1.23 g/cm3. The number added to the resin hardener depends on the epoxy groups in the resin (17-18%) and is determined by the formula
3,28, where the estimated coefficient of 3.28;
To the percentage of epoxy groups in the resin.The specific value of the quantity of hardener, depending on the purpose of the composition within the calculated values are chosen empirically. The hardener from MTHFA designed for hot curing at a temperature of 60-100aboutC.The viability of the prepared composition with the curing agent at comnuttee by the compositions of epoxy resins, as the long-term viability allows you to prepare the composition by mechanical means in the mixers sufficient for mass production volumes with subsequent storage in closed vessels.Another advantage of the composition with the curing agent from MTHFA great weight of hardener (55-60 wt.h.) the mass of the resin (100 wt.h.), what gives the composition of lower viscosity than the viscosity of other similar compositions. Due to the low viscosity of the mixture of resin and hardener is possible to increase the share of the input in the composition of the filler, which, in turn, improves the insulating properties of the composition and reduces its technological cost.As filler in the proposed composition can be applied powder calcined talc having a specific gravity of 0.6-0.8 g/cm3. The small share of the proposed filler provides good promyshelennosti composition and uniform distribution of filler particles in the filled volume. It is possible to use other fillers, for example quartz sand (specific gravity of 1.2 g/cm3), silicon carbide, titanium dioxide, or any other insulating material. When ravago sand with a specific gravity of 1.2 g/cm3140-160 wt.h. on 100 wt.h. the resin.Specified in the application quantity of the injected filler selected empirically, based on the need to maximize electrical insulating properties and permeability of the composition. It can vary depending on the destination of the composition as downward and upward.In order to reduce process cycle curing of the composition in its composition is added to 2 wt.h. accelerator pack 606/2 (dimethylamino)phenol, , , Tris (dimethylaminomethyl) with the empirical formula
C15H27ON3.The accelerator is a clear liquid, amber color with a basic substance content of up to 95.5% of the Amount of injected substances recommended specifications for the modified resin (up to 2 wt.h.). The increase in the share of the accelerator more than 2 wt.h. not recommended as it can lead to the formation of the filled weight of the free, not bound with resin substances that can impair the mechanical and electrical properties.Accelerator pack 606/2 industry comes complete with resin ED-20.Flame retardant additive (flame retardant) winits in industry polovogo ether-chloroethylphosphonic acid, designed for use as a flame retardant funds in the manufacture of polyurethane and other plastics.Winits is a transparent yellowish liquid density 1,325 to 1.34 g/cm3acid number mg KOH per 1 g of Vinitsa not more than 1.0. Mass fraction of phosphorus not less than 12.0 percent
Comparative analysis of the proposed structure with prototype and other similar compositions, for example, a composition based on resin ED-20 hardener PEPA, composition-based resin of SEDM-6 (with an epoxy group 12-14% ) with hardener L 20, leads to the conclusion that the claimed composition is different from the known to the introduction of a new component, namely di---hloretilova ether vinylphosphonic acid. Thus, the claimed solution meets the criterion of "novelty."Analysis of the known insulating compositions used to fill radio and electrical products, showed that the known compositions compositions based on epoxy resins do not provide drenched products property of non-manifested in the inventive solution by introducing into the composition of the new substances Vinitsa at a certain ratio kowalstwo, that allows to make a conclusion on the conformity of the proposed solutions to the criterion of "inventive step".For experimental confirmation of the possibility of the selected song is property of non-injected into its composition flame retardant additives were manufactured and tested 10 types of standard samples (disks with a diameter of I mm) and samples of products (coils, high-voltage transformers), filled composite composition with the addition of flame retardant chemicals (flame retardants) 6 wt.h. winits, the product AB by THE 6-15-3086-88; three-chloroethyl phosphate; cocondensate Chlorella AMG; apret AK-1.The results of the tests on the flame resistance are given in table.1.The test was carried out according to the method GOST 11983-81 method of exposure to the flame of a gas burner with a nozzle diameter 0,50,1 mm, a length of the vertical flame 12 2 mm.The test results revealed that the epoxy composition property of non-attached supplements: vinilos; winits in combination with cocondensation Chlorella; chloroethylphosphonic in combination with the product AB.However, the introduction of additives: chlorotyrosine, the product AB, cocondensate Chlorella, providing flame resistance, CCS is ity and porosity filled mass. The most effective technology appeared to be additive 30-32 wt.h. Vinitsa on 100 wt.h. the resin.Experimental testing process was carried out by pouring and testing of the products (coils, transformers TVs) the compositions based on epoxy resin ED-20 using hardeners: polyethylenepolyamine (PEPA); someinteresting anhydride; fillers: silica, talc, ground and other.The best results for manufacturability (toughness, vitality) and electrical insulating properties are obtained when the ratio of the components described in the present invention.In the process of experimental studies have shown that the decline in the share of Vinitsa below 30 wt.h. does not provide the full song non, and the increase in the share of higher than 32 wt.h. leads to a decrease in electrical properties. Examples of insulating compositions shown in table.2.There is a technical report on the selection of the composition that meets the requirements electric strength of insulation, resistance to high operating temperatures and non.Selected staff ogramme periodic compliance tests for the coils GOST 11983-81. Results positive (Protocol RLH 193-90 from 30.02.90 g).The preparation of the composition and shading products are produced according to the following technological scheme.The tank weighed heated to 70aboutWith the resin injected into the resin winits and stirred for 2-3 minutes Add in the mixture of preheated 7010aboutWith the filler (talc powder) and mix until no lumps of filler. Add to the mix the hardener and mix until the disappearance of the precipitate. The mixture is poured into a vacuum mixer.Stirred the mixture at a residual pressure of 150-200 mm RT.article for 15-20 min, then enter the accelerator and stirred for another 5-7 minutes Off the vacuum created in the mixer pressure of 2-2 .5 ATM. Pour the product composition through the nozzle of the faucet with the faucet. Put the product in a vacuum chamber heated to 60-70aboutWith and vaccum pressure 0,96-0,98 kg/cm2within 10-15 minutes Block the vacuum, remove the product from the vacuum Cabinet, placed in a heat chamber and stabilize at a temperature of 130 10aboutC for at least 4 hours INSULATING COMPOSITION containing epoxy Dianova resin, isomethyltetrahydrophthalic anhydride and a filler, characterized in that it sod is 606/2, but as epoxy Dianova resin resin that is modified by poliefirakrilaty, in the amount of 20 wt.h. on 100 wt.h. resin in the following, wt.h.Epoxy Dianova resin 100
Isomethyltetrahydrophthalic anhydride 55 60
Filler 100 160
Di - chlorotalonil alcohol WineFestival acid mentioned formula 30 32
Accelerator pack 606/2 1 2
FIELD: insulation materials.
SUBSTANCE: method of preparing insulation compound, which can be used for impregnating and pouring high- and low-voltage components of electrical and radio equipment, transformers, and throttle valves, comprises mixing at temperature 50-60°C resin having molecular weight 1000-6000 with phosphorus-containing modifier, in particular triglycidyl phosphate or diglycidyl methyl phosphate, or diglycidyl methyl phosphonate, after which is added stoichiometric amount of hardener, in particular 4,4'-diaminodiphenylmethane or 4,4'-diaminodiphenyl sulfone, or 4,4'-diaminodiphenyl oxide.
EFFECT: reduced viscosity of compound, enhanced insulation and electric-strength properties, and simplified preparation procedure.
2 tbl, 17 ex
FIELD: electrical engineering.
SUBSTANCE: proposed method for producing polymeric case of vacuum circuit breaker includes installation of vacuum chamber in mold, locking of the latter, and chamber sealing followed by filling space between chamber and mold with liquid insulator. In the course of molding, prior to filling chamber-to-mold space with liquid insulator, external surface of chamber is covered with flexible shock-absorbing silicon rubber, epoxy compound being used as liquid insulator. Epoxy compound has following composition, parts by mass: epoxy resin, 100; filler, 360; hardener, 85; promoter, 1. Polymeric case is molded at mold temperature of 140 - 145 °C and pole molding time of 27-35 minutes, followed by hardening for 12 h at 140 °C.
EFFECT: facilitated procedure, reduced cost.
3 cl, 3 dwg
FIELD: antenna engineering.
SUBSTANCE: proposed composite dielectric material used, for instance, to produce antenna lenses of desired dielectric constant and density capable of operating under vibrating load conditions at temperatures ranging between -60 and +85 °C has epoxy resin functioning as binder and hollow glass microspheres and titanium, as fillers, their proportion being given in invention specification.
EFFECT: enhanced resistance to vibrations, enlarged operating temperature range.
2 cl, 1 tbl
FIELD: electrical and instrumentation engineering, microelectronics.
SUBSTANCE: proposed epoxy resin based current-conducting adhesive composition characterized in high electric conductivity and high strength of glued joints at temperature ranging between -60 and +150 °C, as well as in case of glued joint shear at temperatures of 20 to 150 °C has following ingredients, parts by mass: nitrogen-containing epoxy resin, 100; curing agent (isomethyl tetrahydrophthalic anhydride or low-molecular polyamide), 40- 80; electricity-conducting filler (carbonic nickel), 416 - 475; aliphatic epoxy resin, 15 - 25; organic solvent, 15 - 25; (tris-2,4,6-dimethyl aminomethyl) phenol or mixture of λ-aminopropyl triethoxysilane and β-aminoisopropyl triethoxysilane isomers, 0.5 - 2.5.
EFFECT: enhanced strength and electric conductivity properties of adhesive composition.
5 cl, 2 tbl
SUBSTANCE: invention pertains to a composition based on an epoxide resin, designed for sealing semiconductor devices. The compound consists of the following components in the given mass ratios: 100 epoxide resin "ЭД-22" with 22% content of epoxide groups for formation of a more compact and tough polymer network, 50 oligoester acrylates "МГФ-9", 20 metaphenylene diamine, 35 filler, 0.5 nigrosine as black dye and a catalyst of the solidification reaction of the epoxy groups. The filler is a mixture of 6.0 mass ratio of boron nitride, 4.0 mass ratio of talc and 0.8 mass ratio of aerosil.
EFFECT: invention provides sealing devices with extended surfaces of p-n-junctions and consistency of dielectric, mechanical and thermophysical properties of polymer material.
FIELD: technological processes.
SUBSTANCE: invention is related to finishing baking enamels intended for production of insulating protective coatings for impregnated windings, units and parts of electric machines and devices with insulation of thermal endurance class of (155°C). Enamel that includes filming agent, coupling agent, siccative, pigments, fillers, desired additives and organic dissolvents, as filming agent it contains epoxy ester produced by reactions of etherification and thermal polymerisation 1.0 Mole of epoxy modified resins with content of epoxy groups of 3.5÷4.5 wt %, 2.4 Mole of fatty acids of bodied oils and 1.3 Mole of colophony, and as active filler for increase of electric strength of enamel coating it additionally contains hydrophobic aerosil at the following ratio: Epoxy ester (55%-solution in xylene) 62.0÷81.0, Hydrophobic aerosil 0.3÷0.6, Hydrophobic aerosol 0.3÷0.6, Pigments and fillers 13.0÷29.0, Hydrophobic aerosil 0.3÷0.6, Coupling agent 4.5÷5.5, Desired additives (dispenser, defoaming agent, thixotropic, anti-flotation, antioxidant) 1.5÷6.5, Siccative (cobalt oktoat) 0.2÷0.5, Organic dissolvents 1.5÷7.5.
EFFECT: higher class of enamel thermal endurance, higher adhesion of enamel coating, improvement of coating dielectric properties.
2 tbl, 7 ex
SUBSTANCE: invention is attributed to electric engineering in particular to hot hardening epoxy electrical embedment compounds intended for electrical insulation and strengthening of units and blocks of high-voltage devices, inductors, metal-loaded transformers, for sealing and protection of electronic equipment against moisture and mechanical impacts. Composition for electrical embedment compound contains (in mass p.): epoxy-diane resin - 60-70, triglycidyl ester of trimethylolpropane - 15-20, monoglycidiyl ester of alkyl phenol - 10-20, isomethyltetrahydrophthalic anhydride - 90-95, 2,4,6 tris(dimethylaminomethyl)fenol 0.8-1.0, quartz powder - 400-500. Due to small temperature coefficient of linear expansion, high volume electric resistance and mechanical strength, it is recommended to use offered compound for high-voltage devices containing dissimilar materials.
EFFECT: creation of electrical embedment compound with high values of specific insulation resistance, low dissipation factors of a dielectric and small temperature coefficient of linear expansion (TCLE).
SUBSTANCE: housing has inner layer and outer layer. Thickness of inner layer is at least by 50% more than thickness of outer layer, and inner layer is more flexible than outer layer. Inner layer is made from composition of the first resin which at hardening has relative elongation at rupture which is more than 5%, and outer layer is made from composition of the second resin which at hardening has relative elongation at rupture which is less than 5%.
EFFECT: improving insulation and strength properties of electric item, and profitability of its manufacture.
14 cl, 2 dwg
SUBSTANCE: surface modified electrical insulation system, comprising a cured synthetic polymer composition including at least one filler and optional additives, wherein the surface of said synthetic polymer composition is modified by applying a thin coating; said thin coating being applied via plasma enhanced chemical vapour deposition (PECVD) with thickness within the range of about 50 nm to about 50 mcm; and/or said thin coating is applied via a sol-gel technique with thickness within the range of about 0.5 mcm to about 2 mm; and wherein said thin coat is an electrically non-conducting polymeric material with melting point which is considerably higher than the melting point or degradation temperature of the synthetic filler containing polymer composition; and a method of making said electrical system involving formation of a hardened or cured synthetic polymer composition, applying a thin coating on the surface of said synthetic polymer composition via plasma enhanced chemical vapour deposition.
EFFECT: improved system.
18 cl, 2 ex, 4 tbl
SUBSTANCE: electric insulating filling compound contains epoxide diane resin, amine hardener in the form of triethylene tetramine (TETA), and also a modifier - a phosphorus-containing methyl acrylate (PCM), at the following ratio of components, wt parts: epoxide diane resin ED-20 - 100 triethylene tetramine (TETA) - 10-15 phosphorus-containing methyl acrylate (PCM) - 30-40.
EFFECT: reduced viscosity of a filling compound, its higher viability, improved elasticity after hardening, preservation of dielectric properties.