Photopolymerizable dielectric composition

 

(57) Abstract:

Usage: electrical insulating coatings for electronics. Essence: photopolymerizable dielectric composition contains, by weight. h: methyl methacrylate 100, a copolymer of 2-10 wt.% methacrylic acid and 90-98 wt.% of butyl methacrylate 2,0-20,0, di(meth)acrylate, di(three)glycol of 0.1-3.0, photoinitiator of 0.1 to 3.0. Mix the components until complete homogeneity at normal temperature. table 1.

The invention relates to the field of polymer chemistry, namely to photopolymerizable dielectric compositions (FDC) used in electronic industries for production of lacquer coatings on circuit boards for the purpose of electrical insulation of the components and protect them from external factors.

Curing FDC is due to UV exposure. The ultraviolet source is a mercury lamp. Application FDC on the circuit Board and further curing of UV-rays is performed on conveyor lines, therefore, a significant role is played by the exposure time of the compositions under a mercury lamp. The residence time of the circuit boards in the area of UV exposure should be no more than 10 seconds Then the card is removed from the irradiation zone and leave to boatwrights on voobragenie breakdown of not less than 50,000/mm, the thickness of the coating shall be not more than 0,02-0,03 mm in Addition, the coating must be flexible, possess adhesion to copper, tin and steklotekstolity substrates and retain these properties in the temperature range (-60)-(+125)aboutWith, and save dielectric properties after exposure of the coating in the chamber with a humidity of 95% and a temperature of 40aboutWith over 20 day.

Known photopolymerized composition [1] masking the details of the electronic circuit. The composition contains as the film-forming polymer synthetic resin (for example, epoxyacrylate, urethaneacrylate and others), monomerization (for example, etilenglikolevye and others ), photoinitiator (for example, benzyldimethylamine), fotoserial (for example, 6% cobalt naphthenate), the curing agent at room temperature (for example, benzoyl peroxide, methylethylketone and others) and the dye (for example, red iron oxide). The composition is applied with a layer of 1 mm on the surface of the integrated circuit, is subjected to UV irradiation lamp with an intensity of 80 W/cm2within 10 seconds When this occurs, the curing of the surface coating layer, full curing occurs at room temperature for 4 h the resulting coating panotopoulos the nature of the used film-forming polymer, which requires additional use of accelerators UV polymerization and curing at room temperature. In addition, the composition is applied in a thick layer and allow for full otverzhdenija requires a relatively large time.

The closest in technical essence to the present invention is photopolymerizable dielectric composition [2] containing (wt.) film-forming polymer (a mixture of 20-35 acelerando prepolymer urethane, 10-50 unsaturated prepolymer thiolene), 10-40 crosslinking monomer-diluent (N-vinylpyrrolidone), 1-10 photoinitiator (2,2-dimethoxy-2-phenylacetophenone), 4-18 plasticizer and 0.05-0.3 adhesion promoter (organosilane).

FDC obtained by mixing the components until complete homogenization for 1 h, and the temperature of the mixture varies from 15 to 20aboutWith, and at the end of cooking FDC better to return to the original temperature, as above 15aboutWith the composition becomes less viscous. In the preparation of the composition are first mixed terenowy prepolymer with hardener, then add a crosslinking monomer-solvent, other components are added to the mixture in any order. Full curing of the coating occurs for mojca. During aging the samples at a temperature of 85aboutC and humidity of 95% within 10 days of the formation of cracks in the coating is not observed, the coating remains flexible, not otlipat from the substrate. Temperature at which the coating retains its properties is -20 to +75aboutC.

The disadvantages of the compositions are low dielectric properties (breakdown voltage 1250-1390 In/mm) when the thickness of the coating, a narrow operating temperature and longer time for complete curing. In addition, when preparing FDC must comply with the above order of mixing the components.

The aim of the invention is to increase the dielectric properties utverzhdenii composition, extended temperature operation mode and reducing the time its full cure.

This objective is achieved in that the photopolymerizable dielectric composition comprising a film-forming, the monomer-solvent, a crosslinking agent and photoinitiator, as contains a film-forming polymer 2-10 wt. methacrylic acid and 90-98 wt. of butyl methacrylate as monomer-diluent methyl methacrylate as a crosslinking agent di(meth)acrylate, di(three)etilogy the iloveu acid

and 90-98 wt. of butyl methacrylate 2,0-20,0

Di(meth)acrylate

di(three)ethylene glycol 0.1 to 3.0 Photoinitiator 0,1-3,0

The composition may further contain 2-ethyl hexyl acrylate in an amount of 0.1-10 wt.h. as the monomer-diluent and the adhesion promoter, for example methacrylic acid, in the amount of 1-15 wt.h.

Obvious effect is the improvement of dielectric properties utverzhdenii composition by reducing the thickness of the coating.

As the use of film-forming copolymer of methacrylic acid (2-10 wt.) and butyl methacrylate (90-98 wt.) (OST 6-01-26-75), as a monomer-diluent methyl methacrylate (GOST 20370-74) or its mixture with 2-hexyl acrylate (TU 6-01-1232-80), as photoinitiator mixture (mass ratio 10: 1) benzophenone (MRTU 6-09-1169-64) and michler ketone (MRTU 6-09-6671-70), methyl ether of benzoin (TU 14P-1010-69), 2,2-dimethoxy-2-phenylacetophenone, 2,2-diisopropanolamine, as cross-linking agent dietilenglikoluretan (TU 6-02-10-88), triethylenemelamine, triethylenemelamine - relat (TSS-2-9-88), as protomateria adhesion methacrylic acid (TU 6-01-914-79).

The composition is prepared by mixing the components at room temperature until complete homaged, tin, fiberglass once or twice before reaching the coating thickness 0,02-0,03 mm Each layer utverjdayut UV-irradiation of a mercury lamp with an intensity of irradiation of 56 W/m2. Then the substrate is removed from the zone of irradiation and incubated for 1 h (time full otverzhdenija) at room temperature, followed by the determination of dielectric and mechanical properties of the obtained coatings.

P R I m e R 1. To 100 wt.h. of methyl methacrylate (MMA) add 7 wt.h. copolymer of methacrylic acid (5 wt. ) and butyl methacrylate (95 wt.) (BMK-5), 1 wt. including a mixture of benzophenone and michler ketone (CF KM), taken in the ratio of 10:1, and 0.25 wt.h. dietilenglikoluretan (DHA). Mixing lead to the complete homogenization of the mixture.

Thus prepared VDC applied on the substrate using the applicator and utverjdayut UV rays. Pets applying the composition by spraying, pouring or dipping.

To determine the breakdown voltage of the composition is applied on the copper substrate and the determination performed according to GOST 6433.2-71. The elasticity of the coating is determined according to GOST 6806-73, while FDC onto the base of the tin. The adhesion of the coating is determined according to GOST 15140-78.2 steklotekstolity substrate. Temperature dir is sliianie) after alternate premises steklotekstolity substrate coated in cells with low and high temperature. The residence time in each cell is 1 o'clock At operating temperature, take the temperature, which is not observed cracking and peeling of the coating. The moisture resistance of the coating is evaluated according to a change in the value of the breakdown voltage after exposure of the copper substrate with a deposited coating in the humidity chamber for 20 days. The camera is supported by the humidity of 95% and temperature of 40aboutC. Coating water-resistant, if the breakdown voltage of not less than 50,000/mm

The results are given in the table.

P R I m m e R 2. The composition is prepared and experienced to example 1, except that to 100 wt.h. MMA add 20 wt.h. copolymer of methacrylic acid (2.) and butyl methacrylate (98 wt.) (BMC-2), 0.1 wt.h. 2,2-dimethoxy-2-phenylacetophenone (DMPAP) and 0.1 wt.h. triethylenemelamine (TGA).

The results are given in the table.

P R I m e R 3. The composition is prepared and experienced to example 1, except that to 100 wt.h. MMA add 2 wt.h. copolymer of methacrylic acid (10 wt.) and butyl methacrylate (90 wt.) (BMK-10), 3 wt.h. methyl ether, benzoin (OIE) and 3 wt.h. Triethylenetetramine (TBI).

The results are given in the table.

P the slots (5 wt.) and butyl methacrylate (95 wt.) (BMK-5), 0.5.h. 2,2-Diisopropylamine (DIPF) and 0.25 wt.h. dietilenglikoluretan (DHA).

The results are given in the table.

P R I m e R 5. The composition is prepared and experienced to example 1, except that to 100 wt.h. MMA add 7 wt.h. 2-ethylhexyl acrylate (2-EGO), 7 wt.h. copolymer of methacrylic acid (4 wt.) and butyl methacrylate (96 wt.) (BMK-4), 1.5 wt.h. BF and KM, 0.3 wt.h. TGA.

The results are given in the table.

From the results shown in the table, it is seen that using the proposed FDC improve the dielectric properties of the cured coating (the breakdown voltage of more than 50,000/mm), extended operating temperature coatings (from -60 to +125about(C) reducing the thickness of the coating (0.02-0.03 mm), and reduced the full cure time (0.5-1 h).

PHOTOPOLYMERIZABLE DIELECTRIC COMPOSITION including a film-forming, the monomer-solvent, a crosslinking agent and photoinitiator, characterized in that, to improve the dielectric properties utverzhdenii composition, extension of the operating temperature of and reduce the time it fully cure, as it contains a film-forming copolymer of 2 to 10 wt. metac the non agent - di(meth)acrylate, di(three)of ethylene glycol in the following ratio, wt.h.

The methyl methacrylate 100

The copolymer of 2 to 10 wt. methacrylic acid and 90 to 98 wt. of butyl methacrylate 2,0 20,0

Di(meth)acrylate, di(three)of ethylene glycol 0,1 3,0

Photoinitiator 0,1 3,0

 

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1 tbl

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