Insulating composition of low toxicity

 

(57) Abstract:

The invention relates to electrical engineering and can be used in the production of enamelled wires. The purpose of the invention is the improvement of the efficiency of the insulating composition and improving the reliability of insulation on its basis by increasing thermal shock resistance and bursting strength at elevated temperatures. Insulating composition containing oligoasthenozoospermia, phenylglycol and polybutylene enables manufacture of wire with core diameter of 1.0 mm, the rate of heat stroke 1d (0,54, 155°C) and an indicator of thermoplasticity 365 - 369°C. table 3.,1 Il.

The invention relates to insulating compositions of low toxicity on the basis of oligoasthenozoospermia to isolate electrical conductors.

Known insulating structures on the basis of oligoasthenozoospermia, for example, electrical insulating varnish composed of oligoasthenozoospermia, solvent mixtures krasilnogo type (tricresol, dicrete, Xylenol) and xylene (or solvent).

These varnishes are highly toxic substances, as members solvent, mass fraction of solids (concentration), the viscosity should vary depending on the diameter amayuelas wire and, accordingly, the type of enalaprilat.

Varnishes used for enameling wire diameter 0,400 mm and above on the vertical enalaprilat, are made with a mass fraction of non-volatile equal to 27 - 33% and conditional viscosity VZ-246 with the nozzle diameter of 4.0 mm (20aboutC) - 60-170 C. For enameling wire thin and thinnest sections on horizontal amalagamated use varnish with a mass fraction of non-volatile 23-27% and a viscosity of 20-40 with VZ-246 (20aboutC).

Thus, for the production of enamelled wires in the range of all sizes, something subtle to large, you need to produce, using the same basis, varnishes with different concentration.

Closest to the present invention is electrically insulating composition containing oligoasthenozoospermia based on the dimethyl terephthalate, 4,4' -diaminodiphenylmethane and trimellitic anhydride, including 8-16 wt.% imenik groups and solvents-monoalkyl ethers of diethylene glycol or phenylglycol.

In comparison with compositions containing solvents krasilnogo type, aImost viscosity on concentration. Therefore, its use in the production of enamelled wires in the whole range of sizes as well as for crazycameras, require production of formulations with different concentration.

The possibility of using a known composition of solvent type monoalkyl ethers of diethylene glycol or phenylglycol is achieved by introducing into the composition of polyetherimide, in particular, oligoasthenozoospermia, instead difunctional glycols, such as ethylene glycol, monoamino diethylene glycol or triethylene glycol. Monofunctionality - the presence of one hydroxyl group and higher in comparison with ethylene glycol of molecular weight used monoamino allow you to get oligoasthenozoospermia with a smaller number of saponification and more loose structure that provides its increased solubility in bezkrasaina solvents, in particular in monoether glycols. The saponification number of oligoasthenozoospermia is 225-258 mgKOH/g

To provide the necessary technological properties of known composition - viscosity suitable for application to the wire in the process of enameling, as well as a good effective flowing property of the composition on the surface of the wire, it's errosion, the diluent - solvent.

If N-methyl-2-pyrrolidone is toxicity besides, the 4th class of hazard that monoether glycols, cresol to the 1st, solvent - to 3-him.

Enameled wire, obtained on the basis of known composition, have insufficient resistance to thermal shock and significant spread of values of the temperature forcing isolation (figure cut-through) from 246 to 349aboutC. At this higher temperature forcing (349about(C) characteristic of enamelled wire with lower resistance to thermal shock. Enameled wire with better resistance to thermal shock is pressed at a temperature of 246aboutC.

The aim of the invention is to improve the manufacturability of the insulating composition of low toxicity and improving the reliability of insulation on its basis by increasing thermal shock resistance and bursting strength at elevated temperatures.

This objective is achieved in that the insulating composition of low toxicity, containing oligoasthenozoospermia based on the dimethyl terephthalate, 4,4'-diaminodiphenylmethane and trimellitates the mgKOH/g and the content hydroxilic groups of 5-6 wt.% (1), and additionally polybutylene in the following ratio, wt.%: oligoasthenozoospermia 1 30-38,8, phenylglycol 60,0 - 39,1, polybutylene is 0.9 - 1.2.

Phenylglycol - solvent technical, is a mixture of (80-85) wt.% montenerodomo ether of ethylene glycol and (15-20) wt.% montenerodomo ether of diethylene glycol, boiling point 246-298aboutC density (20aboutC) - 1109 kg/m3the refractive index (20aboutC) 1,533-1,536, the water content is not more than 0.2%.

The invention is illustrated by a drawing which shows the dependence of the viscosity of the proposed and known composition on temperature.

Below are examples of the synthesis of oligoasthenozoospermia 1, fundamentals of the proposed composition and production of dielectric composition.

P R I m e R 1. In chetyrehosnuju flask equipped with a stirrer, a thermometer, a tube for inert gas supply connected direct refrigerator with receiver eye-catching products, load components of the formulation of example 1 are presented in table.1, in the following sequence: ethylene glycol, diethylene glycol, glycerin, terephthalate, Tris(2-hydroxyethyl) isocyanurate, 4,4'-diaminodiphenylmethane and kilt mixer, mix the contents of the flask 10-15 min and impose a pre-prepared solution of tetraethoxysilane in xylene (1/3 of the amount specified in the recipe). The temperature was raised to 135-140aboutWith, and slowly introducing trimellitic anhydride (15-20 min) and then begin to rise in temperature with a speed of 5-6aboutWith in hours Specified rate of temperature rise until the end of the process. At a temperature of 150aboutTo begin the allocation of water, xylene and methanol. The distillate by-products lead through the distillation column, the temperature of the distillate at the top of the column should not exceed 105aboutC. the Specified temperature of the top of the support column to achieve in the flask temperature 190aboutS, after which the column off and lead removal products direct distillation from the reaction flask.

At a temperature of 190aboutTo enter Tung oil and continue to heat in a current of inert gas to a temperature of 225 - 230aboutC. the Reaction mass is then maintained at this temperature until receipt of oligoasthenozoospermia with viscosity of Ballade (capillary III) equal to 75 C. the Final product has a saponification number 297 mgKOH/g and contains 5.4% of the hydroxyl groups.

P R I m Nologie, described in example 1.

The process of closing the achievement of viscosity on Ballade equal s.

The final oligoasthenozoospermia has a saponification number 320 Khan/g and contains 6.0% of hydroxyl groups.

P R I m e R 3. Oligoasthenozoospermia receive in accordance with formulation example 3 are presented in table.1, according to the technology described in example 1.

The process of closing the achievement of viscosity on Ballade equal to 73.

The final oligoasthenozoospermia contains 5.0% of hydroxyl groups.

P R I m e R 4. In chetyrehosnuju flask equipped with stirrer, thermometer, reflux condenser, a tube for introducing components, load the resin of example 1 in accordance with the formulation shown in table.2.

Include the heating, heating the contents of the flask to melt, let the mixer, raise the temperature to 160aboutC, then type in accordance with the recipe phenylglycol for pre-dissolution, stirred for 1 h at this temperature, after which the heating is switched off, introduce according to the recipe phenylglycol for complete dissolution, the temperature was lowered to 105 to 110aboutC, kept at this temperature for 4-5 h before the initial solution polybutylene in phenylglycol (Solution prepared immediately before introduction when heated to 60-70aboutC). The flask contents are stirred at a temperature of 90-100aboutC. the flask Contents are stirred at a temperature of 90-100aboutWith 2-3 hours

Ready to determine the composition: mass fraction of solids, viscosity, and then cooled to 40-50aboutC and filtered. If necessary, dilute the composition is administered in an additional amount of phenylglycol, maintained at a temperature of 90-100aboutWith 1.5-2 h, cooled to 40-50aboutC and filtered.

The viscosity of the compositions on the basis of oligoasthenozoospermia example 1 when the contents of 30, 35, 40% are listed in the table.2 - examples 4.1, 4.2 and 4.3.

P R I m e R 5. The composition of example 5, get, using oligopiridinovymi of example 2, according to a formulation shown in table.2, and the techniques described in example 4.

Characteristics of the composition shown in table.2.

P R I m e R 6. The composition of example 6 receive, using oligopiridinovymi example, according to a formulation shown in table.2, and the techniques described in example 4.

Characteristics of the composition shown in table.2.

The viscosity of the proposed and known compounds is determined according to GOST 8420-74 using viscometer VZ-246 with the nozzle diameter of 4.0 mm at the temperature of the composition 20, 30, 40, 50, 60the frames shows the advantage of the proposed structure is the ability to use the characteristic dependence of viscosity on temperature, the viscosity reduction of about a factor of 2 with increasing temperature for every 10aboutWith that illustrated in the drawing.

The drawing shows the dependence of viscosity on temperature, the proposed composition (curves 1,2) and of known composition (curve 3), which has a similar character. However, for a known composition viscosity required for enameling wire thin and thinnest sections of 20-40s VZ-246, is achieved at 50-65aboutS, while for the proposed - at 40-50aboutC.

If this is not possible for some reasons known to heat the composition containing the solvent is highly volatile fumes, such as solvent, xylene, and others, to temperatures above 40aboutC.

First, high volatility vapors such solvents as xylene, solvent (13,5-20 over the air) increases the concentration of the composition, resulting in its viscosity increases rapidly. Secondly formulations containing xylene, solvents have a flash point of from 31 to 40aboutC. Therefore, the increased concentration of solvent vapour creates the possibility of an explosion and exceeds 40aboutC.

The proposed composition containing phenylglycol, has a low volatility vapours (1000 over the air) and a high flash point (107aboutC).

This allows you to work for a long time at a higher temperature in the application unit enalaprilat - 60aboutWithout changing the aspect ratio of the components and the specified temperature provides a lower viscosity to enameling wire thin and thinnest sections.

Thus, the nature of the dependence of viscosity on temperature in combination with low volatility and high flash point determine the increased technological properties of the proposed structure is its versatility in the production of enamelled wires of different diameters - from subtle to major sections. Practically this means that you can use with the original constant mass fraction of non-volatiles and a viscosity in the enameling wire of various cross-sections by varying the temperature of the composition in the application unit enalaprilat.

The compositions of examples 4-6 are experiencing for the enamelling of copper wire with a diameter of 1,000 and 0,315 mm Wire diameter 1,000 mm enamel is,315 mm applied the composition of example 6, testing is carried out on the horizontal enalaprilate. The test result obtained enameled wires and conditions of application of the composition onto the wire are given in table. 3.

At the same time spend enameling wire with a diameter of 1,000 mm and 0,315 mm known composition.

As follows from the data table.3, using the composition according to the invention can be emulirovat wire with a diameter of 1,000 and 0,315 mm, adjust only the temperature of the composition at the site of application. For enameling these wire sizes known composition it is necessary to prepare the compositions of different concentrations to obtain the required technological viscosity.

Enameled wire, obtained on the basis of the proposed composition, exhibit improved thermal properties: high resistance to thermal shock, high temperature pressing isolation, which is characterized by high fever which he maintained at the definition of the indicator "cut-through.

Insulation coating has good adhesion to copper. Thus, the electrically insulating coating obtained on the copper foil with a thickness of 0.1 mm with multiple inflection 180aboutit does not peel from foil to break fidgety also provides high mechanical strength determined by rubbing in one direction.

INSULATING COMPOSITION of LOW TOXICITY, containing oligoasthenozoospermia based on the dimethyl terephthalate, 4,4'-diaminodiphenylmethane and trimellitic anhydride, comprising 8 to 16 wt.% imenik groups, and phenylglycol, characterized in that, to improve workability and increase of operational reliability of insulation on its basis by increasing thermal shock resistance and bursting strength at elevated temperatures, it is as oligoasthenozoospermia contains oligoasthenozoospermia with saponification number 285 to 320 mg KOH/g and the content of hydroxyl groups of 5 - 6 wt. % (I) and optionally polybutylene in the following ratio, wt.%:

Oligoasthenozoospermia I 30,0 - 38,8

Phenylglycol 60,0 - 69,1

Polybutylene 0,9 - 1,2

 

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