Printed circuit boards with reserve circuits arrangement method
FIELD: printing industry.
SUBSTANCE: in the printed circuit boards arrangement method, comprising a mutual arrangement of redundant and backup boards, redundant and backup boards arrangement and trace, the reference conductor is in the form of separate layers on the redundant and backup boards; the redundant and backup boards are glued with a dielectric layer having a relative dielectric capacity higher than that of the dielectric substrates of the redundant and backup boards; corresponding to each other routes of the redundant and backup circuits are arranged parallel to and under each other in the gluing dielectric layer; redundant and backup radio-electronic components are placed on the opposite glued sides of the redundant and backup printed circuit boards. In case of failure of a redundant circuit, the same technical result will be achieved in the backup circuit.
EFFECT: reduction of redundant circuit sensitivity to external conductive emissions and reduction of the conducted emissions level from the redundant circuit.
FIELD: technological processes.
SUBSTANCE: invention relates to instrument making and radio electronic engineering and can be used in the production of flexible printed boards used in the manufacture of secondary converters of micromechanical accelerometers, microgyroscopes, integral pressure sensors and other items. In a manufacturing method of a two-sided flexible printed board, which consists in the fact that to a metal plate on both sides there applied is an aluminium layer and further on both sides there applied is a metal resistive electrically conductive coating; photolithography is performed on both sides; marks of transient holes are a mirror reflection of both sides; after that, the aluminium coating is etched away simultaneously from both sides, and then, the flexible printed boards are separated on both sides from the metal plate and they are attached to each other by means of a polymer layer.
EFFECT: improving positioning accuracy, identity of obtaining elements of two flexible printed boards, their further alignment and connection to obtain the two-sided flexible printed board and shortening the technological cycle.
SUBSTANCE: in the method the unified blocks of printed-circuit boards, each of which is made of identical amount of printed-circuit boards of the first and second type. The blocks are connected among themselves two by two, and first of all one pair block is turned on 180 degrees with reference to the second pair block and the named blocks are joined by end faces. Each printed-circuit board of the first type of one pair block joined with the printed-circuit board of the second type of another pair block. The joint line along the whole length is covered by bars, which are fixed then to the printed-circuit boards of the first and second pair blocks. An obtained product is then separated into composite printed-circuit boards.
EFFECT: minimising the amount of operations for manufacture of composite printed-circuit boards.
5 cl, 6 dwg
SUBSTANCE: in the method of assembling microelectronic components, once a position fixing polymer (4), in order to maintain alignment of microelectronic components (2) that are assembled on a substrate (1) using an anisotropic electroconductive film (7), is applied onto the substrate and hardened, the microelectronic components (2) are heated to a predetermined temperature and compressed at a predetermined pressure using a flexible sheet (5) provided on the microelectronic components and then subjected to single-step compressive fixation on the substrate (1).
EFFECT: providing a method of assembling microelectronic components which, when using an anisotropic electroconductive film to assemble a plurality of microelectronic components of different height on a base plate, allows assembling at precise positions on the base plate, thereby preventing position shift which results from compressive fixation.
5 cl, 16 dwg
FIELD: radio engineering, communication.
SUBSTANCE: topological pattern of all conducting layers and electrical contacts between them are formed in one process by a photomask through photolithography, wherein an electrical contact is formed from material of conducting layers. In a single process cycle, a second photomask is used to form windows in dielectric layers of the flexible part for electrical and mechanical connection with the rigid part of the board. The rigid part of the board is made using the conventional technique of double-sided boards. The flexible part and the rigid part are joined, for example, by microwelding, brazing or gluing with electroconductive adhesives, through the windows in the dielectric layers. A multilayer flexible-rigid integrated board is formed by successively folding the flexible part in form of an envelope and placing the rigid part of the board inside, after which all layers of the board are tied into a single structure which meets technical requirements for multilayer boards.
EFFECT: fewer process operations and number of photomasks when making flexible and flexible-rigid multilayer boards, high reliability of electrical contacts between layers of the multilayer board, low labour input and production cost.
SUBSTANCE: dielectric foiled at both sides is used (for instance, in the form of a flexible polymer) and a metal substrate with a plating layer, besides, a solder layer is arranged between them. In the metal substrate of the printed circuit board there might be through holes made for connection with other printed circuit boards. Besides, tinning of the printed circuit board is carried out simultaneously with tinning of the plating layer of the metal substrate, afterwards the printed circuit board billet is soldered to the metal substrate billet. It is possible to simultaneously solder radio elements to contact sites of the printed circuit board.
EFFECT: provision of the possibility to manufacture in conditions of a conventional assembly production facility both rigid and flexible-rigid printed circuit board on a metal substrate having increased strength, resistance to mechanical actions, improved heat removal and screening properties.
4 cl, 2 dwg
SUBSTANCE: method involves the following: prior to application of electroplated conductive copper coating to the fibre-glass plastic surface and to inner surface of bypass openings there applied is thin silver coating with thickness of 2÷4 mcm using the chemical method, silver salts, protected with polymer film or photoresist material; pattern of electroconductive scheme is formed, and after creation of electroconductive paths and electroplated metal coating of inner surface of bypass openings the protective polymer coating is removed and thin metal coating is etched from the sections not protected with metal resistive coating.
EFFECT: elimination of activation of fiber-glass plastic surface and holes using expensive palladium chloride; and elimination of power loss, especially at low currents, due to big difference in electric resistance of silver and palladium.
FIELD: radio engineering.
SUBSTANCE: wiring unit comprises printed circuit boards and multiserial sockets installed on their ends, besides printed circuit boards are installed between rows of socket contacts parallel to each other so that in the first version one of boards with its end sides is electrically connected along one and another surface accordingly with one and another neighbouring rows of socket contacts, and another and subsequent boards with their end sides are electrically connected along outer surface accordingly with other subsequent rows of socket contacts; in the second version - each board with its one end side is electrically connected along one and another surface accordingly to neighbouring rows of opposite sockets contacts, and with its other end side it is electrically connected along external surface accordingly to outer row of opposite sockets contacts. Unit of electrical equipment comprises packet of wiring units made of printed circuit boards with sockets installed on their ends fixed by pair fastening panels. Methods are also proposed to manufacture wiring unit and unit of electrotechnical equipment. Method for repair of electrical equipment unit, in which in packet of wiring unit they detect faulty wiring unit, packet fixtures are removed, due to rotation of units access is provided to faulty piece, fault is eliminated, and packet of units is returned into initial position, consists in the fact that in packet of wiring units arranged with sockets, to which at least printed circuit boards are connected electrically, and boards along their single identical side through holes-contacts are pierced mainly with rigid single-core electric wires, fastening panels are removed from wiring units, faulty unit is detected, and packet of wiring units is divided into two parts relative to it, other units are turned due to bending of wires in different sides to obtain required access to faulty board of unit, after elimination of fault units and fastening panels are put back in place.
EFFECT: high technological properties, low metal intensity, high rigidity and strength characteristics, good repairability and wide opportunities in building of universal units and blocks of various purpose.
13 cl, 12 dwg
FIELD: physics, radio.
SUBSTANCE: invention relates to the field of radio communication, namely to the field of radio communication systems with frequency hopping. The time-varied procedure operational frequencies are used, depending on the time scale value of the communication system. Synchronization is performed by transmission of markers of special structure at the initial frequency corresponding to the current value of the time scale of the transmitter. The receiver periodically performs a serial search of the synchronization marker at the frequencies corresponding to previous, current and subsequent time intervals of the time scale of the receiver. Meanwhile on each frequency the duration of receipt is such that the skip of the marker transferred at this frequency is excluded. The received marker has the structure allowing to detect it due to the preset sequences contained in it, in addition the marker contains the value permitting uniquely identify the position of the received marker in a general layout of synchronization sending. After reception of the marker on the basis of its structure the receiver executes sync of the program of modification of frequency.
EFFECT: improved accuracy of synchronisation.
FIELD: radio engineering, communication.
SUBSTANCE: system comprises a receiving radio centre, which comprises N receiving tracts, a switchboard, a transceiver of wireless access equipment (WAE), a shaper of control signals, a receiving antenna feeder system from N antenna elements, N devices of matching and distribution of high-frequency signals (MDD), comprising a distribution unit and a filtration unit, a directivity pattern generation unit (DPGU), a unit of short-wave modems, equipment for detection of location coordinates and exact time marks, a remote control panel, a communication line, a reference signal unit (RSU), a WAE antenna. Also the system comprises a transmitting radio centre, which comprises four short-wave transmitting tracts, a WAE transceiver, a WAE antenna, a switchboard of the transmitting radio centre, a summation and switching unit of high-frequency signals (SSU) and a transmitting antenna-feeder system.
EFFECT: higher noise immunity of signals reception and reliability of signals transfer to radio correspondents, reduction of finance costs in manufacturing and service.
FIELD: radio engineering.
SUBSTANCE: control of several simultaneous radio connections is done in communication device. It is identified whether existing radio connection interferes with new radio connection; and new radio connection is created with parametres that minimise noise between existing radio connection and new radio connection, if existing radio connection and new radio connection create noise for each other.
EFFECT: minimisation of noise between radio connections.
36 cl, 5 dwg
FIELD: physics; radio.
SUBSTANCE: present invention pertains to transformation technology and can be used for efficient suppression of non-symmetrical conducted noise, generated by transformers, working at high frequencies (up to tens of kHz), in input and output lines. Proposal is given of method of suppressing non-symmetrical conducted noise of electrical equipment containing one or more transformers, acting as noise sources, each of which, at its operating frequency, generates non-symmetrical noises, relative the potential of the case of the electrical equipment at its input and output lines, whose frequency and phase are different. The high frequency component of these noises is attenuated using high frequency filters of non-symmetrical radio noises, connected at the input and output lines of the electrical equipment. For each noise source, the equivalent EMF of which affects the case relative one of the transformer circuits, a voltage is generated, relative the potential of that circuit, in antiphase relative the voltage of that noise, and that voltage is applied to the case through a two-terminal network, the impedance of which chosen from the condition of maximum compensation of the noise voltage between the lines and the case from the given noise source.
EFFECT: higher degree of suppressing non-symmetrical noises at operating frequencies of transformers in electrical equipment.
FIELD: technology for high frequency synchronization of an electric system and an electronic board used for that purpose.
SUBSTANCE: during realization of high frequency adjustment method, high frequency plug socket (1) is used, comprising electronic board (3), which has two types of contact points: points (21-28) for high frequency contacts and points (31-38) for contacts with isolation shift, each contact point (21-28) for high frequency contacts is connected to corresponding contact point (31-38) for isolation-shifting contacts, between high frequency contacts capacity connections appear, causing generation of cross inductions on near end of communication line. At least one first conductive track (46), connected on one side to contact point (26) of electric contact, is placed on electronic board (3) together with at least one second conductive track (44), positioned on electronic board (3) and/or inside it, forms capacitor (C46). At least one frequency-dependent parameter of device is measured and compared to set parameter, and depending on the difference produced as a result of comparison, conductive track (46), contacting on one side, is removed partially or fully.
EFFECT: creation of method for synchronization of high frequency plug socket, in particular, RJ-45 socket, with at least one electronic board, and also creation of an electronic board, which allows adjustment of high frequency characteristics within a narrow tolerance range.
2 cl, 5 dwg
FIELD: engineering of vehicle energy supplies, for automobiles in particular.
SUBSTANCE: in accordance to invention, mounted between walls of plug well and ignition coil mounted in well is screen, provided (with forming of open circular coil) with through recess, extending from end of screen positioned on the side of spark plug to the end of screen opposite relatively to spark plug. Screen is made perforated by a set of through slits, positioned in parallel to longitudinal geometrical axis of screen. Minimal width of any one of slits is selected so that its opposite edges do not contact each other during radial forming of screen, value of interval between screen slits equals from 1 to 3 of values of slit width, while maximal length of slit is less than length of screen generatrix.
EFFECT: decreased electric capacity introduced to electric contour of ignition coil, without substantially increasing radio interference emitted from radiation object and, as a result, improved energetic parameters thereof.
FIELD: electrical engineering; secondary three-phase power supplies for electrical and electronic equipment.
SUBSTANCE: three cylindrical inductance coils of proposed three-phase inductance system are similar in shape and size; they have no ferromagnetic cores and are compactly disposed in system and each one is connected to respective line of three-phase supply mains. Transverse dimension of each wound cylindrical inductance coil equals its longitudinal dimension. Centers of symmetry of cylindrical inductance coils are disposed on longitudinal symmetry axis of three-phase inductance system. Winding axes of coils are orthogonal and direction of coil winding is arbitrary.
EFFECT: reduced mass and size, enhanced noise immunity.
1 cl, 1 dwg
SUBSTANCE: method includes formation of volume current leads (VCL) on contact sites of a primary converter (PC) of crystalline type by the method of thermosonic microwelding with subsequent installation of the PC onto the board of the secondary converter of microelectromechanical devices and systems (MEMS). At the same time they previously perform high-temperature assembly of the PC made of a sensitive element SE and other functional elements of MEMS, which is carried out at temperature of not more than 500°C, afterwards to volume current leads made on contact sites of the PC, made of alternating metal layers Cr - Au with thickness of not more than 0.4 mcm, current leads are welded, in the form of a wire of gold by the method of contact welding. Then the PC produced in the specified manner is connected by the produced current leads in the form of a wire by the method of contact welding to contact sites of the secondary converter (SC) of MEMS.
EFFECT: increased reliability of functioning under conditions of high complex external impact.
SUBSTANCE: invention relates to electrical engineering and may be used for the production of highly stable quartz resonators and generators with inner thermostating. The production method provides for installing radio elements of generator (resonator) and quartz piezo-element by their group soldering to the board. The board is then installed to the housing basis. After that, the generator (resonator) is heated at 150°C and tuned to the operating frequency under vacuum conditions. The housing lid is vacuum tightly connected with the basis. The thermovacuum annealing of generator (resonator) at 150÷200°C is performed at the open riveted hole in the housing lid. Then, the generator is cooled to the confinement temperature (70±10) °C. The housing is vacuum confined by riveted hole soldering in the lid. After installation, the board with soldered radio elements and the housing lid with the soldered riveted hole are subject to vacuum annealing during 0.5÷2.5 hours at the temperature of solder melting (Th÷Tl), where Th and Tl - high and low temperature of solder melting. The thermovacuum annealing of generator (resonator) at the open riveted hole is conducted until the surface inside the generator (resonator) housing is cleaned to 6·10-5÷2.5·10-2 tore·sm3/f·m2 which is defined by the specific gas release value within the temperature 120-180°C.
EFFECT: improved efficiency, high items quality and reliability.
2 dwg, 1 tbl