Curable compositions

FIELD: chemistry.

SUBSTANCE: invention relates to curable compositions of epoxy resin, suitable for making an insulator for a high-voltage gas-insulated switchgear. Invention includes (A) epoxy resin composition containing a mixture of: (A1) at least one solid epoxy resin, (A2) of at least one novolac epoxy resin, and (A3) at least one cycloaliphatic epoxy resin; (B) at least one anhydride hardener; (C) at least one filler; and (D) optionally at least one catalyst or at least one accelerator. Composition has a ratio of epoxy groups to anhydride groups from 1:0.75 to 1:0.85.

EFFECT: invention increases mechanical strength and hardness of composition.

14 cl, 1 tbl, 3 ex

 



 

Same patents:

FIELD: electricity.

SUBSTANCE: composition for isolation of plates of magnetic conductors of transformers is offered which comprises a composition base - epoxy, aromatic solvent and hardener - hexamethylenediamine, and also magnetite with nano-sized magnetic particles in the medium of oleic acid with the following ratio of components, wt %: epoxy - 16-30, magnetite with nanodimensional magnetic particles in the medium of oleic acid - 30-58, aromatic solvent - 5-10, hexamethylenediamine - 1-2.

EFFECT: offered composition for insulation of plates of magnetic conductors of transformers allows to decrease considerably the hardening time, and also provides increase of heat resistance, mechanical, electric strength of coating, and also electric resistance at a small thickness.

FIELD: chemistry.

SUBSTANCE: invention relates to high-frequency composite dielectric materials used in antenna engineering and high-frequency transmission lines. The composite material comprises packed fluoroplast-4 powder with particle size of no more than 5 mcm, impregnated with binder. The binder used is epoxy resin with a curing agent. The epoxy resin is a product of condensation of epichlorohydrin and aniline in an alkaline medium, with viscosity of no more than 200 mPa·s, and the curing agent used has viscosity of no more than 40 mPa·s. Impregnation with binder is carried out under pressure and while evacuating the volume of the powder, followed by curing.

EFFECT: producing a dielectric material with low permittivity, low dielectric loss tangent and improved properties such as strength and modulus of elasticity in compression.

1 dwg, 1 tbl

Direct filling // 2528845

FIELD: chemistry.

SUBSTANCE: invention relates to a curing composition for producing electrically insulating structural material for electrical or electronic components. The curing composition contains epoxy resin, a curing agent and a filler composition. The filler composition contains wollastonite and amorphous silicon dioxide. The surface of one of the fillers is treated with silane. A cured product is obtained by curing said curing composition.

EFFECT: invention enables to use said curing composition directly in the ceramic housing of a switching device and has high cracking resistance.

9 cl, 3 tbl, 2 ex

FIELD: electricity.

SUBSTANCE: invention relates to electric engineering, namely, to a heat-generating electromechanical converter designed for heating and/or movement of liquid or gaseous medium. The device comprises an additional fixed element made of antifriction non-electroconductive material, which performs the functions of a radial and/or thrust sliding bearing, from polymer composite material on the basis of epoxide-diane resin with filler from fluoroplastic powder, cut glass fibre and additionally aluminium oxide Al2O3 or silicon dioxide SiO2, which makes it possible to increase quantity of heat removed from the primary winding.

EFFECT: increased coefficient of heat conductivity of a fixed heat-insulating element provides for reduced temperature of primary winding of a heat-generating electromechanical converter, which accordingly increases reliability of its operation.

2 tbl

FIELD: chemistry.

SUBSTANCE: claimed invention relates to the field of casting resins for switching devices. Described is a solid resin system for insulating materials in the switching devices, which contains a solid bisphenol A-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.3, and a liquid bisphenol F-based resin, which has an epoxy number (DIN ISO 16945) from ≥0.4 to ≤0.63, where a part of the liquid bisphenol F-based resin, measured as a weight to the total weight of the resin, constitutes from ≥5% to ≤60%, with the solid resin system before hardening having an epoxy number (DIN ISO 16945) from ≥0.2 to ≤0.55, and the solid resin system includes as resins only the said resins themselves. Also described is application of the said solid resin system as an insulating material in electric switching devices.

EFFECT: obtaining the solid resin system, possessing low susceptibility to cracking and high resistance to bursting.

7 cl, 1 ex

FIELD: chemistry.

SUBSTANCE: resin contains methyl nadic anhydride and/or hydrogenated methyl nadic anhydride and imidazole of formula , where R1, R2, R3 and R4 are given in claim 1.

EFFECT: obtained resin has significantly higher glass transition temperature with high quality mechanical characteristics and tracking resistance.

3 dwg, 7 cl, 1 ex

FIELD: electricity.

SUBSTANCE: electric insulating filling compound contains epoxide diane resin, amine hardener in the form of triethylene tetramine (TETA), and also a modifier - a phosphorus-containing methyl acrylate (PCM), at the following ratio of components, wt parts: epoxide diane resin ED-20 - 100 triethylene tetramine (TETA) - 10-15 phosphorus-containing methyl acrylate (PCM) - 30-40.

EFFECT: reduced viscosity of a filling compound, its higher viability, improved elasticity after hardening, preservation of dielectric properties.

1 tbl

FIELD: chemistry.

SUBSTANCE: surface modified electrical insulation system, comprising a cured synthetic polymer composition including at least one filler and optional additives, wherein the surface of said synthetic polymer composition is modified by applying a thin coating; said thin coating being applied via plasma enhanced chemical vapour deposition (PECVD) with thickness within the range of about 50 nm to about 50 mcm; and/or said thin coating is applied via a sol-gel technique with thickness within the range of about 0.5 mcm to about 2 mm; and wherein said thin coat is an electrically non-conducting polymeric material with melting point which is considerably higher than the melting point or degradation temperature of the synthetic filler containing polymer composition; and a method of making said electrical system involving formation of a hardened or cured synthetic polymer composition, applying a thin coating on the surface of said synthetic polymer composition via plasma enhanced chemical vapour deposition.

EFFECT: improved system.

18 cl, 2 ex, 4 tbl

FIELD: electricity.

SUBSTANCE: housing has inner layer and outer layer. Thickness of inner layer is at least by 50% more than thickness of outer layer, and inner layer is more flexible than outer layer. Inner layer is made from composition of the first resin which at hardening has relative elongation at rupture which is more than 5%, and outer layer is made from composition of the second resin which at hardening has relative elongation at rupture which is less than 5%.

EFFECT: improving insulation and strength properties of electric item, and profitability of its manufacture.

14 cl, 2 dwg

FIELD: electricity.

SUBSTANCE: invention is attributed to electric engineering in particular to hot hardening epoxy electrical embedment compounds intended for electrical insulation and strengthening of units and blocks of high-voltage devices, inductors, metal-loaded transformers, for sealing and protection of electronic equipment against moisture and mechanical impacts. Composition for electrical embedment compound contains (in mass p.): epoxy-diane resin - 60-70, triglycidyl ester of trimethylolpropane - 15-20, monoglycidiyl ester of alkyl phenol - 10-20, isomethyltetrahydrophthalic anhydride - 90-95, 2,4,6 tris(dimethylaminomethyl)fenol 0.8-1.0, quartz powder - 400-500. Due to small temperature coefficient of linear expansion, high volume electric resistance and mechanical strength, it is recommended to use offered compound for high-voltage devices containing dissimilar materials.

EFFECT: creation of electrical embedment compound with high values of specific insulation resistance, low dissipation factors of a dielectric and small temperature coefficient of linear expansion (TCLE).

1 tbl

FIELD: chemistry.

SUBSTANCE: invention relates to rubber composition, in particular, for obtaining tyres or half-finished products for tyres. Rubber composition consists of at least diene elastomer, enhancing filler, cross-linking system, epoxy resin - from more than 1 to less than 20 phr and amine hardening agent - from more than 1 to less than 15 phr. Amine hardening agent is selected from the group, consisting of p-xilylenediamine, 1,3-bis(aminomethyl)cyclohexane, 1,8-diaminooctane, 3,3′-diaminobenzidine and their mixtures. Enhancing filler contains soot, silica or their mixture.

EFFECT: invention makes it possible to provide high rigidity with low deformation without noticeable impairment of hysteresis.

11 cl, 2 tbl

FIELD: chemistry.

SUBSTANCE: invention relates to polyethylene terephthalate-based polymer compositions, which can be used in producing bottles, containers for different purposes, film articles and fibres. The polyethylene terephthalate-based polymer composition contains 3-10 wt % of polyhydroxyether with molecular weight of 25-35 thousand standard units.

EFFECT: invention increases melt flow index and lowers processing temperature, which reduces melt viscosity by 1,5-2,5 times and processing temperature by 20-25°C.

2 tbl, 7 ex

FIELD: chemistry.

SUBSTANCE: described is a binding agent, which contains a composition of epoxyvinylether resin, containing a compound of formula

100 wt. p., an accelerator NK-2 or OK-1 - 1-15 wt. p., isopropylbenzene hydroperoxide - 1-15 wt. p., manganese acetylacetonate - 1-2 wt. p., vanadium acetylacetonate - 0.015-0.020 wt. p. Also described is a polymer construction material, made from the claimed binding agent and reinforcing material.

EFFECT: obtaining the binding agent and based on it polymer construction material, which has reduced inflammability, reduced release of volatile toxic substances and increased index of inhabitation, with the preservation of strength characteristic.

14 cl, 1 tbl, 3 ex

FIELD: chemistry.

SUBSTANCE: invention relates to the field of creating highly-strong composite materials based on fibrous fillers and epoxy binding agents, which can be used in the aviation industry, machine-, shipbuilding and other fields of technology. A binding agent includes dianic epoxy resin, the hardener diaminodiphenylsulphone and a modifier, the latter is represented by a mixture of thermoplastic modifiers, consisting of polysulphone and polyetherimide in a ratio from 1:3 to 3:1, with the following ratio of components, wt.p.: dianic epoxy resin - 100, mixture of thermoplastic modifiers - 1-25, diaminodiphenylsulphone - 35-50.

EFFECT: increase of toughness, strength and thermal resistance of the binding agent.

2 tbl, 8 ex

FIELD: chemistry.

SUBSTANCE: invention relates to high-frequency composite dielectric materials used in antenna engineering and high-frequency transmission lines. The composite material comprises packed fluoroplast-4 powder with particle size of no more than 5 mcm, impregnated with binder. The binder used is epoxy resin with a curing agent. The epoxy resin is a product of condensation of epichlorohydrin and aniline in an alkaline medium, with viscosity of no more than 200 mPa·s, and the curing agent used has viscosity of no more than 40 mPa·s. Impregnation with binder is carried out under pressure and while evacuating the volume of the powder, followed by curing.

EFFECT: producing a dielectric material with low permittivity, low dielectric loss tangent and improved properties such as strength and modulus of elasticity in compression.

1 dwg, 1 tbl

Epoxy composition // 2542234

FIELD: chemistry.

SUBSTANCE: invention relates to the field of epoxy compositions, in particular fast hardening epoxy compositions, used as glues, and a binder for the production of composite materials. The epoxy composition includes, at least, one epoxy novolac resin, or epoxydiane resin, or their mixture, an aromatic amine hardener and a curing accelerator, as the latter, it contains urethane rubber of casting grades SKU PFL.

EFFECT: invention makes it possible to reduce the temperature of the composition hardening and accelerate the process of its curing.

2 tbl

FIELD: chemistry.

SUBSTANCE: invention relates to the field of epoxy compositions, in particular to fast hardening hot moulding epoxy compositions, used as a binder for the production of composite materials by methods of pultrusion, casting, autoclave moulding. A hot curing epoxy composition includes at least one epoxy resin or its mixtures with epoxy resins, an anhydride hardener and phosphonium salt as a catalyst, selected from the group of quaternary phosphonium salts of the general formula where R1R2R3 are butyl or phenyl radicals, R4 is an aliphatic radical, containing 2-14 carbon atoms, X-H, phthalimide, Br, COO-, P(R1R2R3)+, A--Cl-, Br-.

EFFECT: invention makes it possible to reduce the time of the composition hardening, increase its viability in storage.

2 tbl

Polymer composition // 2540084

FIELD: chemistry.

SUBSTANCE: polymer composition for polymer compositional materials contains oligocyanurate, hollow microspheres, additionally contains epoxy oligomer with viscosity less than 5 Pa·s at room temperature, with the following component ratio, wt %: oligocyanurate 20-60, epoxy oligomer 5-40, hollow microspheres 23-35. Polymer composition is additionally contains fibrous filler and/or disperse filler. Also claimed is product from polymer composition.

EFFECT: obtaining polymeric composition with increased viability at room temperature, which has higher compression strength, impact strength, work temperature.

13 cl, 3 tbl, 4 ex

FIELD: chemistry.

SUBSTANCE: method includes interaction of diatomic phenol, epichlorohydrin and chlorocyclophosphazene. As chlorocyclophosphazene used is hexachlorocyclotriphosphazene or its mixture with higher chlorocyclophosphazenes[NPCl2]n, where n=4-15. Synthesis is carried out by direct interaction of said reagents in presence of bases. Diphenol is taken in quantity from 2 to 120 moles per NPCl2 unit, and epichlorohydrin is taken in not less than 2-fold excess with respect to diphenol.

EFFECT: elaboration of simple and technological method of synthesis of epoxyphosphazenes, characterised by high content of epoxy groups and easily compatible with industrial epoxy resins of ED type with application of available resources.

3 cl, 7 ex

FIELD: chemistry.

SUBSTANCE: invention relates to cyanic ester-based polymer compositions which are reinforced with fibrous filler and are used for producing structural polymer composite materials with operating temperature of up to 200°C and articles from said materials which can be used in aviation, aerospace, motorcar, ship-building and other industries. The invention also relates to prepregs which include said polymer composition and articles made from said prepregs. The cyanic ester-based polymer composition contains epoxy resin, which is a modifier and selected from: epoxy diane resin, epoxy novolac resin, nitrogen-containing epoxy resin or mixtures thereof, wherein components of the composition are in the following ratio, wt %: cyanic ester 55-95, epoxy resin 5-45. The composition can further contain a solvent selected from: acetone, ethyl acetate, isopropyl alcohol or mixtures thereof. The prepreg includes the described polymer composition and fibrous filler, wherein components of the prepreg are in the following ratio, wt %: polymer composition 30.0-50.0, fibrous filler 50.0-70.0. The fibrous filler used in the prepreg can be fabric or bundles or strips based on carbon or glass fibre. An article is made from said prepreg by moulding.

EFFECT: low viscosity of the cyanic ester-based polymer composition when processing and homogeneity of the composition, which enables processing thereof via a prepreg technique and enables to obtain water-resistant articles from polymer composite materials with improved thermomechanical properties, low coefficient of variation of physical and mechanical properties, well retained strength properties at high temperatures (up to 200°C), and reduced shrinkage of the composition during processing.

5 cl, 3 tbl, 12 ex

FIELD: chemistry.

SUBSTANCE: invention refers to bitumens, particularly bituminous-polymer compositions used in industry and/or road construction. Producing a bitumen/polymer composition uses a mother solution free from mineral oil, containing at least one herbal and/or animal oil, copolymer 20 to 50 wt % based on conjugated diene units and aromatic monovinyl hydrocarbon units, in relation to the mother solution weight, containing or free from at least one cross-linking agent, wherein the above herbal and/or animal oil is an acid; an acid value measured according to NF EN ISO 660 standard makes from 50 to 300 mg potassium hydroxide/g.

EFFECT: this mother solution characterised by the very high concentration of the polymer is stable and does not gelatinise that enables dissolving and using it for producing the cross-linked bitumen/polymer compositions and then bitumen mixtures.

15 cl, 2 tbl

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