Method for preparation of polyimide surface for chemical metal coating

FIELD: manufacturing technology.

SUBSTANCE: invention relates to methods for production of flexible printed circuit boards, connection cables, trains, microcircuits. Method for preparation of polyimide surface for chemical deposition of copper coating is disclosed, which involves polyimide etching with aqueous solution of alkali, containing 150–250 g/l of NaOH or KOH, at temperature of 60±2 °C during 5–15 minutes with subsequent activation with water solutions of silver nitrate of composition 3–5 g/l for 10–15 minutes at room temperature.

EFFECT: proposed technology of chemical application of conductive coating is easier, more efficient and chemically and environmentally safer than known level of equipment.

1 cl, 7 ex



Same patents:

FIELD: electricity.

SUBSTANCE: relief is applied onto thermoplastic material on two opposite sides, one of which is mirror reflection of the shaped profile. Separate parts of die mould in combination with free masks are used as provision of required stiffness when performing operations of cleaning, activation of surface of base and application of conductors. This invention allows creating electronic and electrotechnical products with high operating properties.

EFFECT: creation of manufacturing method of relief printed-circuit board on maximum thin and flexible insulation base, which has considerably smaller weight and dimensions in comparison to conventional relief printed-circuit boards.

5 cl, 5 dwg

FIELD: electricity.

SUBSTANCE: method of laser application of metal coatings and conductors onto dielectrics consists in arrangement of the dielectric surface onto the solution surface, focusing of the laser radiation at the dielectric - solution interface and scanning with laser radiation onto the dielectric surface, at the same time the solution includes photoactive heterometal metal-organic complexes in amount of 0.005-0.1 g per 10 g and with the controlled ratio of metals in their composition, and scanning onto the dielectric surface is carried out with a helium-cadmium laser.

EFFECT: higher accuracy of the specified path width and control of the metal coating composition.

6 cl, 3 dwg, 3 ex

FIELD: electricity.

SUBSTANCE: manufacturing method of Josephson current switch-limiter (JCSL) involves vacuum application of thin granular carbon film on dielectric substrate by means of CVD deposition method by using hydrocarbon gases, such as acetylene, methane and others, as well as their mixture, as raw material for CVD. Deposition is performed in vacuum at temperatures of 700 - 1300°C till thickness of film is equal to 500 - 5000 Е, and metal contacts are applied on film surface. Device with active element on JCSL basis includes active JCSL element, hermetically sealed reed relay, constant magnet, key with trigger mechanism, which are connected according to the scheme excluding formation of electric arc when JCSL is switched.

EFFECT: improving manufacturability of carbon film of JCSL, increasing critical currents and reducing the time of relaxation to initial state after switching.

4 cl, 2 dwg

FIELD: electrical engineering.

SUBSTANCE: method of microstrip SHF integrated chips manufacture includes electrolytic application of protective layer from gold onto barrier sublayer of multilayer strips of integrated chips from nickel in phosphate electrolyte of gilding with platinum anodes, which contains the following components in 1l of distilled water: potassium dicyano-1-aurate, K[Au(CN)2], - 8...12 g/l (in terms of Au); monosubstituted ammonia phosphate, (NH4)2HPO4 3H2O, - 8...12 g/l; twice-substituted ammonia phosphate, (NH4)2HPO4, - 40...80 g/l; tallium nitrate, T1 NO3, -0.005...0.015 g/l, with acidity of pH=5.2...5.6 at current density of DK=0.3...0.4 A/dm2 and temperature of t=68±2°C.

EFFECT: reduction of energy losses in microstrip SHF integrated chips down to 1,1...1,2 dB/m and higher reliability of their operation.

FIELD: manufacturing of electronic equipment; printed circuit boards.

SUBSTANCE: method for manufacturing of printed circuit boards includes the following operations: drilling holes in a dielectric workpiece, its surface preparation and metal deposition on its dielectric base and hole surfaces performed by vapour decomposing of metal carbonyls of the first group, e.g., such as Cu2(CO)6, CuCO, Cu(CO)2, Cu(CO)3 and others of said group, according to their chemical properties, at 1·10-1 mm of mercury column in vacuum. Alternatively the process is carried out in hydrogen, nitrogen or argon when said gases are used as carrier gases and are transferred from an evaporator to a reactor wherein workpieces of printed circuit boards are placed. Moreover, the process of metal deposition on the dielectric base and hole surfaces is carried out sequentially in response to computer commands and according to the printed circuit pattern: source metal carbonyl of the first group, being heated up to a required temperature, evaporates under pressure via cartridge nozzles of a supplying head, the vapour is transferred and supplied to the workpieces of printed circuit boards heated to a temperature whereat the vapour thermally dissociates, then adsorption-desorption reactions, nucleation and metal deposition to a required thickness take place on the surface of printed circuit boards workpieces with the result that a pattern of the printed circuit board appears on its dielectric workpiece. Another proposed alternate method for making a printed circuit board includes the following operations: drilling holes in a dielectric workpiece, its surface preparation whereby metal deposition on its dielectric base and hole surfaces is performed in a laser-type reproducing device whereon metal particles are electrically attracted, and said metal particles are electrically charged by means of a laser beam in response to computer commands and according to the printed circuit pattern.

EFFECT: reduction of the terms of manufacturing of printed circuit boards, manufacturing cost saving.

5 cl

FIELD: various branches of microelectronics and manufacture of printed circuit boards, in particular, manufacture of multilayer printed circuit boards.

SUBSTANCE: a current-conducting pattern of the electric circuit is formed on the dielectric base in succession by the method of photolithography with production of a layer of metalloresist, the dielectric base is punched and through holes are obtained on the preset sections, and a metal-containing coating is applied by the galvanic method. After that the layer of the current-conducting coating is protected, and the coating is removed from the non-sanctioned sections corresponding to the photolithographic circuit by the method of chemical pickling. Finally the lands are fused. Solutions of cuprous chloride are used as the pickling agent for chemical pickling, and a tin-bismuth alloy obtained from electrolyte based on the salts of thin and bismuth is used as an unremoved layer of metalloresist with a brightener by galvanic method at a current density of 1 to 6 A/ EKOMET-L 6 is used as the brightener.

EFFECT: developed method for manufacture of the printed circuit board characterized by a high accuracy of reproduction of the electric circuit pattern providing a high adhesion of the layer of metalloresist to the substrate, lands and to the walls of the punched holes of the printed circuit board preserving the ability of soldering by a tin-containing alloy during a long period of time (about 6 months).

2 cl, 2 ex, 1 tbl

FIELD: radio-electronics, possible use for manufacturing electronic boards used for making radio-electronic equipment.

SUBSTANCE: method includes subsequent application onto metallic plate with pass apertures of two-layered dielectric cover, consisting of aluminum oxide (copper oxide) and chromium oxide, and two-layered electro-conductive metallic cover, consisting of copper and nickel. Oxide-aluminum and oxide-copper covers are produced in galvanic manner, while oxide-chromium and electro-conductive metallic covers are produced from gas phase by thermal decomposition of metal-organic compounds.

EFFECT: possible production of electronic boards which are good for soldering and have stable technical characteristics, also having value of penetration voltage 560≤U≤600 Volts and with specific electric resistance ρ≥1·1012 Ohm·cm.

3 ex

FIELD: tool-making industry, possible use in technology for manufacturing relief circuit boards.

SUBSTANCE: method uses filling of porous structure of substrate of circuit board by acryl polymers, while aforementioned filling is performed prior to performing operation of forming of metallic conductors in grooves. Method makes it possible to increase production of valid circuit boards, to increase resistance level of isolation between disconnected circuits and to realize technology for manufacturing circuit boards of high precision class.

EFFECT: increased reliability and moisture resistance of relief circuit boards.

4 ex, 1 tbl

Electronic board // 2267872

FIELD: electronic industry, mainly, production of electronic circuit boards.

SUBSTANCE: result is achieved because conductive drawing of circuit board is made using solder.

EFFECT: lower laboriousness and simplified manufacturing process for circuit boards, decreased waste products output, possible recycling of board after end of lifespan.

FIELD: electric engineering.

SUBSTANCE: in making method, under increased pressure in reservoir, melted down solder through aperture is applied to board, and in erasing method, under decreased pressure solder is sucked back into reservoir, while reservoir is moved along board surface in accordance to drawing, and devices for making and erasing circuit boards have reservoir with aperture, heater and pump connected to reservoir.

EFFECT: lower laboriousness, simplified construction, lower costs, higher efficiency, higher durability.

4 cl, 1 dwg

FIELD: process engineering.

SUBSTANCE: invention relates to powder metallurgy and may be used to increase thermal stability of titanium hydride powder. Proposed method consists in making diffusion barrier coating on surface of titanium hydride powder particles applied from solution that contains, in g/l: copper sulphate 15-35, sodium-potassium tartrate 60-170, sodium hydroxide 15-50, sodium carbonate 3-35, formalin 6-16, sodium thiosuplhate 0.003-0.001, nickel chloride 2-3. Titanium hydride powder is filled with fresh solution, mixed by magnetic mixer, filtered, rinsed and dried.

EFFECT: 60%-increase in thermal decomposition temperature, reduced hydrogen release rate.

3 dwg, 1 tbl

FIELD: construction.

SUBSTANCE: method includes application of chemically pure copper onto the surface of a steel reinforcement rod and manufacturing of reinforced concrete structures containing chemically pure copper introduced into the area of power contact of a reinforcement rod with concrete, besides, application of the chemically pure copper is carried out by electrodeless plating from a solution of a copper-containing salt.

EFFECT: simplified technological process, higher strength properties of a reinforced concrete structure due to a metal lubricant, increased production safety.

6 cl

FIELD: metallurgy.

SUBSTANCE: solution contains, wt %: copper sulphate 5-10, sulphuric acid 8-10, ethylene-diamine-tetra-acetic acid and/or its sodium salts 0.01-6 and water - the rest.

EFFECT: strong adhesion of coating to wire, increased density and uniformity of coating, reduced porosity, and increased applicability of solution for copper coating during 60-70 days.

1 tbl, 1 ex

FIELD: process engineering.

SUBSTANCE: invention relates to metal-working and can be used in metallurgy, machine building and other industrial branches for processing wire, strips, tubes and other various-section products. Proposed method comprises, prior to applying copper from copper-containing solutions, coppering and processing products after coppering. Note here that at least a part of product processing process, prior to coppering, is performed by at least single vacuum-arc processing of a product-cathode, and at least with the help of electrode-anode. Note here that said vacuum-arc processing is performed in conditions of product cleaning without oxidising its surface in conditions of cleaning with oxidising at least a part of product surface, while blue copperas solution represents copper-containing solution.

EFFECT: perfected production of coppered metal, higher efficiency and coppered products transfer rate, higher quality of cleaning.

5 cl, 4 dwg

FIELD: technological processes.

SUBSTANCE: invention is related to technology for production of metalised woven and nonwoven materials, and may be used for production of catalysts, and also for production of decorative and finishing materials. Method includes previous chemical activation of coated material surface, using as activator glyoxal acid and/or oxalic acid. Then chemical metallisation is carried out, which is realised from solution containing bluestone. Stabiliser used is tetraethylene glycol, and reducer - glyoxal. Sodium hydroxide is used in solution to maintain required acidity.

EFFECT: invention provides for production of metalised dispersed woven and nonwoven materials using simplified technology, with simultaneous cheapening and provision of production safety due to use of proposed ingredients and their certain ratio.

2 ex

FIELD: technological process.

SUBSTANCE: invention is related to methods of copper coating of plastics, in particular, polymer composition materials on the basis of carbon fibers and may be used in manufacture of furniture fittings, household appliances and utensils, in automobile and radio industries. Method includes preparation of polymer composition material surface - cleaning, degreasing, immersion and soaking of polymer composition material for 40 - 60 minutes in acid solution of electrolyte with the following composition, g/l: copper sulfate 195 - 235, concentrated sulfuric acid 50 - 60, sodium chloride 0.07 - 0.15 and electrochemical depositing of copper in the same electrolyte at temperature of 20 - 24°C, current density of 5.0 - 6.0 A/dm2 for 5-10 minutes, pH of electrolyte - 1.

EFFECT: allows to increase purity of productivity, to simplify copper coating process, to increase environmental safety and economic efficiency of production.

2 dwg, 2 tbl, 13 ex

FIELD: application of metallic coatings, possibly chemical deposition of composition type copper coatings onto steel parts that may be used in electric, chemical industry branches, in machine engineering.

SUBSTANCE: solution contains copper sulfate, sodium potassium tartrate, sodium sulfate, sodium hydroxide, Formalin, Aerosil and 20% aqueous solution of polyacrylamide at next relation of ingredients (g/l): copper sulfate, 4 - 5; sodium potassium tartrate, 20 - 22; sodium sulfate, 15 - 16; sodium hydroxide, 10 - 12; Formalin, 20 -24; Aerosil, 0.2 - 0.3; 20% aqueous solution of polyacrylamide, 0.5 - 3.

EFFECT: improved wear resistance, corrosion resistance in sea atmosphere due to increased thickness of coating, lowered friction factor.

1 ex, 2 tbl

FIELD: application of metallic; chemical copper plating of metal and dielectric parts, mechanical rubber goods in particular.

SUBSTANCE: proposed aqueous solution contains, g/l: copper sulfate, 4-5; potassium sodium tartrate (Rochelle salt), 20-22; sodium sulfate, 15-16; sodium hydroxide, 10-12; polyvinyl pyrrolidone, 2-3; ammonium benzoate, 0.05-0.1; formalin, 20-22.

EFFECT: enhanced elasticity of copper coat; enhanced adhesion with surface to be coated; increased rate of reaction.

2 tbl, 1 ex

The invention relates to the field of applying metal coatings, in particular, compositions of the solutions for the contact copper coating of refractory metals such as zirconium and its alloys, and can be used for applying technological Podlaski when drawing

FIELD: application of metallic; chemical copper plating of metal and dielectric parts, mechanical rubber goods in particular.

SUBSTANCE: proposed aqueous solution contains, g/l: copper sulfate, 4-5; potassium sodium tartrate (Rochelle salt), 20-22; sodium sulfate, 15-16; sodium hydroxide, 10-12; polyvinyl pyrrolidone, 2-3; ammonium benzoate, 0.05-0.1; formalin, 20-22.

EFFECT: enhanced elasticity of copper coat; enhanced adhesion with surface to be coated; increased rate of reaction.

2 tbl, 1 ex