High-frequency composite dielectric

FIELD: chemistry.

SUBSTANCE: invention relates to high-frequency composite dielectric materials used in antenna engineering and high-frequency transmission lines. The composite material comprises packed fluoroplast-4 powder with particle size of no more than 5 mcm, impregnated with binder. The binder used is epoxy resin with a curing agent. The epoxy resin is a product of condensation of epichlorohydrin and aniline in an alkaline medium, with viscosity of no more than 200 mPa·s, and the curing agent used has viscosity of no more than 40 mPa·s. Impregnation with binder is carried out under pressure and while evacuating the volume of the powder, followed by curing.

EFFECT: producing a dielectric material with low permittivity, low dielectric loss tangent and improved properties such as strength and modulus of elasticity in compression.

1 dwg, 1 tbl

 

The invention relates to high frequency dielectric materials based on the composition of fluoroplast-4 in powder form, where the average particle size of the powder is not more than 5 μm, and an epoxy resin (condensation product of epichlorohydrin and aniline in an alkaline environment) and can be used in the manufacture of the antenna insulators and insulators devices, analiziruemykh frequency energy.

All dielectric materials-analogues of the claimed composition are divided into groups using one -, two prevailing characteristics. So, polystyrene, polyethylene, Teflon-3, Teflon-4 possess at frequencies over 1 MHz low permittivity ε=2.1 and 2.5 and a small value of tangent of dielectric loss angle tgδ=0.0002 to 0.001 (see "Electrical engineering materials", Gotman, E., Moscow, Energia 1969, p. 170-189). However, these materials are not constructive, i.e. cannot be used for the manufacture of components operating at high mechanical loads and high temperatures. To another group of dielectric materials-analogs include materials having good mechanical properties (tensile strength from 8090 to 5000 kg/cm2), but with insufficient electrical parameters (ε=4.5 to 8, tgδ=0.01 to 0.05) and a large water absorption (0.2 to 0.5 mass%). This materials - AG-4, the different glass Maro� SCM-1, STEF, STAT (see "Electrical engineering materials", Gotman, E., Moscow, Energia, 1969, pp. 163-164, 205 to 220).

As the closest analogue (prototype) of the present invention are selected material KF-9 - composition based on organosilicon resin modified PTFE and mineral fillers. The material used for the manufacture of parts and products electronic destination (see "Handbook of Aviation materials", volume 7, part 1, Moscow, Auntie-1976, p. 305).

Table 1 shows the characteristics of the materials-analogues of the material of the prototype and the proposed material KMD (composite dielectric material).

The table shows that the proposed material KMD has electrical parameters (ε and tgδ) at the level of the best options dielectric - PTFE-4, and the mechanical parameters at the level of the composition of AG-4 and exceeds the parameters of the material-prototype - KF-9 on electrical parameters on the compressive strength and, importantly, on water absorption. This allows the use of the proposed material KMD for the manufacture of parts and products employed in circuits of high-frequency signals under mechanical loads and in water, for example, in an airtight comparenode and connectors.

The present invention is durable�Xia establishment of a dielectric material, having electric characteristics with a low dielectric constant at 2.1-2.5 and a low value of dielectric loss tangent of 0.001, as for example, Teflon-4, and the best mechanical and climatic characteristics, selected as a prototype of press material KF-9 strength and modulus of elasticity in compression.

The problem is solved in that the following components were used:

powder PTFE-4 (polytetrafluorethylen) with an average grain size 5 μm under the trademark "TOMFLON" (ultrafine powder of PTFE with a mass fraction of moisture not more than 0.02%, a specific gravity of 2.2 g/cm3the melting point is 250°C). The binder used in the composition is not more than 30-40%,

- binder composed of:

epoxy resin with a viscosity of 200 MPa·sec and a curing agent with a viscosity of 40 MPa·sec. As such a curing agent were used material From MTHFA (isomethyltetrahydrophthalic anhydrite) is easily crystallizing soluble liquid. The quantitative ratio of the components is expressed in mass units. The ratio of the mass of 40-45% and 55-60%.

- binder in the composition is not more than 30-40%.

For the implementation of the task developed a method of making the inventive material using the apparatus shown�CSOs in Fig. 1,

where the notation:

1 - cylindrical shape for powder;

2 - in the form of powder;

3, a cylindrical shape for the binder;

4 - binder;

5 - shape piston POS.3;

6 - shape, where a vacuum is created.

To implement the manufacture of the inventive material, we used the following technological processes.

1. Preparatory operations

1.1 Sieved powder of PTFE;

1.2 Sifted powder is heated to a temperature of 90°C and held for three hours;

1.3 stage filling of cylindrical shape sifted 1 powder 2 with simultaneous vibration of form and further degassing forms a seal for the powder (see Fig 1). The evacuation process lasts at least 20 minutes;

1.4 heating Is of the form 1 with compacted powder 2 to a temperature of 90°C for at least two hours, followed by heating to a temperature of 70°C and aged for 15 minutes;

1.5 is Prepared binder material epoxy resin with a viscosity of 200 MPa·sec and a curing agent with a viscosity of 40 MPa·sec. The ratio of the mass of 40-45% and 55-60%. Is blended in a separate container selected epoxy resin and hardener for at least 15 minutes.

2. Impregnation

2.1 user fills in top shape with powder 2 prepared by impregnating composition 4;

22 is a vacuum Created 6 from the form of powder 1. A discharge is not less than minus 1 ATM;

2.3 mechanical pressure is Created in the connecting material 4, for example, the yoke on the piston 5;

2.4 controlled impregnation process by darkening the color of the powder in the form 2.

3. Curing

3.1 Shape with impregnated throughout the volume of the powder 1 is heated to a temperature of 90°C and held for at least three hours;

3.2 Pre-utverjdena composition "powder - impregnated" placed in an oven with a temperature of 160-170°C for 7 hours to finish curing;

3.3 The sample material on a lathe cut ends.

The thus obtained substance has characteristics and properties that allow its continued use as an insulating material in the manufacture of insulators in high frequency products.

High-frequency composite dielectric made of the cured composite material containing a compacted powder of the PTFE-4 with a particle size of not more than 5 μm, impregnated, taken in an amount of 30-40% and containing 40-45% of epoxy resin is the condensation product of epichlorohydrin and aniline in an alkaline medium, with a viscosity of 200 MPa·sec and 55-60% of curing agent with a viscosity of 40 MPa·sec.



 

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