Printed circuit board

FIELD: electricity.

SUBSTANCE: printed circuit board comprises a dielectric base (1) with contact sites (3) on the first side, connected by through metallised transition holes (5) with metallised sections (4) on the second side. At the same time each contact site (3) is connected with the specified transition holes (5) not more than with one metallised section, at the same time areas of the metallised sections (4) are in direct proportion to quantity of contact sites (3), with which they are accordingly connected electrically.

EFFECT: provision of even heat removal from contact sites of a printed circuit board with preservation of possibility of their electric connection.

8 cl, 3 dwg

 

The technical field.

The invention relates to the fields of electrical engineering and radio engineering, and in particular to electronic equipment. Declare printed Board is used to connect electronic components according to the circuit diagram in units of radio-electronic devices, mainly in the led lamps.

The prior art.

Among the printed circuit boards are known, for example, a printed circuit Board containing the base on both sides of which are made conductive drawings. All required electrical connections of the two sides are connected mainly through metallized holes. (A. Medvedev of the PCB. Structures and materials", Moscow: Technosphere, 2005, page 23 [1]).

The disadvantage of this analogue of [1] is that when using conductors conductive pattern not only for the transmission of electrical signals, but also for heat transfer, and if these conductors are of different size, but must dissipate the same amount of heat is uneven heat from the conductors of a conductive pattern. This is when using the PCB leads to overheating of conductors and mounted on them electronic components, and reduces the reliability of the PCB, and products in which it is included.

Also the well-known printed circuit Board, containing dielectric base, the first and second sides of the conductors and pads. Pads two sides are electrically connected by metallized holes (EV Pirogov "Design and technology of printed circuit boards", Moscow: FORUM: INFRA-M, 2005, p.153-155 [2]).

The specified analogue of [2] also suffers from a lack of previous similar [1]. The specified printed circuit Board [2] is the set of essential characteristics of the closest device to the same destination to the claimed invention, Therefore, it is adopted as the prototype of the claimed invention.

Disclosure of the invention.

Technical problem on which the invention is directed, is to increase the reliability of the PCB.

The technical result provided by the claimed invention is to provide uniform heat dissipation from the contact pads of the PCB while maintaining the possibility of their electrical connections.

The essence of the invention lies in the fact that the card is printed contains a dielectric substrate with contact pads on the first side connected through metallized vias with metallized areas on the second side. Each contact pad connected to the specified transient resp what NSTEMI not more than one metallic plot this area is directly proportional to the number of connected pads.

Metallic parts are preferably occupy the maximum possible area of the second side of the PCB.

The dielectric base may be made rigid. When this dielectric base is preferably made of textolite.

The dielectric base can be made flexible.

Two metallized area electrically mainly connected each with one contact pad, and the other metallic parts are connected each with two pads.

Two metallized area can be electrically connected each with two pads, and other metallic parts are connected each with four pads.

On the first and second Board surface is preferably deposited solder mask.

A brief description of the drawings.

The figure 1 shows the scheme of the first side of the printed circuit Board, figure 2 - scheme of the second side of the printed circuit Board according to example 3, figure 3 - the second side of the printed circuit Board according to example 4.

The implementation of the invention.

Card printing (1, 2) represents a dielectric base (1)on the first side of which is made of printed conductors (2) and pads (3), and the and the second side is made metallized areas (4).

The dielectric base (1) is a dielectric plate, and ability to perceive the printing technology. The dielectric base (1) may be made rigid or flexible. Rigid dielectric base (1) is made preferably of the PCB. The topology of the printed conductors (2) and pads (3) on the first side of the base (1) and the topology of the metallized areas (4) on the second side of the base (1) are printed drawings of the PCB.

Printed conductors (2) are paths of conductive material deposited on the first side of the dielectric base (1) with known methods of PCB Assembly. The conductive material of the printed conductors (2) preferably is copper. Printed conductors (2) are provided for supplying a supply voltage to the electronic components, mainly the LEDs mounted on the first side of the PCB.

Pads (3) performed on the first side of the dielectric base (1) and represent the areas of the printed conductors, intended for the connection of the conclusions of electronic components, mainly LEDs. Thus one contact pad (3) is used to attach a single output electronic component.

Through metallized vias (5) electrically connecting the contact pad (3) on the first side of the base (1) with metallized areas (4) on the second side of the base (1). The orifices (5) are used for transmitting electrical signals and heat from the pads (3) on metallized areas (4). One contact pad (3) can be connected to these vias not more than one metallic area (4). But one metallized area (4) can be connected to multiple pads (3).

Metallized areas (4) on the second side of the base (1) perform conductive and heat functions. Each metallized area (4) made in the form of electrically closed areas, predominantly polygonal. Metallized areas (4) occupy as much of the surface of the second side of the dielectric base (1). Preferably metallized areas (4) so that they take up the maximum possible area of the second side of the PCB. Area (4) is directly proportional to the number of connected pads (3). Examples of implementation of the PCB with the specified characteristic is described below.

To protect the conductive drawings of the first and second sides of the printed PLA is s, on both the surface solder mask. Solder mask is a heat-resistant insulating coating, such as enamel coating or a coating with a dry film photoresist. When this solder mask on the first side of the pads (3)) is white, as this increases the reflectivity of the PCB.

Examples of specific performance.

Example 1. Printed circuit Board contains six metallized areas (4), each of which is electrically connected to two pads (3) two pairs of through-plated vias (5). When this area of the metallized areas (4) relate to each other as 2:2:2:2:2:2, that is, the area of the metallized areas (4) are equal.

Example 2. Printed circuit Board contains twelve metallized areas (4), each of which is electrically connected with four pads (3) four pairs of through-plated vias (5). When this area of the metallized areas (4) relate to each other as 4:4:...:4, i.e. the area of the metallized areas (4) are equal.

Example 3. Printed circuit Board contains twenty-four metallized area (4) (figure 2). When you do this:

- first and twenty-fourth metallic parts (4) electrically soy is inany each with one contact pad (3) a pair of through-plated vias (5);

each of the metallized areas (4) from the second to the twenty-third electrically connected to two pads (3) two pairs of through-plated vias (5).

When this area of the metallized areas (4) relate to each other as 1:2:2:...:2:2:1. That is:

square first and twenty-fourth metallized areas (4) are equal;

square each of the metallized areas (4) from the second to the twenty-third are equal to each other;

- the area of the second metallized area (4) is two times larger than the area of the first metallized area (4).

Example 4. Printed circuit Board contains twelve metallized areas (4) (figure 3). When you do this:

- first and twelfth metallized areas (4) are electrically connected each with two pads (3) two pairs of through-plated vias (5);

each of the metallized areas (4) from the second to the eleventh electrically connected with four pads (3) four pairs of through-plated vias (5).

When this area of the metallized areas (4) relate to each other as 2:4:4:...:4:4:2. That is:

- area of the first and twelfth metallized areas (4) are equal;

square each IU is alizirovannaya sections (4) from the second to the eleventh equal to each other;

- the area of the second metallized area (4) is two times larger than the area of the first metallized area (4).

The implementation of the structural elements of the claimed invention is not limited to the above examples. The job description.

The use of the inventive printed circuit Board is that its contact pads (3) you solder the same type of electronic components, mainly the LEDs. Then, the obtained printing unit is installed in the host electronic equipment, mainly in the case of led lamps. The installation of the printhead mainly produce so that the metallized areas (4) mechanical contact with elements of the host electronic equipment designed to provide heat dissipation from the circuit Board.

During operation of the printhead heat from the legs of electronic components is transferred to the contact areas (3). Then through plated-through vias (5) heat is transferred to the metallic parts (4). As the parts (4) occupy a large part of the area of the second side of the base (1), the heat from these areas (4) will move with maximum speed. Because the land area (4) is directly proportional to the number of connected pads (3), and electronic components which are the same type, the heat from the metallized areas (4) is uniform. The maximum dissipation rate, combined with the uniformity of this process ensures efficient heat dissipation provided by the inventive circuit Board.

Thus, from the foregoing that in the inventive printed circuit Board of the claimed technical result: "ensuring uniform heat dissipation from the contact pads of the PCB while maintaining the possibility of electrical connection is achieved due to the fact that the card is printed contains a dielectric substrate with contact pads on the first side connected through metallized vias with metallized areas on the second side. Each contact pad connected to these vias not more than one metallic area, the area of the metallized areas relate to each other as the number of pads, with which they are respectively electrically connected.

Industrial applicability.

The inventors constructed a prototype of the declared card printing, tests confirmed the achievement of the technical result.

Declare printed Board is implemented with the use of industrially produced devices and m is materials, can be made at the electrical company and will find wide application in electronics and instrumentation.

Sources of information

1. A. Medvedev of the PCB. Structures and materials", Moscow: Technosphere, publ. 2005

2. EV Pirogov "Design and technology of printed circuit boards", Moscow: FORUM: INFRA-M, publ. 2005

1. Card printed, containing dielectric substrate with contact pads on the first side connected through metallized vias with metallized areas on the second side, wherein each contact pad connected to these vias not more than one metallic area, this area is directly proportional to the number of connected pads.

2. Fee according to claim 1, characterized in that the metallized areas occupy the maximum possible area of the second side of the PCB.

3. Fee according to claim 1, characterized in that the dielectric base is made hard.

4. Fee according to claim 3, characterized in that the dielectric base is made of textolite.

5. Fee according to claim 1, characterized in that the dielectric base is made flexible.

6. Fee according to claim 1, characterized in that the two metallized area electric which are connected each with one contact pad, and other metallic parts are connected each with two pads.

7. Fee according to claim 1, characterized in that the two metal land electrically connected each with two pads, and other metallic parts are connected each with four pads.

8. Fee according to claim 1, characterized in that on its first and second surface of the deposited solder mask.



 

Same patents:

FIELD: physics.

SUBSTANCE: method involves making holes in a substrate by moving the focal spot of focused laser radiation and plating said holes. The laser radiation is in form of a cone with a focal spot at its vertex. The focal spot is moved vertically downwards from the upper surface of the board to the lower surface of the board, under which, before piercing, a substrate of electroconductive material which reflects laser radiation is placed. Reflected laser radiation is used when piercing. The holes are then plated via electric gas discharge by applying voltage with one pole to the substrate and another pole to a ring which encircles the laser radiation and which is placed over the printed-circuit board.

EFFECT: simple and faster process of plating laser-pierced holes in a printed-circuit board.

1 dwg

FIELD: electricity.

SUBSTANCE: method involves the following: prior to application of electroplated conductive copper coating to the fibre-glass plastic surface and to inner surface of bypass openings there applied is thin silver coating with thickness of 24 mcm using the chemical method, silver salts, protected with polymer film or photoresist material; pattern of electroconductive scheme is formed, and after creation of electroconductive paths and electroplated metal coating of inner surface of bypass openings the protective polymer coating is removed and thin metal coating is etched from the sections not protected with metal resistive coating.

EFFECT: elimination of activation of fiber-glass plastic surface and holes using expensive palladium chloride; and elimination of power loss, especially at low currents, due to big difference in electric resistance of silver and palladium.

FIELD: chemistry.

SUBSTANCE: method for metal coating holes in multilayer printed-circuit boards involves deoiling and pickling the workpiece, treating said workpiece in a silver solution based on potassium ferrocyanide and potassium rhodanate, sensitisation in a tin chloride solution, activation in a palladium chloride solution, chemical copper plating, galvanic copper plating and thermodiffusion treatment in an argon medium while raising temperature in steps. Galvanic copper plating in pyrophosphate electrolyte at temperature of about 40C and raising temperature in steps during thermodiffusion treatment in an argon medium are carried out in the following modes: (400.1)C for 64930 s; (410.1)C for 41956 s; (420.1)C for 528 s; (430.1)C for 260 s; (440.1)C for 97 s; (450.1)C for 52 s; (460.1)C for 33 s; (470.1)C for 16 s; (480.1)C for 10 s; (490s1)C for 7 s.

EFFECT: high reliability of interlayer connections in multilayer printed-circuit boards, shorter cycle for making printed-circuit boards and reduced labour input of the process.

The invention relates to the field of microelectronics, in particular to devices printed circuit boards

The invention relates to the field of electrical engineering, in particular to methods of applying metal coating on the substrate with a polymeric surfaces in the manufacture of printed circuit boards with tiny holes and fine structure
The invention relates to the production of electronic equipment, namely the technology of printed circuit boards

The invention relates to the manufacture of multilayer printed circuit boards, in particular to the preparation for metallization of through conical holes

Bulk pcb // 2173945
The invention relates to the field of microelectronics, in particular to devices printed circuit boards

The invention relates to electrical engineering, radio engineering, electronics and microwave technique, in particular metal oxide PCB, and can be used in the manufacture of metal oxide printed circuit boards using the metal base circuit Board as a ground bus

FIELD: physics.

SUBSTANCE: in the method of assembling microelectronic components, once a position fixing polymer (4), in order to maintain alignment of microelectronic components (2) that are assembled on a substrate (1) using an anisotropic electroconductive film (7), is applied onto the substrate and hardened, the microelectronic components (2) are heated to a predetermined temperature and compressed at a predetermined pressure using a flexible sheet (5) provided on the microelectronic components and then subjected to single-step compressive fixation on the substrate (1).

EFFECT: providing a method of assembling microelectronic components which, when using an anisotropic electroconductive film to assemble a plurality of microelectronic components of different height on a base plate, allows assembling at precise positions on the base plate, thereby preventing position shift which results from compressive fixation.

5 cl, 16 dwg

FIELD: electronic engineering.

SUBSTANCE: present invention relates in substance to shell-type discrete electronic components, containing, for example, electronic power supply circuit, shell or case in the form of parallelepiped and contact pins connected inside shell with the above circuit and protruding out of shell for electric connection with printed-circuit board (PCB). Shell contains heat-dissipating front section having at least one surface outside shell and lying in plane; specified contact pins protrude from shell so that their first section lies in parallel to the above plane. Flat-topped is preferred in a couple of contact pins located after the first section parallel to plane as such bend will allow more stable mounting of component in process of its soldering on heat-dissipating intermediate pad.

EFFECT: creation of discrete electronic component, which structural and functional performance provide its easy, fast and simple mounting at supporting pad for further installation with other components at PCB.

9 cl, 6 dwg

FIELD: electricity.

SUBSTANCE: invention may be used for surface installation of electronic components with ball leads by flip-chip method and particularly for installation of electronic component with ball lead matrix. Installation method of electronic components with ball leads provides for application of flip-chip method including ball leads positioning, fastening and connection to printed circuit card mounting surface contacts, which are mechanically and electrically connected with plated-through holes by soldering. Prior to positioning, printed circuit card is turned over, with its mounting surface directed downwards, ball leads of electronic component being placed under plated-thought holes contacts, with the said special orientation of printed circuit card preserved for the time of all operation execution.

EFFECT: production of reliable high-quality soldered connection during surface installation of electronic components.

4 cl, 4 dwg

FIELD: electrotechnics.

SUBSTANCE: invention is related to the method, according to which semiconductor elements, forming the part of electronic circuit or at least some of its components, of integration to the plate-base, for example to the printing board in the process of its production. The effect of the invention is achieved by making through-holes in the plate-base for semiconductor components, together with that these holes move between the first and the second surfaces of the plate-base. After creating these holes on the second surface structure plate-base one lays on the plastic foil, which covers the through-holes for semiconducting elements from the side of the second surface structure plates-base. Before hardening of he plastic foil or after its partial hardening the semiconductor elements are cut in from the side of the first surface. Semiconductor elements are pressed down to the plastic foil after that they are being glued to it. After that the final hardening of the plastic foil is carried out.

EFFECT: creation of the method, by which packageless microcircuit are inbuilt safely and economically to the plate-base.

24 cl, 23 dwg

FIELD: engineering of flexible multilayer electronic boards (loops) for assembly of microelectronic equipment.

SUBSTANCE: in accordance to the invention, as substrate material, polyimide, polyether and fluoroplastic films are used. Polyimide film substrates make it possible to achieve high thermal stability of loops and allow usage of different methods of assembly, including welding and soldering, and fluoroplastic films are most usable for making loops based on them for assembly of UHF circuits, due to low losses in UHF frequency range and possible constant wave resistance of loops which connect UHF modules and devices. Structure and placement of contact areas, meant for assembly of electronic components or connection of loop to other devices or electronic boards, and also materials and covers, used for forming aforementioned contact areas, must also provide for high density inter-cell connection in electronic equipment. To that end, contact areas are positioned on the other side of flexible substrate and connected to working conductors via through metallized apertures in the substrate. External sides of contact areas are tin-plated, for example, covered in layer of tin-bismuth alloy, onto the surface of contact areas which is adjacent to substrate, a layer of material is applied to prevent spreading of soldering alloy, chromium for example, and connection of contact areas of loop to contacts of electronic devices is realized by welding-soldering using double electrode tool for micro-mounting, brought to contact with the other surface of contact area via through aperture in the film positioned above the contact area.

EFFECT: manufacture of flexible electronic board, wherein the gap between adjacent conductors does not exceed 20 micrometers, making it possible to ensure placement density of components and contact areas for assembly thereof, approaching contact placement density of modern VLSI circuits.

2 cl, 2 tbl, 2 ex

The invention relates to a card with a chip contact area, the region has suffered a conductive varnish, and the varnish can be painted

The invention relates to electrical engineering and can be used in electronics, instrumentation

The invention relates to electrical and radio engineering, in particular to methods, devices, and types of electrical and electronic connections

FIELD: electricity.

SUBSTANCE: composite printed-circuit board includes at least two printed-circuit boards (1) electrically and mechanically connected to each other by means of substrate (2) that is fixed on surfaces of adjacent printed-circuit boards (1) and includes electrical conductors (6) electrically connected to input contact platforms (4) of printed-circuit boards (1). With that, substrate (2) is stiff and rigidly attached to printed-circuit boards (1) by soldering.

EFFECT: improving stiffness and strength of a mechanical connection of printed-circuit boards to each other at provision of reliable electric connection between them.

5 cl, 5 dwg

Up!