Production plant for material deposition and electrode for use in it

FIELD: electricity.

SUBSTANCE: bearing substrate has the first end and the second end located at the distance from each other. A contact seat is arranged on each end of the bearing substrate. The production plant comprises a body, which forms a chamber. At least one electrode is arranged as stretching through the body, besides, this electrode is at least partially arranged inside the chamber for connection with the contact seat. The electrode has outer surface that has an area of contact, which is adapted for contact with the contact seat. An outer coating is arranged on the outer surface of the electrode, outside the contact area. The outer coating has electric conductivity, at least, 9×106 Siemens/metre and corrosion resistance higher than of silver in the row of electrode potentials, which is based on using marine water of room temperature as electrolyte.

EFFECT: slower clogging of an electrode and its increased service life.

28 cl, 5 dwg

 

Related applications

[0001] This application claims priority to and all advantages of a preliminary application for U.S. patent No. 61/044687, which was filed on April 14, 2008.

The scope of the invention

[0002] This invention relates to a production installation. In particular, this invention relates to electrode used inside the production plant.

Background of the invention

[0003] Production plant for the deposition of material on the carrier substrate known in the art. Such production units include a housing that forms a chamber. Typically, the carrier substrate is almost U-shaped and has spaced apart first end and a second end. Usually at each end of the carrier substrate is a contact socket. Usually inside the chamber there are two or more electrode for receiving a corresponding pin socket located respectively at the first end and the second end of the carrier substrate. The electrode also includes a contact area, which supports the contact socket and, eventually, a carrier substrate, to prevent movement of the carrier substrate relative to the housing. The contact area is a part of the electrode adapted to be in direct contact with the contact socket and especiauy the main current path from the electrode to the contact socket and the carrier substrate.

[0004] With the electrode connected to the power source to supply electric current carrier substrate. The electric current heats both the electrode and the carrier substrate. The electrode and the supporting substrate each has a certain temperature, and the temperature of the supporting substrate is heated to the deposition temperature. The treated carrier substrate is formed by deposition of material on the carrier substrate.

[0005] As is known in the art, there are variations in the shape of the electrode and the contact socket to accommodate thermal expansion precipitated on the carrier substrate material by heating the carrier substrate prior to deposition temperature. One such method involves the use of an electrode with a flat head and a contact socket in the form of graphite slide block. Graphite slide block acts as a bridge between the carrier substrate and the electrode with a flat head. The weight of the carrier substrate and graphite slide block acting on the contact area, reduces the contact resistance between the graphite slide block and the electrode with a flat head. Another such method involves the use of electrodes of two parts. The electrode of the two parts includes a first half and second half of the compression of the contact socket. With the first half and the second half of the electrode is C two parts is connected to the spring element to provide power for compression of the contact socket. Another such method involves the use of forming a glass electrode contact area, located inside of this Cup. Pin receptacle adapted to sit in a glass electrode and to contact with a contact area located inside of the glass electrode. Alternatively, the electrode may form a contact area on its outer surface without obrazovaniya of the glass and the pin can be made in the form of a cap that sits on top of the electrode for contact with a contact area located on the outer surface of the electrode.

[0006] On the outer surface of the electrode outside the contact area on the part of the electrode, which is located inside the chamber, is the obliteration of the electrode due to sediment accumulation. Deposits over time lead to improper landing between the contact socket and the electrode. Improper landing causes a small electrical arc between the contact area and the contact socket, resulting in the contamination of a metal material deposited on the carrier substrate. Contamination of the metal reduces the value of the carrier substrate as deposited material is less pure. In addition, the occlusion reduces the heat transfer between the electrode and the contact socket, resulting in the electrode reaches a higher temp the temperature for effective heating of the contact socket and in the end, the carrier substrate. The higher the temperature of the electrode lead to rapid deposition of material on the electrode. This is especially true in the case of electrodes that contain silver or copper as the sole or primary present in the metal.

[0007] in Addition, the obliteration of the electrode occurs on the outer surface of the electrode, on the part of the outer surface, which is located outside the chamber. This overgrowth is different from the type of vegetation that occurs on the part of the electrode, which is located inside the chamber, which results used for deposition of material. Covering the outer surface of the electrode, which is located outside the cell, can be caused by manufacturing conditions in a non-production installation, or may simply be caused by oxidation due to exposure to the air electrode. This is especially true in the case of electrodes that contain silver or copper as the sole or primary present in the metal.

[0008] the Electrode must be replaced when one or more of the following conditions: first, when the contamination of the material deposited on the carrier substrate, exceeds a threshold level; secondly, when covering the outer surface of the electrode in the chamber causes the deterioration of the connection between the electrode and the contact socket; and thirdly, when you need too big operating temperature of the electrode due to the deposition of material on the electrode. The electrode has a life determined by the number of load-bearing substrate, the electrode can handle before something happens to one of the above.

[0009] In connection with the above-mentioned problems related to occlusion of the electrode, there remains a need for at least slowing the overgrowth of the electrode to improve the performance of the electrode and thereby increase the useful life of the electrode.

The invention and advantages

[0010] the present invention relates to a production plant for deposition of material on the carrier substrate and the electrode for use in such manufacturing facility. The carrier substrate is located at a distance from each other, the first end and the second end. At each end of the carrier substrate is a contact socket.

[0011] Production unit includes a housing that forms a chamber. Through the housing formed inlet for introducing gas into the chamber. Also formed through the housing issue for the discharge of gas from the chamber. At least one electrode is passing through the body, and this electrode is at least partially located inside the chamber for connection with the contact socket. E is ectad has an external surface, having a contact area, which is adapted to contact with the contact socket. On the outer surface of the electrode, outside the contact area, is the outer covering. The outer coating has a conductivity of at least 9×106Siemens/meter and corrosion resistance greater than that of silver in the range of electrode potentials, which is based on the use of sea water at room temperature as the electrolyte. With the electrode connected to the power source to supply electric current to the electrode.

[0012] There are many advantages of regulation type and location of the external coating on the outer surface of the electrode. One advantage is that it is possible to slow down the spread of the electrode by the selection of the external coating on the outer surface of the electrode in its various fields with different materials depending on the source of eutrophication. By slowing down the overgrown extended service life of the electrode, which leads to lower production costs and reduce the length of the production of the processed load-bearing substrates. In addition, considerations of electrical conductivity are less important outside the contact area on the outer surface compared to the area inside the contact area, thereby providing the ability to use external ocrite outside the contact area, the greater number of options in relation to the type of metal, which can be included in it.

Brief description of drawings

[0013] Other advantages of this invention will be easily appreciated, and will be best understood by reference to the following detailed description when considered together with the attached drawings, on which:

[0014] Figure 1 is a view in section of a production plant for the deposition of material on the carrier substrate;

[0015] Figure 2 is a view in perspective of the electrode used with the production installation according to Figure 1;

[0016] Figure 3 is a view in cross section of the electrode on the Figure 2, is made along the line 3-3 on Figure 2;

[0017] Figure 4 is a view in cross section of the electrode on the Figure 3, showing the external coating on its outer surface;

[0018] Figure 4A is a view in cross section of the electrode on the Figure 3 with a part connected to the circulation system;

[0019] Figure 5 is a view in cross section of the production installation according to Figure 1 during the deposition of material on the carrier substrate.

Detailed description of the invention

[0020] Referring to the Figures, in which similar numbers indicate similar or corresponding parts in the several views, a production unit 20 for the deposition of material 22 on the carrier substrate 24 shown in Figures 1 and 5. In one embodiment, the implementation is subject to deposition of material 22 which is silicon; however, it should be understood that the production unit 20 can be used for deposition on the carrier substrate 24 other materials without departing from the scope of the proposed invention.

[0021] Typically, the methods of chemical vapor deposition known in the art, such as the way Siemens, carrier substrate 24 is made almost U-shaped and has a first end 54 and second end 56 spaced and parallel to each other. Each of the first end 54 and second end 56 of the carrier substrate 24 is pin 57.

[0022] Production unit 20 includes a housing 28, which forms the chamber 30. Typically, the housing 28 includes an inner cylinder 32, the outer cylinder 34 and the plate base 36. The inner cylinder 32 includes an open end 38 and the closed end 40 spaced from each other. The outer cylinder 34 is located around the inner cylinder 32, forming a cavity 42 between the inner cylinder 32 and the outer cylinder 34, typically serves as the shirt containing a circulating coolant (not shown). Experts in the art should understand that the cavity 42 may be a traditional shirt vessel, jacket with reflectors or shirt from polutropos, but not limited to.

[0023] the Plate base 36 is located at the open end 38 of the inner cylinder 32, forming chamber 30. Plate base 36 includes a seal (not shown)located in alignment with the inner cylinder 32 to seal the chamber 30 when the inner cylinder 32 is located on the plate-the base 36. In one embodiment, the implementation of the production unit 20 is a reactor of a chemical vapor deposition type Siemens.

[0024] the Housing 28 forms an inlet 44 for introducing gas 45 in the chamber 30 and 46 for discharge of the gas 45 from the chamber 30. Typically, the inlet pipe 48 is connected to the inlet 44 to the gas supply 45 in the housing 28 and the outlet pipe 50 is connected with the release of 46 for removing gas 45 from the housing 28. The outlet 50 may be enclosed in a shirt with a cooling liquid, such as water or a commercially available heat transfer fluid.

[0025] At least one electrode 52 is passing through the housing 28 for connection with the contact socket 57. In one embodiment, the implementation of this at least one electrode 52 includes a first electrode 52 located through the housing 28, to receive the pin 57 of the first end 54 of the carrier substrate 24, and the second electrode 52 located through the housing 28, to receive the pin 57 of the second end 56 of the carrier substrate 24. It should be understood that the electrode 52 may be any type of electrode, it is known the in the art, such as, for example, an electrode with a flat head, the electrode of the two parts or electrode with glass. In addition, this at least one electrode 52 is at least partially located inside the chamber 30. In one implementation, the electrode 52 is passing through the plate base 36.

[0026] the Electrode 52 contains a conductive material having a minimum electrical conductivity at room temperature of at least 14×106Siemens/meter or Cm/m for Example, the electrode 52 may include at least one material from copper, silver, Nickel, Inconel and gold, each of which satisfies the above parameters conductivity. In addition, the electrode 52 may contain an alloy that satisfies the above parameters conductivity. Typically, the electrode 52 contains a conductive material having a minimum electrical conductivity at room temperature of about 58×106Cm/m Typically, the electrode 52 contains copper, and copper is typically present in an amount of about 100% by weight based on the weight of the electrode 52. Copper can be oxygen-free electrolytic copper grade UNS 10100.

[0027] Referring also to Figures 2 and 3, the electrode 52 has an outer surface 60. The outer surface 60 of the electrode 52 has an area of 80 contact. In particular, the area 80 of the contact, as defined here, is the hour of the completion of the external surface 60 of the electrode 52, which is adapted to be in direct contact with the contact socket 57 and which provides the main current path from the electrode 52 to the contact socket 57 and the carrier substrate 24. As such, during normal operation of the production plant 20 region 80 of the contact is shielded from material 22, which is then precipitated onto the carrier substrate 24. Since the area 80 of the contact is adapted to be in direct contact with the contact socket 57 and usually not exposed to material 22 in the process of deposition on the carrier substrate 24 to 80 contact apply a different design considerations than to other parts of the electrode 52, and these considerations are described in more detail below.

[0028] In one implementation, the electrode 52 includes a shaft 58 having a first end 61 and second end 62. When he is, the shaft 58 also forms the outer surface 60 of the electrode 52. Usually, the first end 61 is the open end of the electrode 52. In one embodiment, the implementation of the stem 58 has a circular cross-sectional shape that leads to the trunk in the form of a cylinder, which forms the diameter D1. However, it should be understood that the shaft 58 may have a rectangular, triangular or elliptical cross-sectional shape without departing from the scope of the proposed invention.

[0029] the Electrode 52 may also is a member in the cylinder 72, located on one of the ends 61, 62 of the shaft 58. It should be understood that the cylinder 72 may be integral with the barrel 58. Usually, when the cylinder 72 has a head 72 also forms the outer surface 60 that has an area of 80 contact. Experts in the art should understand that the method of connection of the contact slot 57 with the electrode 52 may vary depending on the application without departing from the scope of the proposed invention. For example, in one implementation, such as in the case of electrodes with flat head (not shown), the contact area may be only the upper, flat surface on the head 72 of the electrode 52, and the pin 57 may form a hood pin socket (not shown), which sits on the head 72 of the electrode 52 for contact with the contact area. Alternatively, although not shown, the head 72 may be missing at the ends 61, 62 of the shaft 58. In this implementation, the electrode 52 may form a contact area on the outer surface 60 of the shaft 58, and the pin 57 may be made in the form of a cap, which sits on the shaft 58 of the electrode 52 for contact with the area of 80 contact located on the outer surface 60 of the shaft 58.

[0030] In another implementation, as shown in Figures 2-4, the electrode 52 forms a glass of 81 for receiving the contact socket 57. When the electrode abrezaet glass 81, region 80 of the contact is on the inside part of the glass 81. Pin 57 and a glass 81 can be designed so that the pin 57 can be removed from the electrode 52 when the carrier substrate 24 is pulled out of the production plant 20. Usually, the head 72 forms a diameter of D2that is larger than the diameter D1shaft 58. Plate base 36 forms a hole (not shown) for receiving the shaft 58 of the electrode 52, so that the head 72 of the electrode 52 remains inside the chamber 30 to seal the chamber 30. It should be understood that the cylinder 72 may be integral with the barrel 58.

[0031] On the outer surface 60 of the electrode 52 may be located first thread 84. Again referring to Figures 1 and 5, around the electrode 52 is typically a dielectric sleeve 86 to isolate the electrode 52. The dielectric sleeve 86 may contain ceramics. On the first thread 84 is nut 88 for clamping the dielectric sleeve 86 between the plate base 36 and a nut 88 to attach the electrode 52 to the housing 28. It should be understood that the electrode 52 can be attached to the housing 28 in other ways, such as, for example, with flange, without departing from the scope of the proposed invention.

[0032] Again referring to Figures 2 through 4, generally at least one of the shaft 58 and the head 72 includes an inner surface 62, obrazuyuyutsya 64. The inner surface 62 includes a contact end 94 located at a distance from the first end 61 of the stem 58. Contact end 94 is generally flat and parallel to the first end 61 of the electrode 52. It should be understood that can be used and other configurations of the contact end 94, such as a configuration in the form of a cone, the configuration in the form of an ellipse or a configuration in the shape of an inverted cone (none of which are shown). The channel 64 has a length L that extends from the first end 61 of the electrode to the contact end 94. It should be understood that the contact end 94 may be located inside the barrel 58 of the electrode 52, or contact end 94 may be located inside the head 72 of the electrode, if it is there, without departing from the scope of the proposed invention.

[0033] Again referring to Figures 1 and 5, production unit 20 additionally includes a source 96 power supply connected to the electrode 52 for supplying electric current to the electrode 52. Usually, an electric wire or cable 97 connects the source 96 power supply electrode 52. In one embodiment, the implementation of the electric wire 97 is connected to the electrode 52 by passing electrical wires 97 between the first thread 84 and a nut 88. It should be understood that the connection of the electric wire 97 with the electrode 52 can be implemented is the means.

[0034] the Electrode 52 has a temperature that varies with the passage through it of an electric current, which leads to heating of the electrode 52 and thereby setting the operating temperature of the electrode. This heat is known to specialists in this field of technology as dzhoulevo heat. In particular, the electric current passes through the electrode 52, the pin through the slot 57 and the carrier substrate 24, which leads to jouleva heat carrier substrate 24. In addition, dzhoulevo heat carrier substrate 24 leads to radiation/convection heating chamber 30. The passage of electric current through the carrier substrate 24 sets the operating temperature of the supporting substrate 24.

[0035] Referring to Figure 4A and again to Figures 1 and 5, production unit 20 may also include a circulation system 98 that is located within the channel 64 of the electrode 52. When available, the circulation system 98 may be at least partially located within the channel 64. It should be understood that part of the circulating system 98 may be located outside of the channel 64. On the inner surface 62 of the electrode 52 may be located a second thread 99 for connecting the circulation system 98 with the electrode 52. However, specialists in the art should understand that the connection of the circulation system 98 with the electrode can be the used and other methods of fastening, such as the use of flanges or couplings.

[0036] the Circulation system 98 includes a cooler in flow communication with the channel 64 of the electrode 52 to reduce the temperature of the electrode 52. In one embodiment, the implementation of the cooler is water; however, it should be understood that the cooling fluid can be any fluid that is designed to reduce heat by circulation, without departing from the scope of the proposed invention. Moreover, the circulation system 98 also includes a hose 100 is connected between the electrode 52 and the reservoir (not shown). Referring only to Figure 4A, the hose 100 includes the inner pipe 101 and the outer tube 102. It should be understood that the inner tube 101 and the outer tube 102 can be integral with the hose 100, or, alternatively, the inner tube 101 and the outer tube 102 may be attached to the hose 100 using a coupling (not shown). The inner tube 101 is located within the channel 64 and extends most of the length L of the channel 64 for circulating coolant within the electrode 52.

[0037] the Coolant inside the coolant circulation system 98 is under pressure to push the coolant through the inner pipe 101 and the outer tube 102. Usually, the coolant leaves the inner tube 101 and forcibly confronted with the contact end 94 of the inner surface 62 e is ctrode 52, and then leaves the channel 64 through the outer tube 102 of the hose 100. It should be understood that it is also possible configuration change threads on the back so that the coolant enters the channel 64 through the outer tube 102, and leaves the channel 64 through the inner tube 101. Experts in the field of heat transfer should be understood that the configuration of the contact end 94 affects the rate of heat transfer due to surface area and proximity to the head 72 of the electrode 52. As indicated above, various geometrical contours of the contact end 94 lead to different coefficients of convective heat transfer at the same speed of circulation.

[0038] Referring to Figure 4, the electrode 52 includes an outer cover 106, located on its outer surface 60 out of 80 contact. In particular, the outer layer 106 is typically located on at least one of the head 72, out of the region of 80 contact, and the shaft 58 of the electrode 52. In other words, the outer layer 106 may be positioned on the head 72 out of 80 contact on the shaft 58, or on the head 72 out of 80 contact and the shaft 58. If it is on the shaft 58, the outer layer 106 may extend from the head 72 to the first thread 84 on the shaft 58. Exterior coating 106 has an electrical conductivity of at least 9×106Siemens/meter, more often at least 20, most often by men is her least 40, and corrosion resistance greater than that of silver in a series of electrical potentials, based on the use of sea water at room temperature as the electrolyte. Such experiments on determination of the number of electrode potentials is well known in the art. Due to less importance of the conductivity to the outer cover 106 than to the electrode 52, and since the outer covering 106 is not intended to be in contact with the carrier substrate 24 in the deposition process for coating 106 can be used over a wide range of materials than those that can be used for parts of the electrode 52, which are not intended to be in contact with the carrier substrate 24. In addition, because the requirements for conductivity to the outer surface 106 satisfies a wider range of materials than to the parts of the electrode 52, which are intended to be in contact with the contact socket 57, can be selected from materials that are more resistant to corrosion and, therefore, grow more slowly than the materials used for the electrode 52. Slower growth provides benefits to increase the service life of the electrode 52.

[0039] a Special type of material used for the exterior coating 106 may depend on the specific location is ogene outer cover 106. For example, the source of corrosion and, therefore, revegetation may be different depending on the specific location of the outer cover 106. When the outer covering 106 is located on the outer surface 60 of the head 72 out of 80 contact, the outer layer 106 is located inside the chamber 30 and, thus, exposed to material 22, which is used for deposition on the carrier substrate 24. Under such circumstances, for the outer cover 106 may be desirable to provide corrosion resistance in a chloride environment in the process of polycrystalline silicon and additional collateral resistance to chemical attack by chlorination and/or sililirovanie as a result of exposure of the material 22, which is used during the deposition process. Suitable metals that can be used for exterior coating 106 on the head 72 of the electrode 52 out of 80 contact include gold, platinum and palladium. Typically, the outer layer 106 contains gold due to the excellent combination of electrical conductivity and resistance to corrosion from various sources. Exterior coating 106 may include other metals, with the proviso that at least one element made of gold, platinum and palladium is included in the outer cover 106. For example, in one embodiment, the external covered the e 106 may optionally include at least one item of silver, Nickel and chromium, such as an alloy of Nickel/silver. Typically, the outer layer 106 includes almost only gold, platinum and/or palladium. However, when one or more of the other metals are present, the total number of gold, platinum and palladium is usually at least 50% by weight calculated on the total weight of the outer cover 106. When the outer covering 106 is located on the outer surface 60 of the shaft 58, the outer layer 106 may include the same or other metals from those included in the external coating 106 on the head 72 out of 80 contact. In one embodiment, the implementation of the external coating 106 on the shaft 58 includes a different material from the outer surface 60 of the head 72, thereby allowing you to choose the exterior coating 106 on the shaft 58, is resistant to corrosion from other sources than the cause corrosion on the outer surface 60 of the head 72. In another variant of realization of the shaft 58 may not have a cover, located on its outer surface 60. In yet another embodiment, one implementation of the external surface 60 of the head may not have a coating, and the outer covering 106 is located only on the outer surface 60 of the shaft 58.

[0040] the External coating 106 typically has a thickness of from 0,0254 mm to 0,254 mm, more often from 0,0508 mm to 0,254 mm, and most often from 0.127 mm to 0,254 mm

[0041] the Electrode 52 may be covered in other places other than the outer surface 60, to extend the service life of the electrode 52. Referring to Figures 2 through 4, on the inner surface 62 of the electrode 52 may be positioned on the floor 104 of the channel to maintain conductivity between the electrode 52 and the cooler. In General, the coating 104 of the channel has a greater resistance to corrosion, which is caused by the interaction of the cooler with the inner surface 62, as compared with the corrosion resistance of the electrode 52. The floor 104 of the channel typically includes a metal that resists corrosion and which inhibits the accumulation of sediments. For example, the coating 104 of the channel may contain at least one element from silver, gold, Nickel, and chromium. Typically, the coating 104 of the channel is Nickel. The floor 104 of the channel has a thermal conductivity of from 70,3 to 427 W/m * K, more often from 70,3 to 405 W/m * K, and most often from 70,3 to 90,5 W/m∙K. the Coating 104 of the channel also has a thickness of from 0,0025 mm to 0.026 mm, more often from 0,0025 mm to 0,0127 mm, and most often from 0,0051 mm to 0,0127 mm

[0042] in Addition, it should be understood that the electrode 52 may also include preventing tarnish layer, located on the floor 104 of the channel. Preventing tarnish layer is a protective organic thin-film layer which is applied over the coating 104 of the channel. Protective systems, such as Tarniban™ firm Technic Inc., can be used after formation of the Oia cover 104 of the channel electrode 52, to reduce oxidation of the metal electrode 52 and the coating 104 of the channel without creating excessive thermal resistance. For example, in one implementation, the electrode 52 may contain silver, and the coating 104 of the channel may contain silver to prevent tarnish layer, present to provide improved resistance to the formation of deposits in comparison with pure silver. Typically, the electrode 52 contains copper, and the coating 104 of the channel contains Nickel to maximize heat conductivity and resistance to Deposit formation, preventing tarnish layer, located on the floor 104 of the channel.

[0043] without going into theory, slow healing, attributed to the presence of the coating 104 of the channel, extends the service life of the electrode 52. Increase service life of the electrode 52 reduces the cost of production, since the electrode 52 need to be replaced less frequently compared with the electrodes 52 without cover 104 of the channel. In addition, the duration of production by the deposition of material 22 on the carrier substrate 24 also decreases as the replacement of the electrodes 52 is less compared to the situation when using the electrodes 52 without cover 104 of the channel. The floor 104 of the channel leads to reduced downtime, production plant 20.

[0044] In one implementation, the electrode 52 includes a cover 110 about the Asti contact located in region 80 of the contact electrode 52. The floor 110 of the contact area typically contains a metal. For example, the floor 110 of the contact area may contain at least one element from silver, gold, Nickel, and chromium. Typically, the floor 110 of the contact area contains Nickel or silver. The floor 110 of the contact area has a thickness of from 0,00254 to 0,254 mm, more often from 0,00508 mm to 0.127 mm, and most often from 0,00508 0,0254 mm to mm range of special type of metal may depend on the chemical nature of the gas, thermal conditions near the electrode 52 due to the fact that the combined temperature of the supporting substrate 24, the current flowing through the electrode 52 of the electric current, flow of coolant and the coolant temperature can all influence the choice of metals used in various sections of the electrode. For example, when the outer covering 106 is located on the cylinder 72 out of 80 contact, the outer layer 106 may contain Nickel or chromium in connection with resistance to chlorination, while the use of silver to cover 110 of the contact area can be selected for resistance to sililirovanie in addition to the natural resistance to chloride exposure. In addition, since silver is more conductive than Nickel or chromium, silver may be the best choice to cover 110 of the contact area than Nickel or chrome, that is, the conductivity is less important outside the scope of 80 contact.

[0045] the Cover 110 of the contact area also provides improved electrical conductivity and minimizes accumulation of copper silicide inside the area 80 of the contact. The accumulation of copper silicide interfere with the proper fit between the contact socket 57 and region 80 of the contact, which can lead to pitting of the contact socket 57. Pitting corrosion causes a small electric arcs between a region 80 of the contact and the contact socket 57, resulting in the contamination of the metal product is polycrystalline silicon.

[0046] it Should be understood that in addition to the outer surface 106 of the electrode 52 may have at least one of the cover 104 of the channel and the cover 110 of the contact area in any combination. The floor 104 of the channel, the outer layer 106 and the floor 110 of the contact area can be formed by deposition (galvanothermy). However, it should be understood that each of these coatings can be formed in various ways without departing from the scope of the proposed invention. Also, experts in the field of production of semiconductor materials of high purity, such as polycrystalline silicon, need to understand that some processes involving the materials used are of the alloying use the s, for example, elements of group III and group-V (with the exception of nitrogen for the case of the production of polycrystalline silicon), and the choice of suitable coating can minimize potential contamination of the carrier substrate 24. For example, it is desirable that the area of the electrode, usually located inside the chamber 32, such as a floor 108 of the head and the floor 110 of the contact area, had minimal inclusion of boron and phosphorus in their respective electrode coating.

[0047] a Typical method of deposition material 22 on the carrier substrate 24 is discussed below with reference to Figure 5. The carrier substrate 24 is placed inside the chamber 30 so that the contact socket 57, located on the first end 54 and second end 56 of the carrier substrate 24, were located inside of the Cup 81 of the electrode 52, and the chamber 30 is pressurized. Electric current is passed from a source 96 of the power supply to the electrode 52. The temperature of deposition is calculated from subject to deposition of material 22. The working temperature of the supporting substrate 24 is increased by direct passage of electric current in the carrier substrate 24, so that the working temperature of the supporting substrate 24 is greater than the temperature of deposition. Gas 45 is injected into the chamber 30, as only the carrier substrate 24 reaches the deposition temperature. In one embodiment, the implementation of gas 45 is introduced into the chamber 30 contains haloids the Academy of Sciences, such as chlorosilane or bromelain. The gas may further comprise hydrogen. However, it should be understood that this invention is not limited to those present in the gas components and that the gas may contain other precursors to the deposition, in particular containing silicon molecules, such as silane, silicon tetrachloride and tribromsalan. In one embodiment, the implement carrier substrate 24 is a thin rod of silicon, and production unit 20 can be used for the deposition of silicon on it. In particular, in this embodiment, a gas composition generally includes trichlorosilane, and silicon precipitated on the carrier substrate 24 in thermal decomposition of trichlorosilane. The cooler is used to prevent reaching the operating temperature of the electrode 52 of the deposition temperature, to ensure the absence of deposition of silicon on the electrode 52. The material 22 uniformly precipitated on the carrier substrate 24 until, until you reach the desired diameter of the material 22 on the carrier substrate 24.

[0048] once the carrier substrate 24 is processed, the electric current is interrupted, so that the electrode 52 and the supporting substrate 24 is deprived of electric current. Gas 45 divert through 46 of the housing 28, and the carrier substrate 24 is allowed to cool. As soon as the working temperature of the treated carrier substrate 24 onisilos is, the treated carrier substrate 24 may be removed from the chamber 30. Processed carrier wafer 24 is then removed, and in the production plant 20 is placed a new carrier substrate 24.

[0049] Obviously, in light of the above indications of possible numerous modifications and variations of the present invention. The above invention has been described in accordance with the relevant requirements of the legislation; therefore, the description is in fact rather rough than restrictive. Variations and modifications of the disclosed embodiments may become apparent to experts in the art and are within the scope of the invention. Accordingly, the scope of legal protection provided by this invention, can be determined only by studying the following claims.

1. A production plant for the deposition of material on a carrier substrate having spaced apart first end and a second end, with the contact socket located on each end of the carrier substrate, and said apparatus comprises:
a housing forming a chamber;
an inlet formed through the said casing, for introducing gas into the chamber;
the issue formed through the said casing for the discharge of gas from the chamber;
at least one electrode having an external surface with the area of the contact, adapted to contact with the contact socket and the said electrode is passing through the said casing and the said electrode at least partially located inside the chamber for connection with the contact socket;
a power source connected to the said electrode for supplying electric current to the above-mentioned electrode; and
the external coating located on said outer surface of the above-mentioned electrode outside of said contact region, and referred to the external coating has a conductivity of at least 9·106Cm/m and corrosion resistance greater than that of silver in the range of electrode potentials, based on the use of sea water at room temperature as the electrolyte.

2. Production installation according to claim 1, with the above-mentioned electrode additionally includes:
the barrel having a first end and a second end; and
head, located on one of the above all of the above-mentioned trunk.

3. Production installation according to claim 2, in fact the head of the above-mentioned electrode forms mentioned outer surface having the above-mentioned contact area.

4. Production installation according to claim 3, these external coating is located on at least one of the mentioned head outside the mentioned area of the contact and the said barrel.

5. Production installation according to claim 4, these external coating located on said head beyond said contact area.

6. Production installation according to claim 5, these external coating is additionally located on said stem above-mentioned electrode, and referred to the external coating on said barrel includes a variety of metals with the said outer surface on said head.

7. Production installation according to claim 2, these trunk does not have coverage within its mentioned outer surface.

8. Production installation according to claim 2, with said head contains copper.

9. Production installation according to claim 2, in fact the head of the above-mentioned electrode at least partially located inside the chamber.

10. Production installation according to any preceding paragraph, these external coating contains at least one element made of gold, platinum and palladium.

11. Production installation according to claim 10, in fact the outer coating further comprises at least one element made of silver, Nickel and chromium.

12. Production installation according to claim 1, in fact the external coating has a thickness of from 0,0254 to 0,254 mm

13. Production installation according to any one of claims 1 to 9, while the UE is mentioned at least one electrode includes a first electrode for receiving pin socket at the first end of the carrier substrate and the second electrode for receiving pin socket on the second end of the carrier substrate.

14. Electrode for use with a production plant for deposition of material on the carrier substrate and the carrier substrate is located at a distance from each other, the first end and the second end, with the contact socket located on each end of the carrier substrate, and the above-mentioned electrode contains:
the barrel having a first end and a second end;
head, located on one of the above all mentioned shaft for connection with the contact socket;
these stem and said head have an external surface having a contact area, which is adapted to contact with the contact socket; and
the said electrode has an outer surface and an exterior coating located on said outer surface outside of said contact region, and referred to the external coating has a conductivity of at least 9·106Cm/m and corrosion resistance greater than that of silver in the range of electrode potentials, based on the use of sea water at room temperature as the electrolyte.

15. The electrode 14, while said head is integral with the said shaft.

16. The electrode 14, while the above-mentioned electrode forms a glass, and referred the contact area is located within the said Cup.

17. El is d 14, these external coating is located on at least one of the said head outside of said contact region and said barrel.

18. The electrode 17, thus referred to the external coating is located on said head beyond said contact area.

19. The electrode p, these trunk does not have coverage within its mentioned outer surface.

20. The electrode 14, thus referred to the head contains copper.

21. The electrode according to any one of p-20, these external coating contains at least one element made of gold, platinum and palladium.

22. The electrode according to item 21, these external coating additionally contains at least one element made of silver, Nickel and chromium.

23. The electrode 14, thus referred to the external coating has a thickness of from 0,0254 to 0,254 mm

24. Production installation according to claim 2, with said head contains copper and the said head is at least partially located inside the chamber.

25. Production installation according to claim 10, in fact the external coating has a thickness of from 0,0254 to 0,254 mm

26. Production installation according to claim 11, these external coating has a thickness of from 0,0254 to 0,254 mm

27. The electrode according to item 21, these external coating has a thickness of from 0,0254 to 0,254 mm

Bet on p.22, these external coating has a thickness of from 0,0254 to 0,254 mm



 

Same patents:

FIELD: electricity.

SUBSTANCE: bearing substrate has the first end and the second end located at the distance from each other. A contact seat is arranged on each end of the bearing substrate. The production plant comprises a body, which forms a chamber. At least one electrode is arranged as stretching through the body, besides, the electrode is at least partially arranged inside the chamber for connection with the contact seat. The electrode has outer surface that has an area of contact, which is adapted for contact with the contact seat. The contact area coating is arranged on the contact area of the outer surface of the electrode. The coating of the contact area has electric conductivity, at least, 9×106 Siemens/metre and corrosion resistance higher than of silver in the row of electrode potentials, which is based on using marine water of room temperature as electrolyte.

EFFECT: invention makes it possible to reduce problem of electrode clogging and to increase efficiency and service life of an electrode.

29 cl, 7 dwg

FIELD: metallurgy.

SUBSTANCE: invention is referred to metal powder industry, particularly, to devices for powders heating by direct electric current transmission during hot pressing. The invention may be used, for example, for hot pressing of diamond-containing segments for cutting wheels in graphite compression molds. The device contains electrode with current lead and, at least, one graphite multi-electrode unit installed on the above current lead. The surface area of the multi-electrode unit contacting with the upper surface of electrode is less than the area of the upper electrode surface. There are crossing grooves on the upper electrode surface where it contacts with the above graphite multi-electrode unit. The groove width makes free deformation possible under temperature loads of electrode surface sections being between grooves without joining. The groove depth is sufficient enough to maintain temperature equal to 0.3-0.5 from temperature measured at the electrode surface where it contacts with graphite multi-electrode unit. The grooves are implemented as parallel lines in two intercrossing directions or in the form of concentric rings and radial lines crossing the above rings.

EFFECT: improving electrode stability and increasing heating device life time.

4 cl, 5 dwg

FIELD: electric heating devices based on heating resistors, possible use as component in various heating devices.

SUBSTANCE: introduction of tubular posistor 2 into body 1 of heater makes isolation of posistor 2 from the body unnecessary, reducing thermal resistance between them.

EFFECT: increased productivity of heating devices due to faster heating, increased electric energy efficiency for same reason, possible placement inside heating device due to small dimensions.

1 dwg

FIELD: electrode system for glassmaking furnaces equipped with glassmaking pool.

SUBSTANCE: proposed electrode system has at least one electrode holder (9) located above melt surface (20) for introducing heating electrodes (7) from above through melt surface (20). Located between electrode holder (9) and heating electrode (7) is connecting unit (27) for coaxial electrical and water conducting connection of electrode holder (9) and heating electrode (7); electrode holder (9) is provided with guide (24) for cooling medium admitted to heating electrode (7). Connecting unit (27) has first carrier detachable threaded joint (8a) with coaxial external thread (28a) for screwing into electrode holder (9) and second carrier detachable threaded joint (8b) with coaxial internal thread (31) for screwing heating electrode (7); guide (24) for cooling medium consists of tube with clearance (26) surrounding it; they pass through threaded joints (8a, 8b) and through connecting unit (27).

EFFECT: enhanced compatibility and flexibility; possibility of re-equipping of electrode holder and heating electrode.

9 cl, 2 dwg, 1 ex

The invention relates to electrode industry, in particular to methods of management processes for graphite at the stage of the graphitization in the graphitization furnace direct heating

The invention relates to elektroapparatstroy, and in particular to apparatus and alternating current, mainly megaampere

FIELD: electricity.

SUBSTANCE: bearing substrate has the first end and the second end located at the distance from each other. A contact seat is arranged on each end of the bearing substrate. The production plant comprises a body, which forms a chamber. At least one electrode is arranged as stretching through the body, besides, the electrode is at least partially arranged inside the chamber for connection with the contact seat. The electrode has outer surface that has an area of contact, which is adapted for contact with the contact seat. The contact area coating is arranged on the contact area of the outer surface of the electrode. The coating of the contact area has electric conductivity, at least, 9×106 Siemens/metre and corrosion resistance higher than of silver in the row of electrode potentials, which is based on using marine water of room temperature as electrolyte.

EFFECT: invention makes it possible to reduce problem of electrode clogging and to increase efficiency and service life of an electrode.

29 cl, 7 dwg

FIELD: chemistry.

SUBSTANCE: invention relates to chemical industry and can be used in producing nanopowder by a plasma-chemical method. The composite nanopowder contains particles consisting of a core, which consists of layers of titanium carbonitride and titanium nitrate, and a cladding which consists of a layer of nickel, with the following ratio of layers of the core and cladding, wt %: TiCxNy, where 0.28≤x≤0.70; 0.27≤y≤0.63; - 24-66; TiN0.6 - 30-67; Ni - 4-9. The method involves feeding a precursor containing titanium nickelide and titanium carbide into a reactor-evaporator, treating in a current of nitrogen plasma at plasma flow rate of 60-100 m/s and at precursor feeding rate of 100-140 g/h, subsequent cooling in a current of nitrogen and trapping the evaporation product on a filter surface. The precursor contains said components in the following ratio TiNi:TiC=25-50:50-75.

EFFECT: obtaining nanocomposite powder which enables to obtain harder alloys.

2 cl, 3 dwg, 2 ex

FIELD: metallurgy.

SUBSTANCE: coatings are obtained from iridium or rhodium; thermal decomposition process is performed at the temperature of 250-450°C and pressure of 0.01-0.05 mm Hg, and as a precursor there used is hydride of iridium tetra-trifluorophosphine of formula HIr(PF3)4 or hydride of rhodium tetra-trifluorophosphine of formula HRh(PF3)4 respectively.

EFFECT: obtaining pore-free microcrystalline coatings with high adhesion to substrate material.

4 tbl, 1 ex

FIELD: chemistry.

SUBSTANCE: apparatus has a reaction chamber, a support means mounted in the reaction chamber for supporting the substrate to be processed, a gas source for feeding into the reaction chamber starting gas containing the element to be deposited, a catalyst wire lying opposite said substrate and made from tantalum wire with a tantalum boride layer which is formed on the surface of the tantalum wire before feeding the starting gas. Said apparatus also has a heat source for heating the catalyst wire in order to deposit onto the substrate decomposition products of the starting gas formed by catalysis or via a thermal decomposition reaction. Said apparatus further includes a control means for activating heating of the catalyst wire with the heat source through continuous supply of energy.

EFFECT: prolonging service life of the catalyst wire by reducing thermal expansion of the catalyst wire and increasing its mechanical strength.

2 cl, 4 dwg, 1 ex

FIELD: metallurgy.

SUBSTANCE: chamber includes a chamber frame. Insert panels are inserted into the frame mechanically detachably and tightly, besides, some of the insert panels carry functional elements. The chamber frame includes at least one main surface with cantilevers cut from a moulded solid metal panel. Cantilevers are bent in the field of attachment to the main surface so that they form chamber frame links. The side surface of the frame is formed from a solid metal part, in which a material with large surface is cut.

EFFECT: holes are produced for insert panels, where insert panels are installed, no welded joints are required.

11 cl, 10 dwg

FIELD: machine building.

SUBSTANCE: reactor comprises reaction chamber with inlet for feeding process gases therein and outlet for discharge of residual gases, and pump to force residual gases from reaction chamber via said outlet. Said pump produces and maintains pressure in reaction chamber equal to or lower than approx. 10 kPa (100 mbar). Besides, reactor comprises appliances to feed liquid diluents into pump to dilute harmful substances precipitated from residual gases on pump inner surfaces. Said appliances are composed of container for diluents communicated with pump delivery and discharge openings to make closed circuit for diluent circulation.

EFFECT: continuous operation.

2 cl, 1 dwg

FIELD: machine building.

SUBSTANCE: at least, first set of porous substrates is arranged in first reaction chamber. Note here that packs of porous substrates arranged along periphery of reaction chamber represent uncompacted porous substrates, partially compacted porous substrates of combination of both aforesaid substrates. One or several packs of partially compacted substrates are located at central part. at least, first set of porous substrate pack set is compacted by chemical infiltration of gas phase. Arrangement and alternation of uncompacted porous substrates and partially compacted substrates allow using thermal characteristics of partially compacted porous substrates for better distribution of heat flow in CVI-furnace chamber.

EFFECT: better quality of compaction, higher efficiency of process.

10 cl, 29 dwg, 4 tbl, 4 ex

FIELD: chemistry.

SUBSTANCE: the invention relates to production of polysilicon, in particular, to the reactor for chemical deposition of polysilicon from steam phase. = The reactor includes a support system fitted with supports for heating elements and the hull attached to the said support system, forming the deposition chamber. The device comprises at least one silicone heating element positioned in the chamber on the supports, and a power source connectable with both ends of the heating element through lead-ins in the support system, used to heat the heating element. The support system has a gas inlet connected with the silicon-containing gas source and a gas outlet. Furthermore, the heating element is U-shaped and has at least one tubular section with the outer diameter of at least 20 mm and the ratio of wall width to the outer diameter less than 1/4.

EFFECT: increased polysilicon production yield.

7 cl, 6 dwg

Heat source // 2439196

FIELD: power engineering.

SUBSTANCE: heat source (1) comprises a container (2) for an initial substance and a cavity (4). The container (2) for the initial substance is made as detachable with the possibility of attachment to the cover (6), having the first heating device (8) to heat the cover (6) so that heat due to heat conductivity is sent to the container (2) and further to the initial substance in the cavity (4). The cover (6) additionally comprises a heated supply channel (14), being in a liquid connection with the cavity (4), to supply the initial substance from the cavity (4) into the reactor so that between the container (2) for the initial substance and the reactor an increasing temperature gradient is achieved.

EFFECT: heat source provides for production of a temperature gradient that increases in direction to the reactor, which prevents condensation of the initial substance.

19 cl, 2 dwg

Coated articles // 2413746

FIELD: chemistry.

SUBSTANCE: invention relates to a method of coating articles made from valve metals which are used as component parts of turbomolecular pumps. An article made from a valve metal selected from aluminium, magnesium, titanium, niobium and/or zirconium and alloys thereof, is coated with an oxide ceramic layer formed from metal using a plasma-chemical method. The ceramic layer has a barrier inter-phase layer adjoining the metal, whose surface is coated with a polymer formed from monomers in form of dimers or halogenated dimers of general formula I where R1 denotes one or more hydrogens or halogens; each R2 denotes hydrogen or halogen; and each R3 denotes a xylylene residue with formation of a dimeric structure. Said monomers are incorporated into a capillary system and then polymerised on the surface of the oxide ceramic layer in a vacuum.

EFFECT: invention enables to obtain coatings with uniform surface porosity and high resistance to aggressive and corrosive media.

10 cl, 1 ex

FIELD: radio and electric engineering.

SUBSTANCE: method includes applying oxide dielectric film on heat-resistant board and making electric-conductive circuit imprint by photo-lithography method, after applying film, metallic film is applied with specific resistance ρ≤1 Ohm•sm with thickness 15-25 mcm, then protective, well-soldering, metal-resistant nickel or cobalt cover is applied with thickness 4-5 mcm, as dielectric oxide film chromium-oxide film of black color is used with thickness not less than 8 mcm with specific resistance ρ≥1x109 Ohm•sm. In certain cases of method realization, applying said dielectric oxide and then metallic with specific resistance ρ≤1 Ohm•sm and protective metal-resistant well-soldering films is performed on both sides of heat-resilient board and onto inner surface of technological apertures; as heat-resilient board titan or copper, or aluminum plates are used, as metallic cover with specific resistance ρ≤1 Ohm•sm copper or aluminum, or molybdenum are precipitated.

EFFECT: higher efficiency.

4 cl, 4 ex

FIELD: luminescent materials.

SUBSTANCE: nitride coating precursor, in particular aluminum-, gallium-, or tin-containing metalloorganic nitride, is charged into reaction vessel 10a filled with electroluminescent phosphor, e.g. ZuS-Cu, and surrounded by heating means 30a using nitrogen as inert gas carrier. Precursor is passed through pipeline 32 open all over its length. Co-reagent, e.g. anhydrous ammonia is fed into lower part of vessel 12a through porous glass disk 12a. When vessel 10a is heated to 150-225°C, nitride coating precipitates on phosphor particles being in fluidized state. Phosphor bearing nonoxide coating is characterized by high brightness after 100 h use at high humidity.

EFFECT: enabled large-scale manufacture of phosphors.

3 cl, 2 dwg

FIELD: microelectronics; methods of manufacture of microcircuit chips.

SUBSTANCE: the offered invention is pertaining to the field of microelectronics, in particular, to the methods of manufacture of microcircuit chips. The offered method includes a loading of semiconductor slices in a reactor having hot walls perpendicularly to a gas stream, pumping-out of the reactor air up to the ultimate vacuum, introduction of monosilane for deposition of layers of polycrystalline silicon, silane supply cutoff, pumping-out of the reactor air up to the ultimate vacuum, delivery of a noble gas into the reactor up to atmospheric air pressure, unloading of the semiconductor slices from the reactor. After introduction of the noble gas into the reactor conduct an additional thermal annealing of layers of polycrystalline silicon at the temperature of no less than 1323K, then keep the slices at this temperature during 40-60 minutes in a stream of noble gas and reduce the temperature down to the temperature of the polycrystalline silicon layers growth. The technical result of the invention is a decrease of heterogeneity of resistance of the polycrystalline silicon layers.

EFFECT: the invention ensures a decrease of heterogeneity of resistance of the polycrystalline silicon layers.

1 dwg, 2 tbl, 1 ex

FIELD: processes of chemical infiltration or chemical deposition from vapor phase, case hardening in furnace.

SUBSTANCE: method is used for monitoring process realized in furnace with use of gas reagent containing at least one gaseous hydrocarbon. Method comprises steps of adjusting working parameters of furnace; adding into furnace gas-reagent containing at least one gaseous hydrocarbon; discharging from furnace exhaust gases that contain by-products of gas-reagent reaction; washing out exhaust gases by means of oil that absorbs resins present in exhaust gases; receiving information related to process according to measured quantity of resins absorbed by oil. It is possible to change working parameters of furnace such as temperature, pressure in furnace, gas-reagent consumption and composition.

EFFECT: possibility for monitoring process in furnace without special apparatus of infiltration furnace.

14 cl, 1 dwg, 1 ex

FIELD: evaporation of liquid reagents used as precursors at application of coats by chemical deposition from vapor phase.

SUBSTANCE: liquid precursors of coat are continuously injected into evaporation chamber for forming the vapor. Evaporation chamber is provided with unit for distribution of liquid precursors of coat and is set in rotation by drive magnetic clutch not provided with seals. According to one version, gas forming the barrier before evaporation chamber is injected into zone located near evaporation chamber; velocity of this gas exceeds velocity of coat precursor vapor escaping from evaporation chamber, thus excluding penetration of vapor into drive magnetic clutch. According to another version, first member of drive magnetic clutch is connected with liquid precursor distributing unit located in evaporation chamber. Second member of drive magnetic clutch located near first member outside the evaporation chamber is set in rotation by first member of clutch which is connected with it by magnetic field.

EFFECT: possibility of obtaining pure flow of vapor used for chemical deposition of coats.

56 cl, 5 dwg

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