Method of assembling microelectronic components

FIELD: physics.

SUBSTANCE: in the method of assembling microelectronic components, once a position fixing polymer (4), in order to maintain alignment of microelectronic components (2) that are assembled on a substrate (1) using an anisotropic electroconductive film (7), is applied onto the substrate and hardened, the microelectronic components (2) are heated to a predetermined temperature and compressed at a predetermined pressure using a flexible sheet (5) provided on the microelectronic components and then subjected to single-step compressive fixation on the substrate (1).

EFFECT: providing a method of assembling microelectronic components which, when using an anisotropic electroconductive film to assemble a plurality of microelectronic components of different height on a base plate, allows assembling at precise positions on the base plate, thereby preventing position shift which results from compressive fixation.

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Technical area

The present invention relates to a method of assembling microelectronic components, in particular for simultaneously mounting on the main Board of many microelectronic components with different height.

Prior art

Usually, when the execution of the method of installation in which microelectronic components (integrated circuits, resistors, capacitors and the like) is subjected to simultaneous compression fixation on the LCD module, glass main Board, main Board or plastic, using an adhesive material such as an anisotropic conductive film or its equivalent.

Anisotropic conductive film (also referred to as ACF) is a high-molecular film, which is divided electroconductive particles (solder or material in which the polymer beads coated); and is the connecting material, which has three properties: adhesive, conductive and insulating. By compression fixation with padded between the upper and lower core plates, or a main Board and microelectronic component, the anisotropic conductive film may: electrically connecting the upper and lower electrodes to each other through conductive particles; providing elektroprovodnosti in the direction of the vertical thickness; and providing isolation in the direction parallel to the surface. Therefore, the anisotropic conductive film prefer to use for fixing the key boards to each other and mounted on the main Board of microelectronic components.

In addition we also used a method in which the anisotropic conductive film is attached to the areas of the electrodes, such as the connecting pins and the like, which are located on the main Board; many microelectronic components mounted on the anisotropic conductive film; a cylinder compression fixation is placed on microelectronic components; perform compression with simultaneous heating to perform one-stage compression fixation. Here, taking into account different component sizes height (for example, microelectronic components)that are subject to compression fixation, already proposed a method of fixation, in which compression between the head commit and component subject to compression fixation, put elastic sheet; and heating and compression produced by head compression fixation, thereby preventing defective compression fixation (for example, see patent document 1).

In addition, the LCD device has a structure including: the areas of the b liquid crystal panel, in which liquid crystals are placed between two glass plates; and a wiring region in which microelectronic components, such as chip formation and the like, and various electronic components are mounted around the area of the liquid crystal panel. because of this, usually used mounting method, in which many microelectronic components subjected to simultaneous compression fixation using an adhesive material such as an anisotropic conductive film or the like, in Addition to the main Board, which serves as a wiring region, place the flexible printed circuit Board wiring (FPC), which is connected with the wiring and the external device output signal.

To achieve miniaturization and complex functionality of the liquid crystal display device, on which is mounted a lot of microelectronic components, it is important on a limited space to mount microelectronic components with the exact location and proper orientation in space. In addition, it is necessary to ensure the reliability of connection, which allows for a correct electrical connections between the microelectronic components and connection areas, such as the electrode pin connections, etc. formed on the main Board.

Even if the COI is lsout component of high quality, if the component is mounted on the main Board are careless, then the product does not provide a predefined functionality, and do not reach the stable product quality, which leads to defects in the product.

The list citation

Patent literature

PLT1: JP-A-2000-68633

The invention

Technical problem

When termocompressive the installation of many microelectronic components on the main Board, using the compression head fixation placed between the cylinder compression fixation and components subject termocompressive fixing the flexible sheet it is possible to perform simultaneous compression fixation, reducing irregularities in the height dimensions of many components that are subject to compression fixation, and to prevent defective compression fixation.

However, when simultaneous compression fixation of many different types of microelectronic components, in that case, if the difference in height sizes large, as the flexible sheet strip use thick flexible sheet, so that the deformation of the flexible sheet was great; during compression, will likely force directed not only in the direction of compression (perpendicular to the main Board), but also the force in the lateral direction (direction horizontal relative to the positive main Board). If there is a lateral force, microelectronic components are shifted from their mounting positions, why the problem occurs reliability of electrical connection between the connecting pin and the desired microelectronic component damage.

For example, as shown in Fig.7(a), the connecting pin located on the main Board 1, is assembled with the anisotropic conductive film 7 has almost the same size in height microelectronic components 21, 22, and having the different height dimensions from microelectronic components 21, 22 of the microelectronic component 23; placing a flexible sheet 5 and spend one-stage compression fixation; in this case, the difference in height is large, so that a region having a small deformation, and the region having a large deformation. And due to the difference between the levels of deformation, occurs laterally directed force, which, as shown in Fig.7(b), introduces a risk, in which the components are in place 21A, 22A, and 23A located offset with respect to the proper mounting location.

Because of this, when mounting multiple microelectronic components having different heights on the main Board using an anisotropic conductive film, it is necessary to deal with the difference in heights of the s size, using thick flexible sheet; and to provide an opportunity to prevent positional shift and mount components at precise positions on the main Board. In addition, preferably the liquid crystal display device, which includes a charge distribution on which is mounted a lot of microelectronic components, and which performs a specific functionality.

Accordingly, the present invention in light of the above problems is the task to provide a structure of mounting the microelectronic components and the method of Assembly of microelectronic components, which when mounted using an anisotropic conductive film, many microelectronic components having different heights on the main Board, allows mounting on the exact positions on the main Board, preventing the positional shift that occurs when compression fixation; and a liquid crystal display device, which includes the main Board.

Solution

To achieve the above objectives the present invention provides a structure of mounting microelectronic components, in which many microelectronic components are placed on the main Board using an anisotropic conductive film; and subjected to single-stage compression mounting, use the I head compression fixation, structure and Assembly of microelectronic components performs simultaneous compression fixation, paving the locking position of the polymer, which preserves the orientation of the microelectronic component that is placed on the anisotropic conductive film.

In accordance with the structure of microelectronic components is subjected to compression fixation with preservation of orientation by putting polymer, fixing the situation that leads to the structure of the Assembly of microelectronic components, capable of preventing lateral shifts that occur during compression fixation, and mount microelectronic components placed on the main Board in the exact provisions.

In addition, the structure of the Assembly of microelectronic components having the above structure, in accordance with the present invention, the fixing position of the polymer is a liquid curable polymer with a coating thickness less than the height of microelectronic components; and applied to the open upper surfaces of microelectronic components. In accordance with this structure, it is possible to apply a liquid curable polymer, applying the method of atomization, microelectronic components held by the adhesion of the anisotropic conductive film. In addition, n is wearing liquid curable polymer only to the level where the upper surface of the microelectronic components are open, by curing the liquid curable polymer, it is possible to fix microelectronic components on the exact locations and in the correct orientation.

In addition, the structure of the Assembly of microelectronic components having the above structure, in accordance with the present invention, the fixing position of the polymer is a liquid curable polymer with a coating thickness less than the height of the highest of the microelectronic component; and applied to the open upper surface of the higher of microelectronic components. In accordance with this structure, opened to the upper surface of the highest component; accordingly, when placing other items on microelectronic components, it is possible to store pre-defined dimensions of the layout.

In addition, the structure of the Assembly of microelectronic components having the above structure, in accordance with the present invention, the main Board includes a flexible printed circuit Board wiring having a height less than the height of microelectronic components; the thickness of the coating fixing a position of the polymer do more than the height of the flexible printed circuit Board wiring. In accordance with this structure is dependent, even in the case when the height of the microelectronic components and the height of the flexible printed wiring Board there is a big difference in height, by increasing the thickness of layer fixing the position of the polymer to high, possible simultaneous compression fixation of the flexible printed wiring Board together with microelectronic components using the locking position of the polymer.

In addition, the present invention provides a method of assembling microelectronic components, in which many microelectronic components are placed on the main Board using an anisotropic conductive film; and performing a one-stage compression fixation using the cylinder compression fixation, where the mounting microelectronic components used fixing position of polymer that holds the orientation of the placement of microelectronic components placed on the anisotropic conductive film; utverjdayut fixing position of the polymer; then, put on microelectronic components flexible sheet; performing heating to a predetermined temperature; perform compression at a predetermined pressure to perform compression commit.

In accordance with this structure many microelectronic components are placed on the main Board by the introduction of an anisotropic conductive film; then put and utverjdayut fixing position of the polymer; and perform compression fixation in the condition in which maintain the orientation of the placement, which leads to method of assembling microelectronic components, which is capable of preventing lateral shifts of microelectronic components, even if the flexible sheet is deformed, and power when performing compression fixation with placed a flexible sheet extends in a lateral direction.

In addition, the method of assembling a microelectronic component having the above structure, in accordance with the present invention, the fixing position of the polymer is a liquid curable polymer with a coating thickness less than the height of the microelectronic component; and a compression fixation holds in a state where the upper surface of the microelectronic components are open. In accordance with this structure it is possible to apply a liquid curable polymer, applying the method of atomization, microelectronic components held by the adhesion of the anisotropic conductive film. In addition, applying a liquid curable polymer only to the level at which the upper surface of the microelectronic components are open, by curing the liquid curable polymer, get pic is b mounting microelectronic components, which is able to fix microelectronic components on the exact locations and exact orientation.

In addition, the method of assembling a microelectronic component having the above structure, in accordance with the present invention, the fixing position of the polymer is a liquid curable polymer with a coating thickness less than the height of the highest of the microelectronic component; and fixed with an open upper surface of the highest of the microelectronic components for providing compression fixation. In accordance with this structure fixes the polymer utverjdayut with an open upper surface of the highest of the components, which leads to method of assembling microelectronic components, which can accommodate other elements exactly on microelectronic components, in accordance with predetermined and established by the dimensions of the layout.

In addition, the method of assembling a microelectronic component having the structure in accordance with the present invention, the main Board includes a flexible printed circuit Board wiring having a lower height than the height of microelectronic components; and the thickness of the coating fixing the position of the polymer do more than the height of the flexible printed circuit Board wiring. In the accordance with this structure, even in the case when there is a big difference between the height of the microelectronic component and the height of the flexible printed wiring Board, by increasing the thickness of layer fixing the position of the polymer, without increasing the thickness posted by a flexible sheet, the possible simultaneous compression fixation of the flexible printed wiring Board and microelectronic components, by applying the locking position of the polymer.

In addition, the present invention provides a liquid crystal display device which includes a liquid crystal panel of the screen and the backlight unit; in which the main Board panel LCD screen is a main Board, on which by means of an anisotropic conductive film placed many microelectronic components; microelectronic components are mounted simultaneously, using the cylinder compression fixation; and a compression fixation performed by placing the locking position of the polymer that holds the microelectronic components placed on the anisotropic conductive film.

In accordance with the structure of microelectronic components is subjected to compression fixation placed in the locking position of the polymer, so that it is possible to prevent lateral shifts that occur in the time compression fixation, which leads to the main Board, which is placed on the main Board of the microelectronic components are mounted in the exact position. This improves the reliability of connection between the main Board and microelectronic components, and provides an opportunity to obtain a liquid crystal display device that performs the desired functionality.

In addition, in the liquid crystal display device having the above structure in accordance with the present invention, the fixing position of the polymer is a liquid curable polymer with a coating thickness less than the height of microelectronic components; and curing at the open upper surfaces of microelectronic components. In accordance with this structure it is possible to apply a liquid curable polymer, applying the method of atomization on microelectronic components held by the adhesion of the anisotropic conductive film. In addition, applying a liquid curable polymer to the level at which the upper surface of the microelectronic components are open, and otorita liquid curable polymer receive the liquid crystal display device in which microelectronic components fixed in precise positions and with the proper orientation, and performs the required functionality.

According to the IMO in this liquid crystal display device, with the above structure in accordance with the present invention, the fixing position of the polymer is a liquid curable polymer with a coating thickness less than the height of the highest of the microelectronic component; and utverjdayut with an open upper surface of the highest of microelectronic components, to perform compression fixation. In accordance with this structure fixes the polymer utverjdayut with an open upper surface of the highest of microelectronic components, which leads to the liquid crystal display device suitable for placement of other elements in exact accordance with predetermined and fixed size layout, and does not impair the desired functionality of the main Board and performs the required functionality.

In addition, in the liquid crystal display device having the above structure in accordance with the present invention, the main Board includes a flexible printed circuit Board wiring having a height less than the height of microelectronic components; and the thickness of the coating fixing the position of the polymer is higher than the height of the flexible printed circuit Board wiring. In accordance with this structure, even if there is a big difference between high is the microelectronic component and the height of the flexible printed wiring Board, by increasing the thickness of the coating layer fixing the position of the polymer, it is possible to simultaneously compression fixation of the flexible printed wiring Board and microelectronic components, the fixing position of the polymer. Thus, receive the liquid crystal display device in which microelectronic components and flexible printed wiring Board is fixed at an accurate position without positional shifts, which leads to the liquid crystal display device that performs the desired functionality.

The effect of inventions

In accordance with the present invention provide a structure for mounting microelectronic components, in which compression fixation is done by placing the locking position of the polymer, which preserves the orientation of placement of microelectronic components, which are placed on the base Board by using an anisotropic conductive film, which leads to the structure of the Assembly of microelectronic components, which prevents lateral displacement, which occurs during compression fixation and mount microelectronic components on the main Board in the exact position. In addition provide a way of mounting microelectronic components, which is applied and utverjdayut fixing position of the polymer, which is the first preserves the orientation of placement of microelectronic components, located on the main Board using an anisotropic conductive film; and then placing a flexible sheet on microelectronic components; performing heating to a predetermined temperature; perform compression at a predetermined pressure to perform simultaneous compression fixation, which gives the method of Assembly of microelectronic components, capable of preventing lateral displacement of microelectronic components, even if the flexible sheet is deformed and, when performing compression fixation hosting a flexible sheet, there is a lateral force directed. In addition provide a liquid crystal display device, which includes the main Board, so that it is possible to provide a liquid crystal display device, which includes the cost of wiring, which accurately assembled many microelectronic components; and performs the desired functionality.

Brief description of drawings

Figure 1 shows a view in sectional view describing a method of assembling a microelectronic component in accordance with the present invention.

Fig 2. provides descriptive views showing the procedure of mounting the microelectronic component in accordance with the present invention, in which (a) shows the state in which anisot apna conductive film attached to the connecting pad on the main Board; (b) shows the state in which the place of microelectronic components; (c) shows the state in which cause the locking position of the polymer; and (d) shows the appearance of the finished product in the context.

Figure 3 shows the flowchart showing the procedure of mounting the microelectronic component in accordance with the present invention.

Figure 4 shows a schematic illustrative view of the first variant implementation of the structure of the Assembly of microelectronic components in accordance with the present invention, in which (a) is top view; (b) is a front view; and (c) lateral view.

Figure 5 shows a schematic illustrative view of the second variant of implementation in accordance with the present invention, in which (a) is top view; (b) is a front view; and (c) lateral view.

Figure 6 shows a schematic illustrative view of the method of installation in accordance with the second embodiment, shown in figure 5, where (a) is a front view in section; and (b) is a side view in section.

Figure 7 shows the schematic illustrative view of a conventional method of mounting microelectronic components, in which (a) is a view in sectional view; (b) is a top view in the section.

Description of embodiments

As described herein, embodiments of the present invention describe with reference to h is rtii. In addition, the same structural elements are denoted by the same numbers, and detailed description is accordingly omitted.

First, using figure 1 and figure 2 describe the method of assembling a microelectronic component in accordance with the present invention.

As shown in figure 1, the method of Assembly of microelectronic components, in accordance with the present invention is a method of assembling a microelectronic component such that upon installation of many microelectronic components 2 on the main Board 1, on which is formed the corresponding wiring, the connecting area, such as a predefined electrode connection pad, and the like, located on the main Board 1 in advance, and fix the anisotropic conductive film 7; place of microelectronic components 2 on the anisotropic conductive film 7; placing a flexible sheet 5 on microelectronic components 2; perform compression at a certain pressure F by means of a head compression fixation 8, simultaneously heating to a certain temperature to perform one-stage compression commit.

In addition, there is used a structure in which, after placing the microelectronic component 2 on the anisotropic conductive film 7, and put utverjdayut FIC is yuushi position polymer 4, which preserves the orientation of the arrangement of microelectronic components 2; then, perform a compression fixation with elastic sheet 5 and the compression head fixation 8.

As described above, the anisotropic conductive film 7 is a connecting material having three functions: adhesion, electrical conductivity and isolation; accordingly, the anisotropic conductive film 7 can be attached in a predetermined position on the main Board; and it is possible to place microelectronic components on the anisotropic conductive film 7, is fixed on the main Board, and temporarily secure microelectronic components.

Preferably, the locking position of the polymer 4 was a liquid curable polymer. In addition, the preferred polymer-curing at a temperature at which hardens the anisotropic conductive film 7; and after curing has resistance to the heating temperature used during compression fixation. For example, you can use light-cured polymer, such as epoxy resin and the like, which utverjdayut using ultraviolet radiation. In addition, a sufficient coating thickness is a thickness capable of positionally fix microelectr the installed components 2 thus, to avoid positional shift after curing and can have a smaller height than a height of microelectronic components 2. If the thickness of the coating fixing position of the polymer 4 makes less height than the height of microelectronic components 2, get a structure in which the upper surface of the microelectronic components 2 are open. Thus, the receive method of assembling microelectronic components, in which you can place items directly on microelectronic components 2, in accordance with predetermined and established by the dimensions of the layout.

In addition, in the case where the height of many microelectronic components differ from each other, it is preferable that the coating thickness was less than the height of the tallest of the microelectronic component. This is preferable because, when the microelectronic components 2 place other components; by opening the upper surface of the highest microelectronic component 2, it is possible to generate a predefined project level, even if there are other components. For this reason, we can say that it is preferable that the thickness of the coating fixing position of the polymer 4 was lower than the height of the microelectronic component 2, which is Udut posted by other elements.

In addition, as for the liquid curable polymer, it is possible and preferable to apply a liquid curable polymer to an arbitrary height by applying the method of Spencer around the microelectronic component 2 held anisotropic conductive film 7.

Rather, if the flexible sheet 5 is a sheet that is flexible and has heat resistance. Here, in the case of the type in which the cylinder compression fixation 8 provided with a heater, it is preferable to use a flexible sheet 5, which has a high conductivity for the smooth transfer of heat from the heater to the anisotropic conductive film 7. In addition, in the case of the type in which the heater is located on the table, on which is placed the baseboard, heating is carried out not through the flexible sheet, thus, the function unimpeded thermal conductivity is not required, and it is enough to use a flexible sheet having low thermal conductivity.

On the main Board 1 in advance form the wiring; and, in predefined positions, place the connecting region, such as the electrodes, the connecting pins and the like, for connecting predetermined electronic components in a predetermined position. As shown in figure 2 (a), to the connecting areas the children attach the anisotropic conductive film 7. Then, as shown in figure 2 (b), the anisotropic conductive film 7 is placed in advance certain electronic components such as microelectronic components 2. As described above, the anisotropic conductive film 7 has adhesion, so that the microelectronic components 2, is placed on the anisotropic conductive film is temporarily fixed in their positions by the force of adhesion.

Then, as shown in figure 2 (c), causing the locking position of the polymer 4. In addition, the thickness of the coating installed at a height lower than the height of the microelectronic component 2. therefore, if the applied fixing position of the polymer hardens, as shown in figure 2 (d)obtain a structure in which microelectronic components 2 is fixed at the open upper surfaces of microelectronic components 2.

If around microelectronic components 2 and put utverjdayut fixing position of the polymer 4, even if caused to the locking position, the polymer is applied in a quantity that allows the upper surfaces of the microelectronic components 2 to remain open, you can easily fix microelectronic components 2. And after curing, fixing the position of the polymer 4 on microelectronic components 2 are placed flexible sheet 5; heated to a predetermined fact is that the temperature; and subjected to compression at a predetermined pressure by means of a head compression fixation 9, to perform one-stage compression commit.

In addition, since the depth of subsidence during compression fixation is very small (for example, 10 μm), the terms of compression fixation (compression settings) can be left the same as in the ordinary way, do not use the locking position of the polymer 4. As described above, the microelectronic components 2 which is attached by fixing a position of the polymer 4, so that it becomes possible to prevent the offset of the microelectronic component 2, which occurs during compression fixation. In addition, the fixing position of the polymer 4 has a function of protection against separation of the microelectronic component 2. In addition, the fixing position of the polymer fills the gaps between the microelectronic components, so that there is a functional effect of insulation fixing position of the polymer electronic components from each other.

Then, using the block diagram shown in figure 3, describe the operating procedure of mounting the microelectronic component.

If initiated, the operation for mounting the microelectronic component, the first on the main Board causing the anisotropic conductive film 7 (ACF) (step S1). C is the, the damages of the anisotropic conductive film 7, is placed microelectronic component (step S2); and cause and utverjdayut fixing position of the polymer (S3). After the polymer has cured, perform the heating and compression with pre-defined parameters, to perform a full compression fixation (step S4), then the mounting operation of the microelectronic component ends. Operations involving the application and curing of the polymer is performed at step S3, indicated by a double border, are a characteristic part of the method in accordance with the present invention.

As described above, the method of assembling a microelectronic component in accordance with the present embodiment, is a method of assembling a microelectronic component, wherein the anisotropic conductive film 7 is fixed on the main Board 1 at a predetermined position; placing the microelectronic components 2 on the anisotropic conductive film 7; and put utverjdayut fixing position of the polymer 4; then place the flexible sheet 5 on microelectronic components 2; carry out heating to a predetermined temperature; perform compression at a predetermined pressure by means of a head compression fixation 8, to perform one-stage compression fixation. Dragonslave, receive a mounting method of a microelectronic component, which applies the fixing position of the polymer 4, which preserves the orientation of the microelectronic component 2 is placed on the anisotropic conductive film 7.

In accordance with the above method of assembling a microelectronic component, after placement on the main Board 1, by using the anisotropic conductive film 7, microelectronic components 2, and put utverjdayut fixing position of the polymer 4, to perform compression fixation, respectively, even if the flexible sheet 5 is deformed, and, when performing compression fixation, there is a lateral force directed, have a way of mounting the microelectronic component that is capable of preventing lateral displacement of the microelectronic component 2, which is preferable.

In the usual way, which does not include the use of fixing the position of the polymer, while compression fixation of many different types of microelectronic components, in cases where the difference in height sizes large, the level of deformation of the flexible sheet 5 becomes high, thus, during compression, a force directed not only in the direction of compression (the direction perpendicular to the main Board), but also strength, healthy lifestyles the bedroom lateral (horizontal with respect to the main Board. In addition, if there is a lateral force directed, microelectronic component is shifted from the intended mounting position, which raises the issue of reliability of electrical connections between the areas of the electrodes, such as the connecting pins and the like, and the desired microelectronic components damage.

However, in the method of assembling a microelectronic component in accordance with the present embodiment, the compression fixation is performed by placing a flexible sheet 5 in this state, which laid the locking position of the polymer 4, in order to fix and prevent lateral displacement of the microelectronic component 2; accordingly, even if many microelectronic components 2, differing from one another in type and have a large difference in the heights, is subjected to simultaneous compression fixation, it is possible to fix microelectronic components at precise locations, without lateral offset.

Then, using figure 4, describe an implementation option structure mounting a microelectronic component in accordance with the present invention.

The structure of mounting the microelectronic component K1, shown in figure 4 (a)is a structure in which the main Board 1 place many microelectronic components 2 such as a planar capacitor, planar resistor, and the like, and place the integrated circuit 3; and put utverjdayut fixing position of the polymer 4 for fixing these components.

In addition, the amount of damage to the locking position of the polymer 4 has a height less than the height of all components. Because of this, as shown in figure 4 (b)fixing the position of the polymer 4 is solidified in a state in which all the upper part of the microelectronic components 2 and the integrated circuit 3 are open. In addition, as shown in figure 4 (c), microelectronic components 2 and the integrated circuit 3 is substantially distinguished from each other in height; however, even in this case, placing a flexible sheet, having a thickness greater than the difference in height, and performing heating and compression, thus, it becomes possible to perform simultaneous compression fixation on the exact positions, without lateral offset.

In addition, the upper part of the microelectronic components 2 are open, so that it is possible directly to place other items on microelectronic components 2, in accordance with predetermined and fixed size layout, which leads to the structure of the installation, which does not impair the desired functionality of the main Board.

Then, using figure 5, describe the second version of the implementation structure mounting microelectronic what about the component in accordance with the present invention.

Shown in figure 5 (a) structure of mounting the microelectronic component K2 is a structure in which the main Board 1 place many microelectronic components 2 such as a planar capacitor, planar resistor, and the like, and place the integrated circuit 3 and the flexible printed circuit Board wiring 6; cause and utverjdayut fixing position of the polymer 4 for fixing these components. The thickness of the flexible printed wiring Board 6 is small, it's easy to bend and is significantly different in height from components such as microelectronic components 2 and the integrated circuit 3.

Because of this, as shown in figure 5 (b), the amount of damage to the locking position of the polymer 4 has a height less than the microelectronic components 2 and the integrated circuit 3, and has a thickness greater than that of the flexible printed wiring Board 6. In other words, the fixing position of the polymer 4 utverjdayut in this state in which the flexible printed wiring Board 6 is covered, and the top surface of the microelectronic component 2 and the integrated circuit 3 are open. In addition, as shown in figure 5 (c), a flexible printed wiring Board 6 is lower than, that is, significantly different in height from microelectronic components 2 and the integrated circuit 3; however, even in this case, the fixing position of the polymer 4 nanos is t and utverjdayut on the flexible printed circuit Board wiring 6; on this is placed a flexible sheet; and perform compression using the compression head fixation, thus, possible simultaneous compression fixation of the flexible printed wiring Board 6, simultaneously with other components.

In accordance with the above structure mounting the microelectronic component, even when the flexible printed wiring Board 6 has a small thickness, it may be a one-stage compression fixation on the main Board 1 by using the anisotropic conductive film 7, while the other components.

In addition, the upper surface of the microelectronic components 2 are open, so that it is possible to place other elements directly on microelectronic components 2, in accordance with predetermined and fixed size layout that gives structure installation, without impairing the desired functionality of the main Board.

Using 6 again describe the method of mounting structure mounting K2 microelectronic component.

Figure 6 (a) shows the method of mounting structure mounting K2 microelectronic component, representing the way in which the connecting region, such as the electrodes, the connecting pins, etc. that are located on the main Board 1, put the anisotropic conductive film 7; Ani is oropou conductive film 7 place many microelectronic components, such as planar capacitor or planar resistor, integrated circuit 3, and a flexible printed circuit Board wiring 6; cause and utverjdayut fixing position of the polymer 4; then, perform compression at a pressure of F by performing heating with placed a flexible sheet 5, to perform one-stage compression commit.

If the compression is performed at a pressure of F, with the flexible sheet 5, is placed, as shown in Fig.6 (b), the pressure F acts on the upper surface of the microelectronic components 2 through the flexible sheet 5, for full compression fixation of the anisotropic conductive film 7 under the electronic components 2. In addition, the pressure F acts on the upper surface of the integrated circuit 3, through the flexible sheet 5, for full compression fixation of the anisotropic conductive film 7 under the integrated circuit 3.

In addition, in regard to the flexible printed wiring Board 6, the pressure F acts on the fixing position of the polymer 4, which covers the flexible printed circuit Board wiring 6 for full compression fixation of the anisotropic conductive film for a flexible printed wiring Board 6.

As described above, even if there is a big difference between the height of the microelectronic component 2 and the height of the flexible printed wiring Board 6, by putting f is xiaoshahe position of polymer 4, it is possible to provide simultaneous compression fixing a flexible printed circuit Board 6, together with microelectronic components 2.

Preferably, the thickness of the coating fixing a position of the polymer 4 was less than the height of microelectronic components 2 and is thicker than the height of the flexible printed wiring Board 6. In addition, in the case where the height of many microelectronic components 2 are different from each other, it is preferable that the thickness of the coating was performed with a height less than the highest of the microelectronic component 2. In addition, if the thickness of the coating makes a big difference from the highest microelectronic component becomes small; therefore, making the thickness of the flexible sheet 5 is small, in accordance with a difference, a possible one-stage compression fixation of microelectronic components 2, the integrated circuit 3 and the flexible printed circuit Board 3.

The main Board having the above structure for mounting a microelectronic component, preferably used as a main Board LCD display panel. For this reason, it is possible to obtain a liquid crystal display device comprising the backlight unit and liquid crystal display panel, which has a main Board, resulting from the placement of mn is the set of microelectronic components on the main Board using an anisotropic conductive film; simultaneous compression fixation for mounting microelectronic components, using head compression fixation; and performing a compression fixation coated with a fixing position of the polymer, which preserves the orientation of placement of microelectronic components placed on the anisotropic conductive film.

In accordance with the structure of microelectronic components is subjected to compression fixation on the main Board, with floor fixing position of the polymer, so that it is possible to prevent lateral displacement arising from compression fixation, which gives the main Board, in which microelectronic components placed on the main Board, mounted at precise positions. Therefore, improving the reliability of the electrical connection between the main Board and microelectronic components, and it is possible to obtain a liquid crystal display device that performs the desired functionality.

Here, it is preferable that the fixing position of the polymer was a liquid curable polymer; and it is preferable that the coating thickness was less than the height of microelectronic components, and curing took place in the state in which the upper surface of the microelectronic components are open. In accordance with this structure is Oh can be applied curable liquid polymer on microelectronic components, held by the adhesion of the anisotropic conductive film, a sputtering method. In addition, the upper surface of the microelectronic components are open, so that it is possible to place items directly in accordance with predetermined and fixed size layout that gives the liquid crystal display device, which does not impair the desired functionality of the base Board and performs the required functionality.

Additionally, if the base Board includes a flexible printed circuit Board wiring having a height less than the height of microelectronic components, it is preferable that the thickness of the coating fixing position of the polymer was doing more than the height of the flexible printed circuit Board wiring. In accordance with this structure, even if there is a big difference between the height of the microelectronic component 2 and the height of the flexible printed wiring Board, making the thickness of the coating fixing position of the polymer is large, it is possible, by means of the clamping position of the polymer, one-stage compression fixation of the flexible printed wiring Board together with microelectronic components. For this reason, get the liquid crystal display device, in which: microelectronic components and flexible printed wiring Board is fixed on the fine the x positions, without positional displacement; and which performs the required functionality.

Earlier in this document were described embodiments of the present invention; however, the scope of the present invention is not limited to these options for implementation, it is possible to make various changes and implement them in practice, without departing from the spirit of this invention. For example, instead of the ultraviolet-curable polymer can be used thermoset polymer. In addition, the structure can be applied as a flexible sheet, using dual layer flexible sheet in which the first flexible sheet and a second, slightly more solid flexible sheet, laminated.

As described above, in accordance with the structure mounting the microelectronic components of the present invention, used the structure of the Assembly of microelectronic components, which is obtained by performing compression fixing superimposed with the fixing position of the polymer, which stores positional orientation of microelectronic components, which are posted on the main Board using an anisotropic conductive film, which leads to the structure of the Assembly of microelectronic components, which is capable of preventing lateral displacement that occurs during compression fixation and mount posted on the main boards who microelectronic components at precise positions.

In addition, in accordance with the method of mounting the microelectronic components of the present invention to apply the method of Assembly of microelectronic components, in which cause and utverjdayut fixing position of the polymer, which stores positional orientation of microelectronic components, placed on the main Board using an anisotropic conductive film; then, put a flexible sheet on microelectronic components; performing heating to a predetermined temperature; perform compression at a predetermined pressure, to perform one-stage compression fixation, which leads to method of assembling microelectronic components, which is capable of preventing lateral displacement of microelectronic components, even when the flexible sheet is deformed, and when performing compression fixation hosting a flexible sheet, there is a lateral force directed.

Additionally, in accordance with the liquid crystal display device of the present invention includes the main Board, on which the exact position and correct orientation of the assembled microelectronic components, which leads to the liquid crystal display device, which includes the main Board, which accurately mounted microelectronic who omponent, having different heights; and performs the required functionality.

Industrial application

The structure of mounting the microelectronic components and the method of Assembly of microelectronic components in accordance with the present invention is preferably applied to a structure of mounting a microelectronic components and method of installation of microelectronic components, in which many microelectronic components with different heights, is subjected to simultaneous compression of the commit.

For a list of symbols

1 - base Board

2 - microelectronic component

3 - integrated circuit

4 - fixing the position of the polymer

5 - flexible sheet

6 - flexible printed circuit Board wiring

7 anisotropic conductive film

8 - cylinder compression fixation

1. The method of Assembly of microelectronic components, in which many microelectronic components are placed using an anisotropic conductive film on the main Board and perform one-stage compression fixation by means of a head compression fixation, mounting microelectronic components cause the locking position of the polymer, which supports positional orientation placed on the anisotropic conductive film microelectronic components, otverzhdayushchikhsya the position of the polymer, then perform heating to a predetermined temperature, with a flexible sheet placed on microelectronic components, perform pressing at a predetermined pressure to perform compression commit.

2. The method of mounting the microelectronic component according to claim 1, in which locking position the polymer is a liquid curable polymer, and is applied with a coating thickness less than the height of microelectronic components, and compression fixation is carried out in a state in which the upper surface of the microelectronic components are open.

3. The method of mounting the microelectronic component according to claim 1, in which locking position the polymer is a liquid curable polymer, and is applied with a coating thickness less than the height of the highest microelectronic component of microelectronic components, and utverjdayut with an open upper surface of the highest microelectronic component to perform compression commit.

4. The method of mounting the microelectronic component according to claim 2, in which the main Board includes a flexible printed circuit Board wiring having a height less than the height of microelectronic components, and fixing the position of the polymer has a coating thickness greater than the height of the flexible printed circuit Board wiring.

5. The way MES is even the microelectronic component according to claim 3, in which the main Board includes a flexible printed circuit Board wiring having a height less than the height of microelectronic components, and fixing the position of the polymer has a coating thickness greater than the height of the flexible printed circuit Board wiring.



 

Same patents:

FIELD: radio engineering, communication.

SUBSTANCE: topological pattern of all conducting layers and electrical contacts between them are formed in one process by a photomask through photolithography, wherein an electrical contact is formed from material of conducting layers. In a single process cycle, a second photomask is used to form windows in dielectric layers of the flexible part for electrical and mechanical connection with the rigid part of the board. The rigid part of the board is made using the conventional technique of double-sided boards. The flexible part and the rigid part are joined, for example, by microwelding, brazing or gluing with electroconductive adhesives, through the windows in the dielectric layers. A multilayer flexible-rigid integrated board is formed by successively folding the flexible part in form of an envelope and placing the rigid part of the board inside, after which all layers of the board are tied into a single structure which meets technical requirements for multilayer boards.

EFFECT: fewer process operations and number of photomasks when making flexible and flexible-rigid multilayer boards, high reliability of electrical contacts between layers of the multilayer board, low labour input and production cost.

10 dwg

FIELD: radio engineering, communication.

SUBSTANCE: module has a multilayer printed-circuit board with N conducting layers and plated holes, through which interlayer electrical connections are made, which carries high-frequency and low-frequency connectors, as well as conductor strips and radio components which are grouped into analogue and digital signal processing zones. The screening plane of the analogue signal processing zone is located in the n-th conducting layer. The screening plane of the digital signal processing zone is located in the neighbouring (n+1)-th conducting layer. The earthing plane of the digital signal processing zone is connected through a plated hole, which forms the earth potential input line into the analogue signal processing zone from the digital signal processing zone, with the earth potential input section, located in the first conducting layer, into the analogue signal processing zone which is connected to the surrounding earthing section at one point by a zero resistance resistor. Said plated hole crosses the screening plane and the earthing sections of the digital signal processing zone to provide electrical contact with them, and the screening plane and crosses the earthing sections of the analogue signal processing zone without electrical contact with them.

EFFECT: designing a new version of the module, which widens the existing range of modules that are characterised by arranging the analogue and digital signal processing zones on below the other on different sides of a multilayer printed-circuit board and mutual screening by on-board means.

13 dwg

FIELD: electricity.

SUBSTANCE: dielectric foiled at both sides is used (for instance, in the form of a flexible polymer) and a metal substrate with a plating layer, besides, a solder layer is arranged between them. In the metal substrate of the printed circuit board there might be through holes made for connection with other printed circuit boards. Besides, tinning of the printed circuit board is carried out simultaneously with tinning of the plating layer of the metal substrate, afterwards the printed circuit board billet is soldered to the metal substrate billet. It is possible to simultaneously solder radio elements to contact sites of the printed circuit board.

EFFECT: provision of the possibility to manufacture in conditions of a conventional assembly production facility both rigid and flexible-rigid printed circuit board on a metal substrate having increased strength, resistance to mechanical actions, improved heat removal and screening properties.

4 cl, 2 dwg

FIELD: radio engineering.

SUBSTANCE: manufacturing method of multilayer printed circuit boards involves assembly into a package of n single- or double-sided printed circuit boards, with plated holes made in them and forming interlayer through connections by means of contact to each other, and n-1 layers of adhesion gaskets; filling of plated holes of circuit boards by means of a filler vulcanised during the pressing process and further vacuum hot pressing of the package. Filler is removed out of through holes after the pressing process is completed.

EFFECT: avoiding the occurrence of metal plating defects - occurrence in walls of holes of broken sections when drilling out the resin penetrated into the holes, and thus, cheapening of the manufacturing process of multilayer printed circuit boards at experimental and small-batch production.

2 dwg

FIELD: electricity.

SUBSTANCE: in the method to manufacture multi-level thin-film microcircuit chips, including alternate vacuum application of conductor layers onto a substrate with subsequent development of a pattern of a chip by the method of photolithography, application of insulating layers and formation of level-to-level connections in them from one conductor layer to another by etching transition windows in the insulation and their dusting with a conducting material, level-to-level connections are formed by dusting of transition windows simultaneously by sputtering of the conductor layer of the appropriate level and making a pattern of the chip by the method of photolithography, besides, level-to-level connections are formed of a larger size than the size of transition windows in plan. In each subsequent insulating layer they etch transition windows of a larger size compared to the previous one.

EFFECT: simplified technology to make microcircuit chips and their higher reliability.

2 cl, 2 dwg

FIELD: electricity.

SUBSTANCE: invention can be used at manufacture of multi-layer printed-circuit boards (MPB) used during design of radio electronic equipment. MPB are obtained by bonding of two-sided and one-sided printed-circuit boards along flat surface through separating dielectric layers from glass fabric saturated with organic bonding agents; at that, electrical diagrams are not available on external surface of bonded boards. Then, through and blind bypass openings are drilled and metal wire with low electric resistance, for example copper, aluminium, or molybdenum, or silver one the diameter of which exceeds the diameter of bypass opening not more than by 5%, is inserted throughout the depth of the latter; after that, on external surface of bonded printed-circuit boards there applied subsequently is thin metal coating, by means of thermodecomposition of metal organic compounds (MOC) of nickel or copper, or cobalt, or molybdenum with thickness of 1.5-3 mcm; polymer organic substance in the form of film, and then, using photolithography or laser beam, or by milling there created is pattern of electrical diagrams, after which electroplated copper coating of required thickness is applied to the sections not protected with polymer film and protective metal resistive coating above it and residues of polymer and thin metal coating is removed.

EFFECT: simpler process for obtaining of multi-layer printed-circuit boards not containing any moisture, installation of electric contact between layers, which does not destruct at temperature drop; reduction of wastes of chemical electroplated manufacture.

FIELD: electricity.

SUBSTANCE: method to manufacture a printed circuit board with a lead pattern includes the following stages: i) on a substrate (1) a conducting layer is attached selectively, for instance, a metal foil (3), so that a part of the specified conducting layer containing the specified sections (3a), forming conductors in the end item, and narrow sections (3c) arranged between the specified conducting sections of the end item, is fixed on the substrate (1) by means of a binder (2). At the same time larger conducting layer sections (3b) to be removed are substantially loose on the substrate and are connected with the substrate (1) by not more than their edge section to be processed at the next stage ii) and possibly sections preventing separation of sections to be removed prior to completion of the stage iii); ii) on the specified conducting layer a lead pattern is arranged by removal of the material, for instance, a metal foil (3), from narrow gaps between specified conducting sections (3a) and at the external periphery of the section (3b) removed in a solid condition; iii) conducting layer sections (3b) to be removed, which are loose on the substrate (1), are removed in a solid condition, since the specified sections (3b) to be removed, which have been previously connected with the substrate by their edge sections are not any longer retained by the edge sections of the conducting layer, which have been removed from the external periphery of the sections to be removed on the stage ii).

EFFECT: higher controllability and efficiency of a method to manufacture multilayer printed circuit boards, increased economic efficiency and reliability of a method to produce electric circuits placed along both sides of a substrate, permitting usage of a laser in production of printed circuit boards.

13 cl, 7 dwg

FIELD: chemistry.

SUBSTANCE: method for metal coating holes in multilayer printed-circuit boards involves deoiling and pickling the workpiece, treating said workpiece in a silver solution based on potassium ferrocyanide and potassium rhodanate, sensitisation in a tin chloride solution, activation in a palladium chloride solution, chemical copper plating, galvanic copper plating and thermodiffusion treatment in an argon medium while raising temperature in steps. Galvanic copper plating in pyrophosphate electrolyte at temperature of about 40°C and raising temperature in steps during thermodiffusion treatment in an argon medium are carried out in the following modes: (40±0.1)°C for 64930 s; (41±0.1)°C for 41956 s; (42±0.1)°C for 528 s; (43±0.1)°C for 260 s; (44±0.1)°C for 97 s; (45±0.1)°C for 52 s; (46±0.1)°C for 33 s; (47±0.1)°C for 16 s; (48±0.1)°C for 10 s; (49±0s1)°C for 7 s.

EFFECT: high reliability of interlayer connections in multilayer printed-circuit boards, shorter cycle for making printed-circuit boards and reduced labour input of the process.

FIELD: electricity.

SUBSTANCE: in a multilayer printed circuit board comprising signal dielectric layers that include a topological pattern of printed wiring alternate with screening layers made in the form of a lattice equipped with printed conductors that follow configuration of the topological pattern of the neighbouring signal layer, and the signal conductors are placed with account of radiation they generate.

EFFECT: improved quality of printed circuit board protection against exposure to electromagnetic fields.

FIELD: electricity.

SUBSTANCE: in method for manufacturing of microcircuit boards with multi-level thin-film commutation including formation of first level conductors vanadium-copper-nickel on ceramic substrate by means of vacuum sputtering with further photolithographic etching, application of insulation layer, opening windows in its for interlevel contacts, formation of interlevel commutation titanium-copper-titanium and conductors of the second level titanium-copper-titanium, formation of structural protection, after opening windows for interlevel contacts, nickel film is etched, and a thin layer of tin is chemically deposited in windows on copper, afterwards, by means of vacuum sputtering through magnetic mask with topological pattern of interlevel commutation, titanium-copper-titanium films are deposited to obtain planar structure.

EFFECT: expansion of functionality and increased switching ability of microcircuit boards with multi-level commutation.

1 dwg

FIELD: radio engineering, communication.

SUBSTANCE: topological pattern of all conducting layers and electrical contacts between them are formed in one process by a photomask through photolithography, wherein an electrical contact is formed from material of conducting layers. In a single process cycle, a second photomask is used to form windows in dielectric layers of the flexible part for electrical and mechanical connection with the rigid part of the board. The rigid part of the board is made using the conventional technique of double-sided boards. The flexible part and the rigid part are joined, for example, by microwelding, brazing or gluing with electroconductive adhesives, through the windows in the dielectric layers. A multilayer flexible-rigid integrated board is formed by successively folding the flexible part in form of an envelope and placing the rigid part of the board inside, after which all layers of the board are tied into a single structure which meets technical requirements for multilayer boards.

EFFECT: fewer process operations and number of photomasks when making flexible and flexible-rigid multilayer boards, high reliability of electrical contacts between layers of the multilayer board, low labour input and production cost.

10 dwg

FIELD: electricity.

SUBSTANCE: dielectric foiled at both sides is used (for instance, in the form of a flexible polymer) and a metal substrate with a plating layer, besides, a solder layer is arranged between them. In the metal substrate of the printed circuit board there might be through holes made for connection with other printed circuit boards. Besides, tinning of the printed circuit board is carried out simultaneously with tinning of the plating layer of the metal substrate, afterwards the printed circuit board billet is soldered to the metal substrate billet. It is possible to simultaneously solder radio elements to contact sites of the printed circuit board.

EFFECT: provision of the possibility to manufacture in conditions of a conventional assembly production facility both rigid and flexible-rigid printed circuit board on a metal substrate having increased strength, resistance to mechanical actions, improved heat removal and screening properties.

4 cl, 2 dwg

FIELD: electricity.

SUBSTANCE: method involves the following: prior to application of electroplated conductive copper coating to the fibre-glass plastic surface and to inner surface of bypass openings there applied is thin silver coating with thickness of 2÷4 mcm using the chemical method, silver salts, protected with polymer film or photoresist material; pattern of electroconductive scheme is formed, and after creation of electroconductive paths and electroplated metal coating of inner surface of bypass openings the protective polymer coating is removed and thin metal coating is etched from the sections not protected with metal resistive coating.

EFFECT: elimination of activation of fiber-glass plastic surface and holes using expensive palladium chloride; and elimination of power loss, especially at low currents, due to big difference in electric resistance of silver and palladium.

FIELD: radio engineering.

SUBSTANCE: wiring unit comprises printed circuit boards and multiserial sockets installed on their ends, besides printed circuit boards are installed between rows of socket contacts parallel to each other so that in the first version one of boards with its end sides is electrically connected along one and another surface accordingly with one and another neighbouring rows of socket contacts, and another and subsequent boards with their end sides are electrically connected along outer surface accordingly with other subsequent rows of socket contacts; in the second version - each board with its one end side is electrically connected along one and another surface accordingly to neighbouring rows of opposite sockets contacts, and with its other end side it is electrically connected along external surface accordingly to outer row of opposite sockets contacts. Unit of electrical equipment comprises packet of wiring units made of printed circuit boards with sockets installed on their ends fixed by pair fastening panels. Methods are also proposed to manufacture wiring unit and unit of electrotechnical equipment. Method for repair of electrical equipment unit, in which in packet of wiring unit they detect faulty wiring unit, packet fixtures are removed, due to rotation of units access is provided to faulty piece, fault is eliminated, and packet of units is returned into initial position, consists in the fact that in packet of wiring units arranged with sockets, to which at least printed circuit boards are connected electrically, and boards along their single identical side through holes-contacts are pierced mainly with rigid single-core electric wires, fastening panels are removed from wiring units, faulty unit is detected, and packet of wiring units is divided into two parts relative to it, other units are turned due to bending of wires in different sides to obtain required access to faulty board of unit, after elimination of fault units and fastening panels are put back in place.

EFFECT: high technological properties, low metal intensity, high rigidity and strength characteristics, good repairability and wide opportunities in building of universal units and blocks of various purpose.

13 cl, 12 dwg

The invention relates to a method of manufacturing at least one electrically conductive connection between two or more conductive structures 2, 4, of which at least one conductive structure connected to the substrate 3 in conducting combined system

The invention relates to the technology of radio-electronic equipment and solves the problem of improving the processability and reduce the cost and improve the reliability of fastening tape wire to Board

Contact site // 2134498
The invention relates to the manufacture of permanent connections in the production process apparatus on the basis of microelectronics and semiconductor devices, and specifically to the contact nodes through which the Assembly, including multilayer switching structures for multichip modules (MCM)and mounting of crystals of BIS on the switching structure in the manufacturing process ΜM

FIELD: electronic engineering.

SUBSTANCE: present invention relates in substance to shell-type discrete electronic components, containing, for example, electronic power supply circuit, shell or case in the form of parallelepiped and contact pins connected inside shell with the above circuit and protruding out of shell for electric connection with printed-circuit board (PCB). Shell contains heat-dissipating front section having at least one surface outside shell and lying in plane; specified contact pins protrude from shell so that their first section lies in parallel to the above plane. Flat-topped is preferred in a couple of contact pins located after the first section parallel to plane as such bend will allow more stable mounting of component in process of its soldering on heat-dissipating intermediate pad.

EFFECT: creation of discrete electronic component, which structural and functional performance provide its easy, fast and simple mounting at supporting pad for further installation with other components at PCB.

9 cl, 6 dwg

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