Electronic board and aircraft with said electronic board

FIELD: physics.

SUBSTANCE: invention relates to an electronic board which is meant, for example, for integration into on-board equipment of an aircraft. Offsetting insulating areas of one layer relative the other enables to bring the working conducting area of one of the two layers "closer" to the peripheral area of the other layer. Insulating areas, which are bad heat conductors, are no longer stacked on one another, thus the heat barrier effect associated with layering in the same zone of these insulating areas is significantly reduced. This is achieved due to that the electronic board has at least two conducting layers (2') stacked on each other with an insulating layer (3') between two conducting layers (2'), wherein each of the two conducting layers (2') has a working conducting layer (7'); an insulating area (8') lies between conducting areas (6', 7'), wherein the insulating area (8') of the first of the two layers (2') is offset from the insulating area (8') of the second of the layers (2'). The aircraft has a chassis (10') on which at least one electronic board is mounted.

EFFECT: design of an electronic board which is reliable and has improved characteristics in terms of heat dissipation.

18 cl, 2 dwg

 

The technical field

The present invention relates to an electronic Board, which is designed, for example, to be integrated in the on-Board equipment of the aircraft.

Prior art

Currently known electronic circuit, shown schematically in figure 1, containing at least two superimposed conductive layer 2, which are separated from each other by an insulating layer 3.

Each conductive layer 2 contains at least one peripheral conductive section 6, and a work of the Central conductive section 7, is electrically connected with the electronic elements 4, 5 and separated from the insulating area 6 area 8, the dimensions and the material of which is selected so as to ensure satisfactory electrical insulation between the sections 6 and 7.

The material and dimensions of the layers 3 also are chosen in such a way as to provide satisfactory electrical insulation between layers 2.

On data cards insulating sections 8 are superimposed on each other and have a portion 11 of the intermediate insulating layer 3, which is located between two adjacent areas 8.

Summary of the invention

The present invention is the creation of electronic cards of the same kind, reliable, but with improved characteristics and in terms of heat dissipation.

To solve this task according to the invention proposed electronic Board containing at least two superimposed on each conductive layer and an insulating layer placed between two conductive layers, each of the two conductive layers has a working conductive area and a conductive area located on the periphery of the working conductive area and an insulating area, located between conductive parts, characterized in that the insulating area of the first two layers are shifted relative to the insulating area of the second of the two layers so that the part of the working conductive section of the first of the two layers is located to the right of the part of the insulating area of the second of two layers, and part of the peripheral part of the second of the two layers is located to the right of the insulating part of the plot of the first two layers.

The offset insulating sections of one layer relative to another allows, thus, bring the working conductive portion of one of the two layers which is electrically connected electronic components, which are sources of heat when they work) to a peripheral area of another layer. Insulating areas that are poor conductors of heat, no longer overlap each other; thus, the effect of thermal barrier, the light is p with layering in the same area these insulating sections, as is the case in the aforementioned circuit boards in accordance with the prior art, is substantially reduced, since the displacement of these sections of one layer relative to another can reduce the distance separating two conductive area (which are good conductors of heat), which are located on two different layers and against each other relative to the insulating sections, so that the heat transfer by heat conduction can occur between these parts from one layer to another.

Heat for scattering coming from electronic components and passed to the working conductive areas can thus more effectively discharged in the direction of adjacent layers.

Thus, the fee, according to the present invention, allows you to meet two requirements at the same time are the opposite, namely to achieve a good galvanic isolation and to maintain the ability of satisfactory heat dissipation.

This arrangement provides, therefore, improved heat dissipation, while avoiding the risk of overheating, thereby increasing the reliability of electronic equipment, in particular, in the case when it is located in a sealed housing, and the dissipation is in this text by the tea mainly by conduction.

It is preferable in the interests of simplicity and convenience in the manufacturing process and the practical application of the insulating areas mentioned two layers have the same dimensions.

Preferably, the above offset is essentially equal to the distance separating the conductive areas of the same layer.

Thus, the fee, according to the present invention are optimized in such a way that it facilitates the dissipation by reducing the distance between two conductive parts of two adjacent layers located opposite each other relative to the insulating areas, while ensuring adequate galvanic isolation; moreover, these layers are placed as close as possible to each other, but without overlap, to avoid the risk of capacitive coupling between the conductive layers, risking damage galvanic isolation.

According to another preferred distinctive features:

- the Board contains at least three conductive layers, insulating parts which are displaced alternately in one direction then in the opposite direction, from one layer to another;

- mentioned insulating parts made of epoxy resin;

- insulating layers made of an insulating material based on fiber;

- the width of the insulating area greater than the thickness izoliruyuscikh the layer;

the ratio between the width of the insulating area and the thickness of one insulating layer five; and/or

- for each layer work area is designed for electrical connection with the electronic elements.

The second aspect of the present invention is an aircraft comprising a housing in which is located, at least one Board, which was presented above.

Preferably:

- housing is a sealed enclosure and/or

at least one peripheral area of each electronic Board accommodated in the housing, electrically connected to the chassis of the aircraft.

Brief description of drawings

Summary of the invention now will be accompanied by a detailed description of an example of practical implementation, are provided for purposes of illustration, without limiting character, with reference to the accompanying drawings, on which:

figure 1 schematically depicts the electronic charge profile in accordance with the prior art;

figure 2 schematically depicts an electronic charge in section, according to the present invention.

Description of the preferred embodiment variants of the invention

Electronic Board 1'according to the invention shown in figure 2, includes a substrate Board (not shown), where the size of the network the set of conductive layers 2' (copper), between which are inserted layers 3', having a thickness d and is made of an insulating material on the base of fiberglass (for example, from a material known under the name "FR4").

In the above example, the card 1' is placed together with other cards of the same type in an airtight casing 10', which includes the Cabinet with the electronic equipment of the aircraft.

Each conductive layer 2' contains peripheral conductive section 6' and the work of the Central conductive area 7', the section 7' is separated from the section 6' insulating area 8'made of epoxy resin.

On the section 7' of the upper conductive layer are attached to the electronic elements 4' and 5', and they are electrically connected to this site or the bottom parts 7' through vias (not shown).

The peripheral section 6' is electrically connected to the chassis of the equipment or aircraft, with regard to section 7', it is isolated from the chassis section 8' so that this electronic circuit forms a current equipment, and the part that holds the active elements 4' and 5', isolated from the chassis.

The insulating sections 8' have a width D, which provides satisfactory electrical isolation between the sections 6' and 7' in the same layer 2', in particular in the case when this device will PR is changing at high altitudes, that is a case of airborne equipment in the field of aviation.

In the present example to provide 1600V isolation between the sections 6' and 7' in the same layer 2' width D is equal to 800 μm.

As for the distance d, it is chosen to provide satisfactory insulation between two adjacent layers 2', while maintaining a minimum overall dimensions. Such a distance less than the distance D, as used in this case FR4 material has a greater insulating capacity than the epoxy resin. In the present example, the distance d is equal to 80 μm, and the ratio D/d, therefore, is 10.

Obtained in this case isolation voltage Board/chassis is 500V.

Thus, this arrangement allows to achieve good isolation, and also to get good performance from the point of view of electromagnetic compatibility.

The electronic Board according to the present invention, the insulating sections 8' are shifted one relative to another by a distance equal to their width D in the direction alternates from one conductive layer to another, forming a structure in the form of a comb, as shown in figure 2.

Thus, the part of the working conductive section 7' of the upper layer 2' is located to the right of the insulating area 8' layer 2', which R is polagaetsa directly under it, and part of the peripheral area 6' of this layer is to the right of the insulating area 8' of the top layer.

This shift from layer to layer leads to the fact that each insulating section 8' is located to the right of the part of the conductive section 6' or 7' layer 2', which are directly adjacent; and these parts of the conductive sections in turn are located to the right of the insulating area 8' of the next adjacent opposite layer 2' and so on.

Thus, plot 6' layer 2' is located closer to the sections 7' adjacent layers 2', and the minimum distance separating this area 6' from sections 7' of the adjacent layers, is equal to the thickness d of the layer 3', as shown in figure 2 by the double arrow 9'.

Thus, the offset sections 8' between the layers is equal to the distance separating the sections 6' and 7' in the same layer, so that the two sections 6' and 7' are closest to each other, but not overlap each other, to facilitate heat dissipation, while avoiding effects (harmful galvanic isolation) capacitive connections between the sections 6' and 7' of the various layers.

The distance d is significantly less than the distance D, thermal conductivity is significantly better. Indeed, the heat is easily dissipated from one layer to another and to move from one plot 7' single layer of a section of 6' adjacent layer is, moreover, the minimum distance of insulating material (bad conductor of heat) to pass in this case is reduced to the value of d (the position 9') against distance equal to a value D in accordance with the prior art (i.e. the distance separating the two sections 6, 7 in the same layer).

Thus, in the Board in accordance with the prior art heat removal is carried out mainly in the plane of the layers (as shown in figure 1, horizontal) due to the strong thermal insulation, due to the juxtaposition of sections 8, while in the circuit Board according to the present invention, the offset sections 8' allows the dissipation across the plane of the layers (i.e. vertically, as shown in figure 2).

The heat can thus be much easier from one layer to another to maintain this Board within the acceptable temperature conditions to ensure the normal operation of the electronic elements.

Such boards are used, in particular, in the auxiliary computing devices in aircraft, where to provide the same galvanic isolation thermal resistance circuit Board is two times smaller when using patterns in the form of combs (figure 2), than when using the isolated patterns, made in the usual way (figure 1).

In addition such an arrangement in the form of combs does not result in additional production costs compared to the Board printed diagram. Thus, it remains, in particular, economical and practical in use.

In accordance with another alternative embodiment (not shown), the offset between the two insulating sections 8' of the two neighboring layers is less than the width D, resulting in only one part of the insulating parcel is located to the right from one part of the respective conductive areas.

In accordance with another variant (not shown), the offset insulating parcel is not in a variable direction from one layer to another, and always in the same direction, and/or the offset between the two insulating sections of two adjacent layers is greater than width D.

In accordance with another variant (not shown) insulating parts have dimensions that vary from one layer to another.

Depending on the requirements of other choices are possible, and in this regard it should be recalled that the invention is not limited to the examples that were presented and described.

1. Electronic Board containing at least two superimposed on each conductive layer (2') and is placed between these two conductive layers (2') an electrically insulating layer (3'), and each of the two conductive layers (2') contains the working conductive area (7') and a transfer section (6')located on the periphery of the working p is Bogashevo plot (7'), thus between these conductive parts (6', 7') posted by isolating the area (8'), characterized in that the insulating section (8') of the first two layers (2') is displaced relative to the insulating section (8') of the second of two layers (2') in such a way that the part of the working conductive section (7') of the first two layers (2') is to the right of part of the insulating section (8') of the second of two layers (2'), while the peripheral part of the plot (6') the second of two layers (2') is to the right of part of the insulating section (8') of the first two layers (2').

2. Fee according to claim 1, characterized in that the insulating sections (8') of the two layers have the same dimensions.

3. Fee according to claim 1, characterized in that the offset is essentially equal to the distance (D)separating the conductive areas (6', 7') of one layer (2').

4. Fee according to claim 2, characterized in that the offset is essentially equal to the distance (D)separating the conductive areas (6', 7') of one layer (2').

5. Fee according to claim 1, characterized in that it contains at least three conductive layer (2'), insulating sections (8') which are displaced alternately in one direction then in the opposite direction from one layer to another.

6. Fee according to claim 2, characterized in that it contains at least three conductive layer (2'), insulating sections (8') which are displaced alternately in one direction then in protivopul is mportant direction from one layer to another.

7. Fee according to claim 3, characterized in that it contains at least three conductive layer (2'), insulating sections (8') which are displaced alternately in one direction then in the opposite direction from one layer to another.

8. Fee according to claim 4, characterized in that it contains at least three conductive layer (2'), insulating sections (8') which are displaced alternately in one direction then in the opposite direction from one layer to another.

9. Card according to any one of claims 1 to 8, characterized in that the insulating sections (8') is made of epoxy resin.

10. Card according to any one of claims 1 to 8, characterized in that the insulating layers (3') made of an insulating material, fiberglass.

11. Card according to any one of claims 1 to 8, characterized in that the width (D) isolating section (8') greater than the thickness (d) an insulating layer (3').

12. Payment of claim 11, wherein the ratio of the width (D) isolating section (8') to the thickness (d) an insulating layer (3') is greater than five.

13. Payment of claim 11, wherein for each layer (2') work area (7') is intended for electrical connection with electronic components(4', 5').

14. The fee for item 12, characterized in that for each layer (2') work area (7') is intended for electrical connection with electronic components(4', 5').

15. Card according to any one of claims 1 to 8, characterized those who, for each layer (2') work area (7') is intended for electrical connection with electronic components(4', 5').

16. Aircraft comprising a housing (10'), which is at least one Board according to any one of claims 1 to 15.

17. Aerial apparatus according to item 16, characterized in that the housing (10') is sealed enclosure.

18. Aerial apparatus according to any one of p or 17, characterized in that the at least one peripheral area (6') of each electronic Board located in the housing (10'), electrically connected to the chassis of the aircraft.



 

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19 cl, 2 dwg

FIELD: electricity.

SUBSTANCE: circuit module is mounted with an integrating circuit, which modulates and demodulates a signal with several carriers. The circuit module has a multilayer circuit board, which is equipped with multiple conducting layers inside laid with insulating layers between them, and the integrating circuit, which is equipped with multiple grounding outputs, which are to be grounded. From multiple conducting layers a conducting layer, which is closest to the integrating circuit, forms a grounding layer, which is electrically connected with multiple grounding outlets.

EFFECT: increased reliability and protection against noise.

16 cl, 39 dwg

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