Piezoelectric multilayer component

FIELD: physics.

SUBSTANCE: piezoelectric multilayer component has a stack (1) of piezoceramic layers (2) and electrode layers (3) arranged one above the other. At least one piezoceramic layer is printed with a layer (4) structured according to a predefined configuration in a piezoelectrically inactive zone of the stack. The structured layer has at least one connecting element (4a) by which piezoceramic layers which are adjacent in the stacking direction are mechanically connected to each other with a first strength. The structured layer has interspaces (4b) filled at least in part with piezoceramic material of the adjacent piezoceramic layers. The adjacent piezoceramic layers in the interspaces are mechanically connected to each other with a second strength, which is less than the first strength.

EFFECT: longer extension and period of operation.

15 cl, 1 tbl, 4 dwg

 

The description of the piezoelectric multi-layer component, in particular a piezoelectric multilayer component containing piezoelectric layers, which can be intentionally partially debonded.

In many designs of piezoelectric multilayer component electrode layers are applied only to the portion of the piezoelectric layer. The remaining area on the piezoelectric layer, therefore, is electrically insulating in order to avoid a short circuit between the external contact and the electrode layer of opposite polarity. This area is free from the electrode layer may be included by reference as inactive area.

Because electrical operating voltage between the electrode layers of opposite polarity is applied only to the Central region, i.e. in the active zone of the multilayer component, only this Central region may expand due to the inverse piezoelectric effect, in this case, the piezoceramic layers arranged between the electrode layers of the same polarity, expanding to a lesser extent, the conditions for mechanical clamping can occur between the inactive area and the active area of the multilayer component. This effect clamping reduces the total expansion of the multilayer component, h is about creating a shortage for its application.

WO 2006/087871-A1 discloses a piezoelectric multilayer component containing side-mounted, causing cracks conductive layers.

One of the goals that must be achieved is to define a piezoelectric multilayer component, which has improved the length of the extension. An additional goal that must be achieved is to define a piezoelectric multilayer component, which has improved the length of the extension and remains functionally workable for a longer period of time.

Defined piezoelectric multilayer component containing the foot of piezoceramic layers and electrode layers arranged one above the other, with at least one piezoceramic layer, printed layer, structured according to a predetermined configuration in piezoelectrically inactive area.

The structured layer has at least one connecting element, whereby the piezoelectric layers, which are adjacent in the direction of stacking, mechanically attached to each other with the first strength.

The structured layer is along the connecting elements, the gaps filled with the piezoelectric material adjacent piezoceramic layers. Between the current can be filled with the piezoelectric material is completely or only partially, that is, with the remaining gaps. In this case, the mechanical connection between the adjacent piezoceramic layers in the gap or in the area of the gap along the connecting elements has a second strength which is less than the first strength mentioned above. In particular, the second strength of the mechanical connection between the adjacent piezoceramic layers is less than the strength of the mechanical connection between adjacent piezoelectric layers in the active zone of the multilayer component.

Because the span along the connecting elements of the structured layer filled in the piezoelectric material of the conditions to the adjacent piezoceramic layers, thereby mechanically joined to each other, the structured layer can also be considered as a continuous layer, that is, continuous or at least nearly continuous layer. In this case, the structured layer has a region that is mechanically attached to the adjacent piezoceramic layer with a higher strength than other areas of the structured layer.

The connecting elements of structured layers, in addition, ensure that the two piezoceramic layers, which are adjacent in the direction of the packaging from mechanical contact with each other in their line is built boundary areas in particular, to a multilayer component is not broken and is not destroyed during its manufacture, prior to the pressing of the package.

The structured layer is located at least in the inactive zone of the multilayer component, which is described to effect clamping. However, it can reach the active zone further within the multilayer component. Fasteners and also space them along, so we can reach the active zone of the multilayer component.

Due to the areas in which the adjacent piezoceramic layers in the inactive area attached to each other with reduced strength, piezoceramic layers may delaminate when operating voltage is applied to the multilayer component. They are fond of expansion of the multilayer component in the Central region or active area with a reduced resistance. Thereby, it is possible to avoid or at least reduce the effect of clamping between the active area and the inactive area of the multilayer component. Thus, it is possible to increase the overall length of extension of the piezoelectric multi-layer component, in particular, in the axial Central region of the package. Moreover, partial otseivaemogo piezoceramic layer in the inactive area at the expense of weaker mechanical connection that is, creates a useful result that the multilayer component is mechanically unloaded in relation to loads of stretching and/or clamping of conditions that could not happen unmanaged cracking within the package, in particular, between the two electrode layers of opposite polarities. Therefore, the duration of the functional capacity of the piezoelectric multi-layer component can also be increased.

In accordance with one variant of implementation, the structured layer comprises a cylindrical connecting elements, which could have a circular or polygonal profile. Alternatively, at least one connecting element is in the form of bars, with many lines, consisting of material printed on the piezoelectric layer, cross each other, and, in the process, cover the gaps filled with material adjacent piezoceramic layers.

In addition or alternatively, the connecting element structural layer may be ring-shaped.

In accordance with one embodiments of the multilayer component, a lot of the annular connecting elements of the structured layer are arranged along each other concentrically on a piezoceramic layer and connect SOS is DNA piezoceramic layers in the package to each other. Gaps filled with material adjacent piezoceramic layers are present along and/or between the annular connecting elements.

Regardless of the described embodiments, the connecting elements and/or areas filled with the piezoelectric material along them, can be molded in any desired manner. Preferably, the structured layer has many connecting elements, uniformly distributed over the piezoelectric layer. In this case, the aforementioned connecting elements can be arranged essentially uniformly and/or equidistant relative to each other.

The electrode layers of the package preferably contain one of the following materials and/or alloys of silver, palladium, Nickel, and copper.

Piezoceramic layers preferably contain ceramics based on lead zirconate titanate lead (PZT).

Preferably, the structured layer and/or the connecting element layer contained material, which is contained in the piezoelectric layer attached to it. In this case, undesirable chemical reactions, in particular, during the production of the multilayer component, between the structured layer and the piezoelectric layer attached to it, mainly avoided. In addition or as the e alternatives the structured layer and/or at least one coupling element contained by it, may contain metal, which is also contained in the electrode layer.

In accordance with one embodiments of the multilayer component, the structured layer arranged on the same piezoelectric layer and the electrode layer. However, it can also be configured on a different piezoceramic layer than the layer on which is arranged an electrode layer. This gives the advantage that, with a suitable mask, containing different configurations, in each case, as for the electrode layer and a structured layer, electrode layer and a structured layer of the type described can simultaneously be applied to the piezoceramic layer.

Preferably, the set of structured layers on multiple piezoceramic layers distributed over the height of the package of the multilayer component. The effect clamping, collectively reduced, thereby increasing the achievable length of extension of the piezoelectric multilayer component, mainly even more.

The electrode layers of the multilayer component is preferably attached to contact external contact, embodied as a layer, referred to the external contact is arranged on the outer section of the package, the cat is which is parallel to the direction of stacking. However, there are other forms of external contact, such as cable shape or form bus.

Piezoceramic layer printed structured layer may be a piezoceramic layer, already printed electrode layer. In this case, the structured layer is applied, preferably at a distance from the electrode layer on the piezoelectric layer along the aforementioned electrode layer.

Between the piezoceramic layers, the printed electrode layers, in accordance with one variant of implementation, many printed piezoceramic layers can be stacked in one package over the other. They are, in each case, can print out the structured layers of the type described.

Defined method for manufacturing a piezoelectric multilayer component, which is formed by the package electrode layers and printed piezoceramic layers. Piezoceramic raw leaves and the electrode material, respectively, are printed as a layer on such raw leaves, are involved in this case. During packaging, the piezoelectric sheets can be subjected to heat treatment and/or already contain additives, which promote their workability during production and/or transportation. Organic binders can b who be involved in this case.

Before laying in the package, at least one piezoceramic layer is printed, at least in piezoelectrically inactive zone in the respective edge region piezoceramic layer, layer structured with a predetermined configuration.

Predefined configuration of the structured layer printed on at least one piezoceramic layer creates a connection elements and the intervals between the last mentioned periods are notches or gaps. The connecting elements joining adjacent piezoceramic layers to each other during and after packaging.

At least one piezoceramic layer is preferably printed using the screen printing method. Squeezing the material through the holes or cutouts in the stencil creates a configuration, in particular the connecting configuration items. The material may be a piezoelectric material or a conductive material, particularly material that is also used for the electrode layers.

The package can then be pressoffice, from the condition that the piezoelectric layers are slightly softened, and their respective material flowed into the gaps or intervals of a structured layer arranged between them. More precisely, during extrusion was observed, Thu is under pressure and high temperature piezoelectric layers are softened enough to fill the gaps of the structured layer, at least enough to ensure that they are mechanically connected in the gap along the connecting elements. However, this causes the mechanical connection between the adjacent piezoceramic layers in the mentioned intervals, which is not as durable as mechanical connection between the piezoelectric layers, which are created by connecting elements during pressing.

The reason for the smaller second strength of the mechanical connection between adjacent piezoelectric layers in between is the fact that there connection is not achieved mainly through the power of pressing, but rather only by mixing and binding material of the piezoceramic layers, which occur at intervals suitable for this purpose.

Described objects are explained in more detail based on the following figures and exemplary embodiments. In this case:

figa shows a piezoelectric multilayer component in longitudinal section,

fig.1b shows a piezoelectric multilayer component on the side view in cross-section,

figa shows a side view in cross section region of a multilayer stack of structured layers that are superimposed on both the regional area od the night piezoceramic layer,

fig.2b shows a side view in cross section showing part of a multilayer stack of structured layers which are imposed separately on different piezoelectric layers

figs shows a side view in cross section showing part of the multi-layer package with lots of structured layers that are superimposed on a common piezoelectric layer and which are located exclusively in the inactive zone,

fig.2d shows a side view in cross section showing part of the multi-layer package with lots of structured layers that are superimposed on a common piezoelectric layer and which are located in the inactive zone and in the active zone,

file shows a side view in cross section showing part of a multilayer stack with a separate structured layers that are superimposed on different piezoelectric layers and arranged along the electrode layers

figa shows a top view of a structured layer with a cylindrical connecting elements,

fig.3b shows a top view of the shaped lattice structure layer, which is arranged on the piezoelectric layer,

figs shows a top view of a structured layer with a concentric structures,

figa shows a side view in cross section showing part of a multilayer stack with a structured layer before compaction package

fig.4b showing the pointed side view in cross section showing part of a multilayer stack with a structured layer during or after the molding of the package.

Figa shows a longitudinal section of a piezoelectric multilayer component that contains the package 1 of the piezoceramic layers 2 and electrode layers 3 arranged one above the other, with the space filled solely by the dielectric between the two electrode layers of the same polarity, forms an inactive area AZ, and a region which overlaps in orthogonal projection between the electrode layers of opposite polarities is an active zone AZ multilayer component, referred to the active area extends in the longitudinal direction when the applied operating voltage. Also shown external contacts 5a and 5b, embodied as layers, which are arranged in areas of the lateral surface of the multilayer component, which extend perpendicular to the piezoceramic layers 2. Many of the piezoceramic layers 2 can be provided between two adjacent electrode layers 3. External contacts 5a, 5b can be applied flame spraying a metal paste or applied galvanically to the area(s) of the side surface of the package.

Fig.1b - side view in cross section of the package 1, however, between the two electrode layers 3 that are adjacent in the direction of the packaging, assembled or stacked package on top of each other many piezoceramics the layer 2. Dashed lines in the figure show the boundaries between two adjacent piezoceramic layers.

Fig. 2a through 2e, respectively, show the field of multilayer component having a construction in accordance with Figo and fig.1b.

Figa shows, on the basis of the horizontal lines shown in bold, the provisions of structured layers 4 through which the piezoceramic layers 2, which are adjacent in the direction of stacking, mechanically attached to each other with less strength than they, also, attached to each other within the package. Each piezoceramic layer 2 overlay many of structured layers 4 located in the outer region of the piezoelectric layer 2. Mentioned structured layers preferably lie opposite each other on a common piezoelectric layer 2.

Fig.2b shows a view in section of a piezoelectric multilayer component according to figa, in this case, a single structured layer 4 is present on respectively one piezoceramic layer 2 between the two electrode layers 3 that are adjacent in the direction of the packaging.

That part of the package of the multilayer component, which is illustrated figs corresponds to the one in figa, but with the difference that the length of the structured areas with the OEB 4, parallel piezoelectric layer are smaller than in accordance with figa. In particular, structured layers 4 are arranged only in the inactive zones IZ (see figa) package 1, which nominally no, or only minimal long - held piezoelectric effect of the package occurs in the longitudinal direction.

Fig.2d - view in the context of the piezoelectric multilayer component according to Figo and figs, with two structured layers 4 are arranged in each case on a piezoceramic layer 2 placed between two electrode layers 3 that are adjacent in the direction of the packaging. The length of the space, the parallel piezoelectric layer structured layers 4 are larger than shown in accordance with the illustrations on figa and 2c, structured layers extend from the active zone AZ between the neighboring electrode layers 3 of opposite polarities, as long as the area of the side surface, on which may be arranged external contact 5a or 5b in accordance with figa.

Looking back on fig.2b, the length of the squares of structured layers shown there can be great just as much as described and illustrated in figs and 2d.

File shows a view in section of the piezoelectric mnogosloino the th component, in which the structured layer 4 in each case arranged on the same piezoelectric layer 2, and the electrode layer 3. In this case, the respective structured layers 4 are arranged only in the inactive zones IZ package 1 of the multilayer component. Themselves structured layers 4 are explained in more detail by the following figure 3 and 4.

Figa is a top view of a structured layer 4 having a cylindrical connecting elements 4a, which preferably have a round profile. The configuration of the structured layer printed on the piezoelectric layer, so is the configuration having the form of a rack connecting elements spaced apart from each other. The connecting elements 4a can be superimposed on the corresponding piezoelectric layer in this configuration, for example, by a screen printing method, the positioning of the connecting elements within the package can be arranged in accordance with the preceding Fig. 2a through 2e. Structured layers can be respectively arranged along the electrode layer 3 or along an unprinted region piezoceramic layer 2, for whatever reason, the area along the structured layer 4 is marked by both characters 2 and 3 in this figure. The connecting elements 4a are continuous and attached to the two pied is keramicheskom layers 2, which are neighboring in the direction of the packaging. That is, they are already in the condition of the package before it is subjected to pressing.

Structural layer contains one or multiple gaps or grooves 4b along the connecting elements 4a at least before you pressed the package.

Fig.3b shows having the form of a rack connecting element 4a structured layer 4, which is arranged in the outer region of the piezoelectric layer 3 and can last as much as external contact arranged in the area of the side surface of the package. This coupling design can also be printed on the piezoelectric layer by the screen printing method.

Figs shows an alternative implementation of a structured layer 4, structure or connecting elements 4a which are arranged in annular form and concentrically in the outer region of the piezoelectric layer 3. In particular, the respective connecting elements are rectangular.

The connecting elements 4a structured layer 4 can be printed on the desired piezoelectric layer 2 through suitably formed openings of the mask.

Ceramic or metal material can pressoffice through the stencil or through a mask, in order to set up, if appropriate the the desired structure on the piezoelectric layer.

Figa shows a longitudinal section of the foot, already shown by the previous figures, the region shown contains piezoelectrically inactive areas of the foot. The illustration shows a stacked adjacent piezoceramic layers 2, between which is arranged a structured layer 4. The latter contains many connecting elements 4a in the form of an upright cylinder or racks, whereby the respective piezoceramic layers already attached to each other. Gaps 4b are present along the connecting elements 4a. Intervals, before pressing, initially filled with air or a substance that can be removed during pressing.

Fig.4b shows the status area of the foot, shown figa, during or after pressing of the foot. Gaps 4b present even earlier, were filled by the material of the piezoceramic layers 2 meanwhile, due to the pressing operation, to be precise, so that there is a mechanical connection between the piezoceramic layers, through the gap or gaps along the connecting elements 4a. In this case, however, the strength that is created during the pressing of the mechanical connection in the region of the connecting elements, is still greater than that in the area of the gaps filled piezoceramic mA what eriala. When pressed, however, it is impossible to exclude the situation in which the gap along the connecting elements still has one or many joints. However, this does not change anything except in respect of circumstances that the mechanical connection of lower strength still occurs between the connecting elements in the mentioned period.

Area of the piezoceramic layers, in which the structured layers 4 are superimposed, can be larger, smaller or equal in size relative to the area of the insulating region between the electrode layer and outer contact of opposite polarity, which is arranged in the area of the lateral surface of the foot.

Structure, structure, or connecting elements of the structured layer can be composed of metal or an electrically non-conductive material, or at least to contain relevant material. These materials are preferably identical to those in the electrode layers or piezoceramic layers of the same piezoelectric multilayer component. It mainly helps to prevent extra chemical reactions between different materials of the multilayer component, in particular, during its production.

The number of piezoceramic layers, which are superimposed described structured slo is, can have a specified amount. However, a structured layer of the type described is superimposed on at least one piezoceramic layer. However, it is also possible that all of piezoceramic layers in multilayer components were printed structured layer.

The following table shows the preferred relationship between the sum of the areas of the connecting elements 4a of the structured layer and the sum of the squares of the periods 4b along the connecting elements.

The sum of the areas of the connecting elementsThe sum of the squares of the periods
Preferably, the101
110
More preferably21
14

List of symbols references

1 Foot, containing piezoceramic layers and electrode layers

2 Piezoceramic layer

3 Electrode layer

4 Structured layer

4a connecting element of the structured layer

4b Elapsed is it along the coupling element

5a, the First external contact

5b, the Second external contact

IZ Inactive area of the foot

AZ Active area of the foot

1. Piezoelectric multilayer component containing the stop (1) piezoelectric layers (2) and electrode layers (3), arranged one above the other, which
at least one piezoceramic layer printed layer (4), structured according to a predetermined configuration in piezoelectrically inactive zone (IZ) of the foot, and at the same time
the structured layer has at least one connecting element (4A)through which the piezoceramic layers, which are adjacent in the direction of stacking, mechanically attached to each other with a first strength, and at the same time
the structured layer has gaps (4b), filled at least in part of piezoelectric material adjacent piezoceramic layers and at the same time
the adjacent piezoceramic layers in between mechanically attached to each other with the second strength that is less than the first strength.

2. Piezoelectric multilayer component according to claim 1, in which the mechanical connection with the second strength between adjacent piezoelectric layers (2) in between (4b) occurred during the pressing of the foot of the multilayer component.

3. Piezoelectric mnogosloino the th component according to any one of the preceding paragraphs, in which the connecting elements (4A) contain standing cylindrical structure.

4. Piezoelectric multilayer component according to claim 3, in which the cylindrical structure at distances from each other in a uniform layout.

5. Piezoelectric multilayer component according to any one of claims 1 or 2, in which at least one connecting element (4A) contains the shaped lattice structure (4b).

6. Piezoelectric multilayer component according to any one of claims 1 or 2, in which at least one connecting element (4A) contains a ring-shaped structure (4b).

7. Piezoelectric multilayer component according to claim 6, in which the structured layer (4) contains a number of connecting elements (4A) in the form of multiple ring-shaped structures are arranged concentrically.

8. Piezoelectric multilayer component according to any one of claims 1 or 2, wherein the structured layer (4) contains the same metal contained in the electrode layers (3).

9. Piezoelectric multilayer component according to any one of claims 1 or 2, wherein the structured layer (4) contains the same material, which is contained in the piezoelectric layers (2).

10. Piezoelectric multilayer component according to any one of claims 1 or 2, wherein the structured layer (4) arranged on the same ro is termicheskom layer (2), that and the electrode layer (3).

11. Piezoelectric multilayer component according to any one of claims 1 or 2, wherein the structured layer (4) arranged on the other piezoceramic layer (2), rather than on the volume on which is arranged an electrode layer (3).

12. Piezoelectric multilayer component according to any one of claims 1 or 2, wherein the structured layer (4) is additionally printed on the piezoelectric layer (2) in the active zone (AZ) of the foot (1).

13. Piezoelectric multilayer component according to any one of claims 1 or 2, wherein a set of structured layers (4) on the set of piezoelectric layers (2) are distributed along the height of the foot (1).

14. Method for manufacturing piezoelectric multi-layer component, in which
form the foot (1) of electrode layers and printed piezoceramic layers (2),
at least one piezoceramic layer is printed in at least piezoelectrically inactive zone of the layer (4), structured with a predetermined configuration, and
predefined configuration printed structured layer creates a connection elements (4A)that mechanically connect adjacent piezoceramic layers and gaps (4b), which are present along the connecting elements,
stop is pressed so that the adjacent piezoceramic layers are softened, and the x corresponding material flows into the gaps (4b) of the conditions, to the mechanical connection between the adjacent piezoceramic layers in between is not as durable as mechanical connection between the piezoelectric layers, which is created connecting elements during pressing.

15. The method according to 14, in which the structured layer (4) is printed on at least one piezoelectric layer (2) by means of screen printing method.



 

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2 cl, 2 dwg

FIELD: electricity.

SUBSTANCE: radiator of plane ultrasonic wave represents coaxial construction containing the set of piezoelements in the form of plane rings, which is enveloped on two sides with parts made in the form of bushes. In holes of piezoelements and bushes, along the construction axis there arranged is resonant waveguide acoustic transformer. This transformer serves as tie bar as well. At that, projection of connection of tie bar and the second bush to radiator axis includes the point belonging to the plane of equal amplitudes of coupled vibrations of itself and the construction tied with it if it can be assumed solid and when there is no that connection. Radiator can include several sets of piezoelements alternating with bushes and tied with common tie bar, which increases mechanical radiation power proportionally to the number of those sets.

EFFECT: increasing efficiency owing to decreasing energy losses in mechanical connections of its vibrating system.

1 tbl, 4 dwg

FIELD: electricity.

SUBSTANCE: piezoelectric drive with 3D packet piezoelement for installation on basic structure has at least one surface of packet piezoelement, which is exposed to 2D or 3D profiling perpendicularly to layers of packet, and this at least one profiled surface is fit to circuit of basic structure, at which drive should be installed.

EFFECT: invention provides for high capacity of piezoelement and piezoelectric drive with simultaneous elimination of piezoelement damage risk in process of installation onto part.

17 cl, 12 dwg

FIELD: electricity.

SUBSTANCE: piezoelectric device consists of a number of stacked layers of piezoceramic material. Each layer has two flat inner electrodes with engagement factor less than 100%; they contact in sequence with either left or right external electrodes which are located at side wall of the device. The device also contains additional uniformly distributed layers of material with high thermal conductivity, for example, aluminium nitride (AlN), beryllium oxide (BeO) or silicon carbide (SiC) or similar materials. Thickness of additional layers is not less than thickness of piezoceramic layers. Number of additional layers is determined by ratio for product of thickness, number of layers and thermal conductivity of main and additional layers.

EFFECT: reduction of inner temperature gradients, improvement of reliability and operating life.

2 cl, 1 dwg

FIELD: physics.

SUBSTANCE: acoustic line is made in form of a rectangular prism. Further, optically antireflecting coatings are deposited via vacuum deposition onto the faces of the rectangular prism. A first adhesive layer is then deposited on one of the faces of the rectangular prism by vacuum deposition. Using vacuum deposition, a first gold layer is deposited on said first adhesive layer. Further, a first indium layer is deposited on said first gold layer by vacuum deposition. Also, using vacuum deposition, a second adhesive layer is deposited on one of the larger faces of each of two plates made from lithium niobate of the (Y+36)-section. Using vacuum deposition, a second gold layer is then deposited on said second adhesive layer. Using vacuum deposition, a second indium layer is deposited on said second gold layer. The acoustic line is the joined with the lithium niobate plates by pressing the lithium niobate plates with the pressure of each lithium niobate plate of the second indium layer to the corresponding first indium layer. Each of the lithium niobate plates is then ground off to the required thickness which corresponds to the operating frequency band. Using vacuum deposition, a third adhesive layer is deposited on each free large face of each lithium niobate plate. A third gold layer is then deposited on said third adhesive layer via vacuum deposition. The method is characterised by that the acoustic line material used is a TeO2 monocrystal, wherein the faces of the rectangular prism are directed perpendicular to the crystallographic direction [001], , [110], and deposition of optically antireflecting coatings is carried out on faces of the rectangular prism which are perpendicular to the the crystallographic direction ; when joining the lithium niobate plates to the acoustic line, the projections of polar axes of the lithium niobate plates are directed onto the same plates in opposite sides; the first adhesive layer is deposited on one of the faces of the rectangular prism (001); the first, second and third adhesive layers are made from chromium; said pressure lies in the range of 50-100 kg/cm2, during at least part of the time when the lithium niobate plates are pressed to acoustic line; voltage of 10-50 V is applied across each lithium niobate plate at antiresonance longitudinal vibrations of the corresponding lithium niobate plate for 1-3 minutes; the resulting workpiece, which is in form of an acoustic line with antireflection coatings, first adhesive layer, first gold layer and first indium layer lying successively on the acoustic line, and successively lying second indium layer, second gold layer, second adhesive layer of one of the lithium niobate plates and the lithium niobate plate itself, as well as the nearby successively lying second indium layer, second gold layer, second adhesive layer of another lithium niobate plate and the lithium niobate plate itself, as well as the third adhesive layer and third gold layer lying on each of said lithium niobate plates, is cut into separate elements in parallel to planes (110) of the TeO2 monocrystal.

EFFECT: high efficiency of the device while simultaneously increasing efficiency of the manufacturing process.

1 cl, 3 dwg

FIELD: physics.

SUBSTANCE: piezoelectric multilayer component has a stack (1) of piezoceramic layers (2) and electrode layers (3) arranged one above the other. At least one piezoceramic layer is printed with a layer (4) structured according to a predefined configuration in a piezoelectrically inactive zone of the stack. The structured layer has at least one connecting element (4a) by which piezoceramic layers which are adjacent in the stacking direction are mechanically connected to each other with a first strength. The structured layer has interspaces (4b) filled at least in part with piezoceramic material of the adjacent piezoceramic layers. The adjacent piezoceramic layers in the interspaces are mechanically connected to each other with a second strength, which is less than the first strength.

EFFECT: longer extension and period of operation.

15 cl, 1 tbl, 4 dwg

FIELD: physics.

SUBSTANCE: invention relates to making magnetoelectric converters used as a base for magnetic field sensors, microwave electronic devices, for magnetoelectric information recording technology and for electromagnetic energy and vibration energy storages. The method involves forming a stack of alternating magnetostrictor and piezoceramic layers. Said stack is formed in three steps: first, electroconductive contacts are deposited on the entire surface of magnetostrictors; all surfaces of magnetostrictors and piezoceramic, except end surfaces, are coated with a layer of electroconductive epoxy adhesive, after which a stack of alternating magnetostrictor and piezoceramic layers is formed. The layers are joined by pressing at temperature of 60-100C and excess pressure of (1.3-2.6)105 Pa. The multilayer ceramic heterostructure contains 9-11 magnetostrictor and piezoceramic layers. The piezoeceramic layer has thickness of 0.10-0.13 mm and the magnetostrictor layer has thickness of 0.25-0.30 mm.

EFFECT: low power consumption and high sensitivity.

2 cl, 2 tbl, 4 dwg

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