Method of producing woodchip board and woodchip board with glossy coat from laminar material

FIELD: process engineering.

SUBSTANCE: invention relates to method of producing woodchip board with glossy coat from laminar coat. Proposed method comprises polishing woodchip board flat wide side and differs from known procedures in that it includes the following jobs: leveling, without chipping, of polished flat wide surface by compacting it by means of cylindrical or plate leveling body with its leveling surface heated to, at least 100 °C, or has this temperature, applying coat on leveled surface by direct application of glossy coat from laminar material.

EFFECT: lower costs.

22 cl, 2 dwg

 

The technical field

The invention relates to a method for producing chipboard with a brilliant coating of layered material in which at least flat wide side of the chipboard is polished before application of a coating of the laminate and also wood-shaving plate, preferably, the chipboard, coated with high-gloss finish laminate.

The level of technology

For coating chipboard, there are a variety of ways. In the field of furniture and interior decoration along with the liquid coating paints and varnishes traditionally used along with lamination and powder coatings the coating of the layered material.

The coating of the laminate is also known in different ways. These methods include the application of several layers of paper impregnated with synthetic resin, usually melamine, melamine-urea-formaldehyde or phenolic resin. While layers of paper can be any color and can contain any printed decors, such as wood decors or fantasy decors. Then at high pressure and temperature such layers of paper pressed either directly (DPL: direct pressing of layered materials), or just pic the e processing in the so-called laminate with wood-shaving plate (HPL: layered materials with a high degree of compaction, or CPL: layered materials extrusion).

In order to improve the wear resistance of the coating of the layered material can be optionally provided top layer of paper, containing, for example, solid particles, such as corundum. The application of the layered materials can be obtained chipboard with a very durable surface. However, this method of applying a coating of layered materials is due to the necessity of application of two-stage pressing more time-consuming than direct coverage (DPL), and therefore more costly. In most applications chipboard, for example in the furniture industry and interior decoration, plate, refined method of directly coating, have sufficient wear resistance, is used For this purpose, as a rule, paper, impregnated with melamine resin.

Layered materials and coatings performed on technologies DPL (direct coating), are usually periodically using single or multi - story presses or continuously using dvuhnitochnyj presses.

Recently, reflective surfaces are increasingly popular for finishing furniture and interior decoration.

To obtain a particularly brilliant coating of the laminate up to the present time is needed, so after pressing was carried out cooling with heating temperature. This means that after proper compaction at high pressure and high temperature requires a sharp decrease in temperature while maintaining the pressure. In addition, it requires brilliant pressing sheets or appropriate lining. This assumes, of course, the use of specially designed for this purpose, the pressing device, which is possible only with great expenditure of energy. To prevent contamination of particularly high-quality surfaces and pressing sheets or pads required cleanliness in the room. In accordance with this and use a different pressing tools must be accompanied by compliance with maximum purity. Fingerprints or dust particles on the surfaces of the press plates or linings able in a very short time to produce a coating of layered material that does not meet the requirements of the first grade, or even to marriage, is not suitable for distribution.

Gloss is an optical property of the reflective surfaces. Physically, Shine characterize through private from a fraction of directional and diffuse reflections falling on the surface of the quantity of light. He can be quantified by a gloss meter; detailed summarized what I described in the standards DIN 67530, ISO 2813. For plates with direct coverage determination gloss is given in the European standard EP 14323 (latest release 2004-06-01). According to him, the gloss should be determined by the so-called domain reflectometer according to ISO 2813. The principle of the reflectometer based on the measurement of directional reflection. This is measured reflected light intensity in a narrow range of the reflection angle. The results of the measurements are not correlated with the amount of light emitted, and black polished standard body with a given refractive index (1,567). For such a standard body established measurement equal to 100 units of brilliance (or points sheen). There are surfaces of materials that have a greater refractive index than that used for calibration standard black body. Therefore, for certain material surfaces indicators gloss make over 100 units, such as polished metals. For a better differentiation of the measured values depending on the gloss measurements are made at different angles. According to ISO 2813 for shiny surfaces (≥70 gloss unit) in addition to the usual measurement geometry measurement 60° conduct measurement in geometry 20°. However, the following values refer only to the results of the var is measured at the measurement geometry 60°.

Disclosure of inventions

The basis of the invention is to provide a method of coating chipboard, in particular chipboard. The technical result achieved in the way that is that can be obtained at low cost chipboard with shiny surface of the layered material. In particular, the basis of the invention lies task is not expensive manufacturing chipboards with shiny surface of the layered material.

The technical result is achieved in the way with signs of paragraph 1 of the claims or chipboard plate with signs 17 formulas. Preferred embodiments of the invention are given in the dependent claims.

The method according to the invention, in which a chipboard has at least one flat wide sanding side, has the following working operations: alignment without removing the chip sanded flat wide side by compaction using a cylindrical or lamellar alignment of the body, smooth the surface which is brought to a temperature of at least 100°C. or has a temperature of at least 100°C., and the coating aligned on the wide side of the press-fitting shiny coating slays the second material in the form of direct coverage.

In accordance with this chipboard plates according to the invention, preferably obtained from chipboard, gets a brilliant cover of the layered material, deposited by direct coating on the aligned strand wide side of chipboards and characterized by the degree of gloss of not less than 105, in particular not less than 110, preferably not less than 115 units of gloss measured according to ISO 2813 at the measurement geometry 60°.

Under a brilliant coating of layered material is meant a coating of layered material, which is caused by direct coating and which is associated with at least one flat wide side chipboards, is characterized on the whole surface or part of at least 80%, preferably at least 90%, preferably at least 95%, at square 1 m2flat wide side of the chipboard gloss of not less than 105 units when measured according to ISO and measurement geometry 60°.

The applicant found that chipboard with shiny surfaces of the layered material can be manufactured at low cost in the case when the respective broad side of chipboards after grinding and before coating (press impregnated with melamine resin is layers of paper) is aligned. Unlike conventional grinding alignment is performed without removing the chip. While in contact with a flat surface with a constant temperature is achieved the effect in which wood fibers or chips, the speakers after grinding on the surface, plastifitsirujushchih and roll. Thus, on the one hand, is secured a position in which substantially eliminates small protrusions formed of wood fibers or chips previously on the surface of the plate, with the result that such projections no longer come into the applied layer of resin, and, on the other hand, when the alignment occurs ordered the seal surface, which leads to the formation on the surface of a uniform film of the applied coating resin. These both conditions significantly increase the gloss level after the final coating of the plate.

Alignment without removing the chips are ground flat wide side of the chipboard through the alignment of the body can be carried out by the method according to the invention periodically or continuously. To align chipboard different length and to minimize the expenditure required for leveling the power leveling polished wide side of the chipboard is preferably C is erevna using, for example, even with a constant temperature of the platen.

Used as a leveling roller body should Nestle in the process according to the invention to align the wide side with a force of from 200 to 1000 N/cm width of the plates, preferably from 450 to 750 N/cm width of the plate. Alignment without removing the chip is held by one or more successive rollers.

It is also proposed that the alignment surface of the alignment body had a constant temperature is preferably in the range from 150 to 240°C.

Experiments using heated to 200°With rollers, which are pressed against the plate with a force of about 350 N/cm width of the plate, accompanied by getting noticeably smoother and denser surface than the surface of the plates only after grinding. For comparison it should be noted that during the experiments with non-aligned plates Shine was 88 points, while for plates after equalization and similar coating gloss was, in particular, of 106 points.

When the circumferential speed of the roller with a constant temperature may correspond to the rate filing align chipboard. Roller with a constant temperature can be used as a transporting roller for feeding wood-strue the offered plate. According to an optimal implementation of the method according to the invention for aligning polished chipboard can also be relative movement between the plate or cylindrical alignment tool and align the wide party chipboard. This increases the efficiency of the alignment tool. In case of application of the leveling roller with a constant temperature is rotating in a variant implementation of the method at a peripheral speed which is greater than or less than the rate filing align chipboard, resulting in between the flat contact surface with constant temperature (peripheral surface) of the roller and in contact leveled surface chipboard slippage occurs.

Maintaining constant temperature of the compensating body or leveling roller should not be achieved by supplying heat or similar energy. On the contrary, in the framework of the invention provides that the temperature is constant alignment surface of the alignment body or leveling roller was achieved due to friction between the alignment body and align the wide party. Heating the alignment surface corresponding friction with the hat not less than 100°C, preferably at least 150°C.

An alternative implementation of the method according to the invention is characterized by the fact that they measure the temperature of the alignment surface of the alignment body or the temperature leveled the broad side of chipboard, compare the measured temperature with the set temperature and the relative movement between aligned wide side and the alignment surface of the alignment of the body and/or the force with which the alignment body is pressed to align the wide side, is adjusted depending on the measured temperature. Thus, particularly securely and automatically achieves the desired alignment chipboard.

The use according to the invention technologists DPL (direct coating) for applying a decorative coating of layered material aligned without removing the chip wide face chipboard provides compared with HPL coating (at high pressure) above the technological and economic advantages.

Rapid cooling from the heating temperature, which is required when using the traditional method of obtaining a shiny coating of the laminate while maintaining the pressure, in the method according to the invention is not required. SL is therefore the method according to the invention also provides advantages in cost, as the design and management used for implementing the method according to the invention the press for coating easier and higher productivity productivity press coating, pressing tools which are equipped with a cooling device. Therefore, according to the preferred variant of the method according to the invention is pressed onto the chipboard plate shiny coat laminate is not subjected to forced cooling inside the press.

The method according to the invention can be applied to fiberboard medium density and particle boards in the same degree. However, it is the most efficient method when using chipboard, since their production is significantly cheaper compared to fibrous plates of average density, which, on the other hand, in principle more suitable for direct coating shiny layered materials than chipboard. More precisely, the method according to the invention creates a prerequisite for the production of cheap chipboard pressed direct coating brilliant layered material.

Another benefit from the use of chipboard compared with fibrous plates CPE is it density is it is possible to perform the grinding particle boards directly after pressing and short cooling (about 10-20 minutes). Fibrous plates medium density must be maintained after hot pressing in 2-5 days in stock for ripening for your grinding and further processing. This fact adversely affects the logistics of production and cost due to the need for storage capacity and long-term immobilization of investments in stock ripening.

According to another variant implementation of the method according to the invention for covering chipboard with the aim of obtaining chipboard with a shiny coating surface of the laminated material is provided to apply or was manufactured multilayer Board, consisting of a middle layer of larger chips and top layers of relatively fine shavings.

In the course of the experiments were made laminated chipboard with a high content of relatively small chip. With the addition of chips in top layers in excess of 5-7% of the number of chips in the chip plates, containing on average about 60% of the large chip in the middle layer and about 2×20% smaller chip in top layers, with the same number of the connection is the pollutant specific and identical to the thickness of the plate appeared, that smaller chips were on the surface. The surface of the chipboard, contained in the coating layers of the increased share of the chips, after alignment has been particularly smooth and dense. After the final coating plates gloss additionally increased at least 3 points.

In the process according to the invention preferably as chipboards produced or used particle Board containing layers with different distribution of chips in length, and contains a middle layer with a maximum distribution of chips in length from 8 to 15 mm and top layers with a maximum distribution of chips in length from 3 to 8 mm, with the proportion of chip length less than 6 mm in strand material of the coating layer is not less than 75 wt.%, in particular at least 80 wt.%, preferably at least 90 wt.%.

In addition, when implementing the method according to the invention is preferably used as chipboard particle Board containing layers with different distribution of chip thickness, and also contains a middle layer in which the maximum distribution of the chip is achieved when its thickness from 1.0 to, 4.0 mm, and the coating layers, in which the maximum distribution of the chip is achieved when its thickness is from 0.1 to 0.8 mm, with the proportion of chips is a thickness less than 0.6 mm in strand material of the coating layer is not less than 75 wt.%, in particular at least 80 wt.%, preferably at least 90 wt.%.

However, the method according to the invention is effective in the case of applications for a single layer of chipboard. During the experiments it was found that to obtain as flat surface and high gloss coating of the laminate, as in the case of applications for single-layer plates and sandwich plates, in particular three-layer particle boards, it is advisable, according to a preferred variant of the method according to the invention was applied strand Board, particle Board material which share the chips with a thickness of 0.6 mm was at least 50 wt.%, in particular at least 65 wt.%, preferably at least 80 wt.%. In particular it is also advisable in order to implement the method according to the invention was made or applied strand Board, particle Board material of which the share of chip length less than 8 mm was at least 50 wt.%, in particular at least 65 wt.%, preferably at least 85 wt.%.

Particularly positive results were obtained in experiments in which instead of chips for the coating layers were applied exclusively sawdust, compared to the usually prepared sawdust, which can sometimes appear insignificant pollution and bark, were completely cleared the impurities. The surface of these contained only sawdust coating layers was particularly flat and uniform. For such particle boards with final floor it was possible to clearly state an additional increase gloss.

The amount of binder in the experiments were used constant, however, due to the increase in the share of relatively small chip in top layers of this amount is inevitably increased, as the shavings coating layers contains more binder than in larger chips of the middle layer. However, it can be expected that the increase of the proportion of binder in the coating layer, for example, 3% of absolutely dry mass increases the gloss level of at least three points (units of Shine).

In the process according to the invention it is preferable that the proportion of binder in the coating layers of chipboard from absolutely dry mass of the chip cover layer was not less than 10 wt.%, in particular not less than 12 wt.%, preferably from 15 to 25 wt.%.

Sanding chipboard, preferably chipboard, according to the method according to the invention is usually carried out at least in three stages. Indicators grit grinding material used at different stages, coordinated. It was found that at last, extremely fine grinding using, for example, grit 180 additional improvement does not occur. In this case, the alignment provides the advantage that it is possible to forego the use of particularly high-quality polished slabs. Therefore, according to a preferred variant implementation is provided, so that has to be cleared by the wide side of the chipboard before alignment without removing the chips were polished in several stages, the last of which grinding is carried out using the grain size is not more than 180, preferably not more than 120.

An alternative implementation of the method according to the invention is that the wood-shaving plate move along the grinding tool, this has to be cleared wide side is polished before alignment without removing the chip additionally by at least one transverse grinding relative to the direction of movement of chipboard along the grinding tool. The result is a further increase of the degree of glitter chipboard after the final coating of the layered material.

According to the following variant of the method according to the invention provides that has to be cleared because the side of the chipboard and/or smooth the surface of the alignment body moisten before alignment. This method further improves the required smoothness chipboards, it results, in which the degree of brilliance of the brilliant coating of the laminate on chipboard plate, preferably the chipboard, increases by an additional three units. The reason for this increase Shine can be explained by the fact that accidental wetting humidity alignment is vaporized and the vapor increases heat transfer and/or that the wetted surface of the chipboard for a short time becomes more plastificated or deformed, resulting in the protruding fibers and/or flakes can more easily otaplivalsya in the structure of chipboard.

Brief description of drawings

The invention is illustrated using examples with reference to the attached drawings, on which:

figure 1 - example of the method according to the invention in the form of a flowsheet

figure 2 - plot of chipboard according to the invention in cross section.

The implementation of the invention

Chopping solid wood in the trunks and branches of trees first produce chips. From the thus obtained chips and/or other ground wood materials prepare the wood chips. Removing the chip is notable corresponds to the moisture content of the wood, which, depending on the origin of the tree and the time of year can range from 60 to 150% of the dry wood mass. Then the wood chips are dried to a moisture content of from about 1.5 to 3% by screening or other appropriate sorting method, such as air separation, separated into fractions for top layers and middle layers.

The maximum chip thickness for medium layer is from 1.0 to 4.0 mm, the Maximum chip thickness for the coating layer is from 0.1 to 0.8 mm in Addition, the share of chip thickness less than 0.6 mm in strand material of the coating layer is not less than 75 wt.%, preferably at least 80 wt.%.

Before or after screening (sort) wood chips clear of impurities such as metal particles and/or rock particles. To do this, the wood chips go through about electromagnets. Department stone particles is carried out using a sorting device density, for example by using an air separator or gravity pipe, in which the falling wood chips is deflected sideways by the blower, while the relatively heavy stone particles are not deflected or deviated slightly and thus are separated from the chips.

Then the chips for the top layer and middle layers separately cover binder. As a binder, the use of AESA preferably urea-formaldehyde resin and/or phenolic resin. In binder type curing agent, a wetting agent (paraffin) and, if necessary, additives (e.g., fungicidal agent and flame retardants). Glue chips are made in the mixer or a spray. While wood chips covered with a very thin layer of the binder.

After application of the binder chips for coating layers contains this substance in an amount of from 15 to 25 wt.% from the absolutely dry weight of the chips.

After application of the binder wood chips plank flooring machine in the form of a multilayer, located in the middle of the plate essentially mirror-symmetrical particle cake. Preferably it is made of three-layer particleboard cake, consisting of the lower cover layer with small chips, the middle layer with larger chips and the upper cover layer with small chips (figure 2). However, the multilayer structure may not be used fully, in that case finally pressed chipboard say about one-layer particle boards.

Hot pressing of chip cake when exposed to pressure and temperature, curing the binder receive strong particle Board, meets the requirements of the European standard 312-3.

Hot pressing of chip cake can be in the bottom or multi - story press (press (periodic action). To do this continuously formed chip cake is cut with the cutting tool on the gauge length. Preferably, hot pressing chip cake was made in a continuously operating press with double tape (so-called "Conti-Roll-Presse). The separation of chip cake in linear dimensions is in this case only after the pressing process.

Preferably, the initially relatively loose chip cake before the actual process of pressing a pre-compacted (pre-pressed) in the press. The advantage of pre-compaction is that the heat in the main press or at the end of the press quickly moves to located in the middle of the chip, resulting in uniform heating of the entire chip and, therefore, the effective setting of the binder. If necessary, pre-sealing is carried out under the action of heat, while the contact surface of the press, communicated, for example, to a temperature of about 50°C.

In the main press or at the end of the press with double tape on the particle cake is affected by temperature more than 200°C and a pressure of, for example, about 25 kg/cm2. Under the influence of high temperature in the press binder is activated and cured.

For press with double tape technology is tallavaara endless strand Board is cut into individual plates of a given length. Along with cutting to length preferably is a scrap chipboard, as a result of which it becomes direct, located at a right angle edge. Pruning is carried out, for example, using a parallel between the circular saws. Then cooling provided by a separate Board (OSB). The cooling Board (OSB) is preferably carried out in the so-called star of the agitator, in which particle Board, without any contact between them, moving around the axis of rotation of the agitator, with chipboard captured and transferred radially protruding from a body of rotation stellate agitator bearing rods. Provided for chipboard cooling time is from about 10 to 30 minutes, preferably from about 10 to 20 minutes.

After that, particle Board, grind, and grind, at least one wide side of the corresponding particle Board. However, it is preferable to grind both the broad side of a corresponding particle Board. Grinding is carried out, at least cylindrocladium machine and/or on a grinding machine with a wide ribbon. Cylindrocopturus machine contains rotating around its own longitudinal middle axis of the cylinder on the lateral surface of which is fixed abrasive paper. Grinding mill is to wide tape, on the contrary, contains an endless grinding belt, moving through several rollers, between at least two rollers is located, the presser plate, which endless grinding belt is pressed against the sanding wide side of the chipboard.

In the process according to the invention it is preferable that the grinding chipboard or particle Board was held, at least one grinding machine with a wide ribbon.

Grinding the respective broad side of chipboard or particle Board is carried out in several stages, starting grinding with a relatively large grain size of, for example, 40. In the subsequent grinding processes used sanding paper or sanding belt with smaller grain size. Last grinding is performed when the grain size is not more than 180, preferably not more than 120.

In addition to the grinding carried out in the direction of chipboard (the conveying direction) along the grinding machine with a wide ribbon or cylindrocopturus machine, it is expedient to provide at least one grinding produced perpendicular to the direction of movement of the endless grinding belt or perpendicular to the direction of movement of chipboard square is you (transverse grinding). Due to the cross grinding can significantly increase the effect of grinding. In particular, when the transverse grinding reduces the amount of dust from sanding with a given number of grinding processes.

Immediately after sanding chipboard is its exposure to warehouse for aging. During this time interval a chipboard comes in accordance with the humidity of the ambient air. The exposure time for the chipboard is from 2 to 4 days.

Then sanded smooth wide side particle Board or chipboard level without removing the chip through the seals using at least one leveling device. The leveling device includes at least one cylindrical or lamellar alignment of the body, smooth the surface of which is maintained at a constant temperature. For this smoothing body pressed to align the wide side particle Board or chipboard.

Preferably, in order to align the applied metal rollers, polished lateral surface of which is heated to a temperature of at least 150°C., for example up to about 200°C. and pressed at the top and bottom to chipboard plate with a force of from 450 to 750 N/cm width of the plate. During match what their experiences were obtained noticeably smoother and more dense surface plate, than the surface of the polished slabs. It is preferable to carry out the alignment without removing the chip using several sequentially arranged in the direction of the feed rollers.

On aligned so the broad side of the chipboard then put a brilliant cover of the layered material, which zapressovyvajut directly on the corresponding aligned wide face. Direct coating chipboard is conducted periodically. A brilliant cover of the layered material may contain the décor of wood, stone, fancy or plain decor without pattern (universal decor).

Chipboard, in particular particle, plate, obtained by the process according to the invention during the experiments and is equipped with a high-gloss finish laminate technology DPL, had a gloss of not less than 105 units (points) gloss measured according to ISO 2813 at the measurement geometry 60°. If this were also obtained, in particular, sparkly chipboard coated laminate, gloss which amounted to more than 110, in particular more than 115, gloss unit.

Figure 2 schematically shows a section chipboard according to the invention, which is a particle Board with the above-described distribution chip on its length and thickness. The transition from the middle layer 1 to the cover layers 2, 3 chipboard shown by the dashed line. Polished and then aligned without removing the chip wide side particle Board have a shiny coating 4, 5 of the layered material.

Figure 1 shows the basic operation and some preferred optional operation method according to the invention in the form of flow charts. According to this scheme, the first pick or manufacture of wood particle Board, preferably particle Board, with the above distribution of chips in length and thickness. At least one or both broad sides of the chipboard then grind in one or several passes. Polished wide face clear of grinding dust and moisten before the subsequent alignment without removing the chip. For wetting can be used, for example, water. However, as the wetting agent may be appropriate application of the solution or emulsion. This may be moistened respectively align the wide side and/or the alignment surface of the alignment body. The invention also provides, if necessary, in the wetting agent were added, one or more additives to further improve the leveling effect or to improve the adhesion of nanos is ICDO then coating of the laminate to the surface of the chipboard. In addition, this method can provide economical use of impregnating resin.

Wetting can be done very simply by spraying, preferably by thin spray in the form of a mist on the front of the leveling device, in particular before levelling roller. Already very small amounts of moisture or wetting agent are sufficient to provide improved alignment effect. Preferably the amount of the applied lubricant is from 2 to 20 g/m2preferably from 2 to 10 g/m2.

After wetting polished wide face chipboard level without removing the chip by seals. For this purpose, preferably the alignment roller, leveling the surface of which has a temperature of at least 100°C. the Maintenance of a constant temperature levelling roller or smoothing body is provided, for example, by activating the built-in leveling roller resistive heating elements, or as a result of friction between the alignment surface of the alignment of the body and align the wide party.

Optional temperature the alignment surface of the alignment of the body and/or the temperature leveled the broad side of chipboards can be measured is compared with a preset temperature indicator to control the alignment process. So, for example, at too low a temperature compensating body or leveling roller to increase the speed of the relative movement between the wood-shaving plate and the alignment surface of the alignment body (preferably the leveling roller and/or the contact force equalizing body to align the surface. Temperature measurement of the alignment surface of the alignment body or aligned with the broad side of chipboard is carried out preferably by a non-contact temperature sensors.

After alignment without removing the chips are aligned on the wide side of the chipboard is applied with a brilliant cover of the layered material. Finally, a chipboard with this coating is subjected to further processing without forced cooling, for example, is cut into smaller formats, and temporarily stored in the warehouse (figure 2).

The implementation of the invention is not limited shown in the drawings example. On the contrary, there are many options, applicable also when different implementation of the inventive concept shown in the attached claims.

1. The method of obtaining chipboard with a brilliant coating of layered material in which wood-shaving plate with at least one the second flat wide side grind on this side, characterized in that it includes the following operations: alignment without removing the chips are ground flat wide side by compaction using a cylindrical or lamellar alignment of the body, the alignment surface is heated to a temperature of at least 100°C. or has a temperature of at least 100°C.; coating aligned on the wide side of the press-fitting shiny coating of layered material by direct coating.

2. The method according to claim 1, characterized in that shiny coat of laminate, pressed wood particle Board, not subjected to forced cooling.

3. The method according to claim 1 or 2, characterized in that the quality of the coated chipboards used particle Board.

4. The method according to claim 1 or 2, characterized in that as chipboard used particle Board containing layers with different distribution chip along its length, and contains a middle layer in which the maximum spread chips in length from 8 to 15 mm, and the coating layers, in which the maximum spread chips in length from 3 to 8 mm, while the share of chip length less than 6 mm in strand material of the coating layer is not less than 75 wt.%, in particular at least 80 wt.%, preferably at least 90 wt.%.

5. The way pop or 2, characterized in that as chipboard used particle Board containing layers with different distribution of chip thickness, and also contains a middle layer in which the maximum spread chips of a thickness of from 1.0 to 4.0 mm, and the coating layers, in which the maximum spread chips of a thickness of from 0.1 to 0.8 mm, while the share of chip thickness less than 0.6 mm in strand material of the coating layer is not less than 75 wt.%, in particular at least 80 wt.%, preferably at least 90 wt.%.

6. The method according to claim 4, characterized in that the proportion of binder in the coating layers of chipboard is not less than 10 wt.%, in particular not less than 12 wt.%, preferably in the range of from 15 to 25 wt.%, from the absolutely dry weight of the chips of the coating layers.

7. The method according to claim 5, characterized in that the proportion of binder in the coating layers of chipboard is not less than 10 wt.%, in particular not less than 12 wt.%, preferably in the range of from 15 to 25 wt.%, from the absolutely dry weight of the chips of the coating layers.

8. The method according to claim 1 or 2, characterized in that as chipboard used particle Board, particle Board material of which the share of chip thickness less than 0.6 mm is not less than 50 wt.%, in particular at least 65 wt.%, preferably at least 80 wt.%.

9. The method according to claim 1 or 2, trichosis fact, as chipboard used particle Board, particle Board material of which the share of chip length less than 8 mm is not less than 50 wt.%, in particular at least 65 wt.%, preferably at least 85 wt.%.

10. The method according to claim 1 or 2, characterized in that the roller as the alignment of the body are pressed with a force of from 200 to 1000 N/cm width of the plates, preferably from 450 to 750 N/cm width of the plate to align the wide side.

11. The method according to claim 1 or 2, characterized in that the smoothing wide face chipboard grind before alignment without removing the chip in several stages, with the final grinding is carried out at a grain size of not more than 180, preferably not more than 120.

12. The method according to claim 1 or 2, characterized in that the wood-shaving plate move along the grinding tool, thus align the wide side of this plate before alignment without removing the chip optionally subjected to at least the transverse grinding relative to the direction of movement of chipboard along the grinding tool.

13. The method according to claim 1 or 2, characterized in that the alignment surface of the alignment body is heated to a temperature of from 150 to 240°C., preferably from 180 to 230°C.

14. The method according to claim 1 or 2, characterized in that the alignment without removing struik is polished flat wide side reach its compaction using rollers, heated to a temperature of at least 150°C., preferably at least 180°C, while the rollers are pressed to the wood-shaving plate top and bottom.

15. The method according to claim 1 or 2, characterized in that the alignment surface of the alignment body is heated to a temperature of not less than 100°C., preferably 150°C. as a result of friction between the alignment body and align the wide side of the plate.

16. The method according to claim 1 or 2, characterized in that the measured temperature of the alignment surface of the alignment body or the temperature leveled the broad side of chipboard, and the measured temperature is compared with the preset temperature, the speed of relative movement between aligned wide side plate and the alignment surface of the alignment of the body and/or the force with which the alignment body press to align the wide side, adjust depending on the measured temperature.

17. The method according to claim 1 or 2, characterized in that the smoothing broad side of chipboards and/or smooth the surface of the alignment body before alignment moisten with water, a solution and/or emulsion.

18. Particleboard, educated boards that contain brilliant coating (4, 5) of the layered material, characterized in that the Board keep the layers with different distribution of chip thickness, and provides the middle layer (1), where the maximum spread chips of a thickness of from 1.0 to 4.0 mm, and cover layers (2, 3), in which the maximum spread chips of a thickness of from 0.1 to 0.8 mm, with the proportion of chip thickness less than 0.6 mm in strand material coating layers (2, 3) is at least 75 wt.%, in particular, at least 80 wt.%, preferably at least 90 wt.%, the coating (4, 5) of the laminate caused by direct coating on the aligned without removing the chip wide face chipboard and has a degree of gloss of not less than 105, in particular not less than 110, preferably not less than 115 units of gloss measured according to ISO 2813 at geometry measurement 60.

19. Particleboard in p, characterized in that the layers are bonded particle boards have a different distribution of chips along its length, with the middle layer (1) maximum spread chips in length from 8 to 15 mm, in top layers (2, 3) maximum spread chips in length from 3 to 8 mm, with the proportion of chip length less than 6 mm in strand material coating layers (2, 3) is at least 75 wt.%, in particular at least 80 wt.%, preferably at least 90 wt.%.

20. Particleboard in p or 19, characterized in that the proportion of binder in the coating layers (2, 3) chipboard is not less than 10 wt.%, in particular at least 12 ve the.%, preferably in the range of from 15 to 25 wt.%, from the absolutely dry weight of the chips of the coating layers.

21. Particleboard in p or 19, characterized in that the particle material chipboard share chips with a thickness of 0.6 mm is not less than 50 wt.%, in particular at least 65 wt.%, preferably at least 80 wt.%.

22. Particleboard in p or 19, characterized in that the particle material chipboard share chip length less than 8 mm is not less than 50 wt.%, in particular at least 65 wt.%, preferably at least 85 wt.%.



 

Same patents:

FIELD: construction.

SUBSTANCE: foam glass is coated with a powdery decorating material. The decorating material is represented with wastes of amber processing ground down to specific surface of 1000-5000 cm2/g. Then thermal treatment is carried out with subsequent cooling.

EFFECT: reduced temperature of thermal treatment of decorated foam glass.

2 ex

Prepreg // 2431572

FIELD: printing industry.

SUBSTANCE: prepreg is proposed, made by impregnation of decorative paper-base with a solution of impregnating resin, containing at least one polymer latex and at least one modified starch with molecular-weight distribution: not more than 6 wt % of molecules with molecular weight of up to 1000 g/mole, from 5 to 20 wt % of molecules with molecular weight from 1000 to 5000 g/mole, from 20 to 40 wt % of molecules with molecular weight from 5000 to 25000 g/mole, from 20 to 45 wt % of molecules with molecular weight from 25000 to 200000 g/mole, from 5 to 22 wt % of molecules with molecular weight from 200000 to 1000000 g/mole, from 0.5 to 5 wt % of molecules with molecular weight of more than 1000000 g/mole.

EFFECT: decorative paper or material for decorative coating made from prepreg are proposed.

2 cl

FIELD: printing industry.

SUBSTANCE: decorative impregnated paper for printing by means of ink-jet printing method is designed for manufacture of decorative laminates which are used as building material during furniture fabrication and for interior finish. This kind of paper includes impregnated paper base and paint receiving layer. Paper base includes resin for impregnation in quantity of 40 to 250 wt %. In relation to the mass of paper base. After drying the paper has sufficient humidity which is at least 3.5% and spreading of more than 0.4%. Also, method for obtaining the above paper and its use are described.

EFFECT: better coating quality.

12 cl, 2 ex

FIELD: printing industry.

SUBSTANCE: decorative paper contains a paper base and an ink-absorbent layer. At the same time the ink-absorbent layer is dyed so that the decorative paper after soaking with impregnating resins and pressing as laminate has the same dye, as well as dyeing of laminate from decorative paper, which does not include the ink-absorbent layer. The latter contains a dyeing pigment and/or colorant in the amount rated for a weight of a dry absorbent ink and makes from 45 to 75%.

EFFECT: reduced quantity of a filler and a pigment in the paper base without deterioration of coverage of the proposed decorative paper.

8 cl, 3 tbl, 9 ex

FIELD: process engineering.

SUBSTANCE: invention relates to lamination and laminate made thereby. Proposed method consists in direct impregnation by pressing of non-impregnated substrate material with non-impregnated decorative layer and one or more upper layers impregnated with polymer that feature intensity of effluent resin exceeding 8%. Method is implemented using short-cycle presses at 15 to 40 bar and 140 to 220 220°C. Intensity of effluent resin is determined by the formula

EFFECT: lamination by direct pressing using short-cycle presses with good quality of finished laminate surface.

13 cl, 3 ex

FIELD: printing industry, decorative art.

SUBSTANCE: present invention refers to the sphere of decorative and applied arts. Method to develop art panel with image of fresco type consists in the fact that glue is applied into cloth, then wet plaster or mastic on acryl base is applied onto a layer of dried glue with a thin layer. Then cloth with applied layers of glue and wet plaster or mastic on acrylic base are maintained at room temperature until completely dry to form cracks on plaster or acrylic-based mastic. After full drying, an additional layer of specified glue is applied over wet plaster or acrylic-based mastic, and then the image is applied with water or pigment paints. Then image is coated with a layer of dissolved polymer glue or varnish and is dried at room temperature, cloth is represented by non-woven material, such as Vlieseline, or glass fibre, or PVC film. Image is applied with the help of plotter.

EFFECT: improved durability and integrity of cloth and image on it with preservation of flexibility.

6 cl

FIELD: process engineering.

SUBSTANCE: invention relates to production of decorative articles, particularly, to furniture production, namely, to production of 3D faces of case furniture. It my be used in fabricating interior doors, safe doors, decorative wall panels, etc., with metal or enamel spraying. In compliance with the first version, preset volume of liquid expanded polyurethane is poured into prefabricated female mould with preset relief and separation substance is applied on the surface of said female mould. Then, female mould is closed from above by panel (facade). In 5-20 minutes, semi-finished product is withdrawn from female mould with finished 3D image for its defects to be removed from its surface, and kept to complete drying. Then, semi-finished product is rendered finished by gluing together with the help of PVC film at membrane-vacuum press, or applying primer, paint or spraying metal after degreasing, or jacketing by fabric or jointing by fabric.

EFFECT: reduced costs, higher quality.

32 cl, 6 dwg

FIELD: process engineering.

SUBSTANCE: invention relates to construction, particularly to floor cover plate, method and production unit for plate fabrication. Proposed method comprises the following stages: one surface of initial panel is coated, partially or completely, with glue. Then panel surface coated with glue is calendared to produce decorative layer with decorative pattern. Produced panel is immediately cut into plates for floor covering.

EFFECT: stable plates for floor covering.

9 cl, 2 dwg

FIELD: process engineering.

SUBSTANCE: invention relates to construction materials, particularly to floor panel and method of its production. Floor panel comprises decor and upper layer made from synthetic material. Decor displays a pattern with several wood parts on floor panel. Panel top surface has one or several differences in height. Note that top surface at the location of wood parts display individual level of the entire surface. Individualised level of the entire surface can be formed by that the surface of displayed wood part is higher or lower the surface of one or several adjacent wood parts, and/or the surface of appropriate displayed wood part is at least inclined to total floor panel surface; and/or surface of appropriate displayed wood part is curved, e.g. convex or concave; and/or surface of said part in recessed in direction to the edge or angle because of inclination relative to adjacent surface.

EFFECT: floor covering panel with several wood parts arranged in antique style.

31 cl, 30 dwg

FIELD: woodworking industry.

SUBSTANCE: proposed method comprises applying glue on base surface of timber, applying facing material and decorative encrusting element with subsequent hot pressing of assembled package. PVC film is used as decorative material for coating and encrusting the surface. Simultaneously, face surface and shaped faces all over the product perimetre are pressed. Decorative encrusting elements are fixed in facing layer with the help of thermosetting process material to be removed after pressing.

EFFECT: perfected and simplified method, higher quality of finished products.

4 cl, 2 dwg, 1 tbl

FIELD: decorative art.

SUBSTANCE: for simplification of the method the relief is produced by sticking of deceptive material over the contour of the applied image, and the required amount of plastic compound is applied by small sections uniformly on the image surface sections that a free of deceptive material.

EFFECT: simplified procedure.

1 cl

FIELD: construction industry; methods of production of decorative tiles with a grainy coating.

SUBSTANCE: the invention is pertaining to the field of construction industry, in particular, to the method of production of decorative tiles with a grainy coating to increase their water-resistance. The method provides, that the base before application of an adhesive underlayer is subjected to a water-repelling process and in the capacity of an adhesive underlayer use a 8-I2 % water solution of sodium salt of carboxymethylcellulose.

EFFECT: the invention ensures production of decorative tiles with a grainy coating.

4 cl

FIELD: decorative-lining sheet material for producing of material simulating natural or artificial stone or various kinds of wood.

SUBSTANCE: method involves providing thermal vacuum forming of thermoplastic sheets having thickness of 0.5-8 mm and comprising on its face side decorative-protective polymeric film.

EFFECT: wider range of decorative and lining materials and increased efficiency in simulating structure of natural or artificial materials.

2 cl, 1 dwg

FIELD: ceramic decorations.

SUBSTANCE: method of making ceramic decorative art wall panel comes to the following: tiles are placed on backing secured vertically with tilting of 10-15° successively, starting from lower horizontal row, tiles of which are placed on corresponding limiting step of backing.

EFFECT: improved quality of wall panels.

5 cl, 1 tbl, 4 dwg

FIELD: construction industry; methods of manufacture of the architectural-decorative products.

SUBSTANCE: the invention is pertaining to the method of manufacture of the architectural-decorative products. To increase the quality the products the method provides for laying of the color mixtures in the mold for casting of the product is conducted with usage of a vibration process on the vibration exciter.

EFFECT: the invention allows to improve quality of manufacture of the architectural-decorative products.

6 cl, 3 dwg

FIELD: papermaking.

SUBSTANCE: pre-impregnate is manufactured by impregnation of crude paper with thermosetting formaldehyde-free resin until content thereof 10 to 70%. Residual moisture content in pre-impregnate is 2-3%. Resin contains: at least one radical-polymerization polymer with less than 5% of α,β-ethylenically unsaturated mono- or dicarboxylic acid; at least one radical-polymerization polymer containing more than 5% of α,β-ethylenically unsaturated mono- or dicarboxylic acid; and at least one alkanolamine with at least two hydroxyl groups; or resin contains at least one radical-polymerization polymer with 5-100%, particularly 5-50%, or more particularly 10-40% of α,β-ethylenically unsaturated mono- or dicarboxylic acid and at least one above alkanolamine.

EFFECT: improved quality of surface, printing properties, delamination resistance, and varnishing capacity.

16 cl, 3 dwg, 2 tbl, 2 ex

FIELD: construction industry; domestic appliances; electrical engineering; motor-car industry; methods of production and application of the laminated composite materials with the different layers of a resin.

SUBSTANCE: the invention is pertaining to the method of production and application of the laminated composite material with the different layers of a resin and may used in construction industry, domestic appliances, electrical engineering, motor-car industry. The laminated composite material contains the carrier made out of the thermoplastic polymeric compound, the located on it intermediate layer also made out of the thermoplastic polymeric compound and the applied on the intermediate layer of the thermoreactive layer. Between the carrier and the intermediate layer there is a layer of the resin (a) with the rate of consolidation of at least 20 %. Between the intermediate layer and the thermoreactive layer there is the layer of the resin (c) with the rate of consolidation of at least 60 %. The materials of the layers are laid as the flat sheets and at the temperature of 150-300° C link to the carrier. The material possess the high degree of stiffness and impact toughness, the high quality of the surface, the fast and easy solidification.

EFFECT: the invention ensures the high degree of stiffness and impact toughness, the high quality of the surface, the fast and easy solidification.

13 cl, 1 ex

FIELD: construction materials industry; production of the moldable decorative laminated material.

SUBSTANCE: the invention is pertaining to the moldable complicated decorative laminated material, which contains the polymer impregnated decorative layer made out of the bilateral expansible decorative paper and the core polymer impregnated layer formed out of the bilateral extendable kraft-paper. The laminated material is used for production of the different products requiring the molding concerning the surface of the complicated form, in particular, to the packet made out of the laminated material. The board made out of the laminated material has the moldable base in addition to the decorative layer. The method of manufacture of the moldable decorative laminated material includes the following operations: treatment of the decorating paper, its impregnation, the treatment and impregnation of the kraft-paper, the layer by layer stacking and joining of the layers of the decorative and kraft-paper under pressure with their preliminary impregnation with the phenol-formaldehyde polymeric compound. The technical result of the invention is improvement of the surface properties of the decorative laminated material.

EFFECT: the invention ensures improvement of the surface properties of the decorative laminated material.

37 cl, 8 dwg

FIELD: construction.

SUBSTANCE: method comprises applying a lining material on the surface of the panel, gluing the lining material to the surface of the panel, pressing, and conditioning. Before applying the lining material, the panel is dampened and treated with steam. Pressing is performed at a temperature 127-132°C and at a pressure of 170 bar for 4-6 min.

EFFECT: enhanced efficiency.

3 cl

FIELD: manufacture of decorative panels.

SUBSTANCE: prior to delivery of PVC blank to working area, its surface is subjected to loosening for increase of surface activity and for enhancing adhesion by applying solution of primer; use is made in working area of contra-shaft for holding-down the blank to drive guide transporting wheels and for rolling-on the facing material and connecting it with front surface; used as hold-down device is hold-down shaft with its own program-controlled shaft which is made from soft elastic material for copying the configuration of front and side surfaces of blank at the moment of connection with facing material at simultaneous stretching of it for avoidance of folds; its longitudinal axis is located at angle of from 0 to 90° relative to delivery of blank.

EFFECT: improved quality of facing; simplified construction of device; increased productivity of process.

5 cl, 3 dwg

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