Circuit module and device of communication in power transmission line

FIELD: electricity.

SUBSTANCE: circuit module is mounted with integral circuit (IC) which modulates and demodulates the signal with several carriers. Circuit module has multi-layer board which is equipped on the outside with many conducting layers laid with insulating layers between them and IC which is equipped with many earthing outputs which shall be earthed. The conducting layer which is the closest to IC of many conducting layers forms the earthing layer electrically connected to many earthing outputs.

EFFECT: improving reliability and increasing noise protection.

16 cl, 39 dwg

 

The technical field to which the invention relates

The present invention relates to a circuit module (i.e. the basis), more specifically to a mounting structure of a semiconductor IC (integrated circuit)used in conditions where noise control is difficult, for example, in high-speed communication over power lines (PLC), etc.

Prior art

Because of the need in a compact electronic components, numerous integrated circuits and IP components must be mounted on a circuit module having a semiconductor IP and IP components. So grew the need for efficient use of space for wiring and installation. In particular, IP modulation/demodulation, which modulates and demodulates signals supplied a large number of pins of the ground (grounds) with a minimum step, each of which is connected to the circuit Board. As the circuit Board is a multilayer Board, which includes many of the multilayer wiring layers including an insulating layer between them (for example, Japan patent No. 3375555 and laid patent publication Japan No. 2000-031329). To minimize wiring and to reduce the impedance related to the wiring, power line and a grounding line, enabled sloe wiring, usually have a flat shape and assembled in a multilayer circuit Board as the plate voltage and the ground plate, respectively.

When such a common plate supply or grounding plate is mounted in a multilayer circuit Board as the inner layer, defining a specific installation location is decided as a matter of design. When the grounding plate, which forms a layer 2200 grounding, provides far-from IP 2100 modulation/demodulation, as shown, for example, on Fig, it is necessary to provide transitional hole to a predetermined depth for electrical connection between the grounding terminal and the grounding plate. The through hole H (hereinafter called transitional pass-through hole, which passes through the entire multilayer cost 1000, it is easy to produce. However, such deep through MTG requires a large flat space and the space on the rear side, thereby wasting space for installation and wiring. In addition, can not be taken into consideration vertical distance, and the increase in inductance caused by the increased thickness of the multilayer Board, not a minor issue.

You can provide transient opening only in the middle to conserve space installation. This, however, is a problem where the farther away from the pickup is and grounding IP 2100 modulation/demodulation provides the ground layer, the more you degrade the accuracy of production. In addition, the increase in inductance caused by the increased thickness of the multilayer Board, is more than a minor problem, as described above.

Disclosure of invention

The present invention is provided to solve the problems described above. The purpose of the present invention is to provide a compact circuit module, which is almost not affected by the noise, and which has high reliability. Another objective of the present invention is to provide a compact, low-noise and high-speed communication device through a power line.

The first aspect of the present invention provided to solve the above problems, provides a circuit module, which includes a multilayer Board (10) and IP (210); a multilayer Board includes a first insulating layer (e.g., 17), the first conductive layer (e.g., 12)deposited on the first insulating layer, the second insulating layer (17)is deposited on the first conductive layer and second conductive layer (13)is deposited on the second insulating layer; IC mounted on the first insulating layer and has many of the conclusions of the ground. The first conductive layer electrically connects with many of the conclusions of the ground. The above-described structure provides the minimum distance between output and ground and the ground layer and connects the findings of the ground and the ground layer, at the same time not requiring a through hole that passes through the multi-layered charge, and maintaining the accuracy of production. Therefore, the mounting space on the rear surface of the multilayer Board is not reduced, while the back surface is a surface on which no IC is not mounted. In addition, minimizing the increase in inductance, which is caused by the increased thickness of the multilayer Board. Conductive layer, shown here next to IP, is the closest layer, except for the conductive layer which forms the pattern of the compounds as contact pads on the surface of the multilayer Board.

The second aspect of the present invention provided to solve the above problems, provides a circuit module according to the first aspect of the present invention, in which IP (210) processes the communication signal. The above-described structure provides the minimum distance between the ground and the ground layer and connects the findings of the ground and the ground layer, at the same time, without requiring a through hole that passes through the multi-layered charge, and maintaining the accuracy of production. Due to this IC that handles the communication signal, can be installed without reducing the mounting space on the rear surface of the multilayer circuit Board, while the rear surface is rnost is a surface, which no IC is not mounted. In addition, minimizing the increase in inductance, which is caused by the increased thickness of the multilayer Board.

The third aspect of the present invention provided to solve the above problems, provides a circuit module according to the second aspect of the present invention, in which the communication signal is a signal with several carriers. The above-described structure provides the minimum distance between the ground and the ground layer and connects the findings of the ground and the ground layer, at the same time, without requiring a through hole that passes through the multi-layered charge, and maintaining the accuracy of production. Due to this IC that handles the multi-carrier signal, can be installed without reducing the mounting space on the rear surface of the multilayer circuit Board, while the rear surface is a surface on which no IC is not mounted. In addition, minimizing the increase in inductance, which is caused by the increased thickness of the multilayer Board.

A fourth aspect of the present invention provided to solve the above problems, provides a circuit module according to a third aspect of the present invention, in which IP (210) performs at least one of modulation and demodulation signals several carriers. IP can perform modulation and demodulation.

The fifth aspect of the present invention provided to solve the above problems, provides a circuit module according to a fourth aspect of the present invention, in which the multi-carrier signal is a communication signal on a transmission line, cross the line (900) transmission. Circuit module additionally includes a filter (260), which is mounted on the surface of the circuit module and which protects a pre-determined frequency range of the communication signal on a transmission line, and the filter is mounted on a surface other than the first insulating layer (17) of the multilayer Board. The above described structure provides IP and filter on different surfaces of the multilayer Board, and because of this IP and filter are protected from each other by means of a multilayer Board. Thus, it is not acceptable to the noise from the IP has reached the filter. In addition, the conclusions of the ground and the ground layer can be connected without the use of end-to-end transition of the hole, thereby allowing efficient use of both surfaces of the multilayer circuit Board as a mounting space, even when the space of installation IP or filter becomes large due to the signal processing multi-carrier, and, therefore, making possible ukrashenie the size of the circuit module.

The sixth aspect of the present invention provided to solve the above problems, provides a circuit module according to the fifth aspect of the present invention, in which the multi-carrier signal is transmitted via line (900) transmission, which has a couple of lines. The transmission line may have three or four lines.

The seventh aspect of the present invention provided to solve the above problems, provides a circuit module according to the sixth aspect of the present invention, in which the filter (260) has a basically equal to an impedance of between pairs of lines (900). The above-described structure mounts a symmetric filter on the surface, which is turned to the integrated circuit, thereby reducing the effect of noise on a symmetric filter. Symmetric filter is usually mounted with chip components, such as inductor chip, planar capacitor and the like, and thus the space for its installation tends to become large. However, the above-described structure can reduce the size of the circuit module, even when the mounting space of the symmetric filter for communication on a transmission line becomes large.

The eighth aspect of the present invention provided to solve the above problems, provides a communication device on the line El is tapered, which performs communication through a power line. The communication device on the transmission line includes a circuit module according to the sixth aspect of the present invention and the coupler (270), which imposes a communication signal on a transmission line, derived from a circuit module, the AC voltage transmitted on the line (900) transmission, and which separates the communication signal on a transmission line from the AC voltage transmitted via the transmission line, so as to output the signal to the circuit module. The above structure can provide a communication device through a power line, allowing for high-speed exchange of information and achieving low noise and high reliability.

The ninth aspect of the present invention provided to solve the above problems, provides a circuit module according to the first aspect of the present invention. Circuit module additionally includes a second multilayer Board (30), which has many of the multilayer conductive layers (31, 32, 33 and 34), with insulating layers (35) between them, and which differs from the first multilayer circuit Board (10); circuit components (e.g., 37), which is mounted on the surface of the second multilayer circuit Board; and an insulating plate (20), which has a conductive path provided is for between the first and second multilayer boards, and electrically connects the IP and circuit components. The above structure can provide a compact IC with low noise level.

The tenth aspect of the present invention provided to solve the above problems, provides a circuit module according to the ninth aspect of the present invention. Circuit module additionally includes an internal circuit components (260), which is an insulating plate (20) and which is mounted in the circuit module, where the internal circuit components are surrounded by the conductive path (Q). The above-described structure creates a conductive path using the conductive paste and the like, thereby making possible a reliable screening with a simple structure. For coating can be used copper foil.

The eleventh aspect of the present invention provided to solve the above problems, provides a circuit module according to the ninth aspect of the present invention, in which the first and second multilayer circuit Board (10 and 30) have the same thickness. The above-described structure provides the Board with the same thickness, thus preventing the separation of the two multilayer circuit boards and insulating plate having a conductive path when thermal expansion cards is different due to a change in the tempo of the atmospheric temperature, for example, heat stroke. In effect this may be enhanced by the connection between the conductive paths, which connects the two multilayer boards.

The twelfth aspect of the present invention provided to solve the above problems, provides a circuit module according to the ninth aspect of the present invention. The circuit module includes at least one internal circuit component (260), which is an insulating plate (20) and which is mounted in the circuit module. Internal circuit component is mounted on a thicker multilayer circuit Board from the first and second multilayer circuit Board (10 and 30). The above-described structure mounts a component schema, only the thicker the card even when the card is thin, thereby preventing the bending of thin Board and improving the connection between the conductive paths, which connects the two multilayer circuit Board when the circuit Board are connected with the insulating plate or a composite plate having a conductive path.

The thirteenth aspect of the present invention provided to solve the above problems, provides a circuit module according to the ninth aspect of the present invention. Circuit module additionally includes a fuel plate (40)which supplies at least one of the first and the Torah multilayer circuit Board (10 and 30). The above structure increases the heat-generating space, thus effectively dissipating heat from both surfaces and increasing the reliability.

The fourteenth aspect of the present invention provided to solve the above problems, provides a circuit module according to the ninth aspect of the present invention, in which an insulating plate (20) includes an inorganic filler and a thermosetting resin. The above-described structure can control the degree of thermal expansion, dielectric constant and thermal conductivity by selecting the inorganic filler, thereby improving the reliability of connection of the conductive paths, which connects the two multilayer Board, and increasing the heat dissipation.

The fifteenth aspect of the present invention provided to solve the above problems, provides a circuit module according to the fourteenth aspect of the present invention, in which an inorganic filler is included in an insulating plate (20)has a range of the percentage of weight from approximately 70% to approximately 95%. The above structure provides the same degree of thermal expansion as that of the two multilayer circuit boards, thus preventing the separation of the two multilayer circuit boards and insulating plate, have it conductive track, due to changes in temperature, such as heat stroke, caused by a difference in thermal expansion of the insulating plate and two multilayer circuit boards. In effect this may be enhanced by the connection between the conductive paths, which connects the two multilayer boards. In addition, the structure reduces the pressure on the scheme component mounted on a surface that is in contact with the insulating plate, when the insulating plate and two multi-layer boards are manufactured, therefore preventing damage to the component schema. Multilayer Board has an insulating layer between the conductive layers created using a predetermined pattern. The insulating layer may also be formed using an inorganic filler and a thermosetting resin in a similar way. When the insulating plate contains a curable resin having a solidification temperature lower than that of the insulating layer included in the multilayer Board, the insulating layer of the multilayer circuit Board is protected from damage caused by heat treatment, when the multilayer circuit Board is firmly bonded to the insulating plate between them.

The sixteenth aspect of the present invention provided to solve the above problems, provides a circuit module according to the first aspect of this is bretania. The circuit module includes a second multilayer Board (30), which has many of the multilayer conductive layers (for example, 31, 32, 33 and 34), with insulating layers (20) between them, and which differs from the first multilayer circuit Board (10); and circuit components (e.g., 18 and 37), which is mounted on the surface of the second multilayer circuit Board. Circuit component is provided between the first and second multilayer boards and holds the first and second multilayer circuit Board. The above structure makes it easier to build and allows cost reduction, without any details, for example an insulating plate.

The seventeenth aspect of the present invention provided to solve the above problems, provides a circuit module, which includes a multilayer Board (10) and IP (210); a multilayer Board includes a first insulating layer (e.g., 17), the first conductive layer (e.g., 12)deposited on the first insulating layer, the second insulating layer (17)is deposited on the first conductive layer and second conductive layer (13)is deposited on the second insulating layer; IP has many of the conclusions of the ground and processing the high frequency signal. IC is mounted on the first insulating layer, and many of the conclusions of the grounding electrically connected with the first conductive layer. The above described structure provides min is the minimum distance between the ground and the ground layer and connects the findings of the ground and the ground layer, at the same time not requiring a through hole that passes through the multi-layered charge, and maintaining the accuracy of production. Therefore, the mounting space is not reduced on the rear surface of the multilayer circuit Board, while the rear surface is a surface on which no IC is not mounted. In addition, minimizing the increase in inductance, which is caused by the increased thickness of the multilayer Board, therefore preventing the attenuation of high-frequency signal processed by IP. Conductive layer, shown here next to IP, is the closest layer, except for the conductive layer which forms the pattern of the compounds as contact pads on the surface of the multilayer Board.

The eighteenth aspect of the present invention provided to solve the above problems, provides a circuit module according to the seventeenth aspect of the present invention, in which a high-frequency signal is a communication signal on a transmission line, are transferred via the line (900) transmission. Circuit module additionally includes a filter (260), which is mounted on the surface of the circuit module and which protects a pre-determined frequency range of the communication signal on a transmission line, and the filter is mounted on a surface other than per the CSO insulating layer (17) of the multilayer Board. The above described structure provides IP and filter on different surfaces of the multilayer Board, and because of this IP and filter are protected from each other by means of a multilayer Board. Thus it is not acceptable to the noise from the IP has reached the filter. In addition, the conclusions of the ground and the ground layer can be connected without the use of end-to-end transition of the hole, thereby allowing efficient use of both surfaces of the multilayer circuit Board as a mounting space, even when the space of the installation of the IP or the filter becomes large due to the signal processing multi-carrier, and, therefore, making it possible to reduce the size of the circuit module.

The nineteenth aspect of the present invention provided to solve the above problems, provides a circuit module according to the eighteenth aspect of the present invention, in which a high-frequency signal is transmitted on line (900) transmission, which has a couple of lines. The transmission line may have three or four lines.

The twentieth aspect of the present invention provided to solve the above problems, provides a circuit module according to a nineteenth aspect of the present invention, in which a high-frequency signal is transmitted on a transmission line, which has a couple of lines, and filter (260) t is aetsa symmetric filter, which has basically equal to an impedance of between pairs of lines (900). The above-described structure mounts a symmetric filter on the surface, which is turned to the integrated circuit, thereby reducing the effect of noise on a symmetric filter. Symmetric filter is usually mounted with chip components, such as inductor chip, planar capacitor and the like, and thus the space for its installation tends to increase. However, the above-described structure can reduce the size of the circuit module, even when the mounting space of the symmetric filter for communication on a transmission line becomes large.

IP, according to the present invention is not necessarily IP modulation/demodulation, for example, the main IP. IP can be used for mounting IC having multiple conclusions ground, such as RF block IP (AFE IC).

List of drawings

Figure 1 is a view in section, illustrating the circuit module communication over power lines (PLC), which uses a circuit Board of the IC according to the first variant of implementation;

Figure 2 is a perspective view illustrating the schematic PLC module according to the first variant of implementation;

Figa and 3B - external views illustrating the PLC modem according to the first variant of implementation;

4 is a perspective disassembled, illustrious is I the PLC modem according to the first variant of implementation;

5 is a block diagram illustrating a hardware sample of the PLC modem according to the first variant of implementation;

6 is a General functional block diagram illustrating a sample of the digital signal processor, provided the main IC 210 in module PLC, according to the first variant of implementation;

Figa-7C is an equivalent schematic diagram illustrating a symmetric filter used in the circuit module PLC according to the first variant of implementation;

Figa and 8B - front and rear views of the second multilayer circuit Board used in the circuit module PLC according to the first variant of implementation;

Figa and 9V - front and rear views of the first multilayer circuit Board used in the circuit module PLC according to the first variant of implementation;

Figa-10F - types in perspective, illustrating a variant of the implementation of the production process of the PLC module according to the first variant of implementation;

Figa-11F - types in section, illustrating a variant of the implementation of the production process of the PLC module according to the first variant of implementation;

Figa-12F - types in section, illustrating the manufacturing process of the first multilayer circuit Board used in the PLC module according to the first variant of implementation;

Fig illustrates a schematic PLC module according to the second variant of implementation;

Fig illustrates a schematic PLC module according to the SNO second variant implementation;

Fig illustrates a schematic PLC module according to the third variant of implementation;

Fig illustrates a schematic PLC module according to the fourth variant of implementation;

Fig illustrates a schematic PLC module according to the fifth variant implementation;

Fig illustrates a schematic PLC module according to the sixth variant implementation; and

Fig illustrates the conventional PLC module.

The best option of carrying out the invention

Below explains the options for implementation with reference to the above drawings.

The first option exercise

In the first embodiment, the modem 100 PLC explains how the mounting plate IP, which consists of case 101 cost PLC, used for high-speed communication over power lines (PLC). The modem 100 PLC is a sample of the PLC device, which may be an electric device having inside the PLC modem.

In the first embodiment, the circuit module 200 PLC includes two circuit boards IP, as shown in figures 1 and 2. Or more precisely, the first multilayer circuit Board 10, which is one of the two circuit boards IP, which form the circuit module 200 PLC mounted in the modem PLC 100, the first metal layer 12 is a conductive layer provided closest to the IC 210 modulation/demodulation, such as IP, and electrically connected to the output ZAZ is Melania the IP 210 modulation/demodulation.

As shown in figures 1 and 2 (Fig 1 is cut along the section a-a of figure 2), the first multilayer Board 10 is firmly bonded with the second multilayer Board 30, having between a composite plate 20 as an insulating plate in the first embodiment. The first multilayer Board 10 mounted with the IC 210 modulation/demodulation, which is IP, which modulates and demodulates the signal with several carriers. On the first multilayer circuit Board 10 of the two multilayer circuit boards each layer in the first to fourth metal layers 12-15 applied and firmly fastened, including the insulating layer 17 between them. Figures 11 and 16 form a wiring layout on the front and back surfaces of the multilayer Board. Drawings wiring similarly provided on the first to fourth metal layers and work as a platform for the connection. Next layer is the first metal layer 12. On the second multilayer circuit Board 30 each layer from the first and second metal layers 32 and 33, which form the drawings wiring, apply and firmly fastened, including an insulating layer 35 between them. Figures 31 and 34 form a wiring layout on the front and back surfaces of the multilayer Board. Drawings wiring similarly provided on the first and second metal layers and work as a platform for the connection. The second m is Ogallala Board 30, which is similar to the first multilayer circuit Board 10, is mounted on the surface together with the AFE IC (RF unit IP) 220 and a symmetric filter 251 (260). The structure of the circuit module 200 PLC, which includes IP 210 modulation/demodulation will be described below.

As shown in figures 1 and 2, the circuit module 200 PLC with two mounting plates IP and placed in the modem 100 PLC, is the first multi-layered charge 10 and the second multi-layered charge 30, which is firmly bonded and constructed with insulating plate 20 between them. IP 210 modulation/demodulation is mounted on the rear surface of the first multilayer circuit Board 10. The filter 251 low-pass and band-pass filter 260, which are symmetric filters, and AFE IC 220 are mounted on the front surface of the second multilayer circuit Board 30. The first multilayer Board 10 includes layers 11 and 16 of the wiring, which include pads on the front and rear surfaces; and a multi-layer metal layers 12, 13, 14 and 15, includes an insulating layer 17 between them. Among the four metal layers of the first metal layer 12 is provided as the ground layer closest to IP modulation/demodulation on the rear surface. The first metal layer 12 is connected with the space B of figure 11 connections through the through hole H1, and then IP 210 modulation/demodulation.

As described the ANO above, the first and second multilayer circuit Board 10 and 30 are used as circuit Board IP, equipped in the circuit module 200 PLC. More specifically, the first multilayer Board 10, which is mounted with the IC 210 of the modulation/demodulation as IP for modulation and demodulation of the signal with several carriers, firmly attached to the second multilayer circuit Board 30, at the same time having a composite plate 20 between them as an insulating plate. On the second multilayer circuit Board 30, each of the multiple metal layers 32 and 33 is applied and firmly fastened, including an insulating layer 35 between them. The second multilayer Board 30 is also provided with metal layers 31 and 34, which form a platform at the front and rear surfaces (see figure 1).

The above-mentioned structure minimizes the distance between the contact pad (not shown in the drawings), which is the ground lead of the IC 210 modulation/demodulation, and the first metal layer 12, which forms the ground layer. Thus, the structure allows you to connect the grounding terminal and the grounding layer through small internal MTG H1, which passes only through the surface of the insulating layer 17 without requiring transitional holes for passage through the multi-layer charge. Due to this structure allows the connection of the grounding terminal and the grounding layer, jevrem maintaining the accuracy of production. Therefore, transitional pass-through hole reduces mounting space on the rear surface of the multilayer Board that no IP is not installed, even when equipped with multiple output pins ground. In addition, minimizing the increase in inductance caused by the increased thickness of the multilayer Board.

The first metal layer 12, which forms the ground layer of the first multilayer circuit Board 10, is covered with a copper foil in order to get space in 80% of the Board surface or more. From the upper layer of the first metal layer 12 (far from IP 210 modulation/demodulation side) is equipped with the second metal layer 13, which is similarly covered with a copper foil and forms a layer of food. The second metal layer 13 is connected via an internal MTG with power lead (not shown in the drawings) IP 210 modulation/demodulation, a storage device 240, etc.

The first and second multilayer circuit Board 10 and 30 are supplied with insulating layers 17 and 35; the metal layers 12, 13, 14, 15, 32 and 33; and figures 11, 16, 31 and 34 of the wiring. Insulating layers are placed between the metal layers that form the drawings, including the ground layer, the layer power layer wiring, etc. Drawings wiring form the connecting pads on the front and back on top of the spines. Layers and drawings are electrically connected via through holes made in the insulating layer 17. Through holes may be formed, for example, by laser processing, drilling, or punching. Preferred is a laser processing as the method provides through holes with a small step and does not chip. Laser processing can be easily done when using the laser, carbon dioxide or excimer laser. For electrical connection can be performed nonelectrolytic plating or can be poured conductive substance.

In addition, the metal layers 11, 12, 13, 14, 15 and 16 (31, 32, 33 and 34) used copper foil, which form the drawings wiring layer and ground layer power supply. However, can be any conducting electricity substance, for example the composition of the conductive resin, etc. When drawing connections using copper foil, may be used, for example, electrolytic metallic copper foil having a thickness of from about 12 microns to 35 microns. To improve the adhesion of copper foil to the insulating layers 17 and 35, it is preferable to roughen the surfaces which are in contact with the insulating layers 17 and 35. Copper foil whose surface is treated binder or coated with tin, zinc or Nickel, t is the train can be used to improve adhesion and kislotostojkuju. For the metal layer can be used lead frame, which is etched or perforated metal plate. Using leadframe allows easy formation as raw film, which is divided and given to the section by printing and the like, is firmly fixed on the lead frame; the components are mounted as needed; apply the following insulation layer; apply the next metal layer; the layers are then applied in a similar manner; and ultimately lead frame is divided into a multilayer PCB module.

Composite plate as an insulating plate 20, to which is firmly attached to the first and second multilayer circuit Board 10 and 30, has a composition that includes an inorganic filler and a thermosetting resin, and is usually called raw film. Rolled uncured plate in which the apertures for the scheme component or conductive paths, as needed. The plate is then heated and dried at a temperature of about 200 degrees Celsius and rolled with the component circuits or conductive track on it. The holes for the scheme component or conductive paths may be provided, for example, laser processing, drilling or punching. Preferred is a laser processing as the way of especial through holes with a small step and does not chip. Laser processing can be easily done when using the laser, carbon dioxide or excimer laser. The hole can be done at the same time when forming raw film using the mixture. As the inorganic filler can be used, for example, Al2O3, MgO, BN, AlN, SiO2and the like, it is Preferable that the inorganic filler had a percentage weight to the mixture from 70% to 95%. Preferably, the inorganic filler had an average grain size of from 0.1 μm to 100 μm or less. The preferred thermosetting resin is, for example, epoxy resin with high heat resistance, phenolic resin or cinematicly resin. Epoxy resin is particularly preferred because of its heat resistance is particularly high. The mixture may include a dispersant, a colorant, a binder or a separator.

Because the mixture of the inorganic filler and thermosetting resin is used as material for the insulating plate 20, in contrast to the ceramic circuit Board, the plate does not need to be cured at high temperature, and it can be produced by drying at a temperature of about 200 degrees Celsius. Thus, the manufacture is simple.

Further, the coefficient of linear expansion, thermal conductivity and dielectric constant of the insulating plate 2 can be easily adjusted by selecting the inorganic filler for use in the insulating plate 20. Essentially, the alignment of the coefficient of linear expansion of the insulating plate 20 and the semiconductor component can prevent the fracture, etc. caused by the temperature change, thereby providing a highly reliable circuit Board IP. Improving thermal conductivity of the insulating plate 20 provides a highly reliable circuit Board IP, even when the schema components are mounted with high density.

Flat insulating plate 20 may be thermally processed at a temperature below the temperature of solidification of the curable resin. Heat treatment eliminates sticking, while maintaining the flexibility of the insulating plate 20, thereby allowing for easy processing in the future. In addition, the heat treatment of the mixture, in which the curable resin is dissolved with a solvent, partially remove the solvent.

Conductive path P is provided in the insulating plate 20 contains, for example, thermosetting conductive substance. As a curable conductive material may be used, for example, a composite mixture of a conductive resin of the metal particles and curable resin. As the metal particles can be used gold, silver, copper or Nickel. Gold, silver, copper and Nickel are the preferred conductive substances due to their high the second conductivity. Copper is especially preferred because of its high conductivity and limited migration. As the curable resin can be used, for example, epoxy resin, phenolic resin or cinematicly resin. Epoxy resin is particularly preferred because of its high heat resistance.

Components 18 and 37 of the circuit placed in the insulating plate 20 can be either the active component or a passive component. As the active component uses a semiconductor component, such as a transistor, IC, LSI or the like, the Semiconductor components can be a semiconductor die IP or sealed with resin the semiconductor component. As a passive component is used, the resistance of the chip, planar capacitor, inductor chip or other Component schemas must not include an active component.

In addition, the use of the insulating plate 20 protects the inside of the provided components 18 and 37 of the circuit from the external atmosphere, thereby preventing the deterioration in the reliability of the effect of the humidity.

Described below is the details of the PLC modem, which uses the first multi-layered charge (and second multi-layered charge) as a circuit Board IC used as a module for high-speed communication over power lines. It is shown to figa, 3B and 4, the modem PLC 100 has a body 101, including the upper case 101a and the lower casing 101b. On the front surface of the housing 101 is equipped with a display 105, including LED (light emitting diode) and the like, as shown in figa. On the rear surface of the housing 101 presents: power connector 102, the modular Jack 103 for LAN (local area network), for example, RJ-45; and a switch 104 for switching the operating mode, as shown in figv. Power cable 106 is connected to the connector 102 of the power supply. LAN cable (not shown in the drawings) is connected to a compatible modular Jack 103. Modem PLC 100 can be equipped with a connector D-sub for cable connection D-sub.

The modem 100 PLC has a circuit module 200 PLC and switching regulator 300, as shown in figure 5. Switching regulator 300 delivers a range of voltages (for example, +1.2 V, +3.3 V and +10.5) to the circuit module 200 PLC. Pulse stabilizer includes, for example, a switching transformer and a DC-to-DC (neither shown in the drawing).

Circuit module 200 PLC is supplied to the main IC 210 as IP modulation/demodulation, AFE (RF unit) IC 220, a storage device 240, the filter 251 lower frequencies, IP 252 shaper and bandpass filter 260. Switching regulator 300 and the coupler 270 are connected to the connector 102 of the power, then to line 900 power through power cable 600, the plug 400 and the outlet 500.

The main IC 210 includes the impact of the CPU (Central processing unit) 211, node 212 MAC PLC (level control access to the transmission medium for communication over power lines) and node 213 PLC PHY (physical layer for communication over power lines). The CPU 211 is installed with 32-bit RISC processor (computer reduced instruction set). Node 212 MAC PLC controls the MAC level of the transmitted and received signals; Node 213 PHY PLC controls the physical level of the transmitted and received signals. AFE IC 220 includes a digital to analog Converter (DAC) 221, an analog-to-digital Converter (ADC) 222 and the amplifier 223 with adjustable amplification (VGA). Splitter 270 includes winding transformer 271 and the dividing capacitors 272a and 272b. Next, the CPU 211 uses the data recorded in the storage device 240 to control operations in the node 212 PLC MAC and node 213 PHY PLC and manage the entire modem 100 PLC.

The modem 100 PLC performs transmission in the OFDM system, etc. that uses multiple subcarriers. Digital signal processing for such transmission is performed in the main IC 210, specifically in the node 213 PHY PLC.

6 is a General functional block diagram illustrating a sample of the digital signal processor in the main IC 210 for OFDM transmission using wavelet transform. The digital signal processor from 6 includes a controller 2110, Converter 2111 characters, series-parallel Converter 2112 (reobrazovateli S/P), the inverse wavelet Converter 2113, wavelet Converter 2114, parallel-to-serial Converter 2115 (Converter P/S) and the feedback transducer 2116.

Converter 2111 characters converts the binary data that you want to send data to character data and converts characters (for example, modulation FRAMES) in accordance with each character data. Converter 2112 S/P converts the converted serial data to parallel data. The inverse wavelet Converter 2113 performs the inverse wavelet transform of the parallel data in the data on the timeline, and generates a sequence of reference values representing the symbols of the transmission. The data is transmitted to analog Converter (DAC) 221 in the AFE IC 220.

The wavelet Converter 2114 performs a discrete wavelet transform of the received digital data (a sequence of reference values, discretized at the same rate that was passed), which are obtained from the analog-to-digital Converter (ADC) 222 in the AFE IC 220, the data on the frequency scale. Converter 2115 P/S converts parallel data on the frequency scale in the serial data. Inverter 2116 calculates the amplitude of each subcarrier to determine a received signal and to receive accepted the data.

Understanding the exchange of information performed by the modem 100 PLC, as follows. When accept input data from the module socket 103, the data is transmitted to the main IC 210 through the physical layer Ethernet IP 230. The transmitted digital signal is generated by digital signal processing, is converted into an analog signal using a digital to analogue Converter (DAC) 221 in the AFE IC 220. The analog signal is then output at line 900 transmission through the filter 251 lower frequencies, IP 252 shaper, the coupler 270, the connector 102 power supply, power cable 600, the plug 400 and the outlet 500.

When a signal is received from line 900 transmission signal is transmitted to the bandpass filter 260 through the splitter 270. Once adjusted, the gain in the amplifier 223 with adjustable amplification (VGA) in the AFE IC 220, the signal is converted into a digital signal by analog-to-digital Converter (ADC) 222. The signal is then transmitted to the main IC 210 and converted into digital data using digital signal processing. Then the data is output from the module slot 103 on the physical layer Ethernet IP 230.

The filter 251 lower frequencies are on the transmission side includes a lot of capacitors and coils, as figa and 7B show its equivalent circuit diagrams. Band-pass filter 260, provided allendy on the receiving side, also includes lots of capacitors and coils, as figs shows its equivalent circuit diagram.

As shown in figa, the filter 251 lower frequencies has two capacitor 251a1 and 251a2, which are connected between a pair of lines 601 and 602. Parallel circuit 251a3 and 251a4 CL are connected in series to a pair of lines 601 and 602, respectively, to be positioned between the two capacitors 251a1 and 251a2. As shown in figv, the filter 251 lower frequencies has one capacitor 251b1, which is connected between a pair of lines 601 and 602. Two inductor 251b2 and 251b3 are connected in series to line 601 to put in the middle of the condenser 251b1. Two inductor 251b4 and 251b5 are connected in series to line 602 to put in the middle of the condenser 251b1.

Lines 601 and 602 are connected to line 900 transmission, which has a couple of lines through power cable 600, shown in figure 5. When the constant circuit in parallel circuits 251a3 and 251a4 CL equal, the filter 251 of the lower frequencies is equal to the impedance from each of the pairs of lines in the lines 900 lines. Thus, the filter 251 lower frequencies forms a symmetric filter. Further, when the constant chain of inductors 251b2 and 251b3 and inductors 251b4 and 251b5 equal, the filter 251 of the lower frequencies is equal to the impedance from each of the pairs of lines in the lines 900 lines. Thus, 251b lower frequencies forms a symmetric filter, similarly, the filter 251a lower frequencies. Therefore, the above structure enables the balancing of the pairs of lines in the transmission line. Accordingly, the noise transmitted over the first line, can balance the noise transmitted on the second line, thereby suppressing the noise.

As shown in figs, band-pass filter 260 has a filter 251a lower frequencies, shown in figa, and filter 251c upper frequencies, which are sequentially connected to the lines 601 and 602. Filter s upper frequencies has one inductor is connected between a pair of lines 601 and 602. Two capacitor 251c2 and 251c3 sequentially connected to line 601 to put in the middle of the inductor 251c1. Two capacitor 251c4 and 251c5 sequentially connected to line 602 to put in the middle of the inductor 251c1.

As shown in figs when constant circuit of capacitors 251c2 and 251c3 and capacitors 251c4 and 251c5 equal, the bandpass filter 260 has an impedance of each pair of lines in the lines 900 lines. Thus, the bandpass filter 260 forms a symmetric filter. Therefore, the above structure enables the balancing of the pairs of lines in the transmission line. Accordingly, the noise transmitted over the first line, can balance the noise transmitted on the second line, thereby suppressing the noise.

The filters shown in figa-7C are full SOP is otulana from each pair of lines in the lines 900 lines. However, the impedance should not be completely identical, and can be basically the same in the range of the effectiveness of noise suppression. For example, the difference in the total resistance ±5% from each of the lines can reach the efficiency of noise reduction.

As described above, the circuit module 200 PLC includes a first multi-layered charge 10 and the second multi-layered charge 30 having a composite plate 20 between them. So, figa and 9B show front and back surface of the first multilayer circuit Board 10, the Board is supplied with four metal layers 11, 12, 13 and 14 in the inner layers and is mounted together with a relatively small component on the side of the front surface, and IP 210 modulation/demodulation, storage device 240 and TPN the back surface. So, figa and 8B show front and back surface of the second multilayer circuit Board 30, the card is supplied with two metal layers 32 and 33 in the inner layers and is mounted together with a relatively small component on the back surface, and a symmetric filters 251 and 260 and AFE IC 220 on the side of the front surface.

The following explains the method of manufacturing the circuit module 200 PLC. Figa-10F - types in perspective, illustrating a variant of the implementation of the production process of the PLC module. Figa-11F provide species in the section. Figa-12F is a view of the section of the illustrating the manufacturing process of the first multilayer circuit Board as the circuit Board IP is enabled in the PLC module. Before explaining the manufacturing process of the module PLC first describes the production process of the first multilayer Board.

As shown in figa created first, an uncured insulating layer 17 of fiberglass impregnated with curable resin, and then is pasted on both sides with copper foil as the metal layers 11 and 12. Similarly prepared insulating layer 17, glued on both sides with copper foil as the metal layers 13 and 14, and the insulating layer 17, glued on both sides with copper foil as the metal layers 15 and 16. Both sides of the Board are pressed together with heat to otvetit resin insulating layer. As a material for the insulating layer can be used aramid non-woven material or inorganic filler. Epoxy resin is used as the curable resin, but can be used phenolic resin, etc.

Thereafter, photolithography is used to form pattern of each of the metal layers in order to obtain a picture of the connections, as shown in figv. Then an insulating layer 17P called prepreg, is inserted and pressed together with heat, as shown in figs. Set the military and laminated layers are pressed, to get a flat base. Then, the flat base is heated to otvetit curable resin insulating layers 17 and 17P and to provide a multi-layer basis, with six metal layers 11, 12, 13, 14, 15 and 16. The heating is performed at a temperature equal to or higher temperature curing thermosetting resin in the insulating layers 17 and 17P (for example, from 150 degrees Celsius to 270 degrees Celsius), in order to convert the uncured layers in the insulating layer 17. When thermosetting resin in the uncured insulating layers is heated for curing, the pressure of 10 kg/cm2up to 200 kg/cm2, while the resin is heated, it increases the mechanical strength of the module component schema.

It then uses the laser to ensure that the hole H in the layer 15 of the ground, as shown in fig.12D. As described previously, the hole H may be provided by laser processing, drilling, or punching.

Then the through hole H to pass through the multilayer card 10, as shown in figa. In addition, the inner surface of the through hole H metallservisa, as shown in Fig to electrically connect the metal layer 16, the ground layer 15, etc. that act as platforms. The through hole H can be filled with a composition of the conductive resin is. The first multilayer Board is provided, as described above.

In this embodiment, figures 11 and 16 of the wiring, which form the outer layers, also applied, layered, and ultimately provided a through hole H, which metallservisa inside. In order, however, to connect the through hole and figure 11 compounds can again be performed selective metallization to provide a metallized layer on the inner surface of the through hole to figure 16 wiring as pads. As for the outer layer may finally stick the copper foil and to complete the formation of the pattern, to ensure the contact area on the through-hole.

Similarly is the second multilayer Board 30. Although mounted another component of the scheme, the second multilayer Board is made in a similar fashion multilayer Board process.

For mounting module PLC first component is mounted 18 circuits on the upper surface of the first multilayer circuit Board 10, as shown in figa and 11A.

Then the component 37 circuit is mounted on the lower surface of the second multilayer circuit Board 30, as shown in figv and 11B.

After this comes the composite plate 20 and provides a through hole H for a component or a transitional hole (conductive on the horns), as shown in figs and 11C. Composite plate 20 is formed from a mixture including an inorganic filler and a thermosetting resin to obtain a flat shape. Flat composite plate 20 is obtained in a process in which an inorganic filler and an uncured thermosetting resin are mixed to obtain a doughy paste, which is then molded to obtain a uniform thickness. Then is provided a through hole H for the transition hole (conductive paths) in a predetermined position of a composite plate 20, and thereby produces a flat shape having a through hole H. The through hole H may be provided, for example, by laser processing, drilling, or punching. In this process, a through hole H may also be created at the same time when forming a flat composite plate 20 of doughy paste.

Then the composition of the conductive resin is filled in the through hole H to obtain conductive paths P, as shown in fig.10D and 11D.

Then the first and second multi-layer boards are placed so that the composite plate 20 was between them, as shown in fige and 11E. Multilayer materials are pressed to provide a flat shape with the components 18 and 37 schema in it, and then heated for curing curable with the Ola in the insulating plate 20 and the composition of the conductive resin. By this we obtain a multi-layer form, with the components 18 and 37 of the circuit between the first multilayer Board 10 and the second multilayer Board 30. The heating is performed at a temperature equal to or higher temperature curing the curable resin in the composite plate 20 and the composition of the conductive resin (for example, from 150 degrees Celsius to 260 degrees Celsius)to otvetit uncured composite plate 20. When uncured composite plate is heated for curing, the pressure of 10 kg/cm2up to 200 kg/cm2, while the plate is heated, it increases the mechanical strength of the circuit module PLC.

After that, as shown in fig.10F, IP 210 modulation/demodulation, a storage device 240, etc. are mounted on the bottom surface of the first multilayer circuit Board 10; and AFE IC 220 and symmetric filters 251 and 260 are mounted on the upper surface of the second multilayer circuit Board 30, thus completing the module the PLC according to this variant implementation.

Module PLC, presented above, is placed in the casing 101a and 101b, as shown in figure 4, and thereby completes the PLC modem, which is shown in figure 4.

The PLC module according to this variant implementation, is supplied IP modulation/demodulation and symmetric filters on different surfaces of the multilayer circuit Board, since snizavanje noise and providing a compact and affordable module, having good characteristics.

The following explains specific variant of implementation of the present invention, which is an example of a method of manufacturing circuit Board IP is enabled in the PLC module according to the present invention.

To make a flat composite plate, a predetermined amount of paste-like mixture having a predetermined composition, is applied first on the anti-adhesive film. Paste-like mixture made from an inorganic filler and a liquid curable resin, which is mixed for about 10 minutes in a mixing device. Used mixing device provides sufficient variance, even when the viscosity of the mixture is relatively high, as inorganic filler and a liquid curable resin is placed in a container having a predetermined capacity, and then rotates the container itself. As the adhesive film is used polyethylene terephthalate film having a thickness mm, whose surface is treated to otlipaniya using silicon.

Then the release film is additionally placed on the pasty mixture on a release film. Then the materials are pressed to a thickness of 500 μm, and the upshot is a flat mix. Then flat the mixture, placed in the middle between antidetonation, heated together with films and heat-treated under the condition that eliminates the sticking of the mixture flat. Heat treatment is performed at a temperature of 120 degrees Celsius when the exposure time is 15 minutes. Heat treatment eliminates sticking of the flat of the mixture, thus allowing easy removal of the release film. As used in the embodiment, the liquid epoxy resin has a solidification temperature of 130 degrees Celsius, the resin is uncured (stage b) by the condition of the heat treatment.

Then with the flat of the mixture are removed with a release film. Flat mixture is then placed in the middle between the heat-resistant adhesive film (PPS or polyster; thickness 75 μm) and heated at a temperature of 170 degrees Celsius simultaneously with compression under a pressure of 50 kg/cm2for solidification.

Then with hardened flat mixture are removed heat-resistant adhesive film, and thereby obtained the insulating layer. The insulating layer is processed to have a predetermined size, and then measured on thermal conductivity, linear expansion coefficient, etc. of the Conductivity is obtained by contact of the sample surface, which is cut to obtain a square of 10 mm, a heater for heating and the implementation of the ia calculation of temperature rise on the opposite surface. The coefficient of linear expansion is obtained by measuring changes in the dimensions of the insulating layer, when the temperature rises from room temperature to 140 degrees Celsius, and then calculate the average change in size. Voltage electric strength is obtained by measuring voltage electric strength, when AC voltage is applied in the direction of the thickness of the insulating layer, and then calculate the voltage of the electric strength per unit thickness. Here, the insulating layer means is electrically isolated charge.

An insulating layer produced as described above and with Al2O3as the inorganic filler has a thermal conductivity of approximately 10 or more times greater than traditional steklopaketa fee (thermal conductivity of 0.2 W/MK to 0.3 W/MK). When the amount of Al2O3as a percentage of weight equal to 85% or more is achieved, thermal conductivity of 2.8 W/MK or higher. In addition, Al2O3value.

When AlN or MgO is used as the inorganic filler, the result is a thermal conductivity equal to or greater than that of Al2O3. In addition, when the inorganic filler is used non-crystalline SiO2the coefficient of linear expansion closer to craniomandibular (coefficient of linear expansion of 3×10 -6/C°). Thus, it is preferable to use an insulating layer having a non-crystalline SiO2as the inorganic filler, for boards with inverted crystal, directly mounted with the semiconductor.

When SiO2is used as the inorganic filler, the insulating layer has a low dielectric constant. In addition, SiO2is advantageous due to the low specific weight.

When BN is used as the inorganic filler, the insulating layer has a high conductivity and a low coefficient of linear expansion. Except when Al2O3having a percentage weight to 60%, is used as the inorganic filler, the insulating layer has a voltage electric strength of 10 kV/mm or higher. Voltage electric strength of the insulation layer is an indicator of adhesion between the inorganic filler and thermosetting resin which is the material of the insulation layer. More specifically, when the adhesion between the inorganic filler and thermosetting resin is poor, between the material and a thin crack, thereby reducing the voltage of the electric strength. This thin crack over time leads to deterioration of the reliability module comprising a component CX is we. As a rule, it is determined that the adhesion between the inorganic filler and thermosetting resin is good, if the voltage of the electric strength is 10 kV/mm or higher. Thus, it is preferable that the amount of inorganic filler was in percentage of weight equal to 70% or higher.

As the strength of the insulating layer deteriorates when there is a small amount of curable resin, it is preferable that the curable resin had a percentage weight of 4.8% or higher.

In this embodiment, as the liquid epoxy resin used epoxy resin produced by Nippon Pelnox Corporation (WE-2025 attached; hardener - acid anhydride). As a phenolic resin is used phenolic resin produced by Dainippon Ink and Chemicals, Inc. (Phenolite VH4150). As cinematical resin is used cinematicly resin produced by Asahi-Ciba, Limited (AcroCy M-30). In this embodiment, an additive is added soot or dispersant. Prokeivanie composite plate between the first multilayer Board 10 and the second multilayer Board 30, the pressing and heating of the materials provides the mounting plate of IP in accordance with the embodiment of the present invention. The following options may not apply to the first version of the implementation.

The second option is the implementation of the

The following explains the second variant implementation. As shown in the section on Fig and in the future on Fig, multilayer Board 10 as a circuit Board of the IC according to the second variant of implementation, is mounted with a symmetric filter 260 on the surface in contact with the composite plate between the two multilayer boards. Symmetric filter 260 is heralded by its perimeter using conductive columns Q with a conductive paste and providing conductive paths. As in the processes of the production process module PLC on figs and 10D is the same processing, the man hours can be minimized. After this mounting plate IP is the same as the circuit Board of the IC shown in figure 1.

In this embodiment, the symmetric filter 260 is mounted on the insulating plate 20 and are surrounded by the conductive columns of Q containing the copper foil and the conductive paste. Through this, the influence of noise can be minimized, and can be obtained a compact and affordable module, independent of the external conditions of the installation.

The noise caused by the increased speed of the signal distorts the signals on the analog circuit transmission/reception, presents a symmetric filter, and thus significantly affects performance. The problem observed is ü, when the environment in which you are installing the module (that is, the noise is high or low) affect the properties of the module. In particular, high-speed communication over power lines (PLC) uses the frequency band having a low frequency from 4 MHz to 28 MHz and a wide range, and therefore, the circuit components are represented in the schema filter, large. Therefore, noise is inevitably distributed in the filter circuit, and therefore the deterioration in characteristics is particularly noticeable. This variant implementation solves the problems described above and provides a compact and affordable unit.

It is also possible to further improve the shielding effect by replacing the metal particles contained in the conductive paste in the above-described embodiment, the ferrite particles, etc.

A third option exercise

The following explains a third option implementation. In the third embodiment, the PLC module has a structure in which the fuel metal layers 40 and 41 are applied to the upper and lower surfaces of the module PLC obtained in the above-described first embodiment, having a composite plates 42 and 43, respectively, between them, as shown in Fig, allowing, thus, the effective heat dissipation module. Other components are provided to the PLC module in a similar way,according to the first variant implementation, shown in figure 1. The same components are given the same reference numbers. The above-mentioned structure in which the fuel plates on both upper and lower surfaces, extends the heat-generating space, even when the density increases schema, and provides a compact and affordable unit. Here is described the case where there are two fuel metal plate, however, you can use the same metal plate. For example, the provision of the metal plate only IP that has the highest heat (for example, the main IP)through the composite plate can extend the fuel surface.

The fourth option exercise

The following explains the fourth option implementation. In the fourth embodiment, the components 18 of the circuit mounted on a surface in contact with the insulating plate, which is surrounded by two multilayer boards, and unite on the thicker side of the multilayer circuit Board, as shown in Fig.

In the fourth embodiment, the components 18 of the circuit mounted on the surface in contact with the insulating plate, formed on the thicker side of the multilayer circuit Board, preventing, thus, the bending of thin Board and improving the connection between the conductive paths, the cat heaven connects the two multilayer circuit Board, when the card together with the composite plate.

The fifth option exercise

The following explains the fifth option implementation. In the fifth embodiment, two multi-layer boards, mapped party, where the components have the same thickness, as shown in Fig.

In the fifth embodiment, the same thickness of the two multilayer boards 10 and 30 reduces the shear stress caused by the difference in thermal expansion boards by increasing the connection between the conductive tracks when the card together with the composite plate 20.

The sixth option exercise

The following explains the sixth version of the implementation. In variants of the implementation from the first to the fifth two multilayer boards are assembled with the composite plate 20 between them. However, in the sixth embodiment, two multilayer circuit Board 10 and 30 associated side where the components are connected using component 21 schemes, simplifying thus the structure.

The above structure eliminates the process of punching, etc. to make composite plate part for the scheme component or part, filled with the conductive paste, as shown in figs by providing affordable module, which allows easy mon is already.

In the above-described embodiments, implementation of the first through sixth main IP, which modulates and demodulates the signal with multiple carriers, is explained as an example of the IP, which connects many of the conclusions of the ground with the ground layer. However, this IP is not limited to the main IP. A similar effect can be also obtained, for example, when connecting many of the conclusions of the ground and the ground layer at the AFE IC.

It is noted that the above examples are provided only for the purpose of explanation and in no case should not be construed as limiting the present invention. Although the present invention is described with reference to typical embodiments of, it is understood that the words used in this document are words of description and illustration, rather than words of limitation. Can be modified within the scope of the attached claims, which is now amended, without deviating from the scope and essence of the present invention in its aspects. Although the present invention is described herein with reference to particular structures, materials, and embodiments of, this invention is not intended to be limited to the particulars disclosed in this document; instead, the present invention extends to all functionally equivale the local structure, methods and applications, for example, which are within the attached claims.

The present invention is not limited to the above-described variants of implementation, and various changes and modifications without deviating from the scope of the present invention. In embodiments, the implementation of the described circuit module with many of the conclusions of the ground, which are connected with the metal layer 12. However, some of the many findings of a ground may be connected with the metal layer 13, 14, 15, etc. mainly in the range of effectiveness of the present invention.

Industrial applicability

Mounting plate IP, as described above, is configured resistant to heat fluctuation and noise. Consequently, it is possible to apply the circuit Board IP to a variety of technologies, including high-speed communication over power lines.

1. Circuit module containing an integrated circuit that has a first ground and the second ground lead, the first insulating layer, on which is mounted integrated circuit, the first conductive layer, which is electrically connected to the first and second findings of the grounding, the second insulating layer and second conductive layer, while the mentioned integrated circuit, the first insulating layer, the first conductive layer, the second insulating layer and the second conductive layer deposited on one another in the order listed and the first ground and the second ground lead is placed only between the integrated circuit and the second insulating layer.

2. Circuit module according to claim 1, in which the mentioned integrated circuit processes the communication signal.

3. Circuit module according to claim 2, in which the communication signal is a signal with several carriers.

4. Circuit module according to claim 3, in which the mentioned integrated circuit performs at least one of modulation and demodulation of the signal with several carriers.

5. Circuit module according to claim 4, in which the multi-carrier signal is a communication signal on a transmission line that is transmitted on a transmission line, and the circuit module further comprises a third conductive layer as the outer surface of the circuit module and the filter, which is located on the third conductive layer and which protects a pre-determined frequency range of the communication signal on a transmission line.

6. Circuit module according to claim 5, in which the multi-carrier signal is transmitted on a transmission line, which has a couple of lines.

7. Circuit module according to claim 6, in which the said filter is a symmetric filter, which has basically equal to an impedance of between pairs of lines.

8. The communication device through a power line having a circuit module according to claim 6, further containing a splitter, which imposes a communication signal on a transmission line, derived from the above-mentioned circuit module, AC in the custody of, transmitted on a transmission line, and which separates the communication signal on a transmission line from the AC voltage transmitted through the transmission line to output a signal to the circuit module.

9. Circuit module according to claim 1, in which the mentioned integrated circuit, the first insulating layer, the first conductive layer, the second insulating layer and the second conductive layer form a first multi-layered charge, while the circuit module further comprises:
the second multi-layered charge, which includes many multi-layer conductive layers with insulating layers between them; circuit component which is mounted on a surface of the second multilayer circuit Board; and an insulating plate disposed between the first and second multilayer boards, and insulating plate has a conductive path electrically connecting an integrated circuit of the first multilayer circuit Board and the second multilayer circuit Board.

10. Circuit module according to claim 9, further containing an internal circuit component, which is mentioned insulating plate and which is mounted in the circuit module, these internal circuit component is surrounded mentioned conductive path.

11. Circuit module according to claim 9, in which the aforementioned first and second multilayer Board, they shall have the same thickness.

12. Circuit module according to claim 9, further containing at least one internal circuit component, which is mentioned insulating plate and which is mounted in the circuit module, these internal circuit component is mounted on a thicker multilayer circuit Board from the first and second multi-layer boards.

13. Circuit module according to claim 9, further containing fuel plate, which is provided at least one of the mentioned first and second multi-layer boards.

14. Circuit module according to claim 9, in which the mentioned insulating plate includes an inorganic filler and a thermosetting resin.

15. Circuit module 14, in which the aforementioned inorganic filler included in said insulating plate, has a range of relationships weight from about 70 to about 95%.

16. Circuit module according to claim 1, in which the mentioned integrated circuit, the first insulating layer, the first conductive layer, the second insulating layer and the second conductive layer form a first multi-layered charge, while the circuit module further comprises a second multi-layered charge, which includes many multi-layer conductive layers with insulating layers between them; and a circuit component mounted on a surface of the second multilayer the Board; moreover, this circuit component is placed between the first and second multilayer boards and holds the first and second multilayer circuit Board.



 

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4 cl, 3 dwg

Electronic board // 2280967

FIELD: electronics, tool-making industry, namely, engineering of electronic boards.

SUBSTANCE: result is achieved because in electronic board as substrate the body of device is utilized, and conductive pattern is made of solder.

EFFECT: lower laboriousness and simplified manufacture of electronic boards, decreased losses during manufacture, possible processing of electronic board after expiration of service time.

FIELD: electronics; printed circuit boards.

SUBSTANCE: multilayer printed circuit board consisting of signal dielectric layers comprising topological patterns of the printed wiring and interchanging with screening layers having the form of a grid provided with printed conductors reflecting the topological pattern configuration of their nearest signal layer. Top layers of said printed circuit board are covered with a protection coat that consists of a mixture of ferrite powder and plastic binder based on protective varnishes or compounds and is applied by means of spreading, immersion or spraying.

EFFECT: enhancement of the quality of printed circuit board protection against effects of EMI.

Damped board // 2332817

FIELD: electricity.

SUBSTANCE: damped board contains printed circuit board and damping unit consisting of reinforcing layer made of structural material bonded with printed board by layer of viscoelastic material. Damping unit is performed as two-layer frame passing through fixing points of printed board and containing reinforcing layer and layer of viscoelastic material.

EFFECT: providing of printed boards damping with maximum saving of useful area; minimal increase of board mass and keeping damping properties in wide temperature range.

3 cl, 7 dwg

FIELD: physics, control.

SUBSTANCE: present invention is related to electron field devices such as transmitters of technological processes parameters used for monitoring (routine inspection) of these processes. In particular, the present invention is related to electron field devices used in environment of technological plants, which may produce high level of electromagnet interference. Field industrial device (200) for operation under severe conditions comprises body (208) with electroconductive walls that surround cavity (206) with open end. Cavity may contain electronic module (292) based on printed circuit boards. Device comprises ready-fitted printed circuit board (270), which represents multilayer printed circuit board with through electric contacts and hidden layer (350) of grounding, which is electrically connected to body (202) for screening of electronic module (292) against electromagnet interference and provision of electronic module protection against effect of environment.

EFFECT: creation of body designs for transmitters of technological processes parameters, which possess improved resistance to effect of moisture and substances that pollute the environment, and also provide efficient filtration of electromagnetic field and radio interference.

30 cl, 9 dwg

FIELD: physics.

SUBSTANCE: invention is related to electronic units, namely, to simplification of such units. In particular, invention is related to electronic ballast resistors for gas discharge lamps, at that such ballast resistors have higher scattering of heat, reduced amount of components, minimised mechanical stress in electric components and improved suppression of electromagnetic interferences (EMI). Electronic unit having vessel is arranged with sealing against effect of environment, with possibility to suppress EMI and proper thermal connection between hot electric components and external heat radiator contained in unit.

EFFECT: improvement of electronic units operation, improvement of electronic ballast resistances operation for gas discharge lamps, reduction of mechanical stresses in such devices, lower EMI emitted by these devices.

4 cl, 6 dwg

FIELD: physics; computer engineering.

SUBSTANCE: tachograph for highly sensitive processing and protecting data which includes a system for protecting hardware for a protected circuit has a substrate which has a central region projecting backwards, where the central region is surrounded by regions which project forward. Due to this, the system for protecting hardware is particularly made in form of a half-cup. Also the system for protecting hardware has conducting structures placed on and/or in the substrate for detecting access to the protected circuit.

EFFECT: design of a system for protecting hardware which can be integrated into an electronic module, which provides reliable detection of attack on hardware.

5 cl, 3 dwg

FIELD: physics.

SUBSTANCE: in system of hardware protection for sensitive electronic modules of data processing against external manipulations has accordingly matched topology.

EFFECT: improves manufacturability.

12 cl, 8 dwg

FIELD: electricity.

SUBSTANCE: hybrid integrated microwave circuit includes dielectric substrate on the front side of which there located is topological metallisation pattern, and on rear side - screen earthing metallisation, at least one metallised mounting platform connected to screen earthing metallisation, at least one transistor, at least two capacitors on both sides of transistor. At that, at least one of the transistor outputs is electrically connected to upper coatings of capacitors, at least two other outputs are electrically connected to topological metallisation pattern, lower coatings of capacitors are electrically connected to metallised mounting platform and through it to screen earthing metallisation. Transistor with outputs, two capacitors and electric connections of one of transistor outputs to upper coatings of capacitors are made in the form of at least one crystal of monolithic integrated circuit, which is located on one metallised mounting platform. At that, both capacitors are film-type, upper coatings of capacitors, outputs of transistor and electric connections of one of transistor outputs with upper coatings of capacitors are provided in one metallisation layer of crystal of monolithic integrated circuit. At that, in crystal of monolithic integrated circuit immediately under lower coatings of capacitors there made are through metallised holes for electric connection of lower coatings of capacitors with metallised mounting platform.

EFFECT: improving electrical and mass and dimensions characteristics, improving reliability, reducing labour input of manufacturing process.

6 cl, 3 dwg, 3 ex

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