Independent electronic component and method of its mounting
FIELD: electronic engineering.
SUBSTANCE: present invention relates in substance to shell-type discrete electronic components, containing, for example, electronic power supply circuit, shell or case in the form of parallelepiped and contact pins connected inside shell with the above circuit and protruding out of shell for electric connection with printed-circuit board (PCB). Shell contains heat-dissipating front section having at least one surface outside shell and lying in plane; specified contact pins protrude from shell so that their first section lies in parallel to the above plane. Flat-topped is preferred in a couple of contact pins located after the first section parallel to plane as such bend will allow more stable mounting of component in process of its soldering on heat-dissipating intermediate pad.
EFFECT: creation of discrete electronic component, which structural and functional performance provide its easy, fast and simple mounting at supporting pad for further installation with other components at PCB.
9 cl, 6 dwg
The technical FIELD
The present invention relates to a discrete electronic component, such as a power switch. In addition, the invention relates to the appropriate installation method of this discrete electronic component on the circuit Board.
Recently, the use of such discrete electronic components in printed circuit boards has increased significantly, and these components are reliable and can manage them easily in a variety of applications.
The LEVEL of TECHNOLOGY
It is well known that hull discrete electronic components generally include power electronic circuit assembled on a small metal frame, and has an electric contact pins and the protective housing or casing made of an insulating plastic material, for example of epoxy resin. The contact pins protrude from the housing after installation of these discrete electronic components on a printed circuit Board enables the transmission of electronic signals to the conductive paths available in the printed circuit Board, and in the opposite direction.
As is known, such discrete electronic components are characterized by high dissipation power, and therefore have integral cooling element. This element may include, for example, the head part associated with discrete e the trip component and embedded in its plastic case.
During installation of the component on the PCB in many cases, the head part is on the opposite side of the PCB, which facilitates the dissipation of heat.
When designing the PCB, you need to pay attention to where it should be installed these discrete electronic components, and to use some solutions, which provide good thermal conductivity to transfer heat and drain power dissipation.
It is known that when one circuit Board are many discrete electronic components, it is preferable to group them all in one area and to supply this area of the large heatsink with fins.
Known technical solution, providing the installation between the radiator fins and the head part of each discrete electronic component intermediate pads of electrically insulating material with good thermal conductivity, for example aluminum oxide. In addition, this block allows to combine in blocks of at least two or neighboring discrete component for joint installation on a printed circuit Board. This Association is performed using fixation devices, such as clamps, etc.
Thus, during installation it is necessary to place electronic components on a printed circuit Board, post pads, install the clips and then place on top of the heat sink with fins.
Although this solution from some points of view has advantages and essentially allows you to achieve the desired goal, it has the following disadvantage. The above installation is impossible to automate: in fact, the clamps must be placed manually by the operator, resulting in significant time and increase the cost of the finished product.
The second solution mentioned technical tasks may include fastening warheads discrete electronic components to the Shoe by means of the fixing means in the form of a metallic solder paste and thus add a component on a printed circuit Board.
This second solution is also not free from disadvantages; namely, as only the head part of each discrete component mounted on the block, the entire structure must be transferred into the oven for reflow soldering. When such a fixing head portion of each discrete electronic component can be rotated to lock on the block in the wrong and/or biased position. It actually makes the whole operation useless, because the obtained component cannot be installed on the circuit Board due to the mismatch between the contact pins of discrete electronic components and PCB.
The technical task underlying altoadige of the invention, is the creation of a discrete electronic component, structural and functional characteristics which provide a convenient, fast and simple installation on the support block for installation together with other components on a printed circuit Board, and which overcome the above disadvantages of the known solutions.
The idea underlying the present invention is to create a discrete electronic component, which can be without difficulty and with geometric precision is attached to the intermediate block, which subsequently provides quick and convenient installation of groups of such components on a printed circuit Board using an automatic device, such as a manipulator for capture, transport and installation details.
In fact, according to the present invention, each discrete electronic component remains fixed on the intermediate block and also during the commit operation in the oven for reflow soldering.
Within this idea mentioned technical problem is solved by the creation of a discrete electronic component of the above type, characterized in that at least one of said contact pins after the first section has essentially a U-shaped curve, in which paraclade is and U is tangent to the specified plane.
The characteristics and advantages of discrete electronic component according to the present invention and the corresponding method of its installation can be seen from the following description with reference to the accompanying drawings of one embodiment of the present invention, given as an illustrative example and is not limiting of the scope of the invention.
BRIEF DESCRIPTION of DRAWINGS
1 schematically shows a perspective view of a discrete electronic component made according to the present invention;
figure 2 shows the view from the perspective of the split parts of the PCB with multiple discrete electronic components, and other components such as heat sinks with fins;
figure 3 shows a top view of the intermediate pads installed between discrete components and heat sinks with fins;
figure 4 shows a front view of three discrete electronic components, made according to the present invention and connected to the intermediate scattering Shoe;
figure 5 shows a side view of the components presented in figure 4;
figure 6 shows a bottom view of the components presented in figure 4.
DETAILED DESCRIPTION of the PRESENT INVENTION
Refer to the description of the drawings, particularly to figure 1, in which position 1 in General schematic outline of discrete power the hydrated component, made according to the present invention.
Discrete electronic component 1 is essentially pressurized and includes a casing or housing 2, is made essentially in the form of a parallelepiped, and multiple contact pins 3 projecting from at least one side 2A of the housing 2.
More specifically, component 1 contains a power electronic circuit mounted on a small metal frame (not shown, as is conventional), which includes electrical contact pins 3 and the body 2 is a protective cover made of a dielectric plastic.
The pins 3 are for electrical connection with the electronic circuitry on the circuit Board 4, on which there are defined conductive paths for connecting the contact pins of various electronic components.
For clarity, the drawing shows three contact pins 3. It is obvious that there may be more than three and less.
In case 2 there is also an element for dissipating internal heat in the form of the head part 5, associated with a small reference frame power electronic circuits and bred to the top of the housing 2.
The width of the head part 5 is essentially equal to the width of the housing 2, and the length is such that the head part is the part opposite to the side surface 2A, is of Duda face contact pins 3. The visible surface of the head part 5 lies in the plane P and withdrawn from the housing 2.
The contact pins 3, protruding from the side surface 2A, have the first section, initially parallel to the plane P.
Intermediate pin 6 has a standard configuration essentially l-shaped form and originally designed as a continuation of this first section parallel to the plane P, and then passes perpendicular to the plane P from the part opposite to the head part 5 and its length is such that it contacts to the circuit Board 4.
In contrast, the two outer contact pins 7 and 8 after the first section, running parallel to the plane P, we have N-shaped curve, which includes two sections 7a, 8A and 7b, 8b of unequal length.
Each section 7a and 8A extends along the head part 5 perpendicular to the plane P to such a length that the bar 7C, 8C U-N-curve is tangent to the plane P.
On the contrary, the target areas 7b and 8b of the contact pins 7 and 8 are of such a length, which allows them to enter into contact with the circuit Board 4. In fact, the free ends of the contact pin 6 and the contact pins 7, 8 with a U-shaped bend are essentially perpendicular to the plane P in the opposite direction relative to the head part 5.
To improve the races is eania internal heat uses intermediate heat dissipating block 9, made of metal with good thermal conductivity but relatively cheap, for example, aluminum.
Block 9 contains the first contact pad 10, the configuration of which corresponds to the configuration of the head part 5 discrete electronic component 1; and a second contact pad 11 and the third contact pad 12, the configuration of which corresponds to the configuration of the bases 7C and 8C of the two outer U-shaped contact pins 7 and 8.
Further, the first pad 9 is pressed micronova insulating support, and areas 10, 11 and 12 is screen printing.
The first space 10 and second 11 and third 13 sites made by screen printing using a solder or solder paste 13, which is typically used for soldering.
It is obvious that these operations are performed before the automatic installation of discrete electronic component 1, which is facilitated by its appropriate form, on the block 9 and transferring them into the oven for reflow soldering.
In the oven for reflow soldering head part 5 could make all the body 2 "to float on the molten paste 13, however, the presence of additional supports, formed the basis 7C and 8C of the outer contact pins 7 and 8, prevents any rotation of a discrete electronic component 1. The situation is similar to the one in which the component 1 is aligned on the table on three points of support, the first bearing is formed a significant share of the head part 5 and the remaining points or supporting legs formed by bending the U-shaped contact pins 7 and 8.
Preferably, three discrete electronic component 1 are connected, for example, in this example, the intermediate block 9 according to the desired configuration and are located next to each other, all contact pins facing in the same direction.
At the outlet of the furnace for reflow soldering three discrete electronic component 1 and the intermediate block 9 becomes a single module 14, designed for installation on a printed circuit Board 4.
Optionally, the circuit Board 4 may contain more modules 14.
Usually after the modules 14 are fixed on the circuit Board 4, block 9 installing the heat sink 15 of a known type with ribs.
The main advantage of the present invention is that a discrete electronic component 1 manufactured in the above way, the result turns out to be locked in a predetermined position on the intermediate block 9 before its final installation on the circuit Board.
In addition, all contact pins 3 each discrete electronic component 1, locked on the intermediate block 9, be aligned in the desired position.
Module 14, with the which can be treated as a normal component of the PCB 4, can be installed without any difficulty by using an automated system. The modules 14 can even be fed by the conveyor to the manipulator for capture, transport and installation of parts, designed for automated Assembly of components on the Board.
Thus, the proposed system installation is simple, fast, and cheap.
Obviously, different ways, such as discrete electronic components 1 with a single contact pin having essentially U-shaped bend, or with three or more contact pins having the same bending should be considered as included in the scope of the present invention.
1. Cabinet discrete electronic component containing power electronic circuit, the housing or casing (2), essentially in the form of a parallelepiped and the contact pins (3), United inside with the specified electronic circuit and protruding from the housing (2) for electrical connection to the circuit Board (4)and the housing (2) has a heat dissipating head part (5)having at least one surface, derived from the housing (2) and lying in the plane (P), and the contact pins (3) protrude from the casing (2) so that the first section initially runs parallel to the specified plane (P), characterized in that for the first Castano at least one (7) of the contact pins (3) has, essentially U-shaped bend, in (7C) the crossbar of the letter P is tangent to the said plane (P).
2. Discrete electronic component according to claim 1, characterized in that the free ends of the contact pins (3) and the specified at least one contact pin (7) with U-shaped bend are essentially perpendicular to the plane (P) in the opposite direction relative to the head part (5).
3. Discrete electronic component according to claim 1, characterized in that the head part (5) and the specified at least one contact pin (7) is associated with an intermediate block (9) for subsequent connection to a heat sink.
4. Discrete electronic component according to claim 1, characterized in that it contains two contact pins (7, 8) with U-shaped bend, and the head part (5) and the contact pins (7, 8) associated with the intermediate block (9) for subsequent connection to a heat sink.
5. Discrete electronic component according to claim 3, characterized in that the said connection is made by soldering using a solder paste.
6. Discrete electronic component according to claim 3, characterized in that at least three components attached to one of the intermediate block (9) and are located next to each other.
7. The installation method of discrete electronic components (1), vypolnennyh to claim 1, on printed circuit boards (4), characterized in that it comprises the following operations: preliminary location intermediate pads (9)having first contact pads (10), limited in predetermined positions marked on them solder paste, the shape of each of which conforms to the shape of the head part (5) of the said body (2), and second contact pads (11), the shape of which conforms to the shape of the base (7C) a U-shaped bend of the specified at least one contact pin (7), placement on the specified intermediate block (9) discrete components (1), the number and arrangement of which correspond to the number and order of these first (10) and second (11) pads, the Assembly with the help of automatic Assembly machines node from the intermediate pads (9) and any of its components (1) and placing them in the oven for reflow soldering with the results in a single modular element (14), the Assembly of modular elements (14) in a dedicated section of the circuit Board (4) with the help of automatic Assembly machines.
8. The method according to claim 7, characterized in that the contact area (10, 11) perform with the possibility of placing components (1) next to the contact pins, directed to one side.
9. The method according to claim 7, characterized in that the specified soldering paste is applied n is specified intermediate pad (9) using screen printing.
FIELD: electric engineering.
SUBSTANCE: invention may be used in any engineering branches for electric cable fastening and routing, especially, for high-voltage electric cable fastening to the instrument housing. There is a graded slot with large diameter step made in the instrument housing. The fastening element is implemented as plug with diametrical side extensions. The chamfered extensions contact with slot walls when plug is installed. The chamfers are made at no more than 30° angle. There are open-end grooves made in the plug comparable to cable diameter by height and to plug extensions by width. The grooves are located at both sides from cable. Besides, the plug height does not exceed the groove depth. The plug is inserted into groove with pre-routed cable. Two longitudinal open-end slots are made on the upper surface of plug and under side grooves. The plug is produced by hot pressing method with one or more grooves being intended for electrical cabling.
EFFECT: improved reliability of high-voltage cable integrity at any spatial positions of instrument; cable is within limited space of instrument housing without any extensions, cable is fastened to instrument housing due to simple fastening technology avoiding cable pre-deformation and excluding mechanical damage of high-voltage electric cable.
2 cl, 2 dwg
SUBSTANCE: electric conductor holder comprises a case with the electric conductor inlet and outlet apertures arranged in it, a bending element providing for the conductor curve towards the foreside and three retaining pins the conductor is wound around. The conductor is laid so that to curve at the bending element, contact the first retaining pin foreside, contact the second retaining pin backside to bend backwards, contact the third retaining pin foreside and egress through the outlet aperture specially arranged for the purpose.
EFFECT: reliable fixture of the electric conductor and slippage prevention without detriment to ease of disconnectibility.
7 cl, 6 dwg
SUBSTANCE: wiring plane (10) for electronic components contains cooling lines (16, 18) integrated into body (14) of the plate, for passage of cooling liquid, where fastening device is positioned on the body (14) for mounting electronic components subject to cooling. Device is different because fastening device has at least one first groove (20), made in cross-section approximately c-like and passing rectilinearly in longitudinal direction (A) of wiring plate (10), into which groove at least one nut is inserted to form bolt connection with electronic component which is stable when turned.
EFFECT: increased efficiency.
12 cl, 3 dwg
FIELD: radio electronics, possible use for making electronic modules of radio-electronic equipment.
SUBSTANCE: in electronic module comprising electronic board fastened in bearing structure, and also electro-radio-elements, positioned on aforementioned board and mechanically and electrically connected thereto, aforementioned board is bent with a radius of at least 100 centimeters. The method for manufacturing electronic module includes installing electro-radio-elements on electronic board, installing mechanical and electrical connections between electro-radio-elements and the electronic board, mounting and fastening the electronic board in bearing structure, during installation and fastening of electronic board in bearing structure, aforementioned board is bent with radius of at least 100 centimeters, while the electronic board bending radius is set by shape of bearing structure elements, for example, shape of guiding elements.
EFFECT: increased reliability of electronic module due to increased rigidity of electronic board and prevented appearance of sign-alternating dynamic board deformations under conditions of resonance with external mechanical influences.
2 cl, 4 dwg
FIELD: electric engineering, possible use for supplying power to electric devices and their special parts, in particular, for combination with devices or filters for suppressing radio interference.
SUBSTANCE: in accordance to one aspect of invention, board is positioned on one end of supply line, which board is made jointly with one end of cable and is located in a slit of electric device wall, while internal side of flat body of board is meant for connection, by means of insertion into radio element, supporting amplifier and device for suppressing radio interference, and also their connections. Aforementioned support is integrated with box by means of angular guides, which box covers and protects aforementioned parts, providing maximal hardness, compatibility and protection without usage of any sort of blocking cable clamps or any isolating resins.
EFFECT: possible supplying of electric energy without blocking of cable and following assemblage of wires without usage of isolating resins.
11 cl, 15 dwg
FIELD: radio engineering; packet-type electronic-equipment modules operating at heavy overloads of printed-circuit board connector.
SUBSTANCE: proposed printed-circuit board connector has insulating receptacle with guide windows whose oval jacks accommodate spring contacts in the form of multiturn oval springs; spring contact is installed in receptacle jack for its locking along small axis; receptacle is made of flexible insulating material and chamfered on its external perimeter; radius of receptacle jack generating line is greater than that of spring contact generating line.
EFFECT: enhanced reliability of connector due to reliable locking of spring contact in jack; enhanced contact pressure.
1 cl, 2 dwg
SUBSTANCE: device has electronic boards block with radio-elements thereon and with radial grooves made in them, electric connectors of electronic boards and arc shields separating boards with sockets for bodies of radio-elements, connected to electronic boards by frame fixing, central bushing and rods. Along peripheral line of each arc shield slits are made, combined with radial grooves of each electronic board. Electric connectors of boards are made in form of shields curved around side surface for console portions of boards, current-conducting drawing of which is made in form of circular sectors, positioned between shields slits.
EFFECT: higher resistance to physical impact.
SUBSTANCE: invention may be used for surface installation of electronic components with ball leads by flip-chip method and particularly for installation of electronic component with ball lead matrix. Installation method of electronic components with ball leads provides for application of flip-chip method including ball leads positioning, fastening and connection to printed circuit card mounting surface contacts, which are mechanically and electrically connected with plated-through holes by soldering. Prior to positioning, printed circuit card is turned over, with its mounting surface directed downwards, ball leads of electronic component being placed under plated-thought holes contacts, with the said special orientation of printed circuit card preserved for the time of all operation execution.
EFFECT: production of reliable high-quality soldered connection during surface installation of electronic components.
4 cl, 4 dwg
SUBSTANCE: invention is related to the method, according to which semiconductor elements, forming the part of electronic circuit or at least some of its components, of integration to the plate-base, for example to the printing board in the process of its production. The effect of the invention is achieved by making through-holes in the plate-base for semiconductor components, together with that these holes move between the first and the second surfaces of the plate-base. After creating these holes on the second surface structure plate-base one lays on the plastic foil, which covers the through-holes for semiconducting elements from the side of the second surface structure plates-base. Before hardening of he plastic foil or after its partial hardening the semiconductor elements are cut in from the side of the first surface. Semiconductor elements are pressed down to the plastic foil after that they are being glued to it. After that the final hardening of the plastic foil is carried out.
EFFECT: creation of the method, by which packageless microcircuit are inbuilt safely and economically to the plate-base.
24 cl, 23 dwg
FIELD: engineering of flexible multilayer electronic boards (loops) for assembly of microelectronic equipment.
SUBSTANCE: in accordance to the invention, as substrate material, polyimide, polyether and fluoroplastic films are used. Polyimide film substrates make it possible to achieve high thermal stability of loops and allow usage of different methods of assembly, including welding and soldering, and fluoroplastic films are most usable for making loops based on them for assembly of UHF circuits, due to low losses in UHF frequency range and possible constant wave resistance of loops which connect UHF modules and devices. Structure and placement of contact areas, meant for assembly of electronic components or connection of loop to other devices or electronic boards, and also materials and covers, used for forming aforementioned contact areas, must also provide for high density inter-cell connection in electronic equipment. To that end, contact areas are positioned on the other side of flexible substrate and connected to working conductors via through metallized apertures in the substrate. External sides of contact areas are tin-plated, for example, covered in layer of tin-bismuth alloy, onto the surface of contact areas which is adjacent to substrate, a layer of material is applied to prevent spreading of soldering alloy, chromium for example, and connection of contact areas of loop to contacts of electronic devices is realized by welding-soldering using double electrode tool for micro-mounting, brought to contact with the other surface of contact area via through aperture in the film positioned above the contact area.
EFFECT: manufacture of flexible electronic board, wherein the gap between adjacent conductors does not exceed 20 micrometers, making it possible to ensure placement density of components and contact areas for assembly thereof, approaching contact placement density of modern VLSI circuits.
2 cl, 2 tbl, 2 ex
SUBSTANCE: bent copper plates including three functional sections, as minimum, are used as heat removing components in the module comprised of power instruments, base and electrical circuit. The first sections are amplified on the base surface and may be used as connecting terminals. The other side of base is installed on the second sections. The third sections are soldered to power instruments bases. The wired terminals of power instruments are soldered to the metal-coated sites of the first base side. The module design is capable of multiple deforming under proper temperatures due to the wired terminals and bent copper plates, which are used for power instruments connection to the base 3, and expansion gap introduction.
EFFECT: development of module with wide temperature range of power instruments operation used for superficial installation.
2 cl, 5 dwg