Vessel for electronic ballast resistance

FIELD: physics.

SUBSTANCE: invention is related to electronic units, namely, to simplification of such units. In particular, invention is related to electronic ballast resistors for gas discharge lamps, at that such ballast resistors have higher scattering of heat, reduced amount of components, minimised mechanical stress in electric components and improved suppression of electromagnetic interferences (EMI). Electronic unit having vessel is arranged with sealing against effect of environment, with possibility to suppress EMI and proper thermal connection between hot electric components and external heat radiator contained in unit.

EFFECT: improvement of electronic units operation, improvement of electronic ballast resistances operation for gas discharge lamps, reduction of mechanical stresses in such devices, lower EMI emitted by these devices.

4 cl, 6 dwg

 

The technical field to which the invention relates.

The invention relates to electronic assemblies and more specifically to the simplification of such nodes. In particular, the invention relates to an electronic ballast resistance for gas discharge lamps, such ballast resistance have increased heat dissipation, reduced the number of components is minimized mechanical stress on the electrical components and the increased suppression of electromagnetic interference (EMI).

The level of technology

Electronic ballast resistance for gas-discharge lamps are well-known as an efficient replacement of magnetic ballast resistance outdated type. As the trend towards miniaturization increases, there are additional problems with the regulation of heat dissipation, electrical insulation, mechanical stresses when placing printed circuit boards, as well as reduce EMFs, which may negatively affect other electrical or electronic devices operating nearby.

Accordingly, in the art would be progress if it would be possible to reduce or eliminate specific problems of the known devices.

Disclosure of inventions

The objective of the invention is to overcome the disadvantages of the prior art.

Another task after the retene is to improve the performance of electronic assemblies.

Object of the invention is also to improve the operation of the electronic ballast resistance for gas discharge lamps.

Another object of the invention is to reduce the mechanical stresses in such devices.

In addition, the object of the invention is to reduce EMFs emanating from such devices.

In one aspect of the invention these problems are solved by developing electronic component, comprising a housing having a first half and a second half, and mentioned the first half and said second half are essentially rectangular in configuration and includes a concave areas, the peripheral groove made in the above-mentioned second half, sealing ring of round cross-section located in said groove, a dependent peripheral flange made at the above-mentioned first half, for introduction into contact with the said sealing ring of round cross-section, when the above-mentioned half closed, at least one first vertical wall performed in the above-mentioned first half, and at least one second vertical wall, made in the above-mentioned second half, and the said walls are set against each other and limit the issue is ransta among themselves, printed circuit Board located between the said wall in said first half and said wall in said second half, and mentioned printed circuit Board has first and second surfaces, the peripheral electrical conductor, performed on each of the aforementioned first and second surfaces and in contact with said first vertical wall and said second vertical wall, at least one electrical conductor passing through the aforementioned circuit Board and being in electrical contact with said peripheral electrical conductors, performed at the above-mentioned first and second surfaces, and a set of fasteners passing through the first mentioned half in the above-mentioned second half, resulting in the aforementioned printed circuit Board applied pressure to maintain the aforementioned printed circuit Board in its desired position, and the electromagnetic interference is suppressed by the contact between the said peripheral electrical conductors and said first and second halves.

Brief description of drawings

Figure 1 presents a view in plan of the first half housing for electronic node;

figure 2 presents a view in plan of the second half housing for electronic node;

3 shows in plan the first half of the casing, shown in figure 1, in an inverted position with the installed circuit Board;

4 shows a similar view of the second half of the housing shown in figure 2;

figure 5 presents a cross-section drawn along line 5-5 shown in Fig 1; and

figure 6 presents a cross-section drawn along line 6-6 shown in figure 1.

The implementation of the invention

For a better understanding of the invention, its objectives, advantages and features should refer to the following description and the attached claims, considering them in conjunction with the above drawings.

Figure 1 and 2 shows the e site, which includes a housing having a first half 10 and a second half 12. The first half 10 and a second half 12 is essentially rectangular in configuration, and each includes a concave sections 14, 16, respectively. In the second half of 12 is a peripheral groove 18, which has located therein a sealing ring 20 round cross-section.

In the first half 22 is made of a dependent peripheral flange 22 for introduction into contact with the sealing ring 20 round cross-section, when the above-mentioned half closed, as best seen in figure 5 and 6.

In the first half of 10 is made of at least one first vertical wall is and 24, and in the second half of the 12 completed at least one second vertical wall 26, and these walls are set against each other and limit the space between them. Figure 5 shows two such walls 24 and 26.

Between the walls 24 in the first half and the walls 26 in the second half is a printed circuit Board 28. The circuit Board has first and second surfaces 30, 32 with the usual addition in the form of made them electrically conductive paths.

In addition, the first surface 30 of the first peripheral electrical conductor 34, and the second surface 32 is made of the second peripheral electrical conductor 36. Peripheral electrical conductors are in contact with the first vertical wall 24 and the second vertical wall 26. Through the printed circuit Board 28 passes, at least one electrical conductor 38 (preferably more than one)that are in electrical contact with the peripheral electrical conductors 34, 36, fulfilled in the first and second surfaces 30, 32.

Through the first half to the second half can be a set of fasteners 40, which can be screwed with an external thread and which ensure the application of pressure to the printed circuit Board for maintaining the printed circuit Board in its desired position, whereupon eliminates need is to be in a separate screws or other locking devices to hold the circuit Board in the desired position, and basically eliminates mechanical stress on the PCB and components located on it. Through contact between the peripheral electrical conductors 34, 36 and the first and second halves 10, 12 is suppression of electromagnetic interference.

Printed circuit Board 28 includes at least one heat-generating component 42 (see Fig.6), and this heat generating component 42 has the carriers 44, 46 disposed between the component 42 and the circuit Board. Heat-generating component may be supporting the required quality power semiconductor made of, for example, in the form of a field-effect transistor based on the structure of metal - oxide - semiconductor (MOS transistor), and the fluids can be deformed by thermal mastic.

Printed circuit Board 28 additionally includes electrical components 48, 50, and these electrical components are isolated from the first and second halves of the body of the air gaps 52, 54, as shown in figure 5.

In addition to the above electrical components of the printed circuit Board 28 is typically also contains a ferrite component 56, which may contain two halves 58, 60, and these halves 58, 60 are jointed with each other by means of a spring clip 62, which includes at least two leaf spring 64, finding the I in contact with the surface of one of the first half housing and the second housing halves. In the embodiment shown in figure 5, the spring holders 64 is introduced into engagement with the surface 66 in the second half of 12.

Thus, the proposed electronic unit having reduced mechanical stress in a member of this site PCB, good thermal and electrical insulation where needed, and providing excellent suppression of EMI, the latter property is due to the creation of part of the Faraday cage, when two of the perimeter of the conductor 34, 36 and copper conductor 38, which passes between them, are brought into contact with each other through the first half 10 and a second half 12.

Although the above illustrated and described solutions, representing the currently favored embodiments of the invention, for specialists in the art it will be obvious that within the scope of the claims of the invention, is characterized by the attached claims may make various changes and modifications.

1. E-node, comprising a housing having a first half and a second half, the first half and the second half is essentially rectangular in configuration and includes a concave areas, the peripheral groove made in the second half, sealing ring of circular cross with the treatment, located in the groove, a dependent peripheral flange made in the first half, for introduction into contact with the sealing ring of round cross-section, when half closed, at least one first vertical wall, completed in the first half, and at least one second vertical wall, made in the second half, and the walls are set against each other and limit the space between the circuit Board located between the wall in the first half and the wall in the second half, and the circuit Board has first and second surfaces, the peripheral electrical conductor, performed on each of the first and second surfaces and in contact with the first vertical wall and second vertical wall, at least one electrical conductor passing through the circuit Board and being in electrical contact with the peripheral electrical conductors made on the first and second surfaces, and a set of fasteners passing through the first half to the second half, resulting in a printed circuit Board applied pressure to maintain the circuit Board in the desired position, and electromagnetic interference are suppressed through contact between the peripheral electrical conductors of the first and the second halves.

2. E-the node of claim 1, wherein the circuit Board includes at least one heat generating component and the heat generating component has a heat transfer posted by ensuring a close link between this component and the shroud.

3. E-the node of claim 1, wherein the circuit Board includes electrical components, and electrical components are isolated from the first and second halves of the body by an air gap.

4. E-the node according to claim 1, in which the printed circuit Board contains a ferrite component containing two halves, with one half connected to each other by means of a spring clip, which includes at least two leaf spring in contact with the surface of one of the first half of the housing or the second housing halves.



 

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