Damped board

FIELD: electricity.

SUBSTANCE: damped board contains printed circuit board and damping unit consisting of reinforcing layer made of structural material bonded with printed board by layer of viscoelastic material. Damping unit is performed as two-layer frame passing through fixing points of printed board and containing reinforcing layer and layer of viscoelastic material.

EFFECT: providing of printed boards damping with maximum saving of useful area; minimal increase of board mass and keeping damping properties in wide temperature range.

3 cl, 7 dwg

 

The invention relates to electronics and can be used in the design of electronic equipment containing PCB, working in conditions of intensive mechanical and thermal loading.

Known damped Board containing several plates on the inner surfaces of which are covered with a rubbery mastic in the form of strips on the grid. Strip grid one plate offset by a half pitch relative to the strips of the grid strips adjacent plates and between the plates entered the strip. This allows us to improve the damping characteristics of the Board (USSR author's certificate No. 1043837, IPC NC 1/02, 1983).

The disadvantage of the invention is the impossibility of end-to-end mounting of radio electronic elements (REE) on both sides of the Board and the impossibility of providing high damping properties in a wide temperature range.

Known invention called "Electronic unit", which describes the damping device circuit Board containing the circuit Board and the damping unit, which consists of a reinforcing layer made of metal, connected to the plate by a layer of viscoelastic material (RF Patent No. 2036568, IPC NC 5/00, 1992).

This device at normal temperature effectively reduces the dynamic circuit boards in the us is the conditions of dynamic effects in a wide range of frequencies.

However, one surface of the PCB is fully connected with a damping node, which reduces the effective area of the card and does not ensure a seamless installation REE on both sides of the Board. In addition, when intense temperature influences (for example, when subzero temperatures) the effectiveness of the damping is reduced, so as not taken measures to stabilize the tangent of mechanical loss vibrationfree material in a wide temperature range.

The disadvantages of the device include its increased weight due to the presence of damping in the host metal plate, which has an area not less than the area of the PCB.

This invention is selected as a prototype.

Solved by the invention is to provide damping circuit boards with the maximum preservation of the useful area for placement of REE, the minimum increase of the weight of the Board, ensuring installation REE on both sides of the PCB and maintaining effective damping in a wide temperature range.

The technical result consists in the fact that by performing a damping node in the form of a narrow two-layer frame (trim Board), including a reinforcing layer and a layer of viscoelastic material, with a surface area substantially smaller area of the PCB, provides damping in terms of the dynamic effects with minimal increase in weight of the Board and a minimum reduction of usable floor space to accommodate REE. As the opposite side of the PCB (except narrow fringing in the locations of the fasteners) are open, may be conducted through mounting REE on both sides. The location of the frame on opposite sides of the PCB and use within a viscoelastic material with different temperature ranges maximum damping ensure effective damping in the operational temperature range.

This technical result in the implementation of the invention is achieved by the fact that in the damped circuit Board containing the circuit Board and the damping unit, which consists of a reinforcing layer made of a structural material that is connected to the circuit Board layer of viscoelastic material according to the invention the damping unit is designed in the form of a two-layer frame containing the reinforcing layer and the layer of viscoelastic material and passing through the point of attachment of the Board. In addition, to extend the temperature range of effective damping fee is equipped with identical frame that is installed on the opposite side of the PCB, and the layers of viscoelastic material frames have different temperature ranges maximum damping.

To improve the damping characteristics of the reinforcing layer is done is n with U-shaped recess, facing the printed circuit Board and filled with viscoelastic material.

The distinguishing characteristics of the proposed device from the above known (prototype) are:

- execution of the damping unit as the double-layer frame containing the reinforcing layer and the layer of viscoelastic material;

- passage double-layer frame via the mounting Board;

- implementation of a reinforcing layer with a U-shaped recess that faces the Board and filled with viscoelastic material;

- supply Board is identical to the framework set out from opposite sides of the PCB, and a layer of viscoelastic material each frame has a different temperature ranges maximum damping.

Due to the presence of these signs together with signs, in common with the prototype, it becomes possible to provide damping of the Board in a wide temperature range with a minimum increase of the weight of the Board and a minimum reduction of usable floor space to accommodate REE.

In the analysis of the prior art, including searching by the patent and scientific and technical information sources and identify sources that contain information about the equivalents of the claimed invention, not found analogues characterized by signs, identical with all the essential features of this izobretatelnie from the list of identified unique prototype as the most similar in essential features analogue, helped to identify a set of essential towards perceived by the applicant to the technical result of the distinctive features in the claimed device, set forth in the claims.

Therefore, the claimed invention meets the condition of "novelty."

To verify compliance of the claimed invention the term "inventive step", the applicant conducted an additional search of the known solutions to identify signs that match the distinctive features of the prototype of the characteristics of the claimed device. The search revealed no technical solutions to these signs. On this basis, we can draw conclusions about the compliance of the claimed invention, the term "inventive step".

Figure 1 shows damped fee, General view.

Figure 2 shows a side view of figure 1.

Figure 3-6 - section a-a figure 1, execution options, and placement of the damping of the node.

7 - dependence of relative figure of meritdamped Board on temperature in the temperature range of minus 40°C... + 60°C.

Damped Board contains the circuit Board 1 and the damping unit, performed in the form of a two-layer strip (frame). Outer (reinforcing) layer 2 made of a structural material, is connected to the circuit Board 1 layer of viscoelastic mA is eriala 3. Damping the site is located on both sides of the printed circuit Board 1 and on both sides mounted REE 4. The damping unit is designed in the shape of a frame and passes through the attachment 5 damped Board to the chassis of the electronic block.

Reinforcing layer 2 can be performed by varying the thickness of the different grades of material. This gives the ability to change within certain limits, the rigidity of the Board 1 and its dynamic properties. The vibrational energy transmitted to the card 1 in place of its attachment, excites Flexural vibrations Board 1, thus due to the deformation of the circuit Board 1 and a reinforcing layer 2 arise shear deformation of the viscoelastic layer 3, which provide intensive absorption of vibrational energy Board 1. The efficiency of energy absorption is determined by the damping properties of viscoelastic material layer 3. Performing a reinforcing layer 2 is filled with a viscoelastic material 3 U-shaped recess 6 (5, 6) ensures the stability of the job, the thickness of the viscoelastic layer and the secure fastening of the damped Board to the chassis of the electronic device, which improves the damping characteristics. The location of the reinforcing layers 2 on both sides of the Board 1 and the use of viscoelastic materials with different temperature ranges maximum damping provide EF the objective damping at variable temperatures (figure 4, 6).

Printed circuit Board 1 made of fiberglass STEF-1 thickness 2 mm Board Size h mm. On Board 1 was set simulators REE. Charge 1 was attached seven M4 screws with a torque of 4 kgf·see Damping node represented made of alloy D16 frame is a U-shaped cross-section passing through the attachment point, 4 mm wide and 0.5 mm thick, mounted on two sides of the Board 1 and the filled compounds CT M and SOPS-ZACK different temperature ranges maximum damping. Sensors were installed on the ground 7 Board 1. 7 shows the dependence of the relative figure of merittemperature.where Qd, Qoaccordingly the ratio of maximum acceleration at the fundamental frequency damped and undamped Board to the acceleration at the attachment point. Values of Qo, Qdandwas determined by the amplitude-frequency characteristics, taken under the action of a harmonic vibration with a constant acceleration level in place of the mounting Board.

As can be seen from Fig.7, the damping of the Board 1 in the temperature range of minus 40°C... + 60°C changes slightly.

Thus, by performing the damping unit as the frame, passing through the attachment point, ensuring the and the possibility of reducing the maximum vipranarayana Board 2...2.5 times in the temperature range of minus 40° C... + 60°C. it also provided the possibility of placing REE on both sides of the Board, that allows to reduce the size of electronic device usually includes a few cards. Placement of the part on both sides of the circuit Board with the use of viscoelastic materials with different temperature ranges maximum damping significantly improves the stability of the damping characteristics in a wide temperature range, which extends the scope of the invention.

Thus, the data presented indicate the implementation of the use of the claimed invention, the following cumulative conditions:

the tool embodying the claimed device in its implementation, is intended for use in various industries;

for the inventive device in the form in which it is characterized in the claims, confirmed the possibility of its implementation.

Therefore, the claimed invention meets the condition of "industrial applicability".

1. Damped Board containing the circuit Board and the damping unit, which consists of a reinforcing layer made of a structural material that is connected to the circuit Board layer of viscoelastic material, characterized in that the damping unit is designed in the form of duhl Inoi frame, passing through the point of attachment to the circuit Board and containing reinforcing layer and the layer of viscoelastic material.

2. Damped Board according to claim 1, characterized in that provided identical double-layer frame that is installed on the opposite side of the PCB, and the layers of viscoelastic material frames have different temperature ranges maximum damping.

3. Damped Board according to claim 1 or 2, characterized in that the reinforcing layer is made with U-shaped cavity facing the Board and filled with viscoelastic material.



 

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