Method of integration of components to plate-base

FIELD: electrotechnics.

SUBSTANCE: invention is related to the method, according to which semiconductor elements, forming the part of electronic circuit or at least some of its components, of integration to the plate-base, for example to the printing board in the process of its production. The effect of the invention is achieved by making through-holes in the plate-base for semiconductor components, together with that these holes move between the first and the second surfaces of the plate-base. After creating these holes on the second surface structure plate-base one lays on the plastic foil, which covers the through-holes for semiconducting elements from the side of the second surface structure plates-base. Before hardening of he plastic foil or after its partial hardening the semiconductor elements are cut in from the side of the first surface. Semiconductor elements are pressed down to the plastic foil after that they are being glued to it. After that the final hardening of the plastic foil is carried out.

EFFECT: creation of the method, by which packageless microcircuit are inbuilt safely and economically to the plate-base.

24 cl, 23 dwg

 

The technical field to which the invention relates.

The present invention relates to a method of embedding one or more components in the base.

The level of technology

The Foundation processed by methods which include the present invention, are used as bases for electrical components, typically, semiconductor components, in particular ICS, electronics. The grounds are designed for mechanical attachment of components and education necessary electrical connections with other components on the base and outside the base. As the Foundation can serve as a printed circuit Board, so that the method which is the subject of the invention is closely related to the technology of production of printed circuit boards. But the base can also be of another type, for example, the packaging component or components, or the basis of a functional module.

Technology of production of printed circuit boards is different from the integrated circuit, among other things, by the fact that the substrate used in the manufacture of integrated circuits, is a semiconductor material, while the base material of the PCB is an insulator. Therefore, the manufacturing of chips, as a rule, requires a much more expensive technology than the manufacture of printed circuit boards.

Technology of production of printed circuit boards is different from the packaging technology in that it focused on education around the semiconductor component housing, which simplifies handling. On the body surface of the semiconductor component has a contact part, usually the tabs, making it easy to install the component in the housing on the circuit Board. The semiconductor body also contains the conductors through which a voltage can be enjoyed on the semiconductor connecting the protruding contact portion outside the housing with the contact pads on the surface of the semiconductor component.

However, the chassis components, manufactured with conventional technologies, take up too much space. The miniaturization of electronic devices has led to attempts to exclude the packaging of semiconductor components. For this purpose was, for example, developed the so-called "flip-chip" technology (the technology of the inverted crystal), in which the planar semiconductor component is mounted directly on the surface of the PCB. However, the technology of the inverted crystal is fraught with difficulties. For example, you may experience problems with the reliability of connections, especially in devices where possible mechanical stresses between the printed PLA is Oh and the semiconductor component. Mechanical stress has to be aligned by adding the appropriate gasket between the chip and PCB. This procedure slows down the process and increases the manufacturing cost. Voltage occur, particularly in devices that use flexible printed circuit Board, exposed to strong bending.

Disclosure of inventions

The objective of the invention is to provide a method by which a die chip can be embedded in the Foundation of a reliable but cost-effective manner.

The invention is based on integration of semiconductor components or at least some of these components in the basis, for example in printed circuit Board in the process of its production, so that part of the base layer formed around the semiconductor components.

More specifically, the invention in its first aspect provides a method of embedding in the basis of at least one component, for example a semiconductor component, the first surface of which is provided with pads. The method comprises providing as the basis of a base plate having a first surface and a second surface, creating a base plate of conductive drawings and run it at least one hole for at least one component, and each hole which passes through the base plate between the first and second surfaces, applying an insulating polymer layer on the second surface of the base plate such that the insulating polymer layer covers at least one opening for the component, the installation of at least one component in at least one hole so that the component is combined with the conductive drawings made on the base plate and the first surface of the component is pressed against the insulating polymer layer, and curing the insulating polymer layer.

The first surface of the component, press either the uncured insulating polymer layer, or in a partially cured insulating polymer layer.

The insulating polymer layer creates either by placing the coated resin copper foil on the second surface of the base plate or coating film, pre-impregnated with epoxy resin on the second surface of the base plate.

In a preferred variant of the method on the walls of the holes for the component increasing conductive material to provide around the component protection from interference.

Contact pads of the component can be United with them contact protrusions, in this case the component is installed in the hole so that the contact tabs are inside the insulating polymer layer. Contact pads of the component can who have United with them contact protrusions, the height of which is at least equal to the thickness of the insulating polymer layer, in this case the component is installed in the hole so that the contact protrusions pass through the insulating polymer layer.

In the following a preferred embodiment, the contact holes for the component to perform the cured insulating polymer layer and in the contact holes and over the insulating polymer layer to create guides for the formation of electrical contact with the component.

Conductive drawings can be created by at least the second surface of the base plate, and an insulating polymer layer can be deposited on the second surface of the base plate so that it covers the conductive patterns on the second surface.

In another preferred embodiment, the first surface of the component press in an insulating polymer layer in contact with the conductive drawings in the conductive layer.

In the most preferred embodiment, at least one set of conductive drawings is placed between the insulating polymer layer, in which press the first surface of the component, and the base plate of the PCB.

Base plate, usually made of insulating material.

The component can be secured in the hole by filling the hole is, made in the base plate filler.

The component may be a chip, and the electrical contact with the chip is formed from the first surface of the base plate after installing the chip in the slot in the base plate.

In another embodiment, the electrical contact with the component form by increasing electrically conductive material on the contact pads of the component or at the ends of the contact tabs.

In the case of chip electrical contact with the chip can be formed without soldering using the technology of the manufacture of printed circuit boards.

Alternatively, in the basis embed more than one component, and the base plate perform a separate hole for each component, embedded in the base, and each component, embedded in the base, set in its own hole. Can also produce a multilayer structure having at least four conductive layers located one on top of another. In this case, is made, for example, the first Foundation, which embed the at least two chips, and at least one second base, which embed the at least two chips, and the base is mounted and fixed on each other with mutual with the tion. Preferably make the first and the second substrate and the intermediate layer, the second base is placed over the first substrate with the alignment relative to the first base, between the first and second base place the intermediate layer and the bond between a first and second base by means of the intermediate layer. Most preferably made of at least one third substrate and the intermediate layer for each of the third base, a third base in turn is placed over the first and second bases with a combination concerning one of the underlying reasons behind each and every third base place the intermediate layer and fastened to each other first, second, and every third base by means of the intermediate layers. In the grounds attached to each other, drill the holes for end-to-end connections, and drilled the holes to create conductors for connection of the electronic circuits of each of the Foundation for education operating together.

The temperature of the base plate, component or conductive layer directly associated with the component, does not exceed in the process 200°S, and preferably is in the range from 20 to 85°C.

In the second aspect of the invention relates to an electronic module, made with the use of Sanogo method.

Using the invention are achieved significant benefits. This is because the printed circuit Board can be manufactured with embedded semiconductor components. The invention also provides the ability to manufacture small and reliable buildings around the components.

For example, using the invention, the execution phase component in the housing, the step of manufacturing the circuit Board and the step of forming contacts of semiconductor components can be combined into one. The combination of the individual steps of the process gives considerable advantages from the point of view of logistics and enables to produce more reliable electronic modules of smaller size. A further advantage of the method is the widespread use of common methods of manufacturing printed circuit boards and Assembly technologies.

A combined process in accordance with a preferred variant of the invention, in General, easier than, for example, manufacturing a circuit Board according to the technology of the inverted crystal to attach components to printed circuit Board. Using these preferred options are obtained the following advantages compared with the known solutions.

No soldering required for the formation of contact with the components, instead, the electrical contact can be formed by building up launched for the s on top of the pads of the semiconductor component. This means no need to use molten metal to connect the components, so that between the metals do not form chemical compounds. These compounds between metals usually fragile, and therefore, in comparison with the contacts made by soldering the contacts according to the present invention have a high reliability. Especially in the small contacts the fragility of compounds of metals creates big problems. According to a preferred variant bezpieczna technology allows to obtain structures are much smaller in comparison with the solder structures. Bezpieczny method of education contacts has the advantage that for the formation of contact does not require high temperatures. The lower temperature of the process provide a wider choice of other materials for printed circuit boards, enclosures, components and electronic modules. In the proposed method, the temperature of the PCB, components and conductive layer is in the range 20-85°C. a higher temperature, for example, about 150°are required only in the case if you apply the curing (polymerization) of any polymer films. However, the temperature of the base plate and the components can be maintained below 200°forall C in the process. The method also permits the use of polymer films, which otverzhdajutsja not due to high temperature, as, for example, chemically or by using a solenoid, for example, ultraviolet radiation. In this preferred embodiment of the invention, the temperature of the base plate and the components can be maintained below 100°during the whole process.

Because the application of the method allows to make the structure smaller components can be more tightly. Conductors between components can, therefore, be shorter, which improves the electrical properties of electronic circuits, for example, by reducing losses, crosstalk and delay.

The method also allows to produce three-dimensional structure, since the base and the components built in to the base, can be placed one above the other. The method also allows to reduce the boundaries between different metals. The method permits the use of lead-free technology.

The invention also allows other preferred implementation. The invention is applicable, for example, to a flexible PCB. The method also allows the installation of printed circuit boards one above the other.

The invention also allows you to produce hyperfine structure in which semiconductor components, in spite of its small thickness, completely for ideny inside the base, for example, a printed circuit Board.

As semiconductor components can be placed completely inside the circuit Board, the connections between the PCB and semiconductor components mechanically strong and reliable.

Brief description of drawings

Hereinafter the invention is explained on the examples with reference to the accompanying drawings, where

figure 1 shows a sequence of cross sections for one process according to the invention;

figure 2 shows a sequence of cross-sections for the second process according to the invention;

figure 3 shows a schematic diagram of a possible method of forming contacts.

figure 4 shows a sequence of cross sections for the third process according to the invention.

The implementation of the invention

The sequence of illustrations figure 1 depicts one possible process according to the invention. Next, the process depicted in figure 1, is considered in stages.

Stage A (Piga)

At the stage And provide the base plate 1, suitable for manufacturing printed circuit boards. As the base plate can be used, for example, epoxy plate, reinforced with fiberglass, for example plate type FR4. The base plate 1 can also be organic plate, as described in the example, the process does not require high the temperature. Therefore, as the base plate 1, you can choose flexible and cheap organic plate. Generally, the base plate 1 is covered with a conductive material 2, usually copper. Of course can be used inorganic plate.

Stage (pigv)

On stage, in the base plate bore apertures 3 for the electrical contacts. Holes 3 can be performed by any known method adopted in the manufacture of printed circuit boards, for example, mechanical drilling.

Stage (figs)

On stage With pass-through holes formed on the stage, increasing the metal. In the described process, the metal 4 also increase on top of the PCB, resulting in increased thickness of the conductive material 2.

Conductive layer increasing from metal 4, which is copper or any other material having sufficient electrical conductivity. Plating with copper is carried out in the form of a coating of the holes with a thin layer of chemical copper and continue coatings using electrochemical method of increasing copper. Chemical copper is used in this example because it will also cover the polymer above and to act as an electrical conductor in electrochemical coating. Capacity metal can, thus, be cheap wet chemical SPO is obom. In an alternative embodiment, conductive layer of metal 4 can be manufactured, for example, by filling a through-hole conductive paste.

Stage D (fig.1D)

At the step D in the conductive layer on the surface of the PCB to create a conductive pattern of circuit connections. This can be accomplished using well-known methods of manufacturing printed circuit boards. Drawing on conductive layer is bound, for example, the holes made on the stage of the Century

Conductive pattern of circuit connections may be created, for example, by coating the surface of the metal 4 photolithographic polymer film on which a desired pattern of circuit connections is formed by exposure to light through a mask for a picture. After exposure of the polymer film show and remove from it the required sections. Under the polymer opens the metal 4 in the form of copper. Then corrode copper, opened under the film, and remains the desired pattern of circuit connections. The polymer plays the role of a so-called mask for etching, and the layer of metal 4 holes 5, the bottom of which exposed the lower part of the PCB. Then the polymer film is removed from the metal surface 4.

Stage E (file)

At stage E in the base plate bore holes 6 for chips. Holes passing through the substrate from the first surface is rnost 1A to the second surface 1b. Holes can be made, for example, mechanical milling on a milling machine. Holes b may be performed, for example, by stamping. Hole 6 is bound to the conducting pattern of circuit connections of the PCB. Through holes 3 done on the stage, can be used for binding, but the binding is also made regarding the pattern of circuit connections, since the pattern of circuit connections has a certain position relative to the through holes 3.

Stage F (fig.1F)

At stage F on the second surface 1b of the base plate is applied polymer film 7, which provides electrical insulation and cover the openings 6. Polymer film 7 has sufficient rigidity to basically keep its shape, but to prevent hardening, so that the components can be attached, if their press in the film. The polymeric film should be tough enough crunched into her components were retained immobility relative to the base during the following stages of the process.

Polymeric film applied in step F may be, for example, the prepreg tape (tape, pre-impregnated binder).

Optionally, at step F the polymer film 7 can be applied metallic coating 8.

In the described example, the step F is performed by applying on the surface is rnost PCB thin polymer film, thickness of, for example, about 40 μm, which is covered with a layer of copper, of a thickness of, for example, about 5 μm. Application produced by pressure and heat. In the described process as the film uses the RCC foil (copper, coated with resin). The adhesion of the film surface must be complete, i.e. there should not be complete curing of the polymer. This process is carried out at significantly lower temperatures and/or reduce the cooking time.

Stage G (fig.1G)

At stage G in the holes 6 from the first surface 1A of the base plate install the chip 18. Installation can be performed using a precision Assembly machines, chip 18 is combined with the conductive pattern of the circuit connections of the PCB. In the same way as in stage E, the hole, on the stage, can be used to bind.

The chip 18 is positioned so that they are bonded to the polymeric film 7 on the bottom of the hole 6. The most convenient way of installation is that with a little effort to push the chip 18 in the polymer film 7 for better retention in its place. Preferably, the chip had contact protrusions 9, these polymeric film 7 through.

Figure 3 shows an interesting alternative, where the contact protrusion is 9 chips so long, they pass through the polymer film 7 to the metallic coating 8. In this case, there is no need to drill holes in the polymer film 7 (step K) for the formation of contacts in the circuits, because such holes are formed during Assembly of the components. In addition, can be simplified step metallization of holes (stage L), as the contact protrusions 9 automatically create a column conductor through the polymer film 7. In a constructive option, shown in figure 3, the contact protrusions may have a pointed shape to improve these abilities. If the contact protrusions 9 is sufficiently long and sharp, they can pass and through the metallic coating 8, and, in principle, to establish electrical contact between the chip 18 and the metallic coating 8.

Stage N (not illustrated)

At stage N utverjdayut polymer film 7. Curing typically involves heat treatment, but for curing polymer can be applied and non-thermal processing methods. If desired, the step H can be excluded, particularly when the curing of the polymer is produced by heat treatment. However, the curing time of the polymer at this stage will not allow the chip to move relative to the base phase I.

Phase I (Fig)

In phase 1 of the chip is attached to the base plate printed circuit Board p is the filler hole chip filler 10. In the described process, this stage is implemented by filling in holes and deposition on top of the chip epoxy resin from the side of the first surface (1A) of the PCB. Epoxy resin is spread with a spatula and utverjdayut by aging in an autoclave. At the same time cures and polymer film 7, if the process was not included stage N.

Stage J (fig.1J)

At stage J at the first surface (1A) of the PCB is applied polymer film 11 and cover the top with a thin metal layer 12.

In the described example, the phase J performed by coating on the surface of the printed circuit Board, a thin polymer film, for example, a thickness of about 40 μm, on top of which is applied a layer of copper of a thickness of, for example, about 5 μm. Application produced by pressure and heat. In the described process as the film uses the RCC foil (copper, coated with resin).

The polymeric film may also be formed, for example, drawing on the PCB liquid polymer. The method of applying a film to stage J is unimportant. It is important that on a printed circuit Board containing embedded components, especially mounted chip was formed an insulating layer, typically of a polymeric film. Itself polymer film can be according to the invention is filled or unfilled. The polymeric film may be the future of metal coating, but this is not essential since the conductive surface may be created later on top of already applied on PCB polymer layer.

Stage J allows the use of conventional methods of manufacturing and processing steps in the manufacture of printed circuit boards in the described example, however, to include in the printed circuit chips and other components.

Stage (1 To)

On the stage in polymer films 7 and 11, and at the same time, in the metallic coating 8 and the layer 12, bore holes 13, through which you can secure contact with the conductive pattern and the through connections (metal 4) printed circuit boards, and chips.

The holes 13 may be performed, for example, using a laser or other suitable method. Conductive pattern created in step D, or through holes made on the stage, can be used for binding.

Stage 1 (fig.1L)

Stage L corresponds to the stage C. stage L in the holes 13 and on the surface of the printed circuit Board form a conductive layer 14.

In the described example, the end-to-end connection (hole 13) first of all clear by a three-stage process. Then end-to-end connection metallizer. To do this, on the surface of the polymer initially create a catalytic surface SnPd, and then on the surface of a thin layer (about 2 femtometres) the chemical is tion of copper. The thickness of the conductive layer 14 of copper increases with electrochemical deposition.

Alternatively, end-to-end connections may be filled with conductive paste, or may use other suitable method of metallization.

Stage M (film)

At the stage of M form a conductive pattern in the same way as in step D.

Stages N and (fig.1N and 1O)

At stages N and O on the surface of the printed circuit Board is applied photolithographic polymer 15, which create the desired pattern (similar to the phases D and M). The exposed polymer show, but remaining on the printed circuit Board pattern of the polymer film is not removed.

Step R (figr)

At the stage of R on the connecting parts of the image of the polymer film formed in the previous stages, apply the coating 16. The coating 16 may be performed, for example, Ni/Au or OSP (organic surface protection).

The example in figure 1 illustrates the process, which can be used when implementing the invention. However, the invention is in no way limited to the above-described process, as it is in accordance with the invention covers a large group of different processes and their end products, and allows equivalents. In particular, the invention is in no way limited to the topology presented in the example, but, on the contrary, to the op is private specialist will be obvious, the processes corresponding to the invention can be used for the manufacture of various types of printed circuit boards, very different from the examples presented. Hence, circuits and connections in the drawings are only for illustrating the fabrication process.

In the above process may be changed without departure from the ideas embodied in the invention. Changes may relate to the operations depicted at various stages, or, for example, to the mutual sequence of stages. For example, the stage may be performed after step D, i.e. the procedure may consist of the combination of the drilled holes with a picture, instead of combine drawing with drilled holes. Respectively, can be changed the order of the stages D and E. Hole components may be performed before formation of the conductive patterns. In this case, the conductive pattern is combined with the holes 6, and the holes 3. Regardless of the order in which stages are b, D and E, the polymer film 7, which should be applied at stage F, closes the opening 6 and the conductive pattern on the second side 1b of the base plate.

The process described above may be added in stages, if necessary. For example, the first surface is 1A circuit Board can be covered with foil, which will protect the surface of the PCB during casting produced at stage N. This protective foil covers all areas except the holes 6. Protective foil ensures the cleanliness of the surface of the PCB when levelling epoxy fill spatula. The protective foil can be applied at any suitable stage prior to stage I, and removed from the surface of the PCB directly after pouring.

Using the proposed method can also produce packages of components attached to the circuit Board. These packets can contain multiple semiconductor components are electrically connected with each other.

The proposed method can also be used for the manufacture of entire electrical modules. The process, depicted in figure 1, can be applied so that the conductive patterns were created only on the second surface 1b of the printed circuit Board is oriented relative to the contact surface of the chip.

This method allows to produce, for example, printed circuit boards or electrical modules with the thickness of the Foundation of the order of 50-200 microns and the thickness of the chip is of the order of 50-150 microns. Step conductors may vary, for example, in the range of 50-250 microns, while the diameter of the conductor of perforations may be, for example, 15-50 m is CZK. Thus, the total thickness of one Board single-layer structures will be about 100-300 microns.

The invention also allows you to set the PCB on one another, forming, thus, a multilayer conductive structure, in which different PCB fabricated in accordance with figure 1, installed one on another and electrically interconnected. PCB mounted one on the other, can also be cards, in which a conductive structure is formed only on the second surface 1b of the PCB. They, however, contain conductive holes through which can be made electrical contact with the circuits on the first side of the PCB. Figure 2 shows one such process.

Figure 2 depicts the connection of printed circuit boards. Next is a gradual process.

Stage 2A (figa)

Phase 2A set one PCB to another. The bottom Board can be obtained, for example, after step J of the modified process of figure 1. In this case, the modification of the process of figure 1 is the exception of step 1C.

Middle and upper printed circuit Board, in turn, can be obtained after step M of the modified process of figure 1. In this case, the modification of the process of figure 1 is the exception of stage 1C and in steps J, K and L only on the second is arnosti 1b PCB.

In addition to the PCB on figa also shows the layers 21, the pre-impregnated epoxy resin, sandwiched between printed circuit boards.

Stage 2B (pigv)

Phase 2B PCB glued together using layers 21, the pre-impregnated epoxy binder. In addition, both sides of the PCB cover of the polymer film 22 with a metallic coating. The process corresponds to the stage J of the process depicted in figure 1. In the depicted example, the polymer film 22 with a metal coating is deposited on the bottom side of the PCB.

Stage 2C (figs)

Phase 2C in printed circuit Board drilling holes 23 for the formation of contacts.

After step 2C, the process can be continued, for example, as follows.

Step 2D

At step 2D on top of the printed circuit Board and in the through holes 23 are increasing conductive material in the same way as in step 1C.

Stage 2E

On the 2ND stage in the conductive layer on the surface of the printed circuit Board form a pattern in the same way as in step 1D.

Step 2F

At step 2F on the surface of the printed circuit Board is applied photolithographic polymer and the polymer form a desired pattern in the same way as on the stages 1N and 10. The exposed polymer film show, but remaining on the printed circuit Board pattern of the polymer film is not removed.

Step 2G

At step 2G connection drawing region of the polymer film obtained in the preceding stage, metallizers in the same way as you did in step 1.

In the example shown in figure 2, it follows that the method can be also used for the manufacture of various kinds of three-dimensional structures. For example, the method can be used so that multiple memory cells have been installed on one another, forming a package containing several storage cells, in which memory cells are connected, forming the operating set. Such a package can be considered as a three-dimensional multichip module. Chip modules can be chosen freely, and the contacts between the chips can be simply implemented in accordance with the selected cells.

The invention allows electromagnetic protection around the components built into the base. For this purpose, the method of figure 1 need to be modified so that the holes 6, performed on stage 1E, can be performed in connection with the holes 3, performed on the stage 1B. In this case, the conductive layer of metal 4, which perform on stage 1C, will also cover the walls of the holes 6, and are designed for components. On figa shows a cross-section of the base layer after step 1F, if the process modificarea the above method.

After the intermediate stage shown in figa, the process can be continued by mounting chips in the same way as you did in step 1G, curing the polymer film, on stage, 1H, and attaching the chip, as in step 11. After that, the polymer and the metal foil can be applied on the first surface of the PCB as well as on stage 1J. On FIGU shows an example of the sectional structure of the base after performing all these steps.

After the intermediate stage shown in figv, the process may be continued by the execution of holes in the polymer film for the formation of contacts in the same way as it was done on stage 1K. Then in the holes and on the surface of the card creates a conductive layer in the same way as it was done on stage 1L. On figs shows an example of the sectional structure of the base after the completion of these stages of the process. For greater clarity conductive layer, made in the holes and on the surface of the Board in the same way as it was done on stage, 1L, indicated by black shading.

After the intermediate stage shown in figs, the process can be continued by creating a conductive pattern on the surface of the Board, as on the stage 1M, and coating surfaces of the Board as on stage 1N. After these steps, the chip is almost completely surrounded by almost the whole metal is eskay foil, providing effective protection from interference caused by electromagnetic effects. This design is depicted in fig.4D. After the intermediate stage shown in fig.4D, perform the steps corresponding to steps 10 and 1R, which on the surface of the PCB cause the protective foil and make connections.

On fig.4D section of the metal layer, which protects the chip, indicated by black shading. In addition, the background of chips allocated to the hatch. Shading should be recalled that all sides of the holes under the chip is covered with a metal foil. Thus, the chip is surrounded by a laterally continuous layer of metal foil. In addition, over the chip may be provided as a metal plate, made simultaneously with the conductive pattern on the circuit Board. Similarly, the metal foil must be laid under the chip as possible, without breaks. The formation of contacts under the chip requires a metal foil were done with small holes, as shown, for example, on fig.4D. These breaks, however, can be so narrow horizontally and such thin vertically, they can weaken the effect of protection from electromagnetic interference.

When considering example fig.4D you also need to take into account that the final structure will gain elements, located at right angles to the plane of the drawing. This structure extends at right angles depicted conductor connected to the contact bar on the left side of the left chip on fig.4D, which is directed in the direction of the observer and is located between the metal foil surrounding the chip from the sides, and conductive layers under the chip.

The design depicted on fig.4D, provides, therefore, excellent protection circuits against electromagnetic interference. Since protection is made directly around the chip, the design also provides protection from mutual interference between the components mounted on the printed circuit Board. A large part of the electromagnetic shielding structures may also be grounded, since the metal foil surrounding the side of the chip may be electrically connected with a metal plate over the scheme. Connection PCB can in turn be designed in such a way that the metal plate was grounded through the conductive patterns of the PCB.

1. The method of embedding in the basis of at least one component, the first surface of which is provided with contact areas, including security as a Foundation base plate having a first surface and a second surface, the implementation in the base place the ine through holes for electrical contacts, creation on the base plate of conductive drawings and run it at least one hole for at least one component in connection with holes for electrical contacts, and each hole passes through the base plate between the first and second surfaces, the walls of the hole for the electrical contacts and at least one hole for at least one component increasing conductive material to provide around the component protection from interference, applying an insulating polymer layer on the second surface of the base plate such that the insulating polymer layer covers at least one hole for component installation at least one component in at least one hole so that the component is combined with the conductive drawings made on the base plate and the first surface of the component is pressed against the insulating polymer layer, and curing the insulating polymer layer.

2. The method according to claim 1, characterized in that the first surface of the component press in the uncured insulating polymer layer.

3. The method according to claim 1, characterized in that the first surface of the component press in a partially cured insulating polymer layer.

4. The method according to one of claims 1 to 3, characterized in that the ring is the dominant polymer layer generated by the location covered by the resin copper foil on the second surface of the base plate.

5. The method according to one of claims 1 to 3, characterized in that the insulating polymer layer is created by applying a film of pre-impregnated epoxy on the second surface of the base plate.

6. The method according to one of claims 1 to 3, characterized in that the contact areas of the component are United with them contact protrusions, and the component is installed in the hole so that the contact tabs are inside the insulating polymer layer.

7. The method according to one of claims 1 to 3, characterized in that the contact areas of the component are United with them contact protrusions, the height of which is at least equal to the thickness of the insulating polymer layer, and the component is installed in the hole so that the contact protrusions pass through the insulating polymer layer.

8. The method according to one of claims 1 to 3, characterized in that the cured insulating polymer layer perform the contact holes for the component, and in the contact holes and over the insulating polymer layer to create guides for the formation of electrical contact with the component.

9. The method according to one of claims 1 to 3, characterized in that the conductive drawings create at least a second surface (1b) of the base plate, and an insulating polymer layer is applied to the second surface (1b) of the base plate so that the closes conductive patterns on the second surface (1b).

10. The method according to one of claims 1 to 3, characterized in that the first surface of the component press in an insulating polymer layer in contact with the conductive drawings in the conductive layer.

11. The method according to one of claims 1 to 3, characterized in that at least one set of conductive drawings is placed between the insulating polymer layer, in which press the first surface of the component, and the base plate of the PCB.

12. The method according to one of claims 1 to 3, characterized in that the base plate made of insulating material.

13. The method according to one of claims 1 to 3, characterized in that the component is fixed in the hole by filling the holes drilled in the base plate filler.

14. The method according to one of claims 1 to 3, characterized in that the component is made in the form of a chip, and the electrical contact with the chip is formed from the first surface of the base plate after installing the chip in the slot in the base plate.

15. The method according to one of claims 1 to 3, characterized in that the electrical contact with the component form by increasing electrically conductive material on the contact pads of the component.

16. The method according to one of claims 1 to 3, characterized in that the contact areas of the component are United with them contact lugs and electrical contact with the components of entom form by increasing electrically conductive material at the ends of the contact tabs.

17. The method according to 14, characterized in that the electrical contact with the chip form without soldering, using the technology of the manufacture of printed circuit boards.

18. The method according to one of claims 1 to 3, characterized in that the base embed more than one component, and the base plate perform a separate hole for each component, embedded in the base, and each component, embedded in the base, set in its own hole.

19. The method according to claim 1, characterized in that made the first and the second substrate and the intermediate layer, the second base is placed over the first substrate with the alignment relative to the first base, between the first and second base place the intermediate layer and the bond between a first and second base by means of the intermediate layer.

20. The method according to claim 19, characterized in that made at least one third substrate and the intermediate layer for each of the third base, a third base in turn is placed over the first and second bases with a combination concerning one of the underlying reasons behind each and every third base place the intermediate layer and fastened to each other first, second, and every third base by means of the intermediate layers.

21. The method according to claim 19 or 20, characterized in that the bases of the deposits, fixed on each other, drill the holes for end-to-end connections, and drilled the holes to create conductors for connection of the electronic circuits of each of the Foundation for education operating together.

22. The method according to one of claims 1 to 3, characterized in that the temperature of the base plate, component or conductive layer directly associated with the component, does not exceed in the process 200°S, and preferably is in the range from 20 to 85°C.

23. An electronic module containing at least one embedded in the base component, the first surface of which is provided with contact pads, and used as the basis of the base plate with a first surface and a second surface having a conductive drawings and at least one opening for at least one component, with each hole passes through the base plate between the first surface and the second surface and the second surface of the base plate is equipped with utverzhdennym insulating polymer layer covering at least one opening for the component, while on the walls of the holes for the component accrued conductive material to provide all around protection component from interference, and at least one component installed in at least one CTE is participation so the specified component is combined with the conductive patterns on the base plate and the first surface of the component is pressed against the insulating polymer layer.

24. An electronic module according to item 23, wherein the component is made in the form of chips, over which is provided a metal plate.

25. An electronic module according to item 23 or 24, characterized in that the component is made in the form of chips, which laid the metal foil.



 

Same patents:

FIELD: engineering of flexible multilayer electronic boards (loops) for assembly of microelectronic equipment.

SUBSTANCE: in accordance to the invention, as substrate material, polyimide, polyether and fluoroplastic films are used. Polyimide film substrates make it possible to achieve high thermal stability of loops and allow usage of different methods of assembly, including welding and soldering, and fluoroplastic films are most usable for making loops based on them for assembly of UHF circuits, due to low losses in UHF frequency range and possible constant wave resistance of loops which connect UHF modules and devices. Structure and placement of contact areas, meant for assembly of electronic components or connection of loop to other devices or electronic boards, and also materials and covers, used for forming aforementioned contact areas, must also provide for high density inter-cell connection in electronic equipment. To that end, contact areas are positioned on the other side of flexible substrate and connected to working conductors via through metallized apertures in the substrate. External sides of contact areas are tin-plated, for example, covered in layer of tin-bismuth alloy, onto the surface of contact areas which is adjacent to substrate, a layer of material is applied to prevent spreading of soldering alloy, chromium for example, and connection of contact areas of loop to contacts of electronic devices is realized by welding-soldering using double electrode tool for micro-mounting, brought to contact with the other surface of contact area via through aperture in the film positioned above the contact area.

EFFECT: manufacture of flexible electronic board, wherein the gap between adjacent conductors does not exceed 20 micrometers, making it possible to ensure placement density of components and contact areas for assembly thereof, approaching contact placement density of modern VLSI circuits.

2 cl, 2 tbl, 2 ex

The invention relates to a card with a chip contact area, the region has suffered a conductive varnish, and the varnish can be painted

The invention relates to electrical engineering and can be used in electronics, instrumentation

The invention relates to electrical and radio engineering, in particular to methods, devices, and types of electrical and electronic connections

The invention relates to apparatus for mounting electronic components, in particular, planar components (chips) on the surface of the PCB

The invention relates to the production of electronic equipment, in particular can be used in the manufacture of single - and double-sided PCB, multilayer printed circuit boards and flexible printed circuit boards

FIELD: radio, computer, and electrical engineering; electrical connection of printed-circuit boards by means of flexible printed cable.

SUBSTANCE: proposed contacting device for electrical connection of rigid printed-circuit boards incorporating block with groove and lugs in its slots locked in position be means of cleat has its clamp provided with pins and projection following shape of groove; flexible printed cable has holes for fastening on clamp pins and is non-insulated at points of contact with lugs following groove shape. Such mechanical design enables electrical connection of several printed-circuit boards by means of flexible printed cable. Implementing such design solution makes it possible to improve functional and operating capabilities of device. Small size of device enables its use in small-size instruments.

EFFECT: enlarged functional capabilities of device.

1 cl, 3 dwg

FIELD: technology for high frequency synchronization of an electric system and an electronic board used for that purpose.

SUBSTANCE: during realization of high frequency adjustment method, high frequency plug socket (1) is used, comprising electronic board (3), which has two types of contact points: points (21-28) for high frequency contacts and points (31-38) for contacts with isolation shift, each contact point (21-28) for high frequency contacts is connected to corresponding contact point (31-38) for isolation-shifting contacts, between high frequency contacts capacity connections appear, causing generation of cross inductions on near end of communication line. At least one first conductive track (46), connected on one side to contact point (26) of electric contact, is placed on electronic board (3) together with at least one second conductive track (44), positioned on electronic board (3) and/or inside it, forms capacitor (C46). At least one frequency-dependent parameter of device is measured and compared to set parameter, and depending on the difference produced as a result of comparison, conductive track (46), contacting on one side, is removed partially or fully.

EFFECT: creation of method for synchronization of high frequency plug socket, in particular, RJ-45 socket, with at least one electronic board, and also creation of an electronic board, which allows adjustment of high frequency characteristics within a narrow tolerance range.

2 cl, 5 dwg

FIELD: circuit boards comprising connected and held together mounting plates, on which interconnection layout is formed, such as flexible electronic board and rigid electronic board, installed in electronic devices, used primarily in electric equipment and communication devices, and also method for mutual connection of mounting plates.

SUBSTANCE: circuit board device consists of first and second mounting plates and anisotropic conductive element. First mounting plate is provided with rows of first separate connecting contacts on its surface layer. Second mounting plate is provided with rows of second separate connecting contacts on its surface layer. Anisotropic conductive element is positioned between first and second mounting plates in a way making possible to mutually connect respectively separate contacts. Local section of each mounting plate is made stepped for separate positioning of electrode contacts. The local section of anisotropic conductive element is made stepped to ensure possible contact with corresponding stepped sections of mounting plate. The multi-layered structure, consisting of mounting plates and anisotropic conductive element which is positioned between mounting plates, is held together by pressure in the direction of superposition.

EFFECT: creation of circuit board device, which may connect mounting plates, on which in matrix configuration a set of connecting electrode contacts is positioned and which may be dismounted, and which device is simple to manufacture for realization of greater thinning and saving of space, and also creation of method for mutual connection of mounting plates.

2 cl, 23 dwg

FIELD: electronic engineering; high-power microwave integrated circuits.

SUBSTANCE: proposed device has transistors in the form of chips with flat heavy-current leads. Current-carrying metal base has projection aligned with insulating substrate hole and disposed in this hole, its height being such that its upper surface is flush with face side of insulating substrate. Depression provided on upper surface of projection is of through type on end of flat heavy-current leads of chip of one of transistors connected to metal coat of topological pattern. At least one contact pad provided with and connected to plate readily conducting heat and electricity is made on upper surface of heat-conducting metal base at least on one end of chip of one of transistors, its size being equal to or greater than 0.3 x 0.3 mm. This metal plate has at least one groove holding chip of other transistor; it is through groove on side of heavy-current leads connected to metal coat of topological pattern; it is of same size as the latter and its bottom thickness is 0.1-0.5 mm. Other flat heavy-current leads of transistor chips are connected to projection on heat-conducting metal base.

EFFECT: enhanced reliability of heat transfer and power characteristics of hybrid integrated circuit.

6 cl, 9 dwg

FIELD: electric engineering.

SUBSTANCE: in accordance to method, semiconductor components, forming a part of electronic circuit, or at least some of such components, are built into base, for example, electronic board during its manufacture. Therefore, structure of base is to a certain degree formed around the semiconductor component. In accordance to invention, at least one conductive pattern and apertures for semiconductor components are formed in the base. After that semiconductor components are placed in apertures, combining these with conductive pattern. Semiconductor components are connected to structure of base, in which one or more conductive patterns are made, so that at least one conductive pattern forms electric contact with contact areas on the surface of semiconductor component.

EFFECT: increased reliability.

2 cl, 23 dwg

FIELD: radio engineering.

SUBSTANCE: device has flexible board with conductors and auxiliary board with radio-elements fixed therein, outputs of which are positioned in apertures of this board. Between apertures in auxiliary board recesses are made, in which radio elements are placed. In conductors of flexible board recesses with special elements are made, positioned in apertures of auxiliary board. Recesses with elements are filled with solder.

EFFECT: higher reliability.

2 dwg

FIELD: instrumentation engineering; nondestructive inspections of printed wiring on multilayer printed-circuit boards.

SUBSTANCE: proposed two-way contact device has top and bottom contact matrices with spring-loaded contacts, changeable top and bottom adapters, top and bottom sagging limiters for interface board, multilayer printed-circuit board under inspection whose overall dimensions exceed those of contact-matrix regular contact field; each of top and bottom changeable adapters has frame carrying first and second guide panels provided with holes to receive spring-loaded contacts connected to contact pads of multilayer printed-circuit board under inspection; flexible guide panel with holes whose diameter is smaller than that of holes receiving respective contacts; interfacing board made in the form of multilayer printed-circuit board; the latter and second guide panel have similar free (idle) holes at points of probable contact with lugs of spring-loaded contacts of contact matrix which are not used in the course of inspection, where there are no printed conductors of interfacing board; diameter of these holes is larger than that of respective lugs of spring-loaded contacts of contact matrix running to them; in addition, bottom changeable adapter has two changeable base locks for installing multilayer printed-circuit board under inspection. Such design provides for double-ended connection of multilayer printed-circuit board under inspection characterized in high layout density of external layers and in overall dimensions exceeding those of regular field of spring-loaded contacts of top and bottom matrices to arbitrarily disposed contact pads.

EFFECT: enlarged functional capabilities.

1 cl, 2 dwg

Electronic unit // 2224388
The invention relates to the field of electronic equipment, the design of electronic units, in which the electrical connection of printed circuit boards is carried out using electrical connectors without backplane

The invention relates to electrical vehicles, in particular to electrical mounting blocks hire, which includes a removable electrical device with pin contacts plug-in electric connection with their unit

Electronic unit // 2216886
The invention relates to electronic equipment, namely, blocks design batch containing PCB and plug-in electric connection, and can be used in computing and similar units

FIELD: instrumentation engineering; nondestructive inspections of printed wiring on multilayer printed-circuit boards.

SUBSTANCE: proposed two-way contact device has top and bottom contact matrices with spring-loaded contacts, changeable top and bottom adapters, top and bottom sagging limiters for interface board, multilayer printed-circuit board under inspection whose overall dimensions exceed those of contact-matrix regular contact field; each of top and bottom changeable adapters has frame carrying first and second guide panels provided with holes to receive spring-loaded contacts connected to contact pads of multilayer printed-circuit board under inspection; flexible guide panel with holes whose diameter is smaller than that of holes receiving respective contacts; interfacing board made in the form of multilayer printed-circuit board; the latter and second guide panel have similar free (idle) holes at points of probable contact with lugs of spring-loaded contacts of contact matrix which are not used in the course of inspection, where there are no printed conductors of interfacing board; diameter of these holes is larger than that of respective lugs of spring-loaded contacts of contact matrix running to them; in addition, bottom changeable adapter has two changeable base locks for installing multilayer printed-circuit board under inspection. Such design provides for double-ended connection of multilayer printed-circuit board under inspection characterized in high layout density of external layers and in overall dimensions exceeding those of regular field of spring-loaded contacts of top and bottom matrices to arbitrarily disposed contact pads.

EFFECT: enlarged functional capabilities.

1 cl, 2 dwg

FIELD: radio engineering.

SUBSTANCE: device has flexible board with conductors and auxiliary board with radio-elements fixed therein, outputs of which are positioned in apertures of this board. Between apertures in auxiliary board recesses are made, in which radio elements are placed. In conductors of flexible board recesses with special elements are made, positioned in apertures of auxiliary board. Recesses with elements are filled with solder.

EFFECT: higher reliability.

2 dwg

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