A non-conductive substrate, forming a tape or unit of use, which made a lot of bearing elements

 

Used for mechanical fixing and electrical contacting of the semiconductor chip. The technical result - the creation on the substrate support member, in which, after discharge from the tape or units of use are excluded access from the side pads to the leads of coils mounted semiconductor chip. Is achieved by the fact that in a non-conductive substrate, forming a ribbon or unit of use, which made a lot of bearing elements, in particular, to be embedded in the chip card, one side of the substrate provided with conductive pads that are inside determines the size of each support member outer contour line (4), the other side of the substrate provided with the conductive structures(9, 10, 11, 14, 15), inside each outer contour line (4) form, at least, pads for at least one to be contacting the coil and, at least one semiconductor chip, and outside each outer contour line (4) in the substrate (2) has a recess (13), through which to test possible access to the coil leads of the semiconductor chip from the side of the contact PL:always;">

Bearing element, which is selected from such a substrate is known from Figures 8 and 9 EP 0671705 A2. The bearing element is provided to be embedded in the chip card, which can be used as a contact through a lot of pads and contactless through the antenna coil, for example, through the transformer connection.

Bearing elements for chip cards are used for mechanical mounting of semiconductor chips and contain, in addition, is required to contact the chip contact pads. They are used both in pure contact chip cards so that access to the semiconductor chip is possible only through the contact area, and in the so-called combined maps, where additional possible contactless access via conductive loops in the map and/or on the host element or chip. Conductive loops are connected for this purpose with the coil leads of the semiconductor chip.

These bearing elements are usually made not by one, but on a long tape or having a large area of the unit of use. This is hereinafter referred to as substrate - tape or unit of use BHA is odorou then structure, for example, by etching so that the pads are formed for the individual bearing elements. All conductive structure of the first electrically impact connected with each other by a narrow conductors, so that you can produce galvanic surface treatment.

A semiconductor chip fixed on the opposite contact pads side of the substrate and through a flexible wire leads through the notches electrically connect with the contact pads. Before the functional test of the semiconductor chips, which is still in the tape or in the unit of use, narrow conductors are interrupted by stamping so that the contact pads are electrically isolated from each other.

In a bearing element according to EP 0671705 A2 the coil leads of the semiconductor chip are connected through the notches in the substrate with contact pads on the opposite semiconductor chip side of the substrate. The ends to be connected antenna coil is also connected to these pads through provided for this purpose in the substrate recess with two of these pads. Thus, pads serve as a connective e is provodnikovoj chips are available from pads even after as bearing elements are separated.

The basis of the invention lies in the task of specifying a bearing element, which is fabricated on a substrate, in which the leads of the coil to be mounted semiconductor chips are available from pads, while the element is still in the ribbon or in the unit of use, and after separation of the individual elements of this access are excluded.

This problem is solved according to paragraph 1 of the claims at the expense of bearing elements having the form of a tape or units of use, non-conductive, additionally hot metal substrate, in which the second side of the substrate provided with the conductive structures that are inside the outer contour line of the bearing member to form at least the contact elements to at least one subject communication coil and at least one semiconductor chip and outside the outer contour line in the substrate has recesses through which to test possible access to the coil leads of the semiconductor chip side pads, while the element is still in the ribbon or in the unit of use.

Due to this the s use. Recesses in the substrate allow access to the side of the chip substrate-side pads. If, however, the bearing element selected from a tape or units of use, the notches are no longer part of the bearing member, as they lie outside its external contour. Thus, when the selected bearing element access to the coil leads of the semiconductor chip side pads is no longer possible. When the bearing element is placed in the map and thus access to the findings of the coil is only possible through contactless connected to the antenna side of the pads is no longer possible piece of eavesdropping or interference or electrical access or manipulation contactless data transmission.

For a simple test access to the coil leads of the semiconductor chip preferably grooves can be covered with conductive pads, which are connected to conductive structures, which are connected to the semiconductor chip or chips and the coil (coil). Test probes can then be established simply through the recess on the Playground.

A further form of execution of predusmatrivaetsya through the notches are connected with the conductive structures on the chip side of the substrate. End-to-end connection may completely fill recesses or only to cover their walls.

The invention is illustrated by the example of execution drawings, and figure 1 is a front view of the cut of the tape substrate; figure 2 is a rear view of the neck of the tape substrate.

Figure 1 shows the cut of the tape 1, which depicts four pairs of bearing element. Of course it is possible to position on the tape next to each other more than two load-bearing element. The tape consists of a non-conductive substrate 2, and the material can be taken, for example, reinforced reinforced epoxy resin.

The substrate 2 has perforations 3 along both edges, which serve for further transportation by members of the perforation 3 leads, for example, when installing the ribbon of semiconductor chips or functional test.

The outer contour of the bearing element shown by the dashed line 4. The finished bearing elements defined circuits Vistanova along the line 4 of the tape 1 or emit any other way.

A non-conductive substrate 2 cacheroot metal foil, preferably copper foil. By subsequently etching the metal foil, the other contact pads 6, which lie outside the outer contour line 4 of the bearing member. Contact pads 5, 6 through the narrow conductors 7 are connected with the surrounding outer contour line 4 conductors 8 and thus they are all interconnected. This electrical short circuit is necessary because the pads 5, 6 are subjected to galvanic surface treatment.

Figure 2 shows the other side of the substrate 2 on which are mounted (not shown) of the semiconductor chip. This side is provided with conductive structures 9, 10, 11, 14, 15, obtained by laminating a metal foil and etching.

The substrate 2 was initially kasirovani metal foil on one side and finally provided with grooves 12, 13, which, for example, is produced by stamping. For the subsequent etching of the conductive structures 9, 10, 11, 14, 15 of the recess 12 must be closed so that the grooves 12 remained metallization 11, which can be used for shielding the coil leads of the semiconductor chip. Metallization 11 respectively form a closed conductive ring around the grooves 12. To avoid a possible emerging of eddy current losses, however, may be provided for interrupting.

Of the grooves 1 is ikovoy chips with lying on the other side of the substrate 2 pads 5 through a flexible wire leads. The second recess 13 is made in the form of end-to-end connections, which connect successive pads 6 through conductors 14 with the contact pads 10 of the coil leads.

The substrate 2 is relatively flexible. In the chip card mounted therein a semiconductor chip is subjected to significant bending loads.

Large semiconductor chips would break even. For this reason, on the chip side of the support member of insulating adhesive paste (not shown in the drawing) of the reinforcement frame. Reinforcing frame made preferably of metal but may be of other material.

As usually, the bearing elements are glued in the chip card along the edge of the load-bearing elements must be the place for glue, so that the reinforcing frame is only slightly outside the scope of holes 12 for microwelding. Since, moreover, the inner part of the reinforcing framework for the protection of the property therein the semiconductor chip or chips and the flexible wire leads is filled with the filling mass, the pads 10 for the connection of an antenna coil for contactless operation of the semiconductor chip must lie outside the effort inside for connection with a semiconductor chip. Since the frame would lay on these conductive structures unstable, on the substrate 2 under the reinforcing frame is corresponding to the shape of the frame metallization 9, at least the same thickness as the conductive structures 15.

Because this ring metallization 9 and located inside the frame contact pads 11, which connects through a flexible wire of the coil leads of the semiconductor chip and which are then connected through the conductive structures 15 with the contact pads 10 of the coil leads represent the parasitic capacitance, the area may choose small to support a capacity as small as possible. Ring metallization 9 under the gain frame should not be closed, because otherwise the ends of the coils are short-circuited. Due to this, however, is the formation of additional parasitic capacitance between the open ends of the ring metallization 9 and the conductor or conductors 15. To maintain these tanks as small as possible clearance in the ring metallization 9 under the frame, on the one hand, is of such a magnitude that pouring the mixture could flow under the frame.

Ready mounted on the ribbon or on the unit of use and soedineniya. Since, however, the contact pads 5, 6 are electrically connected to each other through the narrow conductors 7 and 8, first we have to separate these conductors. This is done by stamping the holes 16. They are shown on figures 1 and 2 for reasons of clarity, only one bearing element.

The semiconductor chip may be tested now through the pad 5 as in the normal operation mode in the chip card. Contactless mode of operation can be tested corresponding to the invention follows from the pad through the contact pads 6, which are connected via a pass-through connection 13 and the conductors 14 with the contact pads 10 of the coil leads.

After separation of the bearing elements, the conductors 14 are interrupted and end-to-end connection 13 and subsequent pads 6 are not integral parts of the bearing member, so that the contact side bearing member to the coil leads of the semiconductor chip is no longer possible. In addition, in the case of a bearing element, placed in the chip card, access to the findings of the coil is possible only through the connected antenna coil.

For tests in which it would be enough to fill the recess conductive material. In addition, when the area that is subject to contact with the test probes, would be considerably smaller.

Another possibility is to make the notches 13 in the form of end-to-end connections, but instead to cover them on the side of the chip pads. Then the test probes can be provided in contact with these pads through the notches 13.

For all embodiments is, however, common that access to the coil leads of the semiconductor chip side pads possible, while bearing element is not divided and is part of a tape or units of use.

Claims

1. A non-conductive substrate (2), forming a tape or unit of use, which made a lot of bearing elements, in particular, to be embedded in the chip card, and one side of the substrate (2) provided with conductive pads (5), which lie inside determines the size of each support member outer contour line (4), characterized in that the other side of the substrate (2) provided with conductive structures(9, 10, 11, 14, 15), which form inside the outer contour lines (4) at least Tannoy coil and conductive patterns (11) in the form of platforms for shielding the coil leads, at least one semiconductor chip, and the fact that the outside of each outer contour line (4) in the substrate (2) made the notches (13) through which to test possible access to the coil leads of the semiconductor chip side pads (5), while the element is still in the tape or unit of use.

2. The substrate under item 1, characterized in that the recesses (13) are designed as end-to-end connections connected with the conductive structures(10, 11, 14, 15), and are respectively in connection with relatively small, additional pads (6) located on the side of the pads (5) outside the outer contour lines (4).

3. The substrate under item 1, characterized in that on the side opposite to the contact pads (5), the recess (13) is covered with conductive pads connected to the conductive structures (10, 11).

4. The substrate under item 1, characterized in that the recesses (13) are designed as end-to-end connections connected with the conductive structures(10, 11, 14, 15), and, accordingly, are in connection with one of the pads (5) inside the outer contour lines (4).

 

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