Compound and method thereof

 

(57) Abstract:

The invention relates to the compounds used for sealing electrical products, including ferrite components microwave devices, radio electronic elements, etc., the Compound includes epoxy Dianova resin ED-20 or ED-16, titankeramik oligomer amine, the curing agent AF-2 and an organic solvent. A certain ratio of the components of the compound provides improved moisture resistance, low viscosity, temperature and curing time. The method of producing compound comprises a mixture of epoxy Dianova resin with the organosilicon oligomer at room temperature, adding an organic solvent or mixture of organic solvents, thorough mixing, adding a hardener for epoxy resins AF-2, additional mixing, degassing at a temperature 2510oC and a pressure of from 1.6 to 1.3 kPa to stop the active selection of bubbles, but not more than 30 minutes, curing at a temperature 2510oC for 1 h, and then at a temperature 7010oC for 3 h 2 S. p. f-crystals, 2 tab.

The invention relates to the compounds used for sealing electrical iostat for compound [RF patent 2064956 "Composition for the compound of the authors of Chuvilin L. F. and others], consisting of epoxy Dianova resin and ORGANOTIN oligomer, provides moisture protection only for 10 days, and it cannot be used in designs with materials which cannot withstand heat close, because it has a high temperature curing (+200oC); the compound [RF patent 2016015 "Epoxy compound" the authors Chuvilin L. F. and others], consisting of epoxy Dianova resin, plasticizer, polyethylenimine and solvent, does not provide proof of ferrite parts (the loss is >2 dB when the requirements are not >1 dB). The method of obtaining and curing is carried out at room temperature.

The closest in technical essence and the achieved result is the compound [A. S. USSR 535330 "Compound" authors Andrianov, K. A. and others], including epoxy Dianova resin, titankeramik oligomer, methyltetrahydrophthalic anhydride and a filler, wt.h.:

Epoxy Dianova resin - 100

Titankeramik oligomer - 10-40

Methyltetrahydrophthalic anhydride - 25-40

Filler - 200-220

The compound was prepared as follows: heated at 110oC for 30 minutes, the mixture of resin and oligomer with stirring injected filler, the mixture alpenchalet high temperature and cooling.

This compound and the method of its preparation does not provide moisture protection ferrite products: loss of microwave energy after exposure to 12 days of high humidity are >1,2 dB (when requirements are not >1 dB). The method of preparation and curing is carried out at elevated temperatures (110oC and 160oRespectively), the cure time is long (more than 8 hours).

The aim of the present invention is to provide such a compound and method of its production, which would increase its moisture resistance, reduced viscosity at room temperature, lowering the temperature and time of curing.

The goal is solved due to the fact that the compound includes epoxy Dianova resin, titankeramik oligomer is characterized by the fact that, as a hardener contains amine curing agent for epoxy resins AF-2 is the product of the interaction of phenol, formaldehyde and ethylene diamine and an organic solvent or mixture of organic solvents in the following ratios, wt.h.:

Epoxy Dianova resin ED-20 or ED-16 - 100

Titankeramik oligomer - 10 - 40

Hardener AF-2 - 15 - 25

Organic solvent ilator, provides solution to this technical problem can be anything.

The compound was prepared as follows: epoxy Dianova resin mixed with titankeramik the oligomer and utverjdayut.

What is new is the mixture at room temperature epoxy Dianova resin with the organosilicon oligomer, the introduction of an organic solvent and thorough mixing, and then adding the amine hardener for epoxy resins AF-2, mixing and degassing at a temperature 2510oC and a pressure of from 1.6 to 1.3 kPa to stop the active selection of bubbles, but no more than 30 minutes; cure at a temperature 2510oC for 1 hour, then at a temperature 7010oC for 3 hours.

In table. 1 shows the composition of the compounds according to the invention, in the table. 2 - their properties.

The specified range of ratios of components selected due to the fact that with the increasing content of hardener AF-2 reduces viability of a compound that increases the viscosity and worse waterproof properties. When you reduce the amount of hardener compound not cures, worse waterproof properties.

When you reduce the amount of solvent leads to the formation of porous structure and reduce the waterproof properties.

The results of comparative tests of analogue and the claimed compound shown in table. 2.

As can be seen from the data given in table. 2, the proposed compound has several advantages:

- high waterproof properties - loss of microwave energy ferrite parts of phasers phased antenna arrays after exposure to 98% humidity at 40oWith over 12 days lower (not more than 1.0 dB 1.2-2.0 dB);

- has a low viscosity of the OT-4 at a temperature 2510o(30-50 with against - "not flowing");

- room temperature 2510oWith (against 90-110oC);

below the curing temperature (70oWith against 160oC)

- 2 times shorter the curing mode (4 hours vs. 8 hours).

1. The compound includes epoxy Dianova resin ED-20 or ED-16, titankeramik oligomer and curing agent, characterized in that as a hardener it contains amine curing agent AF-2 is the product of the interaction of phenol, formaldehyde and ethylene diamine, and optionally an organic solvent or their mixture at a ratio of 1:1 in the following ratio, wt.h.:

Epoxy Dianova resin ED-20 or ED-16 - 100

Titankeramik oligonychus solvent or their mixture at a ratio of 1:1 - 10-30

2. The method of producing compound, comprising pre-mixing the epoxy Dianova resin ED-20 or ED-16 titankeramik the oligomer, and then curing agent and then curing at a temperature, characterized in that the mixture of epoxy Dianova resin with titankeramik the oligomer is carried out at room temperature, add organic solvent or mixture of organic solvents, mix thoroughly, add the hardener AF-2 is the product of the interaction of phenol, formaldehyde and ethylene diamine, optionally mixed, vacuum at a temperature 2510oC and a pressure of from 1.6 to 1.3 kPa to stop the active selection of bubbles, but not more than 30 minutes, utverjdayut at a temperature 2510oC for 1 h, and then at a temperature 7010oC for 3 hours

 

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