Assembling printed circuits with electric components, e.g. with resistor (H05K3/30)

Assembly on printed circuit board // 2614387
FIELD: physics, computer science.SUBSTANCE: present invention relates to the assembly on the printed circuit board. It is achieved by that, the assembly on the circuit board includes: a bottom layer; electronic components, which are divided into categories, at that, each component is attached to the bottom layer by means of fasteners, having a specified temperature of thermal tripping, depending on to which category applies the mentioned component.EFFECT: invention provides creation of an assembly on a printed circuit board and the assembling method of such assembly on a printed circuit board, in order to facilitate separation and collection of different electronic components, mounted in an assembly on a printed circuit board, at the end of its service life, and additionally facilitating the reuse of electronic components and / or recycling of substances, from which the electronic equipment wastes consist of.12 cl, 6 dwg

Deformable device and corresponding method // 2605937
FIELD: electricity.SUBSTANCE: invention relates to deformable device and corresponding method of making for use in electronic device. In proposed device comprising deformable substrate (3); conductive part (7) and at least one support (5), configured for connection of conducting part (7) with deformable substrate (3), elements are configured so that said conducting part (7) is separated from deformable substrate (3) by gap.EFFECT: configuration of electronic components and connections between components so, that they are not damaged at deformation of device in response to force applied by user.47 cl, 37 dwg

Inductance chip for automated surface mounting // 2603362
FIELD: electrical engineering.SUBSTANCE: invention relates to electrical engineering and can be used in oscillating circuits of communication equipment. Inductance chip for automated surface mount comprises a frame, consisting of a core and flanges, wire winding with insulation, leads on flanges, protective coating of polymer material. Protective coating has Shore hardness D from 60 to 80, elasticity with Young's modulus in range from 10 to 14 GPa and strength with value of ultimate tensile strength from 450 to 600 kg/cm2.EFFECT: technical result consists in improvement of resistance of protective coating during operation of inductance chip in temperature range from -60 to +140 C.1 cl, 2 dwg

Woven circuit board and manufacturing method thereof // 2600037
FIELD: electricity.SUBSTANCE: invention relates to articles for installation of electronic components and interconnections of leads of said components in accordance with a circuit diagram. Said result is achieved due to that in a woven circuit board, comprising a substrate in form of a package of two or more grids with seats for installation of electronic components of any type on external surfaces of board, on surfaces of board there are contact pads or wire ends for connection to leads of electronic components. Wire ends for interconnections on one side of board are connected to leads of components or contact pads, other ends of wires for interconnections o other side of board are interconnected in nodes of networks. Disclosed is a method of manufacturing, consisting in that firmware, layout and tracing of each section of wire for interconnections are made on one outer side of circuit board to other side of circuit board through respective cell of each grid through entire grid on a "star" topology.EFFECT: production of substrate of circuit board, providing high density, accuracy and simplicity of manufacturing.3 cl, 1 dwg
Circuit board with electrical and optical interconnections and method of its fabrication // 2577669
FIELD: electronics.SUBSTANCE: claimed circuit board comprises a substrate, bond areas, electrical interconnection conductors and optical interconnections composed by optic fibres. Note here that the used substrates are screens. The starts of the conductors or optic fibres are woven in the screen meshes nearby the bond areas or components terminals. The ends of the conductors or optic fibres are interwoven into the sets of closely set screen meshes and interconnected to make the nodes of screens. The claimed procedure uses the screen-like substrates with the increased linear sizes of the cells before interweaving. After interweaving, the linear sizes of the cells are decreased by approximating the cells elements to design sizes.EFFECT: higher density of circuit density, simplified circuit design, simplified layout and routing, simplified fabrication, higher reliability and lower costs.2 cl

ethod of making electronic assemblies on flexible support without soldering and welding processes // 2572588
FIELD: radio engineering, communication.SUBSTANCE: method is carried out by making electronic assemblies of radioelectronic equipment on a flexible support and includes making a drawing on a foil-coated polymer by photolithography, mounting naked chips with the active side downwards and component chips on the base using polymer lacquer, sealing, making holes in the polymer structure to the leads of the electronic components by plasma-chemical etching, mounting components by magnetron sputtering of metals in a vacuum, growing the required number of layers by photolithography on polymer photosensitive lacquer, forming large external contact pads for subsequent mounting on printed-circuit boards made of any material, such as fibre-glass plastic, ceramic, polyimide and other materials.EFFECT: providing a method of making maximally compact, reliable, high-speed and cheaper-to-manufacture electronic assemblies of radioelectronic equipment by avoiding soldering and welding processes when making the electronic assemblies.13 dwg

icroelectronic components mounting method // 2571880
FIELD: electricity.SUBSTANCE: as per the preset coordinates in a metal circular plate openings are shaped for unpacked chips. Adhesive ribbon is strained to one of outer surfaces of the metal circular plate with its sticky side inwards the plate. Unpacked chips are set as per the preset coordinates by their contacts pads onto surface of the adhesive ribbon, then they are sealed and the adhesive ribbon is removed. Polyimide photosensitive lacquer is applied and openings are formed in it. Switching is performed by vacuum metal deposition via thin strippable mask or photolithography processes are used upon vacuum-plasma metal deposition. A layer of dielectric is applied again and windows are formed in it. The last metallisation layer is applied, switching is formed with contact pads and chip components are mounted.EFFECT: reduced labour intensity and improved reliability of microelectronic units, reduced weight and dimensions of microelectronic units.7 dwg

ethod and device of connecting chip to printed conductive surface // 2563971
FIELD: printing.SUBSTANCE: invention relates to a technology of connecting the element of the integrated circuit (chip) to the surface which comprises conductive patterns. First, the chip (201) is heated to a first temperature lower than the temperature that the chip can endure without damage by heat. The heated chip is pressed against the printed conductive surface with a first pressing force. Joint action of the first temperature and the first pressing force is sufficient to at least partially melt the material of the printed conductive surface and/or the corresponding contact point on the chip (205, 206).EFFECT: creation of the method and device for rapid, smooth and reliable connection of the chip to the printed conductive surface due to the point-like nature of heat transfer and applying pressure to the surface at the contact points.15 cl, 13 dwg
Substrate for printed circuit board assembly // 2551929
FIELD: electricity.SUBSTANCE: pins in a rigid substrate as per version 1 are set on the flat working surface. The height of the pins above the working surface does not exceed the height of a printed circuit board. The rigid substrate as per version 2 is fitted with threaded holes in the flat working surface.EFFECT: provision for the automatic assembly of radioelectronic components on printed circuit boards and reduced materials consumption.9 cl, 2 dwg

Printed circuit board // 2499374
FIELD: electricity.SUBSTANCE: printed circuit board comprises a dielectric base (1) with contact sites (3) on the first side, connected by through metallised transition holes (5) with metallised sections (4) on the second side. At the same time each contact site (3) is connected with the specified transition holes (5) not more than with one metallised section, at the same time areas of the metallised sections (4) are in direct proportion to quantity of contact sites (3), with which they are accordingly connected electrically.EFFECT: provision of even heat removal from contact sites of a printed circuit board with preservation of possibility of their electric connection.8 cl, 3 dwg

ethod of assembling microelectronic components // 2490837
FIELD: physics.SUBSTANCE: in the method of assembling microelectronic components, once a position fixing polymer (4), in order to maintain alignment of microelectronic components (2) that are assembled on a substrate (1) using an anisotropic electroconductive film (7), is applied onto the substrate and hardened, the microelectronic components (2) are heated to a predetermined temperature and compressed at a predetermined pressure using a flexible sheet (5) provided on the microelectronic components and then subjected to single-step compressive fixation on the substrate (1).EFFECT: providing a method of assembling microelectronic components which, when using an anisotropic electroconductive film to assemble a plurality of microelectronic components of different height on a base plate, allows assembling at precise positions on the base plate, thereby preventing position shift which results from compressive fixation.5 cl, 16 dwg

Independent electronic component and method of its mounting // 2363070
FIELD: electronic engineering.SUBSTANCE: present invention relates in substance to shell-type discrete electronic components, containing, for example, electronic power supply circuit, shell or case in the form of parallelepiped and contact pins connected inside shell with the above circuit and protruding out of shell for electric connection with printed-circuit board (PCB). Shell contains heat-dissipating front section having at least one surface outside shell and lying in plane; specified contact pins protrude from shell so that their first section lies in parallel to the above plane. Flat-topped is preferred in a couple of contact pins located after the first section parallel to plane as such bend will allow more stable mounting of component in process of its soldering on heat-dissipating intermediate pad.EFFECT: creation of discrete electronic component, which structural and functional performance provide its easy, fast and simple mounting at supporting pad for further installation with other components at PCB.9 cl, 6 dwg

Installation method of electronic components with ball leads // 2331993
FIELD: electricity.SUBSTANCE: invention may be used for surface installation of electronic components with ball leads by flip-chip method and particularly for installation of electronic component with ball lead matrix. Installation method of electronic components with ball leads provides for application of flip-chip method including ball leads positioning, fastening and connection to printed circuit card mounting surface contacts, which are mechanically and electrically connected with plated-through holes by soldering. Prior to positioning, printed circuit card is turned over, with its mounting surface directed downwards, ball leads of electronic component being placed under plated-thought holes contacts, with the said special orientation of printed circuit card preserved for the time of all operation execution.EFFECT: production of reliable high-quality soldered connection during surface installation of electronic components.4 cl, 4 dwg

ethod of integration of components to plate-base // 2327311
FIELD: electrotechnics.SUBSTANCE: invention is related to the method, according to which semiconductor elements, forming the part of electronic circuit or at least some of its components, of integration to the plate-base, for example to the printing board in the process of its production. The effect of the invention is achieved by making through-holes in the plate-base for semiconductor components, together with that these holes move between the first and the second surfaces of the plate-base. After creating these holes on the second surface structure plate-base one lays on the plastic foil, which covers the through-holes for semiconducting elements from the side of the second surface structure plates-base. Before hardening of he plastic foil or after its partial hardening the semiconductor elements are cut in from the side of the first surface. Semiconductor elements are pressed down to the plastic foil after that they are being glued to it. After that the final hardening of the plastic foil is carried out.EFFECT: creation of the method, by which packageless microcircuit are inbuilt safely and economically to the plate-base.24 cl, 23 dwg
Precision flexible loop and method for high density assembly of electronic device using such loops // 2312474
FIELD: engineering of flexible multilayer electronic boards (loops) for assembly of microelectronic equipment.SUBSTANCE: in accordance to the invention, as substrate material, polyimide, polyether and fluoroplastic films are used. Polyimide film substrates make it possible to achieve high thermal stability of loops and allow usage of different methods of assembly, including welding and soldering, and fluoroplastic films are most usable for making loops based on them for assembly of UHF circuits, due to low losses in UHF frequency range and possible constant wave resistance of loops which connect UHF modules and devices. Structure and placement of contact areas, meant for assembly of electronic components or connection of loop to other devices or electronic boards, and also materials and covers, used for forming aforementioned contact areas, must also provide for high density inter-cell connection in electronic equipment. To that end, contact areas are positioned on the other side of flexible substrate and connected to working conductors via through metallized apertures in the substrate. External sides of contact areas are tin-plated, for example, covered in layer of tin-bismuth alloy, onto the surface of contact areas which is adjacent to substrate, a layer of material is applied to prevent spreading of soldering alloy, chromium for example, and connection of contact areas of loop to contacts of electronic devices is realized by welding-soldering using double electrode tool for micro-mounting, brought to contact with the other surface of contact area via through aperture in the film positioned above the contact area.EFFECT: manufacture of flexible electronic board, wherein the gap between adjacent conductors does not exceed 20 micrometers, making it possible to ensure placement density of components and contact areas for assembly thereof, approaching contact placement density of modern VLSI circuits.2 cl, 2 tbl, 2 ex
Card with a chip having a contact area, and a method of manufacturing such a card with chip // 2215325
The invention relates to a card with a chip contact area, the region has suffered a conductive varnish, and the varnish can be painted

Printed circuit board for soldering the solder columns // 2199840
The invention relates to electrical engineering and can be used in electronics, instrumentation

The method of connecting electrical components and device for its implementation // 2145756
The invention relates to electrical and radio engineering, in particular to methods, devices, and types of electrical and electronic connections

Device for mounting electronic components on a printed circuit board // 2082291
The invention relates to apparatus for mounting electronic components, in particular, planar components (chips) on the surface of the PCB

A method of manufacturing a circuit board // 2010466
The invention relates to the production of electronic equipment, in particular can be used in the manufacture of single - and double-sided PCB, multilayer printed circuit boards and flexible printed circuit boards