(H01L27/088)

H   Electricity(227141)
H01   Basic electric elements(70435)
H01L27/088              (3)

Thin-film transistor, matrix substrate and display panel // 2627934
FIELD: electricity.SUBSTANCE: thin-film transistor TFT includes a gate, a first insulating layer located above the gate, a second insulating layer located above the first insulating layer, a semiconductor layer, a source and a drain, located between the first insulating layer and the second insulating layer, an ohmic contact layer located between the semiconductor layer, the source and the drain, the ohmic contact layer including an opening passing through the ohmic contact layer by means of a gap between the source and the drain in order to open the semiconductor layer, and the second insulating layer is connected to the semiconductor layer through this opening, and a conductive layer located above the second insulating layer. The conductive layer and the gate are electrically connected to each other, so that when the TFT is in the on-state, the switching current generated in the conductive channels of the semiconductor layer is increased. When the TFT is in the off-state, the tripping current generated in the conductive channels is reduced.EFFECT: the ratio of the making current to the tripping current is increased.15 cl, 6 dwg

Semiconductor instrument // 2437183
FIELD: electricity.SUBSTANCE: in semiconductor instrument containing sink, source consisting of transistor cells and peripheral p-n junction, which are located under gate electrode, as well as of metal electrode of source, which is located above gate electrode, polysilicon gate electrode insulated from source areas with dielectric, which contains in middle part the matrix of transistor cells and peripheral end part overlapping above the dielectric the source peripheral p-n junction; end part of polysilicon gate electrode, which overlaps above the dielectric the source peripheral p-n junction, is topologically separated from end cell of matrix of transistor cells and not covered with source metal coating.EFFECT: reducing the resistance of power double-diffused MOS transistors in open state, without increase in the size of crystal and deterioration of other parameters.2 cl, 3 dwg

ultichannel reader // 2282269
FIELD: optical data processing systems.SUBSTANCE: proposed multichannel reader built on semiconductor substrate has N input units, multiple-output switching unit, common read-out bus, write bus, pre-processor signal processing unit incorporating comparator, arithmetic-logic device, and memory unit; one of two comparator inputs is designed to apply digital-code signal thereto and is connected to common read-out bus; other comparator input is designed to feed reference signal; comparator output is connected to input of arithmetic-logic device whose output is connected to input of memory unit whose output is coupled with write bus; each input unit is made in the form of amplifier that has input, output, and control input, as well as two MIS transistors; first MIS transistor gate is connected to output of respective cell of multiple-output switching unit and gate, to common read-out bus; second MIS transistor gate is connected to output of next cell of multiple-output switching unit and gate, to write bus; each input unit is provided in addition with K-capacity analog-to-digital converter and L-capacity digital-to-analog converter; first MIS transistor source is connected to output of analog-to-digital converter whose input is connected to amplifier output; second MIS transistor source is connected to input of digital-to-analog converter whose output is connected to amplifier control input; common read-out bus is assembled of K buses, K being equal to capacity of analog-to-digital converter and to number of first MIS transistors connected through their gates to respective outputs of multiple-output switching unit, through drains, to respective buses of common read-out buses, and through sources, to respective inputs of analog-to-digital converters; write bus is assembled of L buses, L being equal to digital-to-analog converter capacity and to number of second MIS transistors connected through drains to respective buses forming write bus, through gates, to output of next cell of multiple-output switching unity, and through sources, to respective inputs of digital-to-analog converter.EFFECT: extended dynamic range, enhanced speed, enlarged functional capabilities.1 cl, 1 dwg

The amplifier circuit radio circuit of the radio frequency mixer and containing radio // 2217862
The invention relates to a structure oriented on the radio, in particular, to the structure of the CMOS circuits for digital radio transceiver
 
2550977.
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